JPS57143847A - Air-tight sealed package - Google Patents
Air-tight sealed packageInfo
- Publication number
- JPS57143847A JPS57143847A JP56029072A JP2907281A JPS57143847A JP S57143847 A JPS57143847 A JP S57143847A JP 56029072 A JP56029072 A JP 56029072A JP 2907281 A JP2907281 A JP 2907281A JP S57143847 A JPS57143847 A JP S57143847A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- welded
- cover
- gold plating
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 3
- 238000007747 plating Methods 0.000 abstract 3
- 238000003466 welding Methods 0.000 abstract 3
- 230000008021 deposition Effects 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
PURPOSE:To carry out laser welding satisfactorily by a method wherein electroless nickel deposition of suitable thickness is applied to a case and a cover and gold plating is applied to the parts other than those to be welded. CONSTITUTION:Before a base itself 4 and a cover itself 8 are welded, electroless nickel deposition film of 2-3mum thickness is formed on the base itself and that of 6-20mun thickness on the cover. Gold plating is applied to respective parts of the base itself and the cover other than the parts to be welded and laser welding is carried out while the laser power is controlled to approximately 3.8X10<8>J/mm.<2>. With this constitution, because gold plating layer 6 is climinated from the parts irradiated by laser beam 9, reflection of the laser beam is reduced and the welded parts are easy to be fused, so that satisfactory welding can be carried out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56029072A JPS57143847A (en) | 1981-02-27 | 1981-02-27 | Air-tight sealed package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56029072A JPS57143847A (en) | 1981-02-27 | 1981-02-27 | Air-tight sealed package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57143847A true JPS57143847A (en) | 1982-09-06 |
JPS6146060B2 JPS6146060B2 (en) | 1986-10-11 |
Family
ID=12266145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56029072A Granted JPS57143847A (en) | 1981-02-27 | 1981-02-27 | Air-tight sealed package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57143847A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6130246U (en) * | 1984-07-27 | 1986-02-24 | 日本碍子株式会社 | Partially plated ceramic package |
JPS61238484A (en) * | 1985-04-12 | 1986-10-23 | Fujitsu Ltd | Laser welding method |
US6974635B1 (en) | 1998-09-24 | 2005-12-13 | Neomax Materials Co., Ltd. | Package for electronic component, lid material for package lid, and production method for lid material |
JP2014012284A (en) * | 2012-07-04 | 2014-01-23 | Toyota Motor Corp | Heating method, and joining method |
-
1981
- 1981-02-27 JP JP56029072A patent/JPS57143847A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6130246U (en) * | 1984-07-27 | 1986-02-24 | 日本碍子株式会社 | Partially plated ceramic package |
JPS61238484A (en) * | 1985-04-12 | 1986-10-23 | Fujitsu Ltd | Laser welding method |
US6974635B1 (en) | 1998-09-24 | 2005-12-13 | Neomax Materials Co., Ltd. | Package for electronic component, lid material for package lid, and production method for lid material |
JP2014012284A (en) * | 2012-07-04 | 2014-01-23 | Toyota Motor Corp | Heating method, and joining method |
Also Published As
Publication number | Publication date |
---|---|
JPS6146060B2 (en) | 1986-10-11 |
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