JP2013251476A - Ceramic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic package in which a metal lid is welded directly onto a metallization layer provided on the surface of the ceramic package where a cavity opens, or a metal lid is welded onto a metal frame soldered onto the metallization layer, and the metallization layer is less likely to peel while welding.SOLUTION: A ceramic package 1a includes a ceramic package body 2 having rectangular front surface 3 and back surface 4 in plan view, and a cavity 6 opening to the front surface 3 and consisting of a bottom face 7 and side faces 8, and a metallization layer 10 formed to surround the cavity 6 on the rectangular front surface 3 in plan view. On the front surface 10a of the metallization layer 10, a frame-like groove (groove) 13 is formed along the outer shape of the front surface 10a of the metallization layer 10, in plan view, in a region 12 on the outer peripheral side excepting a region 11 on the inner peripheral side covered with the periphery of a metal lid 18.

Description

  In the present invention, a metal lid is directly bonded on a metallized layer formed on the surface of a package body made of a ceramic package body having a cavity on which an electronic component is mounted, or of the metallized layer. The present invention relates to a ceramic package in which a metal lid is bonded on a metal frame bonded upward via a brazing material.

For example, a first conductive metal film formed of a ceramic fired body in which a bottom plate body and a frame body are integrated and having a cavity surrounded by these, and formed over the entire circumference of the upper surface of the frame body, A conductive metal film composed of a second conductive metal film formed at the four corners, a thick conductive metal film having a large thickness disposed at the four corners of the conductive metal film, and a surface thereof; Has been proposed to provide a ceramic package for storing electronic components that is less warped and has excellent bonding reliability and airtight reliability after bonding of the metal lid (see, for example, Patent Documents). 1).
However, in the ceramic package of Patent Document 1, when the metal lid is seam welded onto the conductor metal film including the thick film conductor metal film at the four corners, the center side of the metal lid is accompanied by cooling after the welding. There is a problem that the outer peripheral portion side of the conductive metal film is peeled off from the fired body of the ceramic due to the stress that contracts, whereby the joint reliability and the airtight reliability may be impaired.

In addition, a metal frame is brazed on a frame-like metallized layer formed on a rectangular frame-like surface surrounding the recess of the insulating base having a recess for mounting an electronic component at the center, and the metal frame A metal lid is welded to seal an electronic component housed in the recess, and the frame-like metallized layer includes a first metallized layer on a lower layer side wider than the metal frame, and a metal frame An electronic component storage package is also proposed in which the metallized layer is made difficult to peel off from the insulating base when the metal lid is welded to the metal frame by comprising the second metallized layer on the upper layer side, which is narrower than that. (For example, refer to Patent Document 2).
However, also in the electronic component storage package of Patent Document 2, when a metal lid is seam welded onto a metal frame joined via a brazing material above a frame-like metallized layer having an upper and lower two-layer structure. The frame metallized layer is pulled to the center side together with the metal frame and the brazing material layer due to the shrinking stress toward the center side of the metal lid with cooling after the welding. There is a problem that the sealing and airtightness may be impaired when the side is peeled off from the insulating base.

JP 2007-48798 A (pages 1 to 9, FIGS. 1 to 3) Japanese Patent Laid-Open No. 10-242319 (pages 1 to 5, FIGS. 1 and 2)

  The present invention solves the problems described in the background art, and a metal lid is welded directly on the metallized layer provided on the surface of the ceramic package body in which the cavity is opened, or the metallized layer is brazed on the metallized layer. An object is to provide a ceramic package in which a metal lid is welded onto an attached metal frame, and the metallized layer is difficult to peel off at the time of such welding and has excellent sealing properties.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention provides a cooling process in which the metallized layer and the metal lid are immediately welded or immediately after the metal frame and the metal lid are welded. The idea is to form grooves and recesses on the surface of the metallized layer and the like that make it difficult to transmit the shrinkage stress generated from the metal frame side to the ceramic package body side.
That is, a first ceramic package according to the present invention (Claim 1) is a ceramic package body having a front surface and a back surface that have a rectangular outer shape in plan view, an opening in the front surface, and a cavity formed of a bottom surface and a side surface. And a metallized layer formed so as to surround the cavity on the surface having a rectangular frame shape in plan view, the inner surface of the metallized layer being covered with a peripheral portion of the metal lid. A groove or a recess along the outer shape of the surface of the metallized layer in a plan view is formed in at least the corner portion of the outer peripheral region excluding the peripheral region.

According to this, the metallized layer is formed on the outer peripheral side region excluding the inner peripheral side region covered with the peripheral part of the metal lid on the surface thereof, or at least the corner portion of the region, and the outer shape of the metallized layer A groove or recess along the line. Therefore, after mounting the electronic component in the cavity, the peripheral part of the metal lid is placed on the inner peripheral region on the surface of the metallized layer, and the roller electrode is formed along a pair of peripheral parts opposed to the metal lid. When seam welding is performed while rolling, shrinkage stress in the cooling process after expansion due to welding heat is generated on the metallized layer. At this time, since the difference in thermal expansion coefficient between the ceramic package body and the metal metal lid and the metallized layer is large, the outer peripheral side of the metallized layer in contact with the outer surface of the package body Although the stress generated by the cooling shrinkage tends to act on the boundary in a concentrated manner, a part of the stress is absorbed and dispersed in the groove or the recess, so that the influence of the stress can be suppressed or reduced.
Therefore, when the metal lid is welded, the metallized layer is difficult to peel off, so that the ceramic package is excellent in sealing the cavity with the metal lid. In addition, the range of thermal conditions during welding of the metal lid can be expanded.

