JPS559450A - Container for semiconductor device - Google Patents

Container for semiconductor device

Info

Publication number
JPS559450A
JPS559450A JP8241078A JP8241078A JPS559450A JP S559450 A JPS559450 A JP S559450A JP 8241078 A JP8241078 A JP 8241078A JP 8241078 A JP8241078 A JP 8241078A JP S559450 A JPS559450 A JP S559450A
Authority
JP
Japan
Prior art keywords
cap
holes
wider
shorter sides
seal frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8241078A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8241078A priority Critical patent/JPS559450A/en
Publication of JPS559450A publication Critical patent/JPS559450A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To improve reliability of the device by drilling holes on the surface of a seal frame where a cap is placed and by forming profections on the cap which can be inserted into the holes for location.
CONSTITUTION: A connecting part 2, around which is set a joining pad 3, is set on the bottom of a rectangular concavity placed in the middle of a ceramic base plate 1; then it is connected to an outside lead 5 through a middle layer of the base plate 1. A metallic layer 11 is made on the part higher than the pad 3 by one stage to be wider on thew shorter sides. A seal frame 4' to be brazed to the metallic layer 11 is formed in a rectangular frame shape to be wider on shorter sides where round holes 12 are made on the cap-placing surface. Projections 13 to be fitted into the holes 12 are made on a cap 6' of copal. The projections 13 are for lacation whose size is about 0.5mm. The shorter sides of the seal frame being made thus wider, the brazing are increases to increase connecting strength. Additional concavity and convexity for location ensures low restriction, which prevents cracking, thus improving reliability of a seam welding package.
COPYRIGHT: (C)1980,JPO&Japio
JP8241078A 1978-07-05 1978-07-05 Container for semiconductor device Pending JPS559450A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8241078A JPS559450A (en) 1978-07-05 1978-07-05 Container for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8241078A JPS559450A (en) 1978-07-05 1978-07-05 Container for semiconductor device

Publications (1)

Publication Number Publication Date
JPS559450A true JPS559450A (en) 1980-01-23

Family

ID=13773809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8241078A Pending JPS559450A (en) 1978-07-05 1978-07-05 Container for semiconductor device

Country Status (1)

Country Link
JP (1) JPS559450A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56134525A (en) * 1980-02-19 1981-10-21 Laporte Industries Ltd Oxide ore dressing method
JPS59173343U (en) * 1983-05-06 1984-11-19 松下電器産業株式会社 Semiconductor element storage container

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56134525A (en) * 1980-02-19 1981-10-21 Laporte Industries Ltd Oxide ore dressing method
JPS59173343U (en) * 1983-05-06 1984-11-19 松下電器産業株式会社 Semiconductor element storage container
JPS6334276Y2 (en) * 1983-05-06 1988-09-12

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