JPS60176558U - semiconductor pressure sensor - Google Patents

semiconductor pressure sensor

Info

Publication number
JPS60176558U
JPS60176558U JP6493984U JP6493984U JPS60176558U JP S60176558 U JPS60176558 U JP S60176558U JP 6493984 U JP6493984 U JP 6493984U JP 6493984 U JP6493984 U JP 6493984U JP S60176558 U JPS60176558 U JP S60176558U
Authority
JP
Japan
Prior art keywords
pressure sensor
semiconductor pressure
sensor chip
glass
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6493984U
Other languages
Japanese (ja)
Inventor
山原 清枝
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP6493984U priority Critical patent/JPS60176558U/en
Publication of JPS60176558U publication Critical patent/JPS60176558U/en
Pending legal-status Critical Current

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Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による半導体圧力センサの一実施例を示
す断面図、第2図は従来の半導体圧力センサの製造状態
を示す断面図である。 1・・・・・・圧力センサチップ、2,4・・・・・・
結晶化ガラス、3,5・・・・・・低融点ガラス。
FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor pressure sensor according to the present invention, and FIG. 2 is a cross-sectional view showing the manufacturing state of a conventional semiconductor pressure sensor. 1... Pressure sensor chip, 2, 4...
Crystallized glass, 3,5...Low melting point glass.

Claims (1)

【実用新案登録請求の範囲】 半導体圧力センサチップを低融点ガラスを介して結晶化
ガラスベースに接着してなる半導体圧力センサにおいて
、 前記結晶化ガラスベースのセンサチップ接続部の周辺を
湾曲させ、低融点ガラスを介して半導体圧力センサチッ
プをその上面にガラス接着したことを特徴とする半導体
圧力センサ。
[Claims for Utility Model Registration] A semiconductor pressure sensor in which a semiconductor pressure sensor chip is bonded to a crystallized glass base via a low-melting glass, in which the periphery of the sensor chip connection part of the crystallized glass base is curved to A semiconductor pressure sensor characterized in that a semiconductor pressure sensor chip is glass-bonded to the upper surface of the semiconductor pressure sensor chip via melting point glass.
JP6493984U 1984-05-02 1984-05-02 semiconductor pressure sensor Pending JPS60176558U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6493984U JPS60176558U (en) 1984-05-02 1984-05-02 semiconductor pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6493984U JPS60176558U (en) 1984-05-02 1984-05-02 semiconductor pressure sensor

Publications (1)

Publication Number Publication Date
JPS60176558U true JPS60176558U (en) 1985-11-22

Family

ID=30596485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6493984U Pending JPS60176558U (en) 1984-05-02 1984-05-02 semiconductor pressure sensor

Country Status (1)

Country Link
JP (1) JPS60176558U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62238671A (en) * 1986-04-09 1987-10-19 Ishizuka Glass Ltd Manufacture of semiconductor pressure transducer
JPS62242369A (en) * 1986-04-14 1987-10-22 Ishizuka Glass Ltd Semiconductor pressure transducer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62238671A (en) * 1986-04-09 1987-10-19 Ishizuka Glass Ltd Manufacture of semiconductor pressure transducer
JPS62242369A (en) * 1986-04-14 1987-10-22 Ishizuka Glass Ltd Semiconductor pressure transducer

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