JPS6041044U - Glass sealed case - Google Patents

Glass sealed case

Info

Publication number
JPS6041044U
JPS6041044U JP13329583U JP13329583U JPS6041044U JP S6041044 U JPS6041044 U JP S6041044U JP 13329583 U JP13329583 U JP 13329583U JP 13329583 U JP13329583 U JP 13329583U JP S6041044 U JPS6041044 U JP S6041044U
Authority
JP
Japan
Prior art keywords
sealed case
glass
glass sealed
cavity
die attach
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13329583U
Other languages
Japanese (ja)
Inventor
高志 木下
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP13329583U priority Critical patent/JPS6041044U/en
Publication of JPS6041044U publication Critical patent/JPS6041044U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のガラスマウント用ケースにペレットをマ
ウントした構造を示す断面図、第２図は従来のガラスマ
ウント用ケースに基づくペレット剥離モードを示す拡大
断面図、第３図は従来のガラスマウント用ケースにペレ
ットをマウントした他の構造を示す断面図、第４図は第
３図の従来のガラスマウント用ケースに基づくペレ゛ン
、ト剥離モードを示す拡大断面図、第５図は本考案に基
づくガラスマウント用ケースの実施例を示す断面図、第
６図は第５図のガラスマウント用ケースにペレットをマ
ウントした構造を示す拡大断面図、第７図は本考案に基
づくガラスマウント用ケースに用いるセラミック基体の
斜視図、第８図は第７図の横断面拡大図、である。 なお図において、１・・・セラミック基体、２・・・キ
ャビティ、３・・・ペレット取付用低融点ガラス層、４
・・・低融点ガラス層、５・・・リードフレーム、６・
・・ペレット、７・・・金属膜層、８・・・連続凹凸形
状、である。 第　３　図 第　、５　図Figure 1 is a cross-sectional view showing a structure in which a pellet is mounted in a conventional glass mount case, Figure 2 is an enlarged cross-sectional view showing the pellet peeling mode based on a conventional glass mount case, and Figure 3 is a conventional glass mount case. 4 is an enlarged sectional view showing the pellet peeling mode based on the conventional glass mount case shown in FIG. 3, and FIG. 6 is an enlarged sectional view showing a structure in which pellets are mounted on the glass mount case of FIG. 5, and FIG. 7 is a glass mount case based on the present invention. FIG. 8 is an enlarged cross-sectional view of FIG. 7. In the figure, 1... Ceramic base, 2... Cavity, 3... Low melting point glass layer for pellet attachment, 4
...Low melting point glass layer, 5...Lead frame, 6.
... Pellet, 7... Metal film layer, 8... Continuous uneven shape. Figures 3 and 5

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キャビティーを有するセラミック基体に低融点ガラスを
介してリードフレームを固着して成るガラス封止型ケー
スにおいて、該キャビティー内のダイアタッチ面が複数
個の連続した凹凸形状を有しかつ前記ダイアタッチ面上
に低融点ガラス層を有することを特徴とするガラス封止
型ケース。In a glass-sealed case in which a lead frame is fixed to a ceramic base having a cavity through a low-melting glass, the die attach surface in the cavity has a plurality of continuous uneven shapes, and the die attach A glass-sealed case characterized by having a low melting point glass layer on its surface.
JP13329583U 1983-08-29 1983-08-29 Glass sealed case Pending JPS6041044U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13329583U JPS6041044U (en) 1983-08-29 1983-08-29 Glass sealed case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13329583U JPS6041044U (en) 1983-08-29 1983-08-29 Glass sealed case

Publications (1)

Publication Number Publication Date
JPS6041044U true JPS6041044U (en) 1985-03-23

Family

ID=30300733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13329583U Pending JPS6041044U (en) 1983-08-29 1983-08-29 Glass sealed case

Country Status (1)

Country Link
JP (1) JPS6041044U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201893A (en) * 1995-01-31 1995-08-04 Sony Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201893A (en) * 1995-01-31 1995-08-04 Sony Corp Semiconductor device

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