The ceramic is made of a high-temperature fired ceramic such as alumina or a glass-ceramic which is a kind of low-temperature fired ceramic.
The metallized layer is a conductor formed on substantially the entire surface of the package body and made of W, Mo, Cu, Ag, or the like.
Further, the groove has a V-shaped, U-shaped or concave shape in cross section, and is formed by laser processing or insertion of a blade (mold) or a convex shape. Such a groove is formed at a position of about 10 to 40 μm from the outer peripheral side of the outer surface of the package body or the surface of the metallized layer.
Further, the concave portion is formed by a method of inserting a convex shape similar to the concave portion.
Furthermore, the concave portion is a bottomed hole that exhibits a circular shape, an elliptical shape, an oval shape, a polygonal shape greater than or equal to a triangle, or an arc shape in plan view.
Moreover, you may form a recessed part in positions other than the corner part of the said metallization layer.
Further, the groove and the concave portion may be inserted with a brazing material disposed on the metallized layer in a part of the inside thereof. However, it is essential that the entire inner side is not buried by the brazing material.
The corner portion is a region surrounded by a pair of adjacent outer surfaces of the package main body and extensions of two side surfaces of the cavity parallel to the pair of outer surfaces.
In addition, the ceramic package may be manufactured in a multi-cavity form.

  A second ceramic package according to the present invention (Claim 2) is a ceramic package main body having a front surface and a back surface having a rectangular outer shape in plan view, and having a cavity formed in the front surface and having a bottom surface and a side surface. A metallization layer formed so as to surround the cavity on the surface having a rectangular frame shape in plan view, and a metal frame bonded to the metallization layer via a brazing material. The brazing material is located between the outer surface of the metal frame and the surface of the metallized layer, at least a corner portion of the exposed surface on the outer peripheral side of the brazing material, or positioned on the outer peripheral side of the exposed surface of the brazing material. A groove or recess along the outer shape of the surface of the metallized layer is formed at least at the corner of the surface of the metallized layer. And butterflies.

According to this, a groove or a recess is formed in at least a corner portion of the exposed surface of the brazing material and the surface of the metallized layer in a plan view on the exposed surface of the outer periphery side of the brazing material or the surface of the metallized layer. . Therefore, after mounting an electronic component in the cavity, the peripheral portion of the metal lid is placed on the inner peripheral side of the surface of the metal frame body brazed above the metallization layer formed on the surface of the package body, and When seam welding is performed while rolling the roller electrode along a pair of opposing peripheral portions in the metal lid, contraction stress in the cooling process after expansion due to welding heat is generated for each component. At this time, since the difference in coefficient of thermal expansion between the ceramic package body and the metal metal lid, metal frame, brazing material, and metallization layer is large, the metallization is in contact with the outer surface of the package body. Although the shrinkage stress generated in the cooling process acts intensively on the boundary with the outer peripheral side of the layer, a part of the stress is absorbed and dispersed also in the groove or the concave portion. Can be suppressed or reduced.
Therefore, when the metal lid is welded, the metallized layer is difficult to peel off, so that the ceramic package is excellent in sealing the cavity with the metal lid. In addition, the range of thermal conditions during welding of the metal lid can be expanded.

The metal frame is made of 42 alloy (Fe-42 wt% Ni), Kovar (Fe-29 wt% Ni-17 wt% Co), 194 alloy (Cu-2.3 wt% Fe-0.03 wt% P), or the like. Become.
The brazing material is made of, for example, Ag brazing (Ag—Cu alloy).
Further, the groove or recess formed on the outer exposed surface of the brazing material is not limited to the form located only inside the brazing material, but is located across the brazing material and the metallization layer on the lower layer side. Are also included.
Further, the groove is formed at a position of about 10 to 40 μm from the outer surface of the package body or the outer peripheral side of the metallized layer.
Further, the concave portion may be formed at a position other than the corner portion on the exposed surface of the brazing material.
In addition, the ceramic package may be manufactured in a multi-cavity form.

Furthermore, in the present invention, the groove is a single frame-shaped groove having a shape similar to the outer shape of the surface of the metallized layer in a plan view, or a plurality of partial grooves along the outer shape of the surface of the metallized layer. A ceramic package (claim 3) is also included.
According to this, by forming a single frame-shaped groove having a shape similar to the outer shape of the surface of the metallized layer on the surface of the metallized layer or the exposed surface on the outer peripheral side of the brazing material, It is possible to prevent the outer peripheral side of the metallized layer from peeling off from the ceramic of the package main body on the entire periphery. Alternatively, peeling of the metallized layer can also be achieved by forming a plurality of partial grooves along the outer shape of the surface of the metallized layer individually at each position of the metallized layer and the brazing material, particularly at each corner. It can be suppressed or reduced.
The frame-shaped groove has a rectangular (substantially rectangular or square) shape in plan view.
Further, the partial groove includes not only an elongated oval and an ellipse, but also a dedicated L-shape (saddle shape) at the corner portion.

