JPS6142072U - flat package - Google Patents
flat packageInfo
- Publication number
- JPS6142072U JPS6142072U JP12796684U JP12796684U JPS6142072U JP S6142072 U JPS6142072 U JP S6142072U JP 12796684 U JP12796684 U JP 12796684U JP 12796684 U JP12796684 U JP 12796684U JP S6142072 U JPS6142072 U JP S6142072U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- glass
- cap
- protrusions
- package body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はこの考案の一実施例のフラットパツケージの断
面図で、第2図は第1図の要部拡大断面図である。
第3図は従来のフラットパッケージのキキツプを除いた
平面図で、第4図は第3図の■一IV線に対応する断面
図である。
第5図はキャップシール方法の一例について説明するた
めキャップシール前の分解断面図である。
1・・・パッケージ本体、2・・・底板、3・・・枠体
、4・・・ガラ′ス、5,6・・・リード、7・・・キ
ャップ、8・・・低融点ガラス、12・・・突起部、1
2a・・・肩部、12b・・・根元部。FIG. 1 is a sectional view of a flat package according to an embodiment of this invention, and FIG. 2 is an enlarged sectional view of the main part of FIG. 1. FIG. 3 is a plan view of a conventional flat package with the shell removed, and FIG. 4 is a sectional view corresponding to line 1-IV in FIG. FIG. 5 is an exploded sectional view before cap sealing for explaining an example of a cap sealing method. 1... Package body, 2... Bottom plate, 3... Frame, 4... Glass, 5, 6... Lead, 7... Cap, 8... Low melting point glass, 12...Protrusion, 1
2a... Shoulder part, 12b... Root part.
Claims (1)
のフラットパッケージ本体に低融点ガラスを介してキャ
ップをシールしたフラットパッケージにおいて、 前記フラットパッケージ本体のキャップシール面に、肩
部および根元部が曲面状の突起部を形成し、この突起部
を低融点ガラスに埋設させたことを特徴とするフラット
パッケージ。[Scope of Claim for Utility Model Registration] In a flat package in which a cap is sealed through a low melting point glass to a ceramic flat package body in which leads are hermetically sealed through glass, on the cap sealing surface of the flat package body. , a flat package characterized in that the shoulder portion and the root portion form curved protrusions, and the protrusions are embedded in low-melting glass.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12796684U JPS6142072U (en) | 1984-08-22 | 1984-08-22 | flat package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12796684U JPS6142072U (en) | 1984-08-22 | 1984-08-22 | flat package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6142072U true JPS6142072U (en) | 1986-03-18 |
JPH0249726Y2 JPH0249726Y2 (en) | 1990-12-27 |
Family
ID=30686598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12796684U Granted JPS6142072U (en) | 1984-08-22 | 1984-08-22 | flat package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6142072U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979468A (en) * | 1972-12-04 | 1974-07-31 |
-
1984
- 1984-08-22 JP JP12796684U patent/JPS6142072U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4979468A (en) * | 1972-12-04 | 1974-07-31 |
Also Published As
Publication number | Publication date |
---|---|
JPH0249726Y2 (en) | 1990-12-27 |
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