JP5898561B2 - Ceramic package - Google Patents

Description

  The present invention relates to a ceramic package in which, for example, an electronic component such as a crystal resonator, a semiconductor element, or a piezoelectric element is mounted in a cavity, and the opening of the cavity can be reliably sealed. The present invention relates to a ceramic package in which peeling at an interface with a metallization layer surrounding a cavity opening is suppressed.

A film-like metallized layer is formed on the upper surface of the four side walls standing on the surface side of the box-shaped ceramic substrate having a cavity, and the width of the bottom surface is set on the metallized layer via a brazing material. There has been proposed a semiconductor device container in which a weld ring (metal frame) smaller than the width dimension is joined to obtain a sufficient brazing strength with a small meniscus amount in the obtained brazing material reservoir (for example, , See Patent Document 1).
However, when the peripheral part of the metal lid (lid) for sealing the cavity is joined to the upper surface of the metal frame by seam welding in the container for a semiconductor device, the metal at the time of cooling shrinkage after heating by welding The ceramic substrate shrinks less than the shrinkage of the metal lid, the metal frame, the brazing material such as Ag brazing, and the metallized layer. As a result, the outer peripheral side of the metallized layer is peeled off from the surface of the ceramic substrate, so that sealing of the cavity may be impaired.

In particular, when the distance between the joint between the metal lid and the metal frame and the boundary between the outer peripheral side of the metallized layer and the ceramic base is shortened according to the recent miniaturization needs for the ceramic package, the metallized layer Peeling is likely to occur significantly.
Further, since the brazing material for brazing the metal frame on the metallized layer is reduced, the resistance value of the welding current when the metal lid is seam welded onto the metal frame is increased. In some cases, the surface layer of the brazing material is remelted during welding, and the droplets are scattered in the cavity, thereby impairing the performance of the mounted electronic component.

Japanese Utility Model Publication No. 54-72472 (pages 1-7, FIGS. 1-3)

  The present invention solves the problems described in the background art, and when the metal lid for sealing the cavity opening is bonded onto the metallized layer or metal frame, the metallized layer peels off from the ceramic package body. It is an object of the present invention to provide a ceramic package that is difficult to be soldered, and that a brazing material brazed with a metal frame is hardly melted again to form droplets, and that can easily cope with downsizing.

Means for Solving the Problems and Effects of the Invention

The present invention has been conceived to increase the distance between the joint between the metal lid and the metal frame and the boundary between the outer surface side of the metallization layer and the ceramic package body in order to solve the above-mentioned problems. It was made as a result.
That is, the ceramic package of the present invention (Claim 1) includes a ceramic package main body having a front surface and a back surface having a rectangular outer shape in plan view, an opening on the front surface, and a cavity having a bottom surface and side surfaces, and a flat surface. A metallization layer formed so as to surround the opening of the cavity on the surface having a rectangular frame shape, and at the corners of at least four corners in plan view on the surface of the package body. The thickness of the outer surface side of the package body of the metallized layer is larger than the thickness of the side surface side of the cavity, and a part of the metallized layer on the outer surface side of the package body is the back surface of the surface of the package body. It is formed in the position of the side .

According to this, the joint of the metal lid and the metal frame, or the joint of the metal lid and the metallized layer, which is disposed for sealing the cavity where the electronic component is mounted later, and the outer surface side of the metallized layer And a distance between the boundary portion of the ceramic package body and the ceramic main body are relatively long as compared with a conventional configuration using a metallized layer having a uniform thickness. In addition, the contact area of the entire metallized layer to the ceramic forming the package body also increases. Therefore, when seam welding is performed while rolling the welding electrode along a pair of opposing peripheries of the metal lid, the outer surface of the metallized layer is caused by a difference in shrinkage due to cooling shrinkage after heating due to the welding. It is possible to eliminate or at least suppress side peeling.
In particular, it is possible to suppress peeling of the metallized layer that is likely to occur in the vicinity of the corner portion on the surface of the package body subjected to the seam welding a plurality of times (two or more times). Further, in response to a request for downsizing, for the ceramic package in a form in which the distance between the outer surface side of the metallized layer and the boundary between the ceramic package body is shortened, the metallized layer is peeled off. The effect which prevents can be exhibited. Therefore, it is possible to provide a ceramic package excellent in the sealing performance of the cavity by the metal lid.

