JPS6115749U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6115749U JPS6115749U JP10113984U JP10113984U JPS6115749U JP S6115749 U JPS6115749 U JP S6115749U JP 10113984 U JP10113984 U JP 10113984U JP 10113984 U JP10113984 U JP 10113984U JP S6115749 U JPS6115749 U JP S6115749U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor equipment
- semiconductor device
- hard resin
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の半導体装置の構造図、第２図は、この
考案の一実施例の半導体装置の構造図で・ある。
１・・・半導体チップ、２，３．５・・・リード線、７
・・・取付け板、８・・・軟質樹脂、１１・・・硬質樹
脂、１２，１３，１４・・・チューブ。FIG. 1 is a structural diagram of a conventional semiconductor device, and FIG. 2 is a structural diagram of a semiconductor device according to an embodiment of this invention. 1... Semiconductor chip, 2, 3.5... Lead wire, 7
... Mounting plate, 8... Soft resin, 11... Hard resin, 12, 13, 14... Tube.
Claims (1)
板と、前記半導体チップを被う軟質樹脂と、この軟質樹
脂を被う硬質樹脂により構成された半導体装置において
、硬質樹脂に接するリード線に伸縮性チューブを被覆し
た半導体装置。In a semiconductor device composed of a semiconductor chip, a mounting plate for mounting the semiconductor chip, a soft resin covering the semiconductor chip, and a hard resin covering the soft resin, an elastic tube is attached to a lead wire in contact with the hard resin. coated semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10113984U JPS6115749U (en) | 1984-07-03 | 1984-07-03 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10113984U JPS6115749U (en) | 1984-07-03 | 1984-07-03 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6115749U true JPS6115749U (en) | 1986-01-29 |
Family
ID=30660579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10113984U Pending JPS6115749U (en) | 1984-07-03 | 1984-07-03 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6115749U (en) |
-
1984
- 1984-07-03 JP JP10113984U patent/JPS6115749U/en active Pending
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