JPS60194339U - flat package - Google Patents

flat package

Info

Publication number
JPS60194339U
JPS60194339U JP8215884U JP8215884U JPS60194339U JP S60194339 U JPS60194339 U JP S60194339U JP 8215884 U JP8215884 U JP 8215884U JP 8215884 U JP8215884 U JP 8215884U JP S60194339 U JPS60194339 U JP S60194339U
Authority
JP
Japan
Prior art keywords
flat package
glass
cap
melting point
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8215884U
Other languages
Japanese (ja)
Inventor
大平 良三
南 昶彦
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP8215884U priority Critical patent/JPS60194339U/en
Publication of JPS60194339U publication Critical patent/JPS60194339U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例のフラットパッケージの断
面図である。第2図は従来のフラットパッケージのキャ
ップを除いた平面図で、第3図は第2図の■−■線に沿
う断面図である。第4図はこの考案の背景となるキャッ
プシール方法について説明するための分解断面図である
。 1・・・・・・パッケージ本体、4・・・・・・ガ?ス
、5,6・・・・・・リード、8・・・・・・低融点ガ
ラス、9・・・・・・素子、12・・・・・・キャップ
、13・・・・・・凹凸面。
FIG. 1 is a sectional view of a flat package according to an embodiment of this invention. FIG. 2 is a plan view of a conventional flat package with the cap removed, and FIG. 3 is a cross-sectional view taken along the line ■--■ in FIG. FIG. 4 is an exploded sectional view for explaining the cap sealing method that is the background of this invention. 1...Package body, 4...Ga? 5, 6...Lead, 8...Low melting point glass, 9...Element, 12...Cap, 13...Irregularities surface.

Claims (1)

【実用新案登録請求の範囲】 ガラスを介してリードが気密に封着されたセラミック製
のフラットパッケージ本体に低融点ガラスを介してキャ
ップをシールしたフラットパッケ−ジにおいて、 前記キャップの下面の低融点ガラスによるシール部分を
凹凸面に形成したことを特徴とするフラットパッケージ
[Claims for Utility Model Registration] In a flat package in which a cap is sealed through a low melting point glass to a ceramic flat package body in which a lead is hermetically sealed through a glass, a low melting point of the lower surface of the cap is provided. A flat package characterized by a glass seal with an uneven surface.
JP8215884U 1984-06-01 1984-06-01 flat package Pending JPS60194339U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8215884U JPS60194339U (en) 1984-06-01 1984-06-01 flat package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8215884U JPS60194339U (en) 1984-06-01 1984-06-01 flat package

Publications (1)

Publication Number Publication Date
JPS60194339U true JPS60194339U (en) 1985-12-24

Family

ID=30629623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8215884U Pending JPS60194339U (en) 1984-06-01 1984-06-01 flat package

Country Status (1)

Country Link
JP (1) JPS60194339U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4979468A (en) * 1972-12-04 1974-07-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4979468A (en) * 1972-12-04 1974-07-31

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