The present invention further includes a metal frame joined above the metallization layer via a brazing material, the metal frame having a rectangular frame shape in plan view, and a surface of the frame body In the outer peripheral side area excluding the inner peripheral side area covered by the peripheral part of the metal lid and the outer surface of the frame body, and along the outer shape in plan view of the frame body A ceramic having a single frame-like groove having a rectangular frame shape in plan view, or a plurality of partial grooves formed on at least one of the surface and the outer surface of the corner portion of the frame body. A package (claim 4) is also included.
Furthermore, in the present invention, formed on at least one of the outer peripheral side region excluding the inner peripheral side region covered with the peripheral part of the metal lid on the surface of the frame main body, and the outer surface of the frame main body, A single frame-like groove having a rectangular frame shape in plan view along the outline of the frame body in plan view, or a plurality of grooves formed on at least one of the surface and the outer surface of the frame body at the corner portion And a partial groove of the ceramic package (Claim 5).

According to these, a metal frame is bonded to the upper part of the metallized layer via a brazing material, and at least one of the outer peripheral surface and the outer surface of the surface of the frame main body of the metal frame is further seen in a plan view. A single frame-like groove having a rectangular frame shape is formed. Alternatively, a plurality of partial grooves are individually formed at one of the positions in at least the corner portion of the frame body. Therefore, in addition to the shrinkage stress generated in the cooling process immediately after seam welding the metal lid on the metal frame, in addition to the grooves and recesses provided in the metallized layer and the brazing material, each groove of the metal frame is further provided. However, since it absorbs and disperses, it is possible to further prevent the metallized layer from peeling off.
The plurality of partial grooves may be formed on the surface or outer surface other than the corner portion of the frame body.

The present invention further comprises a metal frame joined above the metallization layer via a brazing material, the metal frame comprising a frame body having a rectangular frame shape in plan view, and a surface of the frame body The outer peripheral region excluding the inner peripheral region covered by the peripheral portion of the metal lid and one or more recesses formed in at least the corner portion of the outer surface of the frame main body. The ceramic package (Claim 6) is also included.
Furthermore, in the present invention, the frame main body is formed on at least a corner portion of any one of the outer peripheral side region excluding the inner peripheral side region covered with the peripheral portion of the metal lid and the outer surface of the frame main body. A ceramic package having a single or a plurality of recesses is also included.

According to these, a metal frame body is joined to the metallized layer via a brazing material, and in the frame body of the metal frame body, at least a corner portion of either the surface of the outer peripheral region or the outer side surface. One or more recesses are formed. Therefore, in addition to the shrinkage stress generated immediately after seam welding the metal lid on the metal frame, in addition to the grooves and recesses provided in the metallized layer and the brazing material, the metal frame is also absorbed and absorbed by each recess. Since it disperses, it becomes possible to further suppress peeling of the metallized layer.
The plurality of recesses are not limited to having the same shape in plan view, but a plurality of recesses having different shapes may be arranged at the same corner portion on the surface or outer surface of the metal frame. At this time, it is desirable that the plurality of recesses be arranged at positions that are symmetrical with respect to the inside and outside directions of the corner portion in plan view.
The plurality of recesses may be formed at positions other than the corners on the surface or outer surface of the metal frame.

The top view which shows 1 form of the 1st ceramic package by this invention. FIG. 2 is a vertical sectional view taken along line XX in FIG. 1. The partial expanded cross section of the dashed-dotted line part Y in FIG. The top view which shows the 1st ceramic package of a different form. Furthermore, the fragmentary top view which shows the 1st ceramic package of a different form. The fragmentary top view which shows the 1st ceramic package of another form. The top view which shows 1 form of the 2nd ceramic package by this invention. FIG. 8 is a vertical sectional view taken along the line U-U in FIG. 7. The partial expanded cross section of the dashed-dotted line part V in FIG. The top view which shows the 2nd ceramic package of a different form. Furthermore, the top view which shows the 2nd ceramic package of a different form. FIG. 8 is a partial vertical sectional view taken along the line ZZ in FIG. 7. The partial top view which shows the 2nd ceramic package of another form. The partial top view which shows the 2nd ceramic package of another form. FIG. 15A is a partial vertical sectional view taken along the line S-S in FIG. 14, and FIG. The fragmentary top view which shows the ceramic package of a different application form. Furthermore, the fragmentary top view which shows the ceramic package of a different application form. The fragmentary vertical sectional view which shows the ceramic package of another application form.

Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a plan view showing one form of a first ceramic package 1a. 2 is a vertical cross-sectional view taken along the line XX in FIG. 1, and FIG. 3 is a partially enlarged cross-sectional view of an alternate long and short dash line portion Y in FIG.
As shown in FIGS. 1 to 3, the first ceramic package 1 a includes a ceramic package body 2 having a rectangular parallelepiped cavity 6 and a metallization formed on almost the entire surface 3 of the package body 2. And a layer 10.
The package body 2 is made of, for example, ceramic such as alumina. As shown in the drawing, the package body 2 has a front surface 3 having a rectangular shape (rectangular shape), a back surface 4 and an outer surface 5 having four sides. It has a cavity 6 that is open and comprises a bottom surface 7 and four side surfaces 8. On one short side (left side in the figure) of the bottom surface 7 of the cavity 6, a pair of terminals (none of which are shown) connected to electrodes such as a crystal resonator (electronic component) to be mounted later are provided on the top surface. A stepped portion 9 is projected.

The metallized layer 10 is made of, for example, W or Mo. As shown in FIGS. 1 and 3, the inner peripheral region of the surface 10 a of the metallized layer 10 that is covered by the peripheral part of the metal lid 18 later. In a region 12 on the outer peripheral side excluding 11, a single frame-like groove (groove) 13 is formed along the outer shape of the surface 10 a of the metallized layer 10 in plan view. The frame-like groove 13 has a substantially V-shaped cross section, the deepest portion is located shallower than the bottom surface of the metallized layer 10, and is within the range of about 10 to 40 μm from the outer surface 5 of the package body 2. Is formed.
The frame-shaped groove 13 is formed by inserting a similar frame shape into the surface 10a of the paste-like metallized layer 10 formed by screen printing on the surface 3 of the green sheet to be the package body 2, or the green sheet The surface 10a of the metallized layer 10 fired together is formed by laser processing.
The cross-sectional shape of the frame-shaped groove 13 may be U-shaped or concave.

