JPS5210091A - Mounting method of radiation detector element - Google Patents

Mounting method of radiation detector element

Info

Publication number
JPS5210091A
JPS5210091A JP50086305A JP8630575A JPS5210091A JP S5210091 A JPS5210091 A JP S5210091A JP 50086305 A JP50086305 A JP 50086305A JP 8630575 A JP8630575 A JP 8630575A JP S5210091 A JPS5210091 A JP S5210091A
Authority
JP
Japan
Prior art keywords
radiation detector
mounting method
detector element
elecment
altogether
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50086305A
Other languages
Japanese (ja)
Inventor
Ryuichi Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP50086305A priority Critical patent/JPS5210091A/en
Publication of JPS5210091A publication Critical patent/JPS5210091A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Light Receiving Elements (AREA)

Abstract

PURPOSE: To perform the connection of lead wire to the electrode of detector elecment simply and without the degradation and damage of the element by making use of the adhesion by press welding of soft metal especially indium altogether.
COPYRIGHT: (C)1977,JPO&Japio
JP50086305A 1975-07-15 1975-07-15 Mounting method of radiation detector element Pending JPS5210091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50086305A JPS5210091A (en) 1975-07-15 1975-07-15 Mounting method of radiation detector element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50086305A JPS5210091A (en) 1975-07-15 1975-07-15 Mounting method of radiation detector element

Publications (1)

Publication Number Publication Date
JPS5210091A true JPS5210091A (en) 1977-01-26

Family

ID=13883112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50086305A Pending JPS5210091A (en) 1975-07-15 1975-07-15 Mounting method of radiation detector element

Country Status (1)

Country Link
JP (1) JPS5210091A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867368A (en) * 1997-09-09 1999-02-02 Amkor Technology, Inc. Mounting for a semiconductor integrated circuit device
US5949655A (en) * 1997-09-09 1999-09-07 Amkor Technology, Inc. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
US6448635B1 (en) 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4729568U (en) * 1971-05-01 1972-12-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4729568U (en) * 1971-05-01 1972-12-04

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867368A (en) * 1997-09-09 1999-02-02 Amkor Technology, Inc. Mounting for a semiconductor integrated circuit device
US5949655A (en) * 1997-09-09 1999-09-07 Amkor Technology, Inc. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
US6448635B1 (en) 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip

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