JPS5974054U - polishing jig - Google Patents
polishing jigInfo
- Publication number
- JPS5974054U JPS5974054U JP1982168731U JP16873182U JPS5974054U JP S5974054 U JPS5974054 U JP S5974054U JP 1982168731 U JP1982168731 U JP 1982168731U JP 16873182 U JP16873182 U JP 16873182U JP S5974054 U JPS5974054 U JP S5974054U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- polishing jig
- bonding part
- wafer
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の研磨治具の断面図、第2図−は本考案の
一実施例の平面図、第3図は第2図のA−A線断面図で
ある。
4:接着部、6:基台部、訃・・ウェハ。FIG. 1 is a sectional view of a conventional polishing jig, FIG. 2 is a plan view of an embodiment of the present invention, and FIG. 3 is a sectional view taken along the line A--A in FIG. 4: Adhesive part, 6: Base part, wafer.
Claims (1)
ウェハと同程度の膨張係数を有する板状の接着部と、こ
の接着部の他方の主面が接合され上記接着部より低い膨
張係数を有しかつ上記接着部より厚肉の板状に形成され
た基台部とを具備することを特徴とする研磨治具。A bonding surface for bonding a wafer is formed on one main surface, and a plate-shaped bonding part having a coefficient of expansion comparable to that of the wafer is bonded to the other main surface of the bonding part, which has a coefficient of expansion lower than that of the bonding part. and a base portion formed into a plate shape with a thicker wall than the adhesive portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982168731U JPS5974054U (en) | 1982-11-09 | 1982-11-09 | polishing jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982168731U JPS5974054U (en) | 1982-11-09 | 1982-11-09 | polishing jig |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5974054U true JPS5974054U (en) | 1984-05-19 |
Family
ID=30368803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982168731U Pending JPS5974054U (en) | 1982-11-09 | 1982-11-09 | polishing jig |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5974054U (en) |
-
1982
- 1982-11-09 JP JP1982168731U patent/JPS5974054U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5974054U (en) | polishing jig | |
JPS60176558U (en) | semiconductor pressure sensor | |
JPS60156754U (en) | heat sink | |
JPS59151450U (en) | semiconductor equipment | |
JPS60138743U (en) | flexible sheet | |
JPS5866690U (en) | hybrid integrated circuit | |
JPS5996883U (en) | electronic components | |
JPS6078158U (en) | hybrid integrated circuit board | |
JPS58116234U (en) | Thick film module heat sink | |
JPS6127579U (en) | Work receiving post | |
JPS60152852U (en) | Vibration isolator | |
JPS5934961U (en) | Mold polishing tool | |
JPS60176171U (en) | Plate capillary column | |
JPS60100102U (en) | Bit mount auxiliary tool | |
JPS5912842U (en) | double-sided adhesive tape | |
JPS5940434U (en) | Joint of tiles | |
JPS59158618U (en) | Tile with family crest | |
JPS5928122U (en) | roofing material | |
JPS6128631U (en) | Structure of adhesive part | |
JPS596834U (en) | silicon wafer | |
JPS58156913U (en) | glass tiles | |
JPS6057131U (en) | Holding jig | |
JPS6013744U (en) | Hybrid integrated circuit device | |
JPS60130935U (en) | indoor floor structure | |
JPS5916147U (en) | semiconductor equipment |