JPS6469038A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS6469038A JPS6469038A JP22684787A JP22684787A JPS6469038A JP S6469038 A JPS6469038 A JP S6469038A JP 22684787 A JP22684787 A JP 22684787A JP 22684787 A JP22684787 A JP 22684787A JP S6469038 A JPS6469038 A JP S6469038A
- Authority
- JP
- Japan
- Prior art keywords
- outer circumferential
- circumferential section
- semiconductor device
- film
- white thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent the excess temperature rise of the surface of the outer circumferential section of a semiconductor device of the time of the reflow of infrared rays by coating the whole region of the top face of the outer circumferential section of the semiconductor device with a white thin-film. CONSTITUTION:The whole region of the surface of an outer circumferential section 7 into which a semiconductor element is sealed is coated with a white thin-film 9. Since the outer circumferential section does not absorb infrared rays even through soldering mounting by the reflow of infrared rays by the structure, the performance of the semiconductor element is difficult to be deteriorated by an excess temperature rise. Consequently, the reliability of a semiconductor device in soldering mounting through an infrared ray reflow system can be improved largely. Marking conducted on the surface of the outer circumferential section is performed by using black paints on the white thin-film or executed by employing a mask on the formation of the white thin-film normally. An area in the extent of the marking characters has no effect on an infrared reflection effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22684787A JPS6469038A (en) | 1987-09-10 | 1987-09-10 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22684787A JPS6469038A (en) | 1987-09-10 | 1987-09-10 | Resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6469038A true JPS6469038A (en) | 1989-03-15 |
Family
ID=16851497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22684787A Pending JPS6469038A (en) | 1987-09-10 | 1987-09-10 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6469038A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0750325A1 (en) * | 1995-06-21 | 1996-12-27 | Illinois Tool Works Inc. | Infrared shielded capacitor |
| JP2017500739A (en) * | 2013-11-29 | 2017-01-05 | エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ | Electronic devices and their use |
-
1987
- 1987-09-10 JP JP22684787A patent/JPS6469038A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0750325A1 (en) * | 1995-06-21 | 1996-12-27 | Illinois Tool Works Inc. | Infrared shielded capacitor |
| CN100390909C (en) * | 1995-06-21 | 2008-05-28 | 伊利诺斯工具制造公司 | Infrared shield of capacitor |
| JP2017500739A (en) * | 2013-11-29 | 2017-01-05 | エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ | Electronic devices and their use |
| US10225965B2 (en) | 2013-11-29 | 2019-03-05 | Epcos Ag | Electronic component and use thereof |
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