JPS5974054U - polishing jig - Google Patents

polishing jig

Info

Publication number
JPS5974054U
JPS5974054U JP1982168731U JP16873182U JPS5974054U JP S5974054 U JPS5974054 U JP S5974054U JP 1982168731 U JP1982168731 U JP 1982168731U JP 16873182 U JP16873182 U JP 16873182U JP S5974054 U JPS5974054 U JP S5974054U
Authority
JP
Japan
Prior art keywords
bonding
polishing jig
bonding part
wafer
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982168731U
Other languages
Japanese (ja)
Inventor
鈴木 成和
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1982168731U priority Critical patent/JPS5974054U/en
Publication of JPS5974054U publication Critical patent/JPS5974054U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の研磨治具の断面図、第2図−は本考案の
一実施例の平面図、第3図は第2図のA−A線断面図で
ある。 4:接着部、6:基台部、訃・・ウェハ。
FIG. 1 is a sectional view of a conventional polishing jig, FIG. 2 is a plan view of an embodiment of the present invention, and FIG. 3 is a sectional view taken along the line A--A in FIG. 4: Adhesive part, 6: Base part, wafer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の主面にウェハを接着する接着面が形成され、上記
ウェハと同程度の膨張係数を有する板状の接着部と、こ
の接着部の他方の主面が接合され上記接着部より低い膨
張係数を有しかつ上記接着部より厚肉の板状に形成され
た基台部とを具備することを特徴とする研磨治具。
A bonding surface for bonding a wafer is formed on one main surface, and a plate-shaped bonding part having a coefficient of expansion comparable to that of the wafer is bonded to the other main surface of the bonding part, which has a coefficient of expansion lower than that of the bonding part. and a base portion formed into a plate shape with a thicker wall than the adhesive portion.
JP1982168731U 1982-11-09 1982-11-09 polishing jig Pending JPS5974054U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982168731U JPS5974054U (en) 1982-11-09 1982-11-09 polishing jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982168731U JPS5974054U (en) 1982-11-09 1982-11-09 polishing jig

Publications (1)

Publication Number Publication Date
JPS5974054U true JPS5974054U (en) 1984-05-19

Family

ID=30368803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982168731U Pending JPS5974054U (en) 1982-11-09 1982-11-09 polishing jig

Country Status (1)

Country Link
JP (1) JPS5974054U (en)

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