In order to seal the cavity 6 from the outside after electronic parts are mounted in the cavity 6 in advance, as shown in FIG. 3, on the inner peripheral side region 11 on the surface 10a of the metallized layer 10 in plan view. Is placed and restrained on the periphery of the metal lid 18 having a substantially rectangular shape, and rotated in the vicinity of both ends of the shaft 19s along a pair of short sides and a pair of long sides facing each other in this state. Seam welding for moving the pair of roller electrodes 19 supported while rolling was performed twice along the short side and the long side.
Note that the surface 10a of the metallized layer 10 including the frame-like groove 13 is previously coated with a metal plating film composed of an inner Ni plating film and an outer Au plating film.
The metal lid 18 is made of, for example, Kovar or 42 alloy, and the bottom surface thereof is covered with a Ni plating film in advance.

As shown in FIG. 3, when seam welding is performed by moving the pair of roller electrodes 19 while rolling along a pair of opposing short sides and long sides in the metal lid 18, the pair of roller electrodes 19, 19 is performed. A plurality of joints in which the outermost Au plating film of the metallization layer 10 and the Ni plating film on the back surface side of the metal lid 18 are melted by the resistance to the welding current passed through the metallization layer 10 therebetween are metallization layers. 10 and the metal lid 18 are formed along the front-rear direction of FIG. As a result, the peripheral portion of the metal lid 18 is welded onto the inner peripheral region 11 on the surface 10 a of the metallized layer 10.
By the seam welding, the metal lid 18 is once thermally expanded in the outer peripheral direction, and then tends to contract toward the center side in the cooling process. The stress generated by the shrinkage tends to reach the metallized layer 10 welded to the metal lid 18.

However, according to the ceramic package 1a as described above, since the single frame-shaped groove 13 is formed in the outer peripheral side region 12 in the surface 10a of the metallized layer 10, the stress is generated by the frame-shaped groove 13. Absorbed and dispersed in As a result, it is possible to reliably prevent the outer peripheral side of the metallized layer 10 from peeling from the outer surface 5 of the package body 2 due to the difference in thermal expansion coefficient between the ceramic of the package body 2 and the metal lid 18 and the metallized layer 10 as in the prior art. Can be suppressed or reduced.
Therefore, according to the ceramic package 1a, the cavity 6 in which the electronic component is mounted inside can be surely sealed from the outside, the performance of the electronic component can be guaranteed, and the thermal welding conditions during the seam welding can be ensured. It is also possible to expand the range.

FIG. 4 is a plan view showing the first ceramic package 1b having a different form.
As shown in FIG. 4, the first ceramic package 1 b also has the same metallization layer formed on almost the entire surface 3 of the package body 2, the cavity 6 provided inside the package body 2, and the package body 2. 10.
The ceramic package 1b is different from the ceramic package 1a in that the outer periphery of the surface 10a of the metallized layer 10 excluding the inner peripheral region 11 covered by the peripheral portion of the metal lid 18, as shown in FIG. A plurality of (four) partial grooves 14 having substantially L shape in plan view are individually formed along the outer shape of the surface 10a of the metallized layer 10 for each of the four corner portions 17 of the region 12 on the side. is there.

As described above, since the seam welding for welding the metal lid 18 to the metallized layer 10 is performed twice along a pair of short sides and long sides facing each other in the metal lid 18 and the metallized layer 10, the metallized layer 10. Each corner portion 17 is greatly affected by the shrinkage stress in the cooling process as compared with the middle portion of each side.
According to the ceramic package 1b as described above, since the partial grooves 14 along the outer shape of the surface 10a of the metallized layer 10 are individually formed only in each corner portion 17 on the surface 10a of the metallized layer 10, Immediately after seam welding, it is possible to suppress a situation in which the outer peripheral side of the metallized layer 10 is peeled off from the outer surface 5 of the package body 2.
The cross section of the partial groove 14 may be V-shaped, U-shaped, or concave.
Moreover, it is good also as a ceramic package of the form which further formed the linear partial groove | channel between the partial grooves 14 for every said corner part 17 further.

FIG. 5 is a partial plan view showing a ceramic package of a further different form. As shown in FIG. 5, the package also includes the same package body 2, cavity 6, and metallized layer 10, and the inner surface of the metallized layer 10 is covered with the periphery of the metal lid 18. For each of the four corner portions 17 of the outer peripheral region 12 excluding the peripheral region 11, three concave portions 15 having a circular shape in plan view are formed. The concave portion 15 is a bottomed hole having a substantially conical shape as a whole, and is formed at a symmetrical position in the inner and outer directions of each corner portion 17.
The recess 15 is formed, for example, by inserting a similar convex shape into the paste-like metallized layer 10 or by partially performing laser irradiation.

