JPS5878636U - glass sealed container - Google Patents
glass sealed containerInfo
- Publication number
- JPS5878636U JPS5878636U JP17511581U JP17511581U JPS5878636U JP S5878636 U JPS5878636 U JP S5878636U JP 17511581 U JP17511581 U JP 17511581U JP 17511581 U JP17511581 U JP 17511581U JP S5878636 U JPS5878636 U JP S5878636U
- Authority
- JP
- Japan
- Prior art keywords
- sealed container
- metallized layer
- glass
- glass sealed
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは従来ガラス封止型ケースの断面図で
あり、素子をマウントした場合の構造を示す。
第２図、第３図は従来ガラス封止型ケースのセラミック
基体部分の断面図を示す。第４図は本考案に基づ〈実施
例であるガラス封止型ケースのセラミック基体部分の断
面図を示す。
なお図において、１・・・・・・ガラス封止型ケース、
２・・・・・・セラミック基体、３・・・・・・キャビ
ティー、４・・・・・・低融点ガラス、５・・・・・・
リードフレーム、６゜６′・・・・・・金メタライズ層
、７・・・・・・Ａｕ−３ｉロウ材、７′・・・・・・
Ａｕ−３ｉ合金層、８・・・・・・素子、９，９′・・
・・・・フリット、である。FIGS. 1a and 1b are cross-sectional views of a conventional glass-sealed case, showing the structure when an element is mounted. FIGS. 2 and 3 show cross-sectional views of a ceramic base portion of a conventional glass-sealed case. FIG. 4 shows a sectional view of a ceramic base portion of a glass-sealed case according to an embodiment of the present invention. In the figure, 1...Glass-sealed case,
2...Ceramic base, 3...Cavity, 4...Low melting point glass, 5...
Lead frame, 6゜6'...Gold metallized layer, 7...Au-3i brazing material, 7'...
Au-3i alloy layer, 8...element, 9,9'...
...It's frit.
Claims (1)
介してリードフレームを固着して成るガラス封止型容器
において、該キャビティー内のダイアタッチ部がフリッ
ト含有率の高い第１の金メタライズ層を有し、かつ前記
第１の金メタライズ層トにフリット含有率の低い第２の
金メタライズ層を備えていることを特徴とするガラス封
止型容器。In a glass-sealed container comprising a lead frame fixed to a ceramic substrate having a cavity through a low-melting glass, a die attach part in the cavity has a first gold metallized layer with a high frit content. and a second gold metallized layer having a low frit content on the first gold metallized layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17511581U JPS5878636U (en) | 1981-11-25 | 1981-11-25 | glass sealed container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17511581U JPS5878636U (en) | 1981-11-25 | 1981-11-25 | glass sealed container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5878636U true JPS5878636U (en) | 1983-05-27 |
Family
ID=29967357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17511581U Pending JPS5878636U (en) | 1981-11-25 | 1981-11-25 | glass sealed container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5878636U (en) |
-
1981
- 1981-11-25 JP JP17511581U patent/JPS5878636U/en active Pending
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