JPS61189894A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS61189894A JPS61189894A JP60029636A JP2963685A JPS61189894A JP S61189894 A JPS61189894 A JP S61189894A JP 60029636 A JP60029636 A JP 60029636A JP 2963685 A JP2963685 A JP 2963685A JP S61189894 A JPS61189894 A JP S61189894A
- Authority
- JP
- Japan
- Prior art keywords
- control device
- laser beam
- radius
- workpiece
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、レーザ光により金属材料、無機材料有機材料
等各種広範囲な材料に対して複雑形状図形を高速・高精
度に切断子るレーザ加工装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a laser processing device that uses laser light to cut complex shapes on a wide range of materials such as metal materials, inorganic materials, and organic materials at high speed and with high precision. It is something.
従来の技術
従来のレーザ加工装置における被加工物の切断加工例に
ついて説明する。2. Description of the Related Art An example of cutting a workpiece using a conventional laser processing apparatus will be described.
第2図は従来装置により被切断材料10をム点からB点
まで直線加工し、B点で直角に曲がり0点まで加工する
場合の例を示したものであり、切断速度が一定な高速で
ある時には実線で示したようにコーナ部には一般にRが
生じる。Figure 2 shows an example in which a conventional device processes a material 10 to be cut in a straight line from point M to point B, then turns at a right angle at point B and processes it to point 0. In some cases, a radius generally occurs at the corner as shown by the solid line.
次に、円形の穴加工に対しては円の半径が小さい場合に
は図形の崩れが大きく、第3図に示したような尖端を始
終端部11に生じる。Next, when drilling a circular hole, if the radius of the circle is small, the shape is greatly distorted, and a pointed end as shown in FIG.
このような現象は、主として駆動系の時定数に付随して
生じるものであり、時定数が大きいほど指定寸法からの
誤差は大きくなる。さらにこの時定数は機械設計上から
はゼロにすることはできない。Such a phenomenon mainly occurs due to the time constant of the drive system, and the larger the time constant, the larger the error from the specified dimension. Furthermore, this time constant cannot be made zero from the viewpoint of mechanical design.
従来のレーザ加工装置では複雑図形で異なる曲率半径を
多く持つ形状を高精度で加工する場合には、このような
誤差を低減するため、例えば作業者が加工速度を手動操
作で低速にすることにより対処していることが多かった
。With conventional laser processing equipment, when processing complex shapes with many different radii of curvature with high precision, in order to reduce such errors, for example, the operator can manually reduce the processing speed. There were many things I was dealing with.
発明が解決しようとする問題点
しかし、この方法では作業者が必ず要ることや、必ずし
も精度確保上での最適速度・最高能率が得られない等の
欠点があった。Problems to be Solved by the Invention However, this method has drawbacks such as the necessity of a worker and the fact that optimum speed and maximum efficiency cannot always be obtained in terms of ensuring accuracy.
本発明は、上記欠点に鑑み、加工精度の確保とともに最
高能率が得られる人手を排除したレーザ加工装置を4供
するものである。In view of the above-mentioned drawbacks, the present invention provides a laser processing apparatus which eliminates manual labor and which ensures processing accuracy and provides maximum efficiency.
問題点を解決するための手段
この目的を達成するために本発明のレーザ加工装置はレ
ーザ発振器と、前記レーザ発振器から出力されたレーザ
光を被加工物まで導き被加工物を照射する集光装置を含
むレーザ光ガイドと、所定形状のレーザ加工を行なうた
めに被加工物と前記レーザ光の被加工物への照射点とを
相対的に移動するワークステーション7と、前記レーザ
光照射点と被加工物6とを所定形状に相対的に移動指令
を行なう第1制御装置と、前記所定形状図形の構成要素
の曲率半径に応じて前記相゛対移動、速度を演算する第
2制御装置から構成されている。Means for Solving the Problems To achieve this object, the laser processing apparatus of the present invention includes a laser oscillator, and a condenser that guides the laser light output from the laser oscillator to the workpiece and irradiates the workpiece. a workstation 7 that relatively moves a workpiece and a point at which the laser beam is applied to the workpiece in order to perform laser processing into a predetermined shape; Consisting of a first control device that issues a command to move the workpiece 6 relative to a predetermined shape, and a second control device that calculates the relative movement and speed according to the radius of curvature of the component of the predetermined shape figure. has been done.