FIG. 6 is a partial plan view showing another form of the ceramic package.
As shown in FIG. 6, the package also includes the same package body 2, cavity 6, and metallized layer 10, and the inner peripheral side covered with the peripheral part of the metal lid 18 on the surface 10 a of the metallized layer 10. For each of the four corners 17 of the outer peripheral region 12 excluding the region 11, a single recess 16 having an elliptical shape in plan view is arranged in a posture in which the major axis is orthogonal to the inner and outer directions of the corner 17. Is formed.
The recess 16 is formed, for example, by inserting a similar convex shape into the paste-like metallized layer 10. It is also possible to arrange a plurality of recesses 16 so that their major axes are along the outer shape of the metallized layer 10.
Even with the first ceramic package in which the concave portions 15 and 16 as described above are formed for each corner portion 17 of the region 12 of the metallized layer 10, the same effects as the ceramic packages 1a and 1b can be obtained.

FIG. 7 is a plan view showing a second ceramic package 1c according to one embodiment. 8 is a vertical cross-sectional view taken along the line U-U in FIG. 2, and FIG. 9 is a partially enlarged cross-sectional view of the dashed-dotted line portion V in FIG. 8.
As shown in FIGS. 7 to 9, the second ceramic package 1 c is formed on the entire surface of the package body 2 having the cavity 6 and the surface 3 of the body 2, and along the outer peripheral side of the surface 3. The metallized layer 10 is formed with a V-shaped frame-like groove 13 and a metal frame 20 joined (brazed) via a brazing material 21 above the metallized layer 10.
The brazing material 21 is made of, for example, Ag brazing (Ag—Cu-based alloy), and is interposed between the metallized layer 10 and the metal frame 20 in a layered manner, and an exposed surface 22 having an arc-shaped cross section on the outer peripheral side. An arc-shaped part (fillet) is included. The metal frame 20 is made of, for example, Kovar, has a rectangular cross-section and a frame-shaped frame main body 20a, and a surface 20b on which the peripheral portion of the metal lid 18 is welded to an inner peripheral area. And an outer surface 20c on which the exposed surface 22 side of the brazing material 21 rises.

The frame-like groove 13 of the metallized layer 10 is not completely filled with the exposed surface 22 on the outer peripheral side of the brazing material 21, and at least a part of the space in the groove is in plan view. It is important that it remains along the entire circumference.
After connecting electrodes of electronic parts (not shown) to the terminals of the step portions 9 and 9 in the cavity 6, as shown in FIG. 9, the periphery of the metal lid 18 is formed in the inner peripheral region on the surface 20 b of the metal frame 20. With the part placed, seam welding is performed while rolling the electrode roller 19 along a pair of opposing sides of the metal lid 18 in the same manner as in the previous period, thereby sealing the cavity 6. At this time, shrinkage stress in the cooling process after expansion by welding heat is generated for each component. At this time, the difference in thermal expansion coefficient between the ceramic package body 2 and the metal lid 18, metal frame 20, brazing material 21, and metallized layer 10 is large. The shrinkage stress on the metal part (18, 20, 21, 10) side in the cooling process tends to concentrate on the vicinity of the boundary between the outer peripheral portion side of the metallized layer 10 adjacent thereto and the metallized layer 10.

However, according to the ceramic package 1c as described above, the shrinkage also occurs in the frame-like groove 13 formed on the outer peripheral side of the surface 10a of the metallized layer 10 located between the vicinity of the boundary and the metal frame 18. Since a part of the stress is absorbed and dispersed, the influence of the stress can be suppressed or reduced.
Therefore, according to the second ceramic package 1c, since the metallized layer 10 is difficult to peel off when the metal lid 18 is welded, the sealing performance of the cavity 6 by the metal lid 18 is stable. In addition, the range of thermal conditions during welding of the metal lid 18 can be expanded.
Further, as shown in FIG. 10, in place of the frame-like groove 13, only the corner portions 17 at the four corners on the surface 10 a of the metallized layer 10 are positioned on the outer peripheral side of the surface of the corner portion 17 in plan view. The same effect as the ceramic package 1c can be obtained by the second ceramic package 1d which is substantially L-shaped and in which the partial grooves 14 along the outer shape of the surface 10a of the metallized layer 10 are individually formed. .
The frame-like groove 13 and the partial groove 14 are also formed by the same method as described above, and their cross sections may be U-shaped or concave. Further, in place of the partial groove 14, the concave portions 15 and 16 may be formed at the same positions of the corner portions 17.

FIG. 11 is a plan view showing a second ceramic package 1e having a different form, and FIG. 12 is a partial vertical sectional view taken along the line ZZ in FIG.
As shown in FIGS. 11 and 12, the second ceramic package 1e includes the same package body 2, the same metallization layer 10 formed on the entire surface 3 as above, and a solder layer above the metallization 10. A metal frame 20 joined through a material 21 is provided. In the brazing material 21, the exposed surface 22 on the outer peripheral side located between the surface 10 a of the metallized layer 10 and the outer surface 20 c of the metal frame 20 has a V-shaped cross section that opens substantially upward or obliquely upward. A frame-like groove 23 is formed along the entire circumference of the exposed surface 22. The frame-like groove 23 is formed, for example, by performing laser processing on the outer peripheral exposed surface 22 of the brazing material 21 formed for joining the metallized layer 10 and the metal frame 20.
The deepest portion of the frame-like groove 23 may be in a form reaching the inside of the metallized layer 10 immediately below, in addition to the form remaining in the brazing material 21 shown in FIG.

