JPS60176558U - semiconductor pressure sensor - Google Patents
semiconductor pressure sensorInfo
- Publication number
- JPS60176558U JPS60176558U JP6493984U JP6493984U JPS60176558U JP S60176558 U JPS60176558 U JP S60176558U JP 6493984 U JP6493984 U JP 6493984U JP 6493984 U JP6493984 U JP 6493984U JP S60176558 U JPS60176558 U JP S60176558U
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- semiconductor pressure
- sensor chip
- glass
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案による半導体圧力センサの一実施例を示
す断面図、第2図は従来の半導体圧力センサの製造状態
を示す断面図である。
1・・・・・・圧力センサチップ、2,4・・・・・・
結晶化ガラス、3,5・・・・・・低融点ガラス。FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor pressure sensor according to the present invention, and FIG. 2 is a cross-sectional view showing the manufacturing state of a conventional semiconductor pressure sensor. 1... Pressure sensor chip, 2, 4...
Crystallized glass, 3,5...Low melting point glass.
Claims (1)
ガラスベースに接着してなる半導体圧力センサにおいて
、 前記結晶化ガラスベースのセンサチップ接続部の周辺を
湾曲させ、低融点ガラスを介して半導体圧力センサチッ
プをその上面にガラス接着したことを特徴とする半導体
圧力センサ。[Claims for Utility Model Registration] A semiconductor pressure sensor in which a semiconductor pressure sensor chip is bonded to a crystallized glass base via a low-melting glass, in which the periphery of the sensor chip connection part of the crystallized glass base is curved to A semiconductor pressure sensor characterized in that a semiconductor pressure sensor chip is glass-bonded to the upper surface of the semiconductor pressure sensor chip via melting point glass.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6493984U JPS60176558U (en) | 1984-05-02 | 1984-05-02 | semiconductor pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6493984U JPS60176558U (en) | 1984-05-02 | 1984-05-02 | semiconductor pressure sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60176558U true JPS60176558U (en) | 1985-11-22 |
Family
ID=30596485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6493984U Pending JPS60176558U (en) | 1984-05-02 | 1984-05-02 | semiconductor pressure sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60176558U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62238671A (en) * | 1986-04-09 | 1987-10-19 | Ishizuka Glass Ltd | Manufacture of semiconductor pressure transducer |
JPS62242369A (en) * | 1986-04-14 | 1987-10-22 | Ishizuka Glass Ltd | Semiconductor pressure transducer |
-
1984
- 1984-05-02 JP JP6493984U patent/JPS60176558U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62238671A (en) * | 1986-04-09 | 1987-10-19 | Ishizuka Glass Ltd | Manufacture of semiconductor pressure transducer |
JPS62242369A (en) * | 1986-04-14 | 1987-10-22 | Ishizuka Glass Ltd | Semiconductor pressure transducer |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS60176558U (en) | semiconductor pressure sensor | |
JPS6117751U (en) | Tape carrier semiconductor device | |
JPS6124467U (en) | crucible | |
JPS59125130U (en) | filter | |
JPS59164241U (en) | Ceramic package | |
JPS591178U (en) | cassette half | |
JPS59112133U (en) | pressure sensor | |
JPS6134733U (en) | semiconductor wafer | |
JPS6083242U (en) | electronic circuit element | |
JPS6027434U (en) | Capillary for wire bonding | |
JPS5844842U (en) | semiconductor equipment | |
JPS617038U (en) | Resin-encapsulated semiconductor device | |
JPS59135861U (en) | brazing structure | |
JPS6013490U (en) | watch glass protector | |
JPS6142845U (en) | flat package | |
JPS581321U (en) | jewel | |
JPS6052635U (en) | lead frame | |
JPS6016553U (en) | Resin-encapsulated semiconductor device | |
JPS5974054U (en) | polishing jig | |
JPS585346U (en) | semiconductor equipment | |
JPS6123717U (en) | flat package | |
JPS6115748U (en) | semiconductor equipment | |
JPS5896509U (en) | Optical coupler protective cap | |
JPS58147250U (en) | package | |
JPS59127247U (en) | Glass sealed semiconductor device |