JPS5325996A - Laser working method - Google Patents
Laser working methodInfo
- Publication number
- JPS5325996A JPS5325996A JP10093576A JP10093576A JPS5325996A JP S5325996 A JPS5325996 A JP S5325996A JP 10093576 A JP10093576 A JP 10093576A JP 10093576 A JP10093576 A JP 10093576A JP S5325996 A JPS5325996 A JP S5325996A
- Authority
- JP
- Japan
- Prior art keywords
- working method
- laser working
- groove
- switching
- working
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Laser Beam Processing (AREA)
Abstract
PURPOSE:To work a groove of a material to be worked accurately without giving damage by performing Q switching at high speed firstly, and thereby dividing large energy into plural laser beam pulses when working the groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10093576A JPS5325996A (en) | 1976-08-24 | 1976-08-24 | Laser working method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10093576A JPS5325996A (en) | 1976-08-24 | 1976-08-24 | Laser working method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5325996A true JPS5325996A (en) | 1978-03-10 |
JPS5512348B2 JPS5512348B2 (en) | 1980-04-01 |
Family
ID=14287198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10093576A Granted JPS5325996A (en) | 1976-08-24 | 1976-08-24 | Laser working method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5325996A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63224270A (en) * | 1987-11-11 | 1988-09-19 | Semiconductor Energy Lab Co Ltd | Manufacture of superconductor device |
JPS63250881A (en) * | 1987-04-07 | 1988-10-18 | Semiconductor Energy Lab Co Ltd | Manufacture of superconductor |
JPS63269586A (en) * | 1987-04-27 | 1988-11-07 | Fujikura Ltd | Manufacture of bridge-type josephson junction device |
US5719372A (en) * | 1994-11-17 | 1998-02-17 | Nec Corporation | Laser marking system and method using controlled pulse width of Q-switch |
JP2004009139A (en) * | 2002-06-10 | 2004-01-15 | New Wave Research | Method and system which manufacture die |
US7052976B2 (en) | 2002-11-05 | 2006-05-30 | New Wave Research | Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
US7112518B2 (en) | 2002-06-10 | 2006-09-26 | New Wave Research | Method and apparatus for cutting devices from substrates |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5998763U (en) * | 1982-12-24 | 1984-07-04 | 池田 正躬 | Containers for hydroponic cultivation |
-
1976
- 1976-08-24 JP JP10093576A patent/JPS5325996A/en active Granted
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63250881A (en) * | 1987-04-07 | 1988-10-18 | Semiconductor Energy Lab Co Ltd | Manufacture of superconductor |
JPS63269586A (en) * | 1987-04-27 | 1988-11-07 | Fujikura Ltd | Manufacture of bridge-type josephson junction device |
JPS63224270A (en) * | 1987-11-11 | 1988-09-19 | Semiconductor Energy Lab Co Ltd | Manufacture of superconductor device |
US5719372A (en) * | 1994-11-17 | 1998-02-17 | Nec Corporation | Laser marking system and method using controlled pulse width of Q-switch |
JP2004009139A (en) * | 2002-06-10 | 2004-01-15 | New Wave Research | Method and system which manufacture die |
US7112518B2 (en) | 2002-06-10 | 2006-09-26 | New Wave Research | Method and apparatus for cutting devices from substrates |
US7169688B2 (en) | 2002-06-10 | 2007-01-30 | New Wave Research, Inc. | Method and apparatus for cutting devices from substrates |
US8822882B2 (en) | 2002-06-10 | 2014-09-02 | New Wave Research | Scribing sapphire substrates with a solid state UV laser with edge detection |
US7052976B2 (en) | 2002-11-05 | 2006-05-30 | New Wave Research | Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
Also Published As
Publication number | Publication date |
---|---|
JPS5512348B2 (en) | 1980-04-01 |
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