  As shown in FIG. 12, along the pair of sides facing each other in the metal lid 18 in the same manner as in the previous period, with the peripheral portion of the metal lid 18 placed on the inner peripheral region of the surface 20 b of the metal frame 20. When seam welding is performed while the electrode roller 19 is rolled, shrinkage stress in the cooling process after expansion due to welding heat is generated in each component. The stress tends to concentrate near the boundary between the side surface 5 and the outer peripheral side of the metallized metal layer 10. However, part of the shrinkage stress is absorbed and dispersed also in the frame-like groove 23 formed in the outer exposed portion 22 of the brazing material 21 located between the vicinity of the boundary and the welded portion of the metal frame 18. Therefore, the influence of the stress can be suppressed or reduced.

Therefore, also in the second ceramic package 1e, the metallized layer 10 is difficult to peel off when the metal lid 18 is welded, so that the sealing performance of the cavity 6 by the metal lid 18 is stable, and the metal lid It is also possible to expand the range of thermal conditions during the 18 welding.
Further, as shown in FIG. 13, in place of the frame-shaped groove 23, only the four corner portions 17 on the exposed surface 22 on the outer peripheral side of the brazing material 21 are substantially L-shaped in a plan view and the metallization is performed. The second ceramic package 1f in which the partial grooves 24 along the outer shape of the surface 10a of the layer 10 are individually formed can provide the same effects as the ceramic package 1e.
The frame-like groove 23 and the partial groove 24 are also formed by the same method as described above, and their cross-sectional shapes may be U-shaped or concave. Further, in place of the partial groove 24, the concave portions 15 and 16 may be formed on the exposed surface 22 in each corner portion 17 of the brazing material 21.

FIG. 14 is a plan view of a ceramic package 1g which is an application form of the ceramic package 1e, and FIG. 15A is a partial vertical sectional view taken along the line S-S in FIG.
The ceramic package 1g includes a package body 2 similar to the above, a brazing material 21 in which a frame-like groove 23 is formed on the exposed surface 22, and a metal frame 20, and a surface 20b of the metal frame 20 is followed later. A frame-like groove 25 having a V-shaped cross section is formed in the region on the outer peripheral side that is not covered by the peripheral portion of the metal lid 18 along the entire periphery in plan view.
That is, in the ceramic package 1g, when the metal lid 18 is welded onto the metal frame 20, both of the welded portions, the vicinity of the boundary between the outer peripheral side of the metallized layer 10 and the outer surface 5 of the package body 2 In between, two frame-like grooves 23 and 25 are formed in parallel. Therefore, the shrinkage stress in the cooling process after the welding is absorbed and dispersed in each of the frame-like grooves 23 and 25, so that the peeling of the metallized layer 10 can be more reliably prevented. In addition, the thermal conditions during welding can be expanded.

As shown in parentheses in FIG. 15A and FIG. 16A, the partial groove 24 is formed only for each corner portion 17 of the exposed surface 22 on the outer peripheral side of the brazing material 21, and the metal The ceramic package 1i in which the partial grooves 26 having an L-shape in plan view are formed in the same manner as described above only for each corner portion 17 on the surface 20b of the frame body 20 may be used. Even the package 1i can achieve the same effects as the ceramic package 1g.
Alternatively, a frame-like groove 23 is formed on the brazing material 21 side and a partial groove 26 is formed on the metal frame 20 side. Conversely, a partial groove 24 is formed on the brazing material 21 side, In addition, a frame-like groove 25 may be formed on the metal frame 20 side.
Further, as shown in FIG. 16B, the partial groove 14 is formed only for each corner portion 17 of the metallized layer 10, and the partial groove 26 is formed only for each corner portion 17 of the surface 20 b of the metal frame 20. The ceramic package 1j having the above-described configuration can achieve the same effects as the ceramic packages 1g and 1i.

15B, the same package body 2, the metallized layer 10 having the same frame-like groove 13 formed on the outer peripheral side of the surface, and the same frame-like groove 23 on the exposed surface 22. A ceramic package 1h having a shape in which a frame-like groove 25 similar to that described above is formed in a region on the outer peripheral side of the surface 20b, and the brazing material 21 on which is formed.
According to the ceramic package 1 h, when the metal lid 18 is welded onto the metal frame 20, both of the welded portions, the vicinity of the boundary between the outer peripheral side of the metallized layer 10 and the outer surface 5 of the package body 2 In between, three frame-shaped grooves 13, 23, 25 are formed in parallel. Therefore, the shrinkage stress generated in the cooling process immediately after the welding is absorbed and dispersed in each of the frame-like grooves 13, 23, 25, so that the peeling of the metallized layer 10 can be more reliably prevented. And the thermal condition at the time of the said welding can also be expanded.

As shown in parentheses in FIG. 15B and FIG. 16C, the partial groove 14 is formed only for each corner portion 17 of the metallized layer 10, and the exposed surface on the outer peripheral side of the brazing material 21. The partial groove 24 may be formed only for each of the 22 corner portions 17, and the partial groove 26 may be formed only for each corner portion 17 on the surface 20 b of the metal frame 20. Even with the package 1k, the same effect as the ceramic package 1h can be obtained.
Further, the frame-like groove 13 or partial groove 14 of the metallized layer 10, the frame-like groove 23 or partial groove 24 of the exposed portion 22 of the brazing material 21, and the frame-like groove 25 or partial groove 26 of the metal frame 20 are appropriately combined. Even when the ceramic package has three grooves, the same effects as those of the packages 1h and 1k can be obtained.

