JPS4979468A - - Google Patents

Info

Publication number
JPS4979468A
JPS4979468A JP47121349A JP12134972A JPS4979468A JP S4979468 A JPS4979468 A JP S4979468A JP 47121349 A JP47121349 A JP 47121349A JP 12134972 A JP12134972 A JP 12134972A JP S4979468 A JPS4979468 A JP S4979468A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47121349A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47121349A priority Critical patent/JPS4979468A/ja
Publication of JPS4979468A publication Critical patent/JPS4979468A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/163Connection portion, e.g. seal
JP47121349A 1972-12-04 1972-12-04 Pending JPS4979468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47121349A JPS4979468A (en) 1972-12-04 1972-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47121349A JPS4979468A (en) 1972-12-04 1972-12-04

Publications (1)

Publication Number Publication Date
JPS4979468A true JPS4979468A (en) 1974-07-31

Family

ID=14809063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47121349A Pending JPS4979468A (en) 1972-12-04 1972-12-04

Country Status (1)

Country Link
JP (1) JPS4979468A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111763U (en) * 1974-07-15 1976-01-28
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS60190044U (en) * 1984-05-25 1985-12-16 関西日本電気株式会社 flat package
JPS60194339U (en) * 1984-06-01 1985-12-24 関西日本電気株式会社 flat package
JPS6142072U (en) * 1984-08-22 1986-03-18 関西日本電気株式会社 flat package
JPS6181145U (en) * 1984-10-31 1986-05-29
JPH0288241U (en) * 1988-12-26 1990-07-12
JPH02276263A (en) * 1989-04-17 1990-11-13 Nec Kyushu Ltd Sealing cap of plastic pga

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111763U (en) * 1974-07-15 1976-01-28
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS5757866B2 (en) * 1978-06-21 1982-12-07 Hitachi Ltd
JPS60190044U (en) * 1984-05-25 1985-12-16 関西日本電気株式会社 flat package
JPS60194339U (en) * 1984-06-01 1985-12-24 関西日本電気株式会社 flat package
JPS6142072U (en) * 1984-08-22 1986-03-18 関西日本電気株式会社 flat package
JPH0249726Y2 (en) * 1984-08-22 1990-12-27
JPS6181145U (en) * 1984-10-31 1986-05-29
JPH0349398Y2 (en) * 1984-10-31 1991-10-22
JPH0288241U (en) * 1988-12-26 1990-07-12
JPH02276263A (en) * 1989-04-17 1990-11-13 Nec Kyushu Ltd Sealing cap of plastic pga

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