JPS5981039U - Glass sealed case - Google Patents
Glass sealed caseInfo
- Publication number
- JPS5981039U JPS5981039U JP17680382U JP17680382U JPS5981039U JP S5981039 U JPS5981039 U JP S5981039U JP 17680382 U JP17680382 U JP 17680382U JP 17680382 U JP17680382 U JP 17680382U JP S5981039 U JPS5981039 U JP S5981039U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- sealed case
- glass sealed
- melting point
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のガラスマウント用ケースにペレットをマ
ウントした構造を示す断面図、第２図は従来のガラスマ
ウント用ケースに基つくペレット剥離モードを示す拡大
断面図、第３図は従来のガラスマウント用ケースにペレ
ットをマウントした他の構造を示す断面図、第４図は第
３図の従来のガラスマウント用ケースに基づくペレット
剥離モードを示す拡大断面図、第５図は米考案に基づく
ガラスラウン１〜用ケースの実施例を示す断面図、第６
図は第５図の一部拡大を示す断面図、である。
なお図において、１・・・・・・セラミック基体、２・
・・・・・キャビティー、３・・・−・・ペレット取付
は用低融点ガラス層、４・・・・・・低融点ガラス層、
５・・・・・・リードフレーム、６・・・・・・ペレッ
ト、７・・・・・・金属膜層、８・・・・・・メタライ
ズ、である。Figure 1 is a sectional view showing a structure in which a pellet is mounted on a conventional glass mount case, Figure 2 is an enlarged sectional view showing the pellet peeling mode based on a conventional glass mount case, and Figure 3 is a conventional glass mount case. A cross-sectional view showing another structure in which pellets are mounted in a mounting case. Fig. 4 is an enlarged cross-sectional view showing a pellet peeling mode based on the conventional glass mounting case shown in Fig. 3. Fig. 5 is a glass mount case based on the US invention. Sectional view showing an example of the case for rows 1 to 6.
The figure is a cross-sectional view showing a partially enlarged view of FIG. 5. In the figure, 1...ceramic base, 2...
...Cavity, 3...--Low melting point glass layer for pellet mounting, 4...Low melting point glass layer,
5... Lead frame, 6... Pellet, 7... Metal film layer, 8... Metallization.
Claims (1)
を介してリードフレームを固着して成るガラス封止型ケ
ースにおいて、該キャビティー内のダイアタッチ面上に
メタライズ層を有しかつ前記メタライズ層上に低融点ガ
ラス層を有することを特徴とするガラス封止型ケース。A glass-sealed case in which a lead frame is fixed to a ceramic substrate having a cavity through a low-melting glass, has a metallized layer on the die attach surface in the cavity, and has a low melting point on the metallized layer. A glass-sealed case characterized by having a melting point glass layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17680382U JPS5981039U (en) | 1982-11-22 | 1982-11-22 | Glass sealed case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17680382U JPS5981039U (en) | 1982-11-22 | 1982-11-22 | Glass sealed case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5981039U true JPS5981039U (en) | 1984-05-31 |
Family
ID=30384291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17680382U Pending JPS5981039U (en) | 1982-11-22 | 1982-11-22 | Glass sealed case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5981039U (en) |
-
1982
- 1982-11-22 JP JP17680382U patent/JPS5981039U/en active Pending
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