JPS54154275A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54154275A
JPS54154275A JP6224878A JP6224878A JPS54154275A JP S54154275 A JPS54154275 A JP S54154275A JP 6224878 A JP6224878 A JP 6224878A JP 6224878 A JP6224878 A JP 6224878A JP S54154275 A JPS54154275 A JP S54154275A
Authority
JP
Japan
Prior art keywords
lead
bar
pair
fusing point
semiconductor bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6224878A
Other languages
Japanese (ja)
Inventor
Akira Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6224878A priority Critical patent/JPS54154275A/en
Publication of JPS54154275A publication Critical patent/JPS54154275A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To secure the chemical stability when the semiconductor bar held between a pair of electrode leads is stored into the glass sleeve, by providing the Pb-Sn alloy solder containing a minute amount of Zn or the like between the lead and the semiconductor bar as well as between the lead outer circumfernce and the sleeve inner circumference each.
CONSTITUTION: Pb-Sn alloy solder 15a and 15b containing a minute amount of Zn, Sb, Ti and Si and featuring a lowered fusing point are covered over the surfaces of a pair of electrode leads 11a and 11b composed of W, Mo and the like and with the lead wire provided. Then semiconductor bar 12 containing vamp 13 formed previouly is put into glass sleeve 14 by means of a tool, and electrode lead 11a and 11b containing solder 15a and 15b coated at its both sides are pushed in to hold bar 12 between. After this, the heat treatment is given at 150W300°C to weld these elements together into one body. And bar 12 is never damaged since the fusing point is lowered down previously.
COPYRIGHT: (C)1979,JPO&Japio
JP6224878A 1978-05-26 1978-05-26 Semiconductor device Pending JPS54154275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6224878A JPS54154275A (en) 1978-05-26 1978-05-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6224878A JPS54154275A (en) 1978-05-26 1978-05-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54154275A true JPS54154275A (en) 1979-12-05

Family

ID=13194640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6224878A Pending JPS54154275A (en) 1978-05-26 1978-05-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54154275A (en)

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