JPS5650548A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5650548A
JPS5650548A JP12760279A JP12760279A JPS5650548A JP S5650548 A JPS5650548 A JP S5650548A JP 12760279 A JP12760279 A JP 12760279A JP 12760279 A JP12760279 A JP 12760279A JP S5650548 A JPS5650548 A JP S5650548A
Authority
JP
Japan
Prior art keywords
refrigerant
sealing
container
semiconductor device
unsealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12760279A
Other languages
Japanese (ja)
Inventor
Kazuo Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12760279A priority Critical patent/JPS5650548A/en
Publication of JPS5650548A publication Critical patent/JPS5650548A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To accomplish sealing without flowing the injected refrigerant out of the container in the semiconductor device having a structure wherein the semiconductor chip is cooled by using the refrigerant; by injecting the refrigerant into the container from the part of a sealing member which is not sealed yet. CONSTITUTION:The semiconductor chip 2 is placed on the container member 4 by using a brazing material 3, and is connected to a metallized layer 6 with thin metal wires 5. When a lid member 8 is welded to the container member 4 by the seam welding and sealing is performed, a part of the sealing member is remained unsealed. When the semiconductor device having unsealed part 10 is immersed in the refrigerant such as phluorocarbon and the like, the refrigerant is injected through the unsealed part 10. When the injection of said refrigerant has finished, the semiconductor device is taken out of the refrigerating bath, and unsealed part 10 is sealed by the seam welding. Since the sealing is performed by partial heating, the sealing can be accomplished without flowing the injected refrigerant out of the container.
JP12760279A 1979-10-02 1979-10-02 Manufacture of semiconductor device Pending JPS5650548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12760279A JPS5650548A (en) 1979-10-02 1979-10-02 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12760279A JPS5650548A (en) 1979-10-02 1979-10-02 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5650548A true JPS5650548A (en) 1981-05-07

Family

ID=14964138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12760279A Pending JPS5650548A (en) 1979-10-02 1979-10-02 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5650548A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169894U (en) * 1987-04-24 1988-11-04
JPH01503426A (en) * 1987-05-07 1989-11-16 エヌシーアール インターナショナル インコーポレイテッド Integrated circuit packaging assembly
JP2008004688A (en) * 2006-06-21 2008-01-10 Noda Screen:Kk Semiconductor package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169894U (en) * 1987-04-24 1988-11-04
JPH01503426A (en) * 1987-05-07 1989-11-16 エヌシーアール インターナショナル インコーポレイテッド Integrated circuit packaging assembly
JP2008004688A (en) * 2006-06-21 2008-01-10 Noda Screen:Kk Semiconductor package

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