JPS642340A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS642340A
JPS642340A JP15857987A JP15857987A JPS642340A JP S642340 A JPS642340 A JP S642340A JP 15857987 A JP15857987 A JP 15857987A JP 15857987 A JP15857987 A JP 15857987A JP S642340 A JPS642340 A JP S642340A
Authority
JP
Japan
Prior art keywords
semiconductor element
resistance
resin
substrate
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15857987A
Other languages
Japanese (ja)
Other versions
JPH012340A (en
Inventor
Akihisa Yano
Yoshitaka Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP15857987A priority Critical patent/JPS642340A/en
Publication of JPH012340A publication Critical patent/JPH012340A/en
Publication of JPS642340A publication Critical patent/JPS642340A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE: To obtain a high moisture resistance and a high heat resistance and impact resistance by a method wherein a semiconductor element is sealed with a sealing resin, whose filling material is unevenly distributed in the vicinity of the semiconductor element.
CONSTITUTION: A semiconductor element 2 is die bonded on a substrate 1 for the semiconductor element and consisting of a glass epoxy resin material with a silver paste 6 and thereafter, is connected electrically with the outside by an Al wire bonding 7. Then, a fluid sealing resin 3 obtainable by kneading a filling material 4 in an epoxy resin is dipped on the element 2 and after the resin is heated at low temperature to make the material 4 distribute unevenly, a cap 5 consisting of Al is placed on the substrate 1 and is fixed by thermocompression bonding. In such a way, a high moisture resistance and a high heat resistance and impact resistance can be obtained.
COPYRIGHT: (C)1989,JPO&Japio
JP15857987A 1987-06-25 1987-06-25 Semiconductor device Pending JPS642340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15857987A JPS642340A (en) 1987-06-25 1987-06-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15857987A JPS642340A (en) 1987-06-25 1987-06-25 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH012340A JPH012340A (en) 1989-01-06
JPS642340A true JPS642340A (en) 1989-01-06

Family

ID=15674774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15857987A Pending JPS642340A (en) 1987-06-25 1987-06-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS642340A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882041B1 (en) * 2002-02-05 2005-04-19 Altera Corporation Thermally enhanced metal capped BGA package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953387A (en) * 1972-09-27 1974-05-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953387A (en) * 1972-09-27 1974-05-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882041B1 (en) * 2002-02-05 2005-04-19 Altera Corporation Thermally enhanced metal capped BGA package

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