JPS5313363A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5313363A
JPS5313363A JP8750176A JP8750176A JPS5313363A JP S5313363 A JPS5313363 A JP S5313363A JP 8750176 A JP8750176 A JP 8750176A JP 8750176 A JP8750176 A JP 8750176A JP S5313363 A JPS5313363 A JP S5313363A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
copper
pwoer
hte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8750176A
Other languages
Japanese (ja)
Other versions
JPS5951132B2 (en
Inventor
Nobuaki Ineya
Toshikatsu Tsunehiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8750176A priority Critical patent/JPS5951132B2/en
Publication of JPS5313363A publication Critical patent/JPS5313363A/en
Publication of JPS5951132B2 publication Critical patent/JPS5951132B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: A mold base is made of copper or copper alloy, hte part except a cavity block fixing surface is covered with adiabatic materials, thereby saving the pwoer and eliminating temperature nonuniformity.
COPYRIGHT: (C)1978,JPO&Japio
JP8750176A 1976-07-22 1976-07-22 Semiconductor device manufacturing equipment Expired JPS5951132B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8750176A JPS5951132B2 (en) 1976-07-22 1976-07-22 Semiconductor device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8750176A JPS5951132B2 (en) 1976-07-22 1976-07-22 Semiconductor device manufacturing equipment

Publications (2)

Publication Number Publication Date
JPS5313363A true JPS5313363A (en) 1978-02-06
JPS5951132B2 JPS5951132B2 (en) 1984-12-12

Family

ID=13916716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8750176A Expired JPS5951132B2 (en) 1976-07-22 1976-07-22 Semiconductor device manufacturing equipment

Country Status (1)

Country Link
JP (1) JPS5951132B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159179A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Metal mold for resin molding
JPS62166631U (en) * 1986-05-17 1987-10-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159179A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Metal mold for resin molding
JPS62166631U (en) * 1986-05-17 1987-10-22

Also Published As

Publication number Publication date
JPS5951132B2 (en) 1984-12-12

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