JPS57206588A - Laser working method - Google Patents

Laser working method

Info

Publication number
JPS57206588A
JPS57206588A JP56090562A JP9056281A JPS57206588A JP S57206588 A JPS57206588 A JP S57206588A JP 56090562 A JP56090562 A JP 56090562A JP 9056281 A JP9056281 A JP 9056281A JP S57206588 A JPS57206588 A JP S57206588A
Authority
JP
Japan
Prior art keywords
working
speed
points
moving
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56090562A
Other languages
Japanese (ja)
Inventor
Hiroshi Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56090562A priority Critical patent/JPS57206588A/en
Publication of JPS57206588A publication Critical patent/JPS57206588A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To reduce an entire working time in the stage of working points at plural places by moving materials to be worked sequentially with a laser at the lowred speed to the extent of obviating deterioration in working characteristics without stopping the materials to be worked during working. CONSTITUTION:When plural working points are going to pass through a laser condensing spot. a locus 3 wherein the moving time including acceleration control is shortest is beforehand determined. The working points thereon are defined sequentially as 1, 2... and the points just before the respective working points where a moving table is decelerated are defined as 1l, 2l.... The respective coordinates are determined as shown in the figure. The moving speed of the materials to be worked on the working table is made a function of positions. In the position (il), said speed is decelerated, and in the position (i), the speed is lowest, and at this point, the laser is irradiated. This min speed (v) can be set by the equation I if the irradiation time is defined as (t), the diameter of punching with a laser or the diameter of weld nugget as (d), and the permissible deformation of the working diameter is <=10%. The distance Li between the points (il) and (i) follows approximately the equation II, but it is justified if it is the distance required for deceleration to the (v) from the moving speed.
JP56090562A 1981-06-11 1981-06-11 Laser working method Pending JPS57206588A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56090562A JPS57206588A (en) 1981-06-11 1981-06-11 Laser working method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56090562A JPS57206588A (en) 1981-06-11 1981-06-11 Laser working method

Publications (1)

Publication Number Publication Date
JPS57206588A true JPS57206588A (en) 1982-12-17

Family

ID=14001858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56090562A Pending JPS57206588A (en) 1981-06-11 1981-06-11 Laser working method

Country Status (1)

Country Link
JP (1) JPS57206588A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6348839A (en) * 1986-08-19 1988-03-01 Nikon Corp Laser machining apparatus
US5910261A (en) * 1995-10-02 1999-06-08 Fanuc, Ltd. Laser machining device and laser machining method of a round hole
JP2004216430A (en) * 2003-01-16 2004-08-05 Ricoh Microelectronics Co Ltd Laser drilling method and its equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52108598A (en) * 1976-03-08 1977-09-12 Nec Corp Laser processing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52108598A (en) * 1976-03-08 1977-09-12 Nec Corp Laser processing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6348839A (en) * 1986-08-19 1988-03-01 Nikon Corp Laser machining apparatus
US5910261A (en) * 1995-10-02 1999-06-08 Fanuc, Ltd. Laser machining device and laser machining method of a round hole
JP2004216430A (en) * 2003-01-16 2004-08-05 Ricoh Microelectronics Co Ltd Laser drilling method and its equipment

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