作用
上記構成により、被加工物とレーザ光照射点との相対速
度を図形構成要素の曲率半径に応じた最適値制御を行な
うことにより、加工精度の確保とともに最高能率が得ら
れる。Operation With the above configuration, by controlling the relative speed between the workpiece and the laser beam irradiation point to an optimum value according to the radius of curvature of the graphic component, machining accuracy can be ensured and maximum efficiency can be obtained.
実施例
以下、本発明の一実施例について、図面を参照しながら
説明する。第1図は本発明の一実施例のレーザ加工装置
を示すもので、レーザ光照射点が固定し、被加工物が移
動する例である。1はレーザ発振器、2はレーザ発振器
1から出力されたレーザ光、10はレーザ光2を被加工
物6の方向に屈折する鏡、3はレーザ光を集光する集光
レンズで、レーザ光2の集光レンズ3により集光された
焦点近傍が一般にはレーザ光2の被加工物6への照射点
6になる。4はレーザ光2を被加工物6へ導くレーザ光
ガイドである。7は一例として被加工物をX軸、τ軸の
2方向に移動させるワークステーション、8は上記ワー
クステーション7に所定の速度で所定の形状に移動指令
を行なうとともに、レーザ発振器1にレーザ照射ならび
にレーザ照射停止等の指令を行なう第1制御装置である
。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 shows a laser processing apparatus according to an embodiment of the present invention, in which the laser beam irradiation point is fixed and the workpiece is moved. 1 is a laser oscillator, 2 is a laser beam output from the laser oscillator 1, 10 is a mirror that refracts the laser beam 2 toward the workpiece 6, and 3 is a condensing lens that focuses the laser beam. The vicinity of the focal point condensed by the condensing lens 3 generally becomes the irradiation point 6 of the laser beam 2 onto the workpiece 6. 4 is a laser light guide that guides the laser light 2 to the workpiece 6. For example, 7 is a workstation that moves the workpiece in two directions, the X-axis and the τ-axis. 8 is a workstation that instructs the workstation 7 to move at a predetermined speed and into a predetermined shape, and also instructs the laser oscillator 1 to irradiate and emit laser beams. This is a first control device that issues commands such as stopping laser irradiation.
9はレーザ光照射点6に対する被加工物6との相対速度
を形状図形構成要素の曲率半径に応じて演算する第2制
御装置で、例えば曲率半径r、駆動系の時定数でとした
場合、上記相対速度はατ″′r′ll(n 、 mh
o )で演算され、速度制御コードを発生する。第2制
御装置9で演算、生成された結果に対して、第1制御装
置8が所定形状を曲率半径に応じた最適速度で加工する
ことになる。9 is a second control device that calculates the relative speed of the workpiece 6 with respect to the laser beam irradiation point 6 according to the radius of curvature of the shape/figure component; for example, when the radius of curvature is r and the time constant of the drive system, The above relative velocity is ατ″′r′ll(n, mh
o) to generate a speed control code. Based on the results calculated and generated by the second control device 9, the first control device 8 processes a predetermined shape at an optimal speed according to the radius of curvature.
第4図は上記相対速度と回加工時の仕上り半径誤差との
関係を示した例であり、半径誤差は加工速度依存性が大
きいことを実証している。この場合、半径誤差の許容値
に応じて加工速度を選択すれば、経験的に大巾な(例え
ば直線切断条件の棒など)速度低減を行なっている時よ
りも加工速度の向上が期待でき、かつ品質の確保安定化
に寄与することが理解できる。この効果は1、高速加工
で加工長が長いものほど大きく、特に高速板金加工には
極めて有効となる。FIG. 4 is an example showing the relationship between the above-mentioned relative speed and the finished radius error during round machining, demonstrating that the radius error is highly dependent on the machining speed. In this case, if the machining speed is selected according to the allowable value of the radius error, it can be expected that the machining speed will be improved more than when the speed is reduced by a wide range (for example, for a bar under straight cutting conditions) based on experience. It can also be understood that this contributes to ensuring and stabilizing quality. 1. This effect is greater in high-speed machining and the longer the machining length is, and is particularly effective in high-speed sheet metal machining.