FIG. 17A is a partial plan view showing a ceramic package 1m provided with the same package body 2, metallized layer 10, brazing material 21, and metal frame 20 as described above. In the package 1m, the corner portion 17 of the metallized layer 10 has a circular recess in a plan view and a conical bottomed hole 28 as a whole, and the long axis on both sides thereof follows the outer shape of the surface 10a of the metallized layer 10. In addition, a pair of recesses 29 having a bottomed hole having an elliptical shape in plan view and an elliptical cone shape as a whole are formed, and one recess 28 is formed for each corner portion 17 of the surface 20b of the metal frame 20. ing.
FIG. 17B is also a partial plan view showing a ceramic package 1n provided with the same package body 2, metallized layer 10, brazing material 21, and metal frame 20 as described above. In the package 1n, a pair of recesses 29 whose major axis is along the outer shape of the surface 10a of the metallized layer 10 are formed in the corner portion 17 of the exposed surface 22 on the outer peripheral side of the brazing material 21, and the surface of the metal frame 20 One concave portion 29 whose major axis is perpendicular to the inner and outer directions is formed in the corner portion 17 of 20b.

FIG. 17C is also a partial plan view showing a ceramic package 1p including the package body 2, the metallized layer 10, the brazing material 21, and the metal frame 20 similar to the above. In the package 1p, one concave portion 28 and two concave portions 29 are formed in the same manner as described above for each corner portion 17 of the metallized layer 10, and two concave portions are provided for each corner portion 17 of the exposed surface 22 on the outer peripheral side of the brazing material 21. 29 is formed in the same manner as described above, and one recess 29 is formed in the same manner as described above for each corner portion 17 of the surface 20b of the metal frame 20.
Also in the ceramic packages 1m, 1n, and 1p in which the concave portions 28 and 29 as described above are formed for each of the metallized layer 10, the exposed surface 22 of the brazing material 21, and the corner portions 17 of two or more types of parts in the metal frame 20. When the metal lid 18 is welded onto the metal frame 20, the welded portion between them, the outer peripheral side for each corner portion 17 of the metallized layer 10, and the outer side surface 5 for each corner portion of the package body 2. Since the single or plural concave portions 28 and 29 are positioned between the vicinity of the boundary, the shrinkage stress in the cooling process can be suppressed and reduced. At the same time, it is possible to expand the range of thermal conditions during the welding.
The concave portions 28 and 29 may also be formed on the surface of the metallized layer 10 other than the corner portion 17, the exposed surface 22 on the outer peripheral side of the brazing material 21, and the surface 20 b of the metal frame 20. Further, the partial grooves 14, 24, 26 and the recesses 28, 29 may be provided on the same surface 10 a of the metallized layer 10, the exposed surface 22 of the brazing material 21, and the surface 20 b of the metal frame 20.

FIG. 18A is a partial vertical sectional view showing a ceramic package 1q provided with the same package body 2, metallized layer 10, brazing material 21, and metal frame 20 as described above. In the package 1q, the partial groove 14 is formed only in the frame-shaped groove 13 or the corner portion 17 on the entire periphery of the surface 10a of the metallized layer 10, and on the entire periphery of the outer surface 20c of the frame body 20a of the metal frame body 20. A frame-like groove 27 having a U-shaped cross section or a partial groove 27 having an L-shape in plan view is formed only in the corner portion 17 of the outer surface 20c.
The frame-like groove 27 or the partial groove 27 is formed by laser processing or the like at a height where the opening is not blocked by the exposed surface 22 of the brazing material 21.

FIG. 18B is also a partial vertical sectional view showing a ceramic package 1 r provided with the same package body 2, metallized layer 10, brazing material 21, and metal frame 20 as described above. In the package 1r, a partial groove 24 is formed only in the frame-like groove 23 along the entire circumference of the exposed surface 22 on the outer peripheral side of the brazing material 21 or in each corner portion 17 of the exposed surface 22, and the metal frame 20 A partial groove 27 is formed only in the lateral frame-like groove 27 or only in the corner portion 17 of the outer surface 20c on the entire circumference of the outer surface 20c of the frame body 20a.
Further, FIG. 18C is a partial vertical sectional view showing a ceramic package 1 s including the package body 2, the metallized layer 10, the brazing material 21, and the metal frame 20 similar to the above. In the package 1s, a frame-like groove 13 or a partial groove 14 is formed on the surface of the metallized layer 10, a frame-like groove 23 or a partial groove 24 is formed on the exposed surface 22 on the outer peripheral side of the brazing material 21, and a metal frame. A frame-like groove 27 or a partial groove 27 is formed on the outer surface 20 c of the frame body 20 a of the body 20.

As described above, when the metal lid 18 is welded onto the metal frame 20 also by the ceramic packages 1q, 1r, and 1s, the welded portion of both of them and the outer circumference of the metallized layer 10 (for each corner portion 17). Any two or all of the frame-shaped grooves 13, 23, 27 are located between the portion side and the vicinity of the boundary between the outer surface 5 of the package body 2 (for each corner portion 17) or the portion Any two or all of the grooves 14, 24, 27 are located. Therefore, it becomes possible to suppress and reduce the shrinkage stress in the cooling process after the welding. Furthermore, it becomes possible to expand the range of thermal conditions during the welding.
A frame-like groove 25 or a partial groove 26 is formed in a region on the outer peripheral side of the surface 20b of the frame body 20a of the metal frame 20, and a frame-like groove 27 or a partial groove 27 is formed on the outer surface 20c of the frame body 20a. Further, it may be formed.
Further, the frame-like groove 27 or the partial groove 27 may have a V-shaped or concave cross section.
Further, in place of the frame-shaped groove 27 or the partial groove 27, any one of the recesses 28 and 29 is formed on the surface 20b and the outer surface 20c of each corner 17 in the frame body 20a of the metal frame 20. Also good.

