JPS5464050A - Soldering tool and its using method - Google Patents

Soldering tool and its using method

Info

Publication number
JPS5464050A
JPS5464050A JP13053677A JP13053677A JPS5464050A JP S5464050 A JPS5464050 A JP S5464050A JP 13053677 A JP13053677 A JP 13053677A JP 13053677 A JP13053677 A JP 13053677A JP S5464050 A JPS5464050 A JP S5464050A
Authority
JP
Japan
Prior art keywords
tool
soldering
contact point
solder
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13053677A
Other languages
Japanese (ja)
Other versions
JPS5615987B2 (en
Inventor
Hiroshi Abe
Shigemi Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13053677A priority Critical patent/JPS5464050A/en
Publication of JPS5464050A publication Critical patent/JPS5464050A/en
Publication of JPS5615987B2 publication Critical patent/JPS5615987B2/ja
Granted legal-status Critical Current

Links

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  • Manufacture Of Switches (AREA)

Abstract

PURPOSE: To prevent the leakage of solder from soldering tool by the procedure in which the skirted portion of a soldering tool whose upper metal ring inside surface is provided with an oxide film is welded onto the one bonding metal and then the other bonding metal is inserted into the soldering tool through solder.
CONSTITUTION: The upper inside surface of the metal ring 13 with the skirted portion 13 of the soldering tool 11 is provided with the oxide film 14 to confer an anti- soldering property upon it. The tip side of the part 2 is given the projection 2a with the same diameter as the contact point 1, and after the projection 2a is fitted into the tool 1, the skirted portion 12 of the tool 11 and the part 2a are welded while holding them with electrodes from both the upper and lower sides. Then, the disc- shaped solder 10 and the button-shaped contact point 1 are inserted into the tool 11 fastened to the part 2, and then the contact point 1 is welded by heating in an oven, Thus, exact positioning is made possible and also the detaching process for the tool 11 can be eliminated, thus enhancing the workability of soldering.
COPYRIGHT: (C)1979,JPO&Japio
JP13053677A 1977-10-31 1977-10-31 Soldering tool and its using method Granted JPS5464050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13053677A JPS5464050A (en) 1977-10-31 1977-10-31 Soldering tool and its using method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13053677A JPS5464050A (en) 1977-10-31 1977-10-31 Soldering tool and its using method

Publications (2)

Publication Number Publication Date
JPS5464050A true JPS5464050A (en) 1979-05-23
JPS5615987B2 JPS5615987B2 (en) 1981-04-14

Family

ID=15036629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13053677A Granted JPS5464050A (en) 1977-10-31 1977-10-31 Soldering tool and its using method

Country Status (1)

Country Link
JP (1) JPS5464050A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015133577A1 (en) * 2014-03-07 2015-09-11 日本碍子株式会社 Joint manufacturing method
JP2015231633A (en) * 2014-06-10 2015-12-24 横浜ゴム株式会社 Manufacturing method of work of using brazing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03241280A (en) * 1990-02-19 1991-10-28 Toshiba Corp Housing of refrigerator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5017307A (en) * 1973-06-21 1975-02-24
JPS5218173A (en) * 1975-08-01 1977-02-10 Mitsubishi Electric Corp Soldering method of semiconductor element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5017307A (en) * 1973-06-21 1975-02-24
JPS5218173A (en) * 1975-08-01 1977-02-10 Mitsubishi Electric Corp Soldering method of semiconductor element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015133577A1 (en) * 2014-03-07 2015-09-11 日本碍子株式会社 Joint manufacturing method
CN106068251A (en) * 2014-03-07 2016-11-02 日本碍子株式会社 The manufacture method of conjugant
JPWO2015133577A1 (en) * 2014-03-07 2017-04-06 日本碍子株式会社 Manufacturing method of joined body
US10150709B2 (en) 2014-03-07 2018-12-11 Ngk Insulators, Ltd. Joined body manufacturing method
JP2015231633A (en) * 2014-06-10 2015-12-24 横浜ゴム株式会社 Manufacturing method of work of using brazing

Also Published As

Publication number Publication date
JPS5615987B2 (en) 1981-04-14

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