The ceramic is a glass-ceramic which is a kind of high-temperature fired ceramic such as alumina or low-temperature fired ceramic.
The metallized layer is a conductor formed on substantially the entire surface of the package body and made of W, Mo, Cu, Ag, or the like.
Further, a portion of the metallized layer having a large thickness located on the outer surface side of the package body is about 60 to 40% of the width along the inner and outer directions of the metallized layer. In other words, a portion of the metallized layer with a small thickness located on the side surface side of the cavity is about 40 to 60% of the width along the inside / outside direction of the metallized layer.
Further, the ceramic package has a form in which a metal lid (lid) for sealing a cavity in which an electronic component is mounted is directly seam welded to the upper surface of the metallized layer, and above the metallized layer. Three forms: a form in which the metal lid is welded and joined to the upper surface of the metal frame brazed to the metal, and a form in which the metallized layer and the metal lid are joined via an Au-Sn brazing material Is included.
Furthermore, the ceramic package may be manufactured in a multi-cavity form.
In addition, the corner portion is a region surrounded by a pair of outer side surfaces adjacent to each other of the package body and extensions of two side surfaces of the cavity parallel to the pair of outer side surfaces.

In the present invention, the metallized layer is formed by laminating one or more unit metallized layers, and the number of unit metallized layers located on the outer side of the package body is located on the side of the cavity. More than the number of unit metallization layers, it is included in the ceramic package (claim 2).
According to this, the thickness of the outer side of the package body in the metallized layer and the thickness of the side of the cavity are made different from each other by making the number of unit metallized layers different. It becomes possible.
The difference in the number of unit metallization layers is not formed along the entire circumference of the surface of the package body, and the number of layers only at the corners of the surface is made larger than the number of layers in other portions. It is good also as a form.
Furthermore, the number of unit metallization layers is, for example, three layers on the outer surface side of the package body at the corner portion on the surface of the package body, and two layers on the outer surface side on each side of the surface excluding the corner portion. In addition, the side surface side of the cavity on each side may be a single layer.

Furthermore, in the present invention, the front and back surfaces of the package body are 3 mm × 3 mm or less in plan view, and the thickness between the outer surface of the package body and the side surface of the cavity is 0.4 mm or less. It is included in a ceramic package (claim 3).
According to this, the thickness of the outer surface side of the package body of the metallized layer is larger than the thickness of the side surface side of the cavity in at least the four corners in plan view on the surface of the package body. The distance between the joint between the metal lid and the metal frame to be disposed, or the joint between the metal lid and the metallized layer, and the boundary between the outer peripheral side of the metallized layer and the ceramic package body is increased. . Therefore, the thickness of the side wall surrounding the front and back surfaces of the package main body and the cavity is the metallized layer as compared with the conventional form using a metallized layer having a uniform thickness even as the size and the thickness, which are indicators of miniaturization. It is possible to further suppress layer peeling.
The front and back surfaces of the package body are 3 mm × 3 mm or less square or rectangular in plan view, and the thickness between the outer surface of the package body and the side surface of the cavity is 0.4 mm or less. Is an exemplary target value for downsizing. Furthermore, although the bottom surface of the cavity is 2.2 mm × 2.2 mm or less according to the above numerical values, this space is also an exemplary target value for downsizing.

Further, the present invention includes a ceramic package (Claim 4) in which a metal frame is attached on the metallized layer via a brazing material.
According to this, since the distance between the joint portion between the metal lid and the metal frame to be disposed later and the boundary portion between the outer peripheral side of the metallized layer and the package body made of ceramic can be made longer than before. Further, peeling of the metallized layer from the ceramic can be suppressed.
Moreover, when the metal lid and the metal frame are joined by welding, even if the amount of brazing material used is reduced, the volume of the metallized layer used on the outer surface side of the package body increases, so the resistance value of the welding current is difficult to increase. Become. As a result, the brazing material brazing the metal frame is difficult to be remelted, and it is difficult to form droplets and scatter in the cavity, so that the performance of the electronic components mounted in the cavity can be guaranteed. It becomes possible.
In addition, the present invention includes a ceramic package in which a metal lid is welded onto the metallized layer.
According to this, since the distance between the joint portion of the metal lid and the metallized layer to be disposed later and the boundary between the outer peripheral side of the metallized layer and the package body made of ceramic can be increased, The peeling can be suppressed.

