JPS6130246U - Partially plated ceramic package - Google Patents
Partially plated ceramic packageInfo
- Publication number
- JPS6130246U JPS6130246U JP11340884U JP11340884U JPS6130246U JP S6130246 U JPS6130246 U JP S6130246U JP 11340884 U JP11340884 U JP 11340884U JP 11340884 U JP11340884 U JP 11340884U JP S6130246 U JPS6130246 U JP S6130246U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic package
- cap
- partially plated
- seal ring
- plated ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案のキャップとシールリングを有するセラ
ミックパッケージの一実施例を示す斜視図、第２図は第
１図に示したセラミックパッケージの断面図である。
１・・・キャップ、２・」・シールリング、３・・・セ
ラミックハウジング、４・・・リード、５，６・・・Ｎ
ｉ−ｐめっき皮膜、７・・・キャビテイ。FIG. 1 is a perspective view showing an embodiment of a ceramic package having a cap and a seal ring according to the present invention, and FIG. 2 is a sectional view of the ceramic package shown in FIG. 1. 1... Cap, 2... Seal ring, 3... Ceramic housing, 4... Lead, 5, 6... N
IP plating film, 7... Cavity.
Claims (1)
着するパッケージにおいて、キャップおよびシールリン
グの最上層のいずれか一方または両方にＮｉ−ｐめっき
を施したことを特徴とするセラミックパッケージ。 ２ キャップおよびシールリングとして熱膨張係数がセ
ラミックスの熱膨張係数とほぼ一致する金属材料を使用
する実用新案登録請求の範囲第１項記載のセラミックパ
ッケージ。[Claims for Utility Model Registration] 1. A ceramic package in which a cap is sealed to a seal ring by a seam weld, characterized in that either or both of the top layer of the cap and the seal ring is coated with Ni-P plating. package. 2. The ceramic package according to claim 1, wherein the cap and the seal ring are made of a metal material whose thermal expansion coefficient substantially matches that of ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11340884U JPS6130246U (en) | 1984-07-27 | 1984-07-27 | Partially plated ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11340884U JPS6130246U (en) | 1984-07-27 | 1984-07-27 | Partially plated ceramic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6130246U true JPS6130246U (en) | 1986-02-24 |
Family
ID=30672439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11340884U Pending JPS6130246U (en) | 1984-07-27 | 1984-07-27 | Partially plated ceramic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6130246U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143847A (en) * | 1981-02-27 | 1982-09-06 | Nec Corp | Air-tight sealed package |
| JPS5933853A (en) * | 1982-08-19 | 1984-02-23 | Nec Corp | Manufacture of package and semiconductor device |
-
1984
- 1984-07-27 JP JP11340884U patent/JPS6130246U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143847A (en) * | 1981-02-27 | 1982-09-06 | Nec Corp | Air-tight sealed package |
| JPS5933853A (en) * | 1982-08-19 | 1984-02-23 | Nec Corp | Manufacture of package and semiconductor device |
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