JPS6115748U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6115748U
JPS6115748U JP1984101138U JP10113884U JPS6115748U JP S6115748 U JPS6115748 U JP S6115748U JP 1984101138 U JP1984101138 U JP 1984101138U JP 10113884 U JP10113884 U JP 10113884U JP S6115748 U JPS6115748 U JP S6115748U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
chip
semiconductor device
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984101138U
Other languages
Japanese (ja)
Inventor
亮一 小林
孝三 西本
淳哉 植川
健司 上田
康夫 土江
Original Assignee
株式会社 三社電機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 三社電機製作所 filed Critical 株式会社 三社電機製作所
Priority to JP1984101138U priority Critical patent/JPS6115748U/en
Publication of JPS6115748U publication Critical patent/JPS6115748U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の半導体装置の構造図、第２図はこの考
案の半導体一置の構造図を示す。 １・・・チップ、７・・・Ｌ型端子、，８・・・クツシ
ョク部。FIG. 1 is a structural diagram of a conventional semiconductor device, and FIG. 2 is a structural diagram of a semiconductor device of this invention. 1... Chip, 7... L-type terminal, , 8... Cushion part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一つ以上の接合部を有するチップと、−このチップに直
接接合された外部リード接続用端子を有する半導体装置
において、前記端子に階段部分等のクッション部を設け
たことを特徴とする半導体装置。1. A semiconductor device comprising a chip having one or more bonding portions, and an external lead connection terminal directly bonded to the chip, characterized in that the terminal is provided with a cushion portion such as a stepped portion.
JP1984101138U 1984-07-03 1984-07-03 semiconductor equipment Pending JPS6115748U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984101138U JPS6115748U (en) 1984-07-03 1984-07-03 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984101138U JPS6115748U (en) 1984-07-03 1984-07-03 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6115748U true JPS6115748U (en) 1986-01-29

Family

ID=30660578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984101138U Pending JPS6115748U (en) 1984-07-03 1984-07-03 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6115748U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131680A (en) * 1973-04-21 1974-12-17
JPS5287979A (en) * 1976-01-19 1977-07-22 Hitachi Ltd Semiconductor device
JPS5340764B2 (en) * 1974-07-20 1978-10-28

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131680A (en) * 1973-04-21 1974-12-17
JPS5340764B2 (en) * 1974-07-20 1978-10-28
JPS5287979A (en) * 1976-01-19 1977-07-22 Hitachi Ltd Semiconductor device

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