JPS6066036U - Ceramic chip kiyariya - Google Patents

Ceramic chip kiyariya

Info

Publication number
JPS6066036U
JPS6066036U JP15798683U JP15798683U JPS6066036U JP S6066036 U JPS6066036 U JP S6066036U JP 15798683 U JP15798683 U JP 15798683U JP 15798683 U JP15798683 U JP 15798683U JP S6066036 U JPS6066036 U JP S6066036U
Authority
JP
Japan
Prior art keywords
kiyariya
ceramic chip
ceramic
lead frame
ceramic package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15798683U
Other languages
Japanese (ja)
Inventor
宇佐美 和男
英明 園田
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP15798683U priority Critical patent/JPS6066036U/en
Publication of JPS6066036U publication Critical patent/JPS6066036U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の断面図、第2図は従来のセ
ラミックチップキャリアの実装図、第3図は本考案の製
造工程を示す図、第4図は本考案の一実施例の実装図で
ある。
Figure 1 is a cross-sectional view of an embodiment of the present invention, Figure 2 is a mounting diagram of a conventional ceramic chip carrier, Figure 3 is a diagram showing the manufacturing process of the present invention, and Figure 4 is an embodiment of the present invention. This is an implementation diagram.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミックパッケージ、ガラス封止材及びリードフレー
ムよりなり、前記リードフレームを前記セラミックパッ
ケージ面に沿って内側に折り曲げたことを特徴とするセ
ラミックチップキャリア。
A ceramic chip carrier comprising a ceramic package, a glass sealing material, and a lead frame, the lead frame being bent inward along the surface of the ceramic package.
JP15798683U 1983-10-14 1983-10-14 Ceramic chip kiyariya Pending JPS6066036U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15798683U JPS6066036U (en) 1983-10-14 1983-10-14 Ceramic chip kiyariya

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15798683U JPS6066036U (en) 1983-10-14 1983-10-14 Ceramic chip kiyariya

Publications (1)

Publication Number Publication Date
JPS6066036U true JPS6066036U (en) 1985-05-10

Family

ID=30348159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15798683U Pending JPS6066036U (en) 1983-10-14 1983-10-14 Ceramic chip kiyariya

Country Status (1)

Country Link
JP (1) JPS6066036U (en)

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