JPS5978636U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5978636U JPS5978636U JP17533982U JP17533982U JPS5978636U JP S5978636 U JPS5978636 U JP S5978636U JP 17533982 U JP17533982 U JP 17533982U JP 17533982 U JP17533982 U JP 17533982U JP S5978636 U JPS5978636 U JP S5978636U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- glass
- cap
- ceramic
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置の断面図、第２図は本考案の
半導体装置の断面図である。
尚図において、１．１′・・・セラミックキャップ、２
．２′・・・シールパス部の封止用溶融ガラス、３゜３
′・・・半導体素子に対向するセラミックキャップ裏面
の領域、４・・・セラミックベース、５・・・半導体素
子ζ６・・・セラミックキャップ裏面のガラス。FIG. 1 is a sectional view of a conventional semiconductor device, and FIG. 2 is a sectional view of a semiconductor device of the present invention. In the figure, 1.1'...ceramic cap, 2
．． 2'... Molten glass for sealing the seal path part, 3゜3
′...A region on the back surface of the ceramic cap facing the semiconductor element, 4...Ceramic base, 5...Semiconductor element ζ6...Glass on the back surface of the ceramic cap.
Claims (1)
ップとの間をガラスで封止してなる半導体装置において
、゛前記キャップの裏面にも前記ガラスが施されている
ことを特徴とする半導体装置。1. A semiconductor device in which a ceramic base on which a semiconductor element is provided and a ceramic cap are sealed with glass, characterized in that the back surface of the cap is also coated with the glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17533982U JPS5978636U (en) | 1982-11-19 | 1982-11-19 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17533982U JPS5978636U (en) | 1982-11-19 | 1982-11-19 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5978636U true JPS5978636U (en) | 1984-05-28 |
Family
ID=30381494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17533982U Pending JPS5978636U (en) | 1982-11-19 | 1982-11-19 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5978636U (en) |
-
1982
- 1982-11-19 JP JP17533982U patent/JPS5978636U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5978636U (en) | semiconductor equipment | |
| JPS5827938U (en) | semiconductor equipment | |
| JPS5920637U (en) | Semiconductor device container cap | |
| JPS588952U (en) | semiconductor equipment | |
| JPS5952697U (en) | packaging tape | |
| JPS59107144U (en) | semiconductor chip container | |
| JPS6071642U (en) | Glass sealed structure | |
| JPS5851447U (en) | semiconductor package | |
| JPS59159950U (en) | Packages for semiconductor devices | |
| JPS59164241U (en) | Ceramic package | |
| JPS6124467U (en) | crucible | |
| JPS58155841U (en) | IC package | |
| JPS58159697U (en) | EPROM package | |
| JPS6142845U (en) | flat package | |
| JPS6079748U (en) | Glass-sealed semiconductor device | |
| JPS60125732U (en) | semiconductor equipment | |
| JPS5911448U (en) | semiconductor package | |
| JPS6112241U (en) | flat package | |
| JPS59119035U (en) | Ceramic package | |
| JPS59158338U (en) | Can seal structure | |
| JPS6142072U (en) | flat package | |
| JPS59177947U (en) | semiconductor equipment | |
| JPS59127247U (en) | Glass sealed semiconductor device | |
| JPS59166448U (en) | semiconductor equipment | |
| JPS6020145U (en) | semiconductor equipment |