JPS5686692A - Punching working method by means of laser - Google Patents

Punching working method by means of laser

Info

Publication number
JPS5686692A
JPS5686692A JP16260079A JP16260079A JPS5686692A JP S5686692 A JPS5686692 A JP S5686692A JP 16260079 A JP16260079 A JP 16260079A JP 16260079 A JP16260079 A JP 16260079A JP S5686692 A JPS5686692 A JP S5686692A
Authority
JP
Japan
Prior art keywords
laser
output
processed material
hole
pulse laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16260079A
Other languages
Japanese (ja)
Inventor
Takashi Omae
Yasuyuki Yoshida
Satoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP16260079A priority Critical patent/JPS5686692A/en
Publication of JPS5686692A publication Critical patent/JPS5686692A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/41—Servomotor, servo controller till figures
    • G05B2219/41036—Position error in memory, lookup table for correction actual position

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To prevent extension of the hole diameter to punch a processed material straightly, by moving the focus position of the pulse laser to hole bottoms successively and by increasing the laser output gradually. CONSTITUTION:The focus position of laser beam 1 of the first pulse laser for processed material 3 is set to a prescribed position on the surface of processed material 3, and the output of the pulse laser is set to a low value. For every irradiation of the pulse laser, the focus position is moved to bottoms of the hole successively, and the output of laser beam 1 is increased gradually or the first irradiation output is set to the lowest output in comparison with the following irradiation output at least. At this time, though oblique-line part 6 of the laser bean is irradiated to the surface of processed material 3, hole 8 is punched without fushion of the surface because the power density on the surface is low.
JP16260079A 1979-12-14 1979-12-14 Punching working method by means of laser Pending JPS5686692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16260079A JPS5686692A (en) 1979-12-14 1979-12-14 Punching working method by means of laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16260079A JPS5686692A (en) 1979-12-14 1979-12-14 Punching working method by means of laser

Publications (1)

Publication Number Publication Date
JPS5686692A true JPS5686692A (en) 1981-07-14

Family

ID=15757666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16260079A Pending JPS5686692A (en) 1979-12-14 1979-12-14 Punching working method by means of laser

Country Status (1)

Country Link
JP (1) JPS5686692A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107570894A (en) * 2016-06-30 2018-01-12 三星钻石工业股份有限公司 The processing method of substrate and the processing unit (plant) of substrate
JP2018016525A (en) * 2016-07-29 2018-02-01 三星ダイヤモンド工業株式会社 Laser processing method and laser processing device for brittle material substrate
JP2018015795A (en) * 2016-07-29 2018-02-01 三星ダイヤモンド工業株式会社 Laser processing method and laser processing device of brittle material substrate
JP2020121921A (en) * 2016-07-29 2020-08-13 三星ダイヤモンド工業株式会社 Laser beam machining apparatus for brittle material substrate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107570894A (en) * 2016-06-30 2018-01-12 三星钻石工业股份有限公司 The processing method of substrate and the processing unit (plant) of substrate
JP2018016525A (en) * 2016-07-29 2018-02-01 三星ダイヤモンド工業株式会社 Laser processing method and laser processing device for brittle material substrate
JP2018015795A (en) * 2016-07-29 2018-02-01 三星ダイヤモンド工業株式会社 Laser processing method and laser processing device of brittle material substrate
CN107662055A (en) * 2016-07-29 2018-02-06 三星钻石工业株式会社 The laser processing and laser processing device of brittle substrate
CN107662053A (en) * 2016-07-29 2018-02-06 三星钻石工业株式会社 The laser processing and laser processing device of brittle substrate
KR20180013679A (en) * 2016-07-29 2018-02-07 미쓰보시 다이야몬도 고교 가부시키가이샤 Method and apparatus for laser processing substrate of brittle material
JP2020121921A (en) * 2016-07-29 2020-08-13 三星ダイヤモンド工業株式会社 Laser beam machining apparatus for brittle material substrate
TWI715745B (en) * 2016-07-29 2021-01-11 日商三星鑽石工業股份有限公司 Laser processing method and laser processing device for brittle material substrate
CN107662055B (en) * 2016-07-29 2021-04-13 三星钻石工业株式会社 Laser processing method and laser processing device for brittle material substrate
TWI725137B (en) * 2016-07-29 2021-04-21 日商三星鑽石工業股份有限公司 Laser processing method and laser processing device for brittle material substrate

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