JPS5669846A - Sealing method of package - Google Patents

Sealing method of package

Info

Publication number
JPS5669846A
JPS5669846A JP14586379A JP14586379A JPS5669846A JP S5669846 A JPS5669846 A JP S5669846A JP 14586379 A JP14586379 A JP 14586379A JP 14586379 A JP14586379 A JP 14586379A JP S5669846 A JPS5669846 A JP S5669846A
Authority
JP
Japan
Prior art keywords
sealing
package
resin
cap
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14586379A
Other languages
Japanese (ja)
Inventor
Yasuhiko Horio
Hiroyuki Nishiue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14586379A priority Critical patent/JPS5669846A/en
Publication of JPS5669846A publication Critical patent/JPS5669846A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE:To eliminate blower holes which will be yielded at the time of sealing and to enhance reliability, in sealing the package enclosing a semiconductor device by a sealing cap, by placing a resinous sealing members in-between, temporarily sealing by melting, then performing curing in the pressure reduced container. CONSTITUTION:The semiconductor device 3 is fixed on a base 1 in space 2 provided in the dual-in-line package of ceramics and the like by using a die bonding member 4. The electrodes provided in the package are connected to the outer leads 1a by thin wires 5 via metallized layers 1b. Then, the sealing resin 6a is placed on the upper surface of the side wall of the package. The sealing cap 6 is placed on the sealing resin 6a. The package and the cap 6 are held by a clip shaped resilient compressing jig. The product is placed in the pressure reduced container and heated, thereby the resin 6a is melted. After the temporarily sealed state has been achieved, the pressure is reduced, and the resin 6a is cured with the yield of blower holes being suppressed.
JP14586379A 1979-11-09 1979-11-09 Sealing method of package Pending JPS5669846A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14586379A JPS5669846A (en) 1979-11-09 1979-11-09 Sealing method of package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14586379A JPS5669846A (en) 1979-11-09 1979-11-09 Sealing method of package

Publications (1)

Publication Number Publication Date
JPS5669846A true JPS5669846A (en) 1981-06-11

Family

ID=15394798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14586379A Pending JPS5669846A (en) 1979-11-09 1979-11-09 Sealing method of package

Country Status (1)

Country Link
JP (1) JPS5669846A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495724B1 (en) 1998-10-15 2002-12-17 Mitsubishi Gas Chemical Company, Inc. Catalysts for producing methylamines and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495724B1 (en) 1998-10-15 2002-12-17 Mitsubishi Gas Chemical Company, Inc. Catalysts for producing methylamines and method for manufacturing the same
US6590124B1 (en) 1998-10-15 2003-07-08 Mitsubishi Gas Chemical Company, Inc. Catalysts for producing methylamines and method for manufacturing the same
US6710009B2 (en) 1998-10-15 2004-03-23 Mitsubishi Gas Chemical Company, Inc. Catalysts for producing methylamines and method for manufacturing the same

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