なお、上記第2制御装置9にレーザ加工装置として必ず
しも組込まれる必要はなく、例えばレーザ加工用自動テ
ープ作成器とした形をとっていても、第1制御装置8に
制御情報が取込まれるという機能は本発明内容と等価な
ものである。It should be noted that the second control device 9 does not necessarily have to be incorporated as a laser processing device; for example, even if it is configured as an automatic tape creator for laser processing, the control information is taken into the first control device 8. The functions are equivalent to the contents of the present invention.
発明の効果
以上のように本発明のレーザ加工装置は、人手を排除し
て加工精度・品質の確保と加工時間の短縮が得られ、実
用的効果大なるものがある。Effects of the Invention As described above, the laser processing apparatus of the present invention eliminates manual labor, ensures processing accuracy and quality, and shortens processing time, and has great practical effects.
第1図に本発明の一実施例を示すレーザ加工装置のブロ
ック図、第2図は従来のレーザ加工装置による直角部の
加工形状を示す正面図、第3図は。
同レーザ加工装置による円の加工形状を示す正面図、第
4図は本発明実施例のレーザ加工装置による加工速度と
仕上り半径誤差の関係を示す特性図である。
1・・・・・・レーザ発振器、2・・・・・・レーザ光
、3・・・・・・集光装置、4・・・・・・レーザ光ガ
イド、6・・・・・・被加工物、6・・・・・・照射点
、7・・・・・・ワークスチーシロン、8・・・・・・
第1制御装置、9・・・・・・第2制御装置。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図
WJ2図
vI 3 図
第 4 図
カロエ速度ζ″/−3)FIG. 1 is a block diagram of a laser processing apparatus showing an embodiment of the present invention, FIG. 2 is a front view showing the shape of a right angle section processed by a conventional laser processing apparatus, and FIG. 3 is a block diagram of a laser processing apparatus according to an embodiment of the present invention. FIG. 4 is a front view showing a circular shape processed by the laser processing device, and a characteristic diagram showing the relationship between processing speed and finished radius error by the laser processing device according to the embodiment of the present invention. 1... Laser oscillator, 2... Laser light, 3... Concentrator, 4... Laser light guide, 6... Target Workpiece, 6... Irradiation point, 7... Workpiece steel, 8...
1st control device, 9...2nd control device. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure WJ2 Figure vI 3 Figure 4 Figure Karoe velocity ζ''/-3)
Claims (1)
レーザ光を被加工物まで導き前記被加工物を照射する集
光装置を含むレーザ光ガイドと、所定形状のレーザ加工
を行なうために前記被加工物と前記レーザ光の前記被加
工物への照射点とを相対的に移動するワークステーショ
ンと、前記レーザ光照射点と前記被加工物とを所定形状
に相対的に移動指令を行なう第1制御装置と、前記所定
形状図形の構成要素の曲率半径に応じて前記相対移動速
度を演算する第2制御装置を備えたレーザ加工装置。a gas laser oscillator; a laser light guide including a condenser that guides the laser beam output from the laser oscillator to the workpiece and irradiates the workpiece; a workstation that relatively moves the irradiation point of the laser beam onto the workpiece; and a first control device that issues a command to relatively move the laser beam irradiation point and the workpiece into a predetermined shape. , a laser processing apparatus comprising a second control device that calculates the relative movement speed according to the radius of curvature of the component of the predetermined shape figure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60029636A JPS61189894A (en) | 1985-02-18 | 1985-02-18 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60029636A JPS61189894A (en) | 1985-02-18 | 1985-02-18 | Laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61189894A true JPS61189894A (en) | 1986-08-23 |
Family
ID=12281566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60029636A Pending JPS61189894A (en) | 1985-02-18 | 1985-02-18 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61189894A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03216290A (en) * | 1990-01-19 | 1991-09-24 | Komatsu Ltd | Laser beam cutting method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57206590A (en) * | 1981-03-17 | 1982-12-17 | Trumpf Gmbh & Co | Blowout method and blowout device using laser beam |
-
1985
- 1985-02-18 JP JP60029636A patent/JPS61189894A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57206590A (en) * | 1981-03-17 | 1982-12-17 | Trumpf Gmbh & Co | Blowout method and blowout device using laser beam |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03216290A (en) * | 1990-01-19 | 1991-09-24 | Komatsu Ltd | Laser beam cutting method |
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