JP6108734B2 - Electronic component element storage package - Google Patents

Description

  The present invention provides an electronic component for mounting an electronic component element such as a semiconductor element or a piezoelectric vibrating piece in a cavity, and sealingly storing the electronic component element in a hollow state by joining a metal lid. More specifically, the present invention relates to an electronic component element storing package in which a plurality of individual pieces are divided by dividing grooves from a mother board on which a plurality of individual pieces are arranged adjacent to each other in the vertical and horizontal directions.

In recent years, electronic component element storage packages have become increasingly lighter, smaller, and more reliable in response to demands for downsizing and high reliability of devices equipped with electronic component elements such as mobile phones and personal computers. There is a need to respond to changes. In order to cope with this, a ceramic substrate made of ceramic such as alumina (Al ₂ O ₃ ) or aluminum nitride (AlN) is used for the electronic component element storage package. The electronic component element storage package is formed by forming a Ni plating film on the surface of an annular metallized film made of refractory metal such as tungsten (W) or molybdenum (Mo) provided on the outer periphery of the upper surface of the ceramic substrate. Is provided with an annular metal frame that is heated and brazed through an AgCu brazing material. Alternatively, the electronic component element storage package uses a joined body of a ceramic base and a ceramic frame made of the same ceramic as the ceramic base. The electronic component element storage package is formed by forming an Ni plating film on the surface of an annular metallized film provided on the upper surface of the ceramic frame, and then heating and brazing the Ag metal brazing material between them. Is provided. This annular metal frame is usually clad with an AgCu brazing material on the lower surface, and this surface is brought into contact with the upper surface of the annular metallized film with the Ni plating film applied to the surface to be brazed and joined. It is like that. Thereby, the lower surface of the annular metal frame is bonded to the upper surface of the annular metallized film on which the Ni plating film is applied, and an AgCu brazing meniscus is formed between the upper surface of the annular metallized film and the wall surface of the annular metal frame. Are joined together. In addition, the Ni plating film is excellent in wettability with the AgCu brazing material, and usually has a thickness of 0.3 μm or more in order to wet and spread on the annular metallized film and join the annular metal frame.

  The electronic component element storage package is formed by the upper surface of the ceramic base and the inner peripheral side wall of the annular metal frame or the upper surface of the ceramic base and the inner peripheral side wall of the ceramic frame and the annular metal frame. After the electronic component element is mounted in the cavity portion, even if the metal lid is joined to the upper surface of the annular metal frame by seam welding, it is used as a package with high hermetic reliability. Since such an electronic component element storage package is required to be inexpensive, conventionally, an electronic component element storage package in a single piece is arranged in the mother board so as to be adjacent in the vertical and horizontal directions. Many are formed to streamline the work. And, on the mother board, usually after pressing the pressing grooves in which a large number of individual pieces are arranged in the vertical and horizontal directions in the laminated body of a plurality of large ceramic green sheets before firing are provided and fired. Divided grooves that can be divided into individual pieces are formed, and each of the divided grooves is used to form an inexpensive individual-piece electronic component element storage package having a predetermined size. In addition, an annular metal frame is brazed with AgCu on the Ni plating film, and the mother substrate before being divided by the dividing groove is formed on the metal portion in order to prevent oxidation of the metal portion exposed to the outside air. An Au plating film is formed on the upper surface of the second Ni plating film and the second Ni plating film.

  Since the electronic component element storage package is formed so as to be arranged adjacent to each other with the dividing grooves in the vertical and horizontal directions on the mother board, it can be surely divided into divided pieces by the dividing grooves. It is necessary. In addition, the electronic component element storage package described above has an annular shape for seam welding a metal lid and joining an annular metal frame necessary for hermetically sealing the electronic component element in a hollow state by downsizing. Since the seal path width of the metallized film is narrowed, it is difficult to provide a portion where the annular metallized film is pulled down from the dividing groove which is the outer shape of the individual piece. Therefore, the mother substrate is provided with a pressing groove by pressing with a pressing blade from the upper surface of the annular metallized printed film provided in the ceramic green sheet laminate at a position between adjacent pieces before firing. Thus, a dividing groove is provided so that it can be divided into individual pieces after the Ni plating film is formed.

  However, the above-described conventional electronic component element storage package has good wettability of the AgCu brazing material for joining the annular metal frame to the annular metallized film with the Ni plating film having a thickness of 0.3 μm or more, Since an AgCu brazing meniscus is formed by extending to the end of the annular metallized film, there is a problem that the end of the annular metallized film is peeled off from the ceramic substrate or the ceramic frame due to thermal stress during bonding. The airtight reliability as a package for housing the element is lowered.

Therefore, it is possible to prevent peeling of the annular metallized film due to thermal stress. In the conventional electronic component element storage package, the annular metal frame is brazed to the annular metallized film provided on the surface of the insulating base and the annular metal frame is used. An electronic component element storage package in which a metal lid is attached to a body and an electronic component element is hermetically accommodated therein, and the brazing material for brazing the annular metal frame to the annular metallized film A coating thickness of 30.0 μm or less has been proposed in the range of 0.3 mm inside from the outer peripheral edge of the annular metallized film (see, for example, Patent Document 1).
In addition, since the peeling of the annular metallized film due to thermal stress can be prevented, the conventional electