JPS5343477A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5343477A
JPS5343477A JP11818576A JP11818576A JPS5343477A JP S5343477 A JPS5343477 A JP S5343477A JP 11818576 A JP11818576 A JP 11818576A JP 11818576 A JP11818576 A JP 11818576A JP S5343477 A JPS5343477 A JP S5343477A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealing material
throughhole
cap
closing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11818576A
Other languages
Japanese (ja)
Inventor
Kenichi Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11818576A priority Critical patent/JPS5343477A/en
Publication of JPS5343477A publication Critical patent/JPS5343477A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the production of air bubbles in the sealing material at the sealing interface between a ceramic substrate and a cap by providing a throughhole which is convergent toward the cavity side to part of a package constituting a semiconductor device and closing said through-hole with a molten sealing material.
COPYRIGHT: (C)1978,JPO&Japio
JP11818576A 1976-09-30 1976-09-30 Semiconductor device Pending JPS5343477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11818576A JPS5343477A (en) 1976-09-30 1976-09-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11818576A JPS5343477A (en) 1976-09-30 1976-09-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5343477A true JPS5343477A (en) 1978-04-19

Family

ID=14730241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11818576A Pending JPS5343477A (en) 1976-09-30 1976-09-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5343477A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178446U (en) * 1981-05-07 1982-11-11
JPS5815260A (en) * 1981-07-21 1983-01-28 Denki Kagaku Kogyo Kk Sealing agent for semiconductor package
JPS58106956U (en) * 1982-01-18 1983-07-21 沖電気工業株式会社 storage container
JPS601894A (en) * 1983-06-17 1985-01-08 株式会社村田製作所 Electronic part
WO2005109528A1 (en) * 2004-05-12 2005-11-17 Hamamatsu Photonics K.K. Electronic part and method of producing the same
JP2007335507A (en) * 2006-06-13 2007-12-27 Shinko Electric Ind Co Ltd Semiconductor device and its manufacturing method
JP4570301B2 (en) * 2001-09-27 2010-10-27 京セラ株式会社 Electronic component storage container
JP2014049762A (en) * 2012-08-31 2014-03-17 Freescale Semiconductor Inc Leadframes, air-cavity packages and electronic devices with offset vent holes, and methods of their manufacture
JP2017036940A (en) * 2015-08-07 2017-02-16 セイコーエプソン株式会社 Electronic device, method for manufacturing electronic device, electronic apparatus, and mobile body

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629728Y2 (en) * 1981-05-07 1987-03-06
JPS57178446U (en) * 1981-05-07 1982-11-11
JPS5815260A (en) * 1981-07-21 1983-01-28 Denki Kagaku Kogyo Kk Sealing agent for semiconductor package
JPS623983B2 (en) * 1981-07-21 1987-01-28 Denki Kagaku Kogyo Kk
JPS58106956U (en) * 1982-01-18 1983-07-21 沖電気工業株式会社 storage container
JPH0251276B2 (en) * 1983-06-17 1990-11-06 Murata Manufacturing Co
JPS601894A (en) * 1983-06-17 1985-01-08 株式会社村田製作所 Electronic part
JP4570301B2 (en) * 2001-09-27 2010-10-27 京セラ株式会社 Electronic component storage container
WO2005109528A1 (en) * 2004-05-12 2005-11-17 Hamamatsu Photonics K.K. Electronic part and method of producing the same
JP2005327818A (en) * 2004-05-12 2005-11-24 Hamamatsu Photonics Kk Electronic part and its manufacturing method
JP4598432B2 (en) * 2004-05-12 2010-12-15 浜松ホトニクス株式会社 Electronic component and manufacturing method thereof
JP2007335507A (en) * 2006-06-13 2007-12-27 Shinko Electric Ind Co Ltd Semiconductor device and its manufacturing method
JP2014049762A (en) * 2012-08-31 2014-03-17 Freescale Semiconductor Inc Leadframes, air-cavity packages and electronic devices with offset vent holes, and methods of their manufacture
JP2017036940A (en) * 2015-08-07 2017-02-16 セイコーエプソン株式会社 Electronic device, method for manufacturing electronic device, electronic apparatus, and mobile body

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