JPS57118650A - Method for solder welding - Google Patents

Method for solder welding

Info

Publication number
JPS57118650A
JPS57118650A JP56196773A JP19677381A JPS57118650A JP S57118650 A JPS57118650 A JP S57118650A JP 56196773 A JP56196773 A JP 56196773A JP 19677381 A JP19677381 A JP 19677381A JP S57118650 A JPS57118650 A JP S57118650A
Authority
JP
Japan
Prior art keywords
chip
solder
lifted
reliability
metal electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56196773A
Other languages
Japanese (ja)
Other versions
JPS5751253B2 (en
Inventor
Masanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56196773A priority Critical patent/JPS57118650A/en
Publication of JPS57118650A publication Critical patent/JPS57118650A/en
Publication of JPS5751253B2 publication Critical patent/JPS5751253B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

PURPOSE:To increase the reliability of the connection of chip parts by a method wherein, when a chip and the metal electrode on a substrate are joind together using solder, the chip is lifted by a supporting tool when performing a welding work, and the connected part is formed in cylindrical shape. CONSTITUTION:A solder bump 2 is formed on the circumference of the chip 1, and after the chip has been temporary attached to the metal electrode 3 on the ceramic substrate 1 and the solder is wetted by heating at the temperature of 314 deg.C or above, the chip is lifted up so that the solder welding part will be cylrndrically formed using a vacuum chuck type tool 6 while the solder is fused. Through these procedures, the reliability of the connection of chip parts can be improved.
JP56196773A 1981-12-09 1981-12-09 Method for solder welding Granted JPS57118650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56196773A JPS57118650A (en) 1981-12-09 1981-12-09 Method for solder welding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56196773A JPS57118650A (en) 1981-12-09 1981-12-09 Method for solder welding

Publications (2)

Publication Number Publication Date
JPS57118650A true JPS57118650A (en) 1982-07-23
JPS5751253B2 JPS5751253B2 (en) 1982-11-01

Family

ID=16363383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56196773A Granted JPS57118650A (en) 1981-12-09 1981-12-09 Method for solder welding

Country Status (1)

Country Link
JP (1) JPS57118650A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62200488A (en) * 1986-02-28 1987-09-04 Sumitomo Electric Ind Ltd Optical character reader

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62200488A (en) * 1986-02-28 1987-09-04 Sumitomo Electric Ind Ltd Optical character reader

Also Published As

Publication number Publication date
JPS5751253B2 (en) 1982-11-01

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