In other words, according to the present invention, the metallized layer has a lower surface in a vertical cross-section from the side surface of the cavity so that the thickness of the outer surface side of the package body is larger than the thickness of the side surface side of the cavity. A ceramic package that is inclined obliquely downward toward the outer surface of the main body may also be included.
In the case of the above configuration, the surface of the package body should not be a horizontal surface, and the outer surface side of the package body should be inclined so as to be lower than the side surface side of the cavity.
Further, when only the thickness of each corner portion on the surface of the package body is increased in the outer peripheral surface side of the package body in the metallized layer, each side is a horizontal plane on the outer surface side in the surface of the package body, and both sides thereof It is good also as a form which makes each corner part located in an inclined surface which goes down diagonally downward.

The perspective view which shows the ceramic package of one form by this invention. The partial vertical sectional view which expanded the arrow of XX in FIG. The perspective view which shows the deformation | transformation form of the said ceramic package. Schematic which shows one manufacturing process of each said ceramic package. Schematic which shows the manufacturing process following FIG. The partial vertical sectional view which shows the application form of the said ceramic package. The vertical sectional view which shows the ceramic package of a different form. The partial vertical sectional view which expanded the dashed-dotted line part Y in FIG. Sectional drawing in a different position which shows the ceramic package of an Example. Sectional drawing in a different position which shows the ceramic package of a comparative example.

Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a perspective view showing a ceramic package 1 according to an embodiment of the present invention, and FIG. 2 is a partial vertical cross-sectional view enlarging an arrow XX in FIG.
As shown in FIG. 1, a ceramic package (hereinafter simply referred to as a package) 1 is a box-shaped body made of ceramic and having a cavity 6 and a package frame 2 having a rectangular frame shape in plan view. 3 includes a metallized layer 10 formed so as to surround the opening of the cavity 6, and a metal frame 15 attached above the metallized layer 10 via a brazing material 14.
The package body 2 includes a front surface 3 and a back surface 4 that have a rectangular (rectangular) outer shape in plan view, and an outer surface 5 having four sides positioned therebetween, and the length of the front surface 3 and the back surface 4 in plan view. The sizes of the length 2L and the width 2W are relatively small, 3 mm × 3 mm or less, respectively. The ceramic constituting the package body 2 includes a high-temperature fired ceramic such as alumina, mullite, or aluminum nitride, or a glass-ceramic that is a kind of low-temperature fired ceramic.

The cavity 6 includes a bottom surface 7 having a rectangular shape (rectangular shape) and side surfaces 8 having four sides in plan view. On the left side of FIG. A pair of mounting parts 9 having a rectangular parallelepiped shape having pads (both not shown) to which the electrodes are individually connected are projected. As shown in FIG. 2, the thickness 2t between the outer side surface 5 of the package body 2 and the side surface 8 of the adjacent cavity 6 (side wall) is relatively thin, 0.4 mm or less.
Further, as shown in FIG. 2, the metallized layer 10 includes a unit metallized layer 11 formed on the surface 3 of the package body 2, a position on the outer surface 5 side of the package body 2, and a back surface from the surface 3. The unit metallization layer 12 is formed at the position on the 4th side. The unit metallized layer 12 has the same thickness as that of the unit metallized layer 11, and the width dimension along the inner and outer directions of the package body 2 is about 50% of the unit metallized layer 11. The unit metallized layers 11 and 12 are made of, for example, W, Mo, Ag, or Cu.

That is, the metallized layer 10 is composed of unit metallized layers 11 and 12 on the outer surface 5 side of the package body 2 on the surface 3 of the package body 2, and the thickness on the outer surface 5 side is composed only of the unit metallized layer 11. The thickness of the cavity 6 is about twice as large as the thickness on the side surface 8 side.
The brazing material 14 is made of, for example, Ag brazing (Ag—Cu alloy), and the metal frame 15 and a metal lid (lid) 17 to be described later are, for example, 42 alloy (Fe-42 wt% Ni), Kovar. (Fe-29 wt% Ni-17 wt% Co) or 194 alloy (Cu-2.3 wt% Fe-0.03 wt% P).
As shown in FIG. 2, a metal plating layer 16 in which a Ni plating film and an Au plating film are sequentially coated on the surfaces exposed to the outside of the metallized layer 10, the brazing material 14, and the metal frame 15 has a substantially constant thickness. It is covered.

