JPS59140443U - Translucent cap for semiconductor devices - Google Patents

Translucent cap for semiconductor devices

Info

Publication number
JPS59140443U
JPS59140443U JP3396883U JP3396883U JPS59140443U JP S59140443 U JPS59140443 U JP S59140443U JP 3396883 U JP3396883 U JP 3396883U JP 3396883 U JP3396883 U JP 3396883U JP S59140443 U JPS59140443 U JP S59140443U
Authority
JP
Japan
Prior art keywords
metal frame
semiconductor devices
translucent cap
melting point
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3396883U
Other languages
Japanese (ja)
Inventor
大日方　弘明
小沼　良雄
之治 竹内
正司 小平
Original Assignee
新光電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電気工業株式会社 filed Critical 新光電気工業株式会社
Priority to JP3396883U priority Critical patent/JPS59140443U/en
Publication of JPS59140443U publication Critical patent/JPS59140443U/en
Pending legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の透光性キャップを示す断面図、第２図お
よび第３図は本考案に係る透光性キャップのそれぞれ好
適な実施例を示す断面図である。 １０・・・金属フレーム、１２・・・低融点ガラス、１
４・・・光学ガラス、１６・・・透光性キャップ、１８
・・・セラミックパッケージ、２０・・・シールリング
、２２・・・金属枠体、２４・・・透孔、２６・・・段
差壁、２８・・・金属リング、３０・・・合金、３２．
３８・・・金属フレーム、３４・・・光学ガラス、３６
・・・低融点ガラス。FIG. 1 is a sectional view showing a conventional light-transmitting cap, and FIGS. 2 and 3 are sectional views showing preferred embodiments of the light-transmitting cap according to the present invention. 10...Metal frame, 12...Low melting point glass, 1
4... Optical glass, 16... Translucent cap, 18
Ceramic package, 20 Seal ring, 22 Metal frame, 24 Through hole, 26 Step wall, 28 Metal ring, 30 Alloy, 32.
38... Metal frame, 34... Optical glass, 36
...Low melting point glass.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属フレームに低融点ガラスを用いて光学ガラスが接着
されて構成され、金属フレームの周縁部分においてセラ
ミックパッケージベース面上にシームウェルド法により
封着される半導体装置用透光性キャップにおいて、前記
金属フレームは、前記低融点ガラスとの接合部が厚肉に
形成され、前記セラミックパッケージのベース面上への
接合部およびその周辺は前記シームウェルドするに適し
た厚さの薄肉部に形成したことを特徴とする半導体装置
用透光性キャップ。In a light-transmitting cap for a semiconductor device, which is configured by bonding optical glass to a metal frame using low melting point glass, and is sealed onto a ceramic package base surface by a seam welding method at a peripheral portion of the metal frame, the metal frame is characterized in that the joint part with the low melting point glass is formed thick, and the joint part on the base surface of the ceramic package and its surroundings are formed as a thin part with a thickness suitable for seam welding. Translucent cap for semiconductor devices.
JP3396883U 1983-03-08 1983-03-08 Translucent cap for semiconductor devices Pending JPS59140443U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3396883U JPS59140443U (en) 1983-03-08 1983-03-08 Translucent cap for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3396883U JPS59140443U (en) 1983-03-08 1983-03-08 Translucent cap for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS59140443U true JPS59140443U (en) 1984-09-19

Family

ID=30164738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3396883U Pending JPS59140443U (en) 1983-03-08 1983-03-08 Translucent cap for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS59140443U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54146985A (en) * 1978-05-10 1979-11-16 Hitachi Ltd Package for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54146985A (en) * 1978-05-10 1979-11-16 Hitachi Ltd Package for semiconductor device

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