JPS6428853A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6428853A
JPS6428853A JP62183395A JP18339587A JPS6428853A JP S6428853 A JPS6428853 A JP S6428853A JP 62183395 A JP62183395 A JP 62183395A JP 18339587 A JP18339587 A JP 18339587A JP S6428853 A JPS6428853 A JP S6428853A
Authority
JP
Japan
Prior art keywords
trench
solder material
cap
sealing
superfluous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62183395A
Other languages
Japanese (ja)
Inventor
Isao Sasahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd, Hitachi Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP62183395A priority Critical patent/JPS6428853A/en
Publication of JPS6428853A publication Critical patent/JPS6428853A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the quality of a semiconductor device, by forming a trench spaced a specified distance away from a cap, in the peripheral vicinity of the cap on a base surface, and absorbing the influence of superfluous solder material unnecessary for sealing. CONSTITUTION:On the periphery of a cap 7 of ceramic, a trench 9 is formed to absorb superfluous part of solder material 8 like Au-Sn which flows into there. The distance from the end-portion of the cap 7 to the trench 9, and the size of the trench 9 are experimentally obtained, and so set that only the solder material unnecessary for sealing flows into there. Thereby, the superfluous solder material unnecessary for sealing can be made to flow into the trench 9, so that the effect of the superfluous solder material unnecessary for sealing can be absorved, and the quality of a semiconductor device can be improved.
JP62183395A 1987-07-24 1987-07-24 Semiconductor device Pending JPS6428853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62183395A JPS6428853A (en) 1987-07-24 1987-07-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62183395A JPS6428853A (en) 1987-07-24 1987-07-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6428853A true JPS6428853A (en) 1989-01-31

Family

ID=16135027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62183395A Pending JPS6428853A (en) 1987-07-24 1987-07-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6428853A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703397A (en) * 1991-11-28 1997-12-30 Tokyo Shibaura Electric Co Semiconductor package having an aluminum nitride substrate
JP2013251476A (en) * 2012-06-04 2013-12-12 Ngk Spark Plug Co Ltd Ceramic package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703397A (en) * 1991-11-28 1997-12-30 Tokyo Shibaura Electric Co Semiconductor package having an aluminum nitride substrate
JP2013251476A (en) * 2012-06-04 2013-12-12 Ngk Spark Plug Co Ltd Ceramic package

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