In the package 1 as described above, after electronic components are mounted on the mounting portion 9 in the cavity 6, the cavity 6 is sealed with a metal lid 17. Then, after placing the peripheral portion of the metal lid 17 having a rectangular shape (rectangular view) in plan view, two seams are formed along the pair of long sides and the pair of short sides in the metal lid 17 and the metal frame 15. Welding was performed. In the seam welding, a pair of left and right roller electrodes 19 rotatably supported on a shaft 18 in a horizontal posture are individually rolled along a pair of long sides or short sides facing each other on the metal lid 17, and the pair This is performed by applying a predetermined welding current between the roller electrodes 19. At this time, the contact area between the metal frame 15 including the metal plating layer 16 and the metal lid 17 is partially melted and then solidified, whereby the metal lid 17 and the metal frame 15 are joined. Specifically, the Ni layer provided on the back surface side of the metal lid 17 and the Au layer on the surface layer side of the metal plating layer 16 coated on the surface of the metal frame 15 are melted and solidified to form a metal. The lid 17 and the metal frame 15 are joined.
The metal lid 17, the metal frame 15, and the metallized layer 10 made of metal in association with the welding are thermally expanded outwardly compared to the package body 2 made of ceramic, and then the center side of the metal lid 17 and the like with cooling. It shrinks greatly toward The stress accompanying the shrinkage is between the joint between the metal lid 17 and the metal frame 15 and the unit metallized layer 12 on the lower layer (back surface 4) side of the metallized layer 10 and the ceramic boundary of the package body 2. Acts mainly.

In this package 1, the metallization layer 10 is configured to use the unit metallizations 11 and 12 together, so that the thickness on the outer surface 5 side of the package body 2 is larger than the thickness on the side surface 8 side of the cavity 6. . As a result, since the stress can be reduced, peeling of the metallized layer 10 on the outer surface 5 side in the vicinity of the boundary between the package body 2 and the ceramic can be eliminated or suppressed.
Further, as described above, the front surface 3 and the back surface 4 of the package body 2 have a small size of 3 mm × 3 mm or less in plan view, and the thickness 2t between the outer surface 5 of the package body 2 and the side surface 8 of the cavity 6 is set to 2t. Even if the thickness is 0.4 mm or less, it is possible to reduce the peeling of the metallized layer 10.
Moreover, even if the amount of the brazing material 14 used is reduced as the size is reduced as described above, the conductor portion corresponding to the unit metallized layer 12 is increased in the metallized layer 10, so that the resistance value during the seam welding hardly increases. Become. As a result, it is possible to eliminate the situation in which the droplets of the brazing material 14 scatter into the cavities 6 and the performance of the mounted electronic component is impaired as the resistance value of the welding current increases during the welding. .

FIG. 3 is a perspective view showing a package 1 a which is a modified form of the package 1. As shown in FIG. 3, the package 1 a also includes the same package body 2, brazing material 14, and metal frame 15 as described above. In such a package 1a, the same unit metallization layer 11 is formed as the metallization layer 10 on the entire surface 3 of the package body 2, whereas the unit metallization layer 12 disposed only on the outer surface 5 side of the package body 2 is formed. Only the corner portions of the surface 3 are used. Therefore, the partial vertical cross-sectional view along the arrow XX perpendicular to the corner portion in FIG. 3 is the same as FIG. The exposed surface of the conductor portion such as the metallized layer 10 as described above is covered with the same metal plating layer 16 as described above.
Also with the package 1a as described above, the peeling of the metallized layer 10 on the outer surface 5 side in the vicinity of the boundary between the package body 2 and the ceramic can be suppressed, and the overall size can be reduced. It is possible to suppress the formation of droplets.

