JPS5686693A - Working method for extremely narrow hole by means of laser - Google Patents

Working method for extremely narrow hole by means of laser

Info

Publication number
JPS5686693A
JPS5686693A JP16325079A JP16325079A JPS5686693A JP S5686693 A JPS5686693 A JP S5686693A JP 16325079 A JP16325079 A JP 16325079A JP 16325079 A JP16325079 A JP 16325079A JP S5686693 A JPS5686693 A JP S5686693A
Authority
JP
Japan
Prior art keywords
hole
coating layer
laser beam
under
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16325079A
Other languages
Japanese (ja)
Other versions
JPS6320637B2 (en
Inventor
Takashi Omae
Yasuyuki Yoshida
Satoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP16325079A priority Critical patent/JPS5686693A/en
Publication of JPS5686693A publication Critical patent/JPS5686693A/en
Publication of JPS6320637B2 publication Critical patent/JPS6320637B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To facilitate the work for an extremely narrow hole, by irradiating the pulse laser to make a hole whose diameter is smaller than the laser beam diameter by forming a laser beam reflective coating layer, where an under-hole is processed, on the surface of the processed material. CONSTITUTION:Coating layer 5 of a high laser beam reflection factor is formed on the surface of processed material 3. At this time, under-hole 6 whose diameter is smaller than the diameter of laser beam 1 is formed in coating layer 5. Next, the output of the pulse laser irradiated to under-hole 6 is set to a low value when the hole is shallow at the initial stage of holing work. Then, base metal fusion region 7 is restrained to a small quantity, and coating layer 5 is not fused under the influence of fusion region 7. The output of the pulse laser is set to a higher value according as the hole is deeper. At this time, base metal fusion region 7 becomes deeper, and coating layer 5 is not fused by the influence of region 7, and thus, a very narrow hole is punched in processed material 3.
JP16325079A 1979-12-15 1979-12-15 Working method for extremely narrow hole by means of laser Granted JPS5686693A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16325079A JPS5686693A (en) 1979-12-15 1979-12-15 Working method for extremely narrow hole by means of laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16325079A JPS5686693A (en) 1979-12-15 1979-12-15 Working method for extremely narrow hole by means of laser

Publications (2)

Publication Number Publication Date
JPS5686693A true JPS5686693A (en) 1981-07-14
JPS6320637B2 JPS6320637B2 (en) 1988-04-28

Family

ID=15770204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16325079A Granted JPS5686693A (en) 1979-12-15 1979-12-15 Working method for extremely narrow hole by means of laser

Country Status (1)

Country Link
JP (1) JPS5686693A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180687A (en) * 1984-02-28 1985-09-14 Sony Corp Working method of printed circuit board
JPS6174791A (en) * 1984-09-19 1986-04-17 Hitachi Ltd Method of forming through holes in base plate
JPS6195792A (en) * 1984-10-17 1986-05-14 Hitachi Ltd Production of printed wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180687A (en) * 1984-02-28 1985-09-14 Sony Corp Working method of printed circuit board
JPS6174791A (en) * 1984-09-19 1986-04-17 Hitachi Ltd Method of forming through holes in base plate
JPS6195792A (en) * 1984-10-17 1986-05-14 Hitachi Ltd Production of printed wiring board

Also Published As

Publication number Publication date
JPS6320637B2 (en) 1988-04-28

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