The present invention is not limited to the embodiments described above.
For example, the ceramic of the package body 2 may be a high-temperature fired ceramic such as aluminum nitride other than alumina or mullite, or a glass ceramic that is a kind of low-temperature fired ceramic. In the latter case, the metallized layer 10 fired at the same time uses a metal mainly composed of Ag, Cu or the like.
Further, the outer shape or shape of the package body 2 and the cavity 6 in a plan view may be a substantially square shape.
Further, the cavity may be not only one that opens on the surface of the package body, but also one that opens on both the front and back surfaces. In such a form, the metallized layer, brazing material, and metal frame are also formed on the back surface side. It is good also as a form where the body was arranged symmetrically.
Further, two or more of the frame-shaped grooves 13 and 23 and the partial grooves 14 and 24 may be arranged in parallel on the same surface 10 a of the metallized layer 10 and the same exposed surface 22 of the brazing material 21. Alternatively, the frame-like groove 13 and the partial groove 14 or the frame-like groove 23 and the partial groove 24 can be arranged in parallel.
In addition, the electronic components mounted in the cavity 6 are not limited to crystal resonators but also include piezoelectric elements and semiconductor elements, and may be light emitting elements such as LEDs.

  According to the present invention, the metal lid is welded directly on the metallized layer provided on the surface of the ceramic package in which the cavity is opened, or the metal lid is formed on the metal frame body brazed on the metallized layer. It is possible to provide a ceramic package which is welded and has an excellent sealing property because the metallized layer is hardly peeled off during the welding.

1a to 1k, 1m, 1n, 1p to 1s ... Ceramic package 2 ……………………………………………… Package body 3 ………………………………………… …… Front side of package body 4 ……………………………………………… Back side of package body 6 ……………………………………………… Cavity 7 …… ……………………………………… Cavity bottom 8 …………………………………………… Cavity side 10 ………………………… ……………… Metallized layer 10a ……………………………………… Metallized layer surface 11 ………………………………………… Area on the inner circumference side 12 ………………………………………… Regional area 13, 23, 25, 27 ………………… Frame-shaped groove (groove)
14, 24, 26, 27 ................ Partial groove (groove)
15, 16, 28, 29 ………………… Recess 17 ………………………………………… Corner 18 ……………………………………… ... Metal lid 20 ………………………………………… Metal frame 20a ……………………………………… Frame body 20b …………………… ………………… Surface of frame body 20c ………………………………………… Outer side of frame body 21 ………………………………………… Material 22 ………………………………………… Exposed surface of brazing material

Claims (7)

A package body made of a ceramic having a rectangular front surface and a back surface in a plan view, and having a cavity formed in the surface and having a bottom surface and a side surface;
A ceramic package having a metallized layer formed so as to surround the cavity on the surface of the rectangular frame in plan view,
In the surface of the metallized layer, a groove along the outer shape of the surface of the metallized layer in a plan view, at least in the corner, out of the region on the outer peripheral side excluding the region on the inner peripheral side covered with the peripheral part of the metal lid, A recess is formed,
A ceramic package characterized by that. A package body made of a ceramic having a rectangular front surface and a back surface in a plan view, and having a cavity formed in the surface and having a bottom surface and a side surface;
On the surface of the rectangular frame shape in plan view, a metallized layer formed so as to surround the cavity;
A metal frame joined above the metallized layer via a brazing material, and a ceramic package,
The metallization located between the outer surface of the metal frame and the surface of the metallized layer, at least the corner of the exposed surface on the outer peripheral side of the brazing material, or on the outer peripheral side of the exposed surface of the brazing material Grooves or recesses along the outer shape of the surface of the metallized layer are formed at least at the corners on the surface of the layer,
A ceramic package characterized by that. The groove is a single frame-shaped groove having a shape similar to the outer shape of the surface of the metallized layer in plan view, or a plurality of partial grooves along the outer shape of the surface of the metallized layer.
The ceramic package according to claim 1 or 2, wherein Further comprising a metal frame joined above the metallization layer via a brazing material,
The metal frame has a rectangular frame body in plan view, and
Formed on at least one of the outer peripheral side area excluding the inner peripheral area covered by the peripheral part of the metal lid on the surface of the frame main body and the outer surface of the frame main body, and the plan view of the frame main body A single frame-shaped groove having a rectangular frame shape in plan view along the outer shape of the frame, or a plurality of partial grooves formed on at least one of the surface and the outer surface of the corner portion of the frame body. doing,
The ceramic package according to claim 1. Formed in at least one of the outer peripheral side area excluding the inner peripheral area covered by the peripheral part of the metal lid on the surface of the frame main body and the outer surface of the frame main body, and the plan view of the frame main body A single frame-like groove having a rectangular frame shape in plan view along the outer shape of the frame, or a plurality of partial grooves formed on either the surface or the outer surface of at least the corner portion of the frame body. doing,
The ceramic package according to claim 2. Further comprising a metal frame joined above the metallization layer via a brazing material,
The metal frame has a rectangular frame body in plan view, and
One or a plurality of recesses formed in at least a corner portion of either the outer peripheral region excluding the inner peripheral region covered by the peripheral portion of the metal lid or the outer surface of the frame main body on the surface of the frame main body And having
The ceramic package according to claim 1. One or a plurality of recesses formed in at least a corner portion of either the outer peripheral side area excluding the inner peripheral side area covered by the peripheral part of the metal lid on the surface of the frame main body or the outer surface of the frame main body And having
The ceramic package according to claim 2.

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