Below, the manufacturing method of the said packages 1 and 1a is demonstrated.
A ceramic slurry was obtained by previously weighing and blending ceramic powder such as alumina powder, binder resin, solvent, and the like in predetermined amounts. The slurry was formed into a sheet by a doctor blade method to prepare a plurality of green sheets.
Next, via holes are formed on the plurality of green sheets at predetermined positions and filled with a conductive paste containing W powder or the like into the via holes to form via conductors. Formed.
Next, as shown in FIGS. 4A and 4B, the same conductivity as described above applied to the surface (lower surface) of the transfer film 20 with respect to the surface 3 of the green sheet 22a to be the uppermost layer. A band-shaped unit metallized layer 12 made of paste was pressure-bonded.
The unit metallized layer 12 may be formed on the surface 3 by screen printing. Moreover, the broken line 21 in FIG. 4 (a), (b) shows the virtual planned cutting surface which divides between each package 1 and 1 later, or between packages 1a and 1a.

Further, as shown in FIG. 4C, a (unit) metallized layer 11 made of a conductive paste was formed on the entire surface 3 of the green sheet 22a including the unit metallized layer 12 by screen printing.
On the other hand, conductor layers (pads, wiring layers, etc.) by screen printing of the same conductive paste as described above were also formed on at least one of the front and back surfaces of the green sheet other than the green sheet 22a.
Next, with respect to the green sheet 22a and the green sheet to be laminated immediately below, through holes having a rectangular shape in a plan view and a size of 2.2 mm × 2.2 mm or less are vertically and horizontally each 0.8 mm or less. The through holes for the cavities 6 were individually formed by performing punching processing so as to be arranged in a lattice shape in a plan view with an interval of.

Next, the plurality of green sheets including a flat green sheet were laminated and pressure-bonded so that each through-hole communicated along the thickness direction. As a result, as shown in the partial vertical cross section of FIG. 5A, the cavities 6 and 6 including the bottom surface 7 and the side surfaces 8 on the four sides are adjacent along the vertical and horizontal directions, and the surface 3 is provided between the cavities 6 and 6. A green sheet laminate 22 having partition walls 28 having a rectangular cross section (substantially square) was obtained.
Next, as shown in FIG. 5B, a cutting tool (not shown) is vertically inserted from the surface 3 side of each partition wall 28 along the planned cutting surface 21 to form the divided grooves 23 having a substantially V-shaped cross section. . The inner wall surface of the dividing groove 23 is the outer screen 5 of the packages 1 and 1a, and the metallized layers 11 and 12 are divided into left and right parts. The dividing groove 23 may be formed by laser processing that irradiates a YAG laser or the like, for example.

Further, the Ni sheet coated with the metallized layer 10 including the fired unit metallized layers 11 and 12 after firing the green sheet laminate 22 having the dividing grooves 24 formed in a lattice frame shape in plan view at a predetermined temperature. The brazing material 14 was heated and melted in a state where the metal frame 15 was placed on the film via the brazing material 14 preformed in a rectangular frame shape.
Then, the exposed surfaces of the metallized layer 10, the brazing material 14, and the metal frame 15 are sequentially subjected to electrolytic Ni plating and electrolytic Au plating, and then subjected to sintering along the dividing grooves 23 to obtain individual packages 1. It separated into pieces every (1a). As a result, the packages 1 and 1a shown in FIGS. 1 and 3 were obtained. The plating process may be electroless Ni plating or electroless Au plating.

FIG. 6 is a similar partial vertical sectional view showing a package 1b which is an application of the packages 1 and 1a.
This package 1b also includes the same package body 2, brazing material 14, and metal frame 15 as described above. In the package 1b, as shown in FIG. 6, the same unit metallized layer 11 as the metallized layer 10 is formed on the entire surface 3 of the package body 2, and the outer surface 5 side of the package body 2 A unit metallized layer 12 having a similar width and a slightly thin thickness and a unit metallized layer 13 having a narrower width are arranged.

In such a package 1b, the unit metallized layers 12 and 13 are formed along the entire length of each outer surface 5 of the package body 2, and only the unit metallized layer 12 is formed along the entire length of each outer surface 5 of the package body 2. And the unit metallized layer 13 may be formed only at each corner, or the unit metallized layers 12 and 13 may be disposed only at each corner.
Even with the package 1b as described above, it is possible to suppress the peeling of the metallized layer 10 on the outer surface 5 side in the vicinity of the boundary between the package body 2 and the ceramic, as well as to reduce the overall size, and to reduce the brazing material 14. It is also possible to suppress the formation of droplets.

FIG. 7 is a vertical sectional view showing a package 1c of a different form according to the present invention, and FIG. 8 is a partially enlarged sectional view of a one-dot chain line portion Y in FIG.
The package 1c also includes the same package body 2 and a metallized layer 10 made up of unit metallized layers 11 and 12. In this package 1c, as shown in FIG. 7, after an electronic component 24 such as a crystal resonator is mounted in a cantilever shape in advance on the mounting portion 9 of the cavity 6, the same metal lid as described above is formed on the upper surface of the metallized layer 10. 17 is welded directly. That is, in this package 1c, as shown in FIG. 8, after the peripheral portion of the metal lid 17 is placed on the upper surface of the unit metallization layer 11 of the metallization layer 10 through the metal plating layer 16 similar to the above. The pair of roller electrodes 19 rolls along a pair of opposing sides of the metal lid 17 and seam welding is performed to pass a predetermined welding current between the adjacent roller electrodes 19 and 19.

Therefore, by forming a large number of flat joint portions 25 extending along the depth direction of FIG. 8 across the unit metallized layer 11, the metal plating layer 16, and the metal lid 17, electrons mounted in the cavity 6 by the metal lid 17. The component 24 is sealed. The joint 25 is formed by melting and solidifying the Ni film coated on the back side of the metal lid 17 and the Au layer on the surface side of the metal plating layer 16 coated on the surface of the metallized layer 11. .
Also with the package 1c as described above, the thickness of the metallized layer 10 on the outer surface 5 side of the package body 2 is made larger than the thickness of the side surface 8 side of the cavity 6 by the unit metallized layers 11 and 12, and the joint 25 Further, the distance between the unit metallized layer 12 and the ceramic of the package body 1 is increased. Therefore, peeling of the metallized layer 10 on the outer surface 5 side can be easily suppressed, and the package body 2 can be reduced in size. In addition, since the brazing material 14 is not used in the package 1c, droplet formation does not occur during the seam welding of the brazing material 14.
Also in the present package 1c, the unit metallized layer 12 is arranged only at each corner portion on the surface 3 of the package body 2, or the unit metallized layers 12 and 13 are used together as in the package 1b. It is good also as a form.

Here, the package 1 according to a specific embodiment of the present invention will be described.
Forty packages 1 of the example shown in the cross-sectional views of FIGS. 9A and 9B were manufactured.
The package 1 has a front surface 3 and a back surface 4 in a plan view of the package body 2 having a rectangular shape, and the package body 2 shown in FIG. As shown in FIG. 9B showing a cross section orthogonal to the short side, it was manufactured by the method described above and formed with the following dimensions.
In the package body 2, the thickness A between the outer side surface 5 and the side surface 8 of the cavity 6 on the long side such as the surface 3 is 0.31 mm.
In the package body 2, the thickness B between the outer side surface 5 and the side surface 8 of the cavity 6 on the short side such as the surface 3 is 0.26 mm.
-Of the metallized layer 10, the thickness C of the unit metallized layer 11 is 0.02 mm.
Of the metallized layer 10, the width of the unit metallized layer 12 is half that of the unit metallized layer 11 and the thickness is the same as C. The thickness D of the horizontal part of the brazing material (Ag—Cu type) 14 is 0.025 mm.
・ Cross section size of metal frame (Kovar): width 0.25mm x height 0.15mm

On the other hand, as shown in FIGS. 10A and 10B, the package body 2 having the same dimensions and materials as those described above, the unit metallized layer 11, the brazing material 14, and the metal frame 15 are provided, and the unit metallized 12 is omitted. Forty comparative packages 30 were manufactured.
The packages 1 and 30 of the example and the comparative example were divided into four sets of 10 pieces each. A metal lid 17 made of Kovar and having the same size and thickness is placed on the metal frame 15 of each package 1, 30, and using a jig having the pair of roller electrodes 19, The metal lid 17 was welded by performing seam welding along both sides of the side. At this time, for each of the 10 packages 1 and 30 each of the example and the comparative example, the welding was performed by changing only the voltage value at the time of welding to conditions a to d.
After the welding, the packages 1 and 30 of each example were placed in pressurized helium gas, and helium gas was sealed in the cavity 6 of the packages 1 and 30 at a predetermined pressure.
The packages 1 and 30 of each example to which the metal lid 17 was welded were transferred to a decompression space, and the presence or absence of leakage of the helium gas was measured using a He leak detector (mass spectrometer) (He leak test). .
The results are shown in Table 1. According to Table 1, all of the packages 1 of the examples did not cause sealing leakage in any of the conditions A to D. On the other hand, in the package 30 of the comparative example, there was no sealing leakage under the conditions A and B, but under the conditions C and D, one or three of the ten packages had sealing leakage.
From the above results, the superiority of the package 1 of the embodiment according to the present invention was found.

The present invention is not limited to the embodiments described above.
For example, the front surface 3 and the back surface 4 of the package body 2 and the bottom surface 7 of the cavity 6 may have a substantially square (rectangular) shape in plan view.
The cavity 6 further includes another cavity 6 that opens on the back surface 4 side as well as on the front surface 3 side of the package body 2, and the metallization layer 10 (unit metallization layer 11 similar to the above is also formed on the back surface 4. To 13) may be formed.
Further, the metallized layer 10 has two unit metallized layers disposed on the side surface 8 side of the cavity 6 and is disposed on the outer side surface 5 side of the package body 2 (including a form in which only the corner portion is disposed). The number of unit metallization layers to be provided may be three or more.
Further, the surface 3 of the package body 2 is not limited to the stepped shape as described above in the vertical cross section, but is an inclined surface or a slanted surface that is inclined downward from the side surface 8 of the cavity 6 toward the outer surface 5 of the package body 2. As the curved surface, the thickness of the metallized layer 10 can be changed as described above.
In addition, in the manufacturing method, even when the dividing groove 23 is formed by laser processing, the outer surface 5 side of the package body 2 in the unit metallized layers 11 to 13 of the metallized layer 10 is slightly more cavity 6 than the outer surface 5. However, since the unit metallized layers 12 and 13 are increased on the outer surface 5 side, the resistance value during the welding does not increase, and the brazing material 14 is formed into droplets. Can be prevented.

  According to the present invention, when the metal lid for sealing the opening of the cavity is joined to the metallized layer or the metal frame, the metallized layer is difficult to peel off from the package body, and the brazing material brazed to the metal frame is It is possible to provide a ceramic package that is difficult to be remelted into droplets and that can easily cope with downsizing.

1, 1a-1c ... Package (ceramic package)
2 ………………… Package body 2t ……………… Thickness 3 ………………… Front side 4 ………………… Back side 5 ………………… Outside side 6 ……… ………… Cavity 7 …………………… Bottom 8 ………………… Side 10 ……………… Metalized layer 11-13 ……… Unit metallized layer 14 ……………… Brass material 15 ……………… Metal frame 17 ……………… Metal lid

Claims (5)

A package body made of a ceramic having a rectangular front surface and a back surface in a plan view, and having a cavity formed in the surface and having a bottom surface and a side surface;
A metallization layer formed so as to surround the opening of the cavity on the surface of the rectangular frame in plan view,
The thickness of the outer surface side of the package body of the metallized layer is larger than the thickness of the side surface side of the cavity in at least the four corners in plan view on the surface of the package body, and the outer surface side of the package body. A part of the metallized layer is formed at a position on the back side of the front surface of the package body .
A ceramic package characterized by that. The metallized layer is formed by laminating one or more unit metallized layers, and the number of unit metallized layers located on the outer side of the package body is greater than the number of unit metallized layers located on the side of the cavity. There are many,
The ceramic package according to claim 1. The front and back surfaces of the package body have a size of 3 mm × 3 mm or less in plan view, and the thickness between the outer surface of the package body and the side surface of the cavity is 0.4 mm or less.
The ceramic package according to claim 1 or 2, wherein On the metallized layer, a metal frame is attached via a brazing material,
The ceramic package according to any one of claims 1 to 3, wherein: A metal lid is welded onto the metallized layer.
The ceramic package according to any one of claims 1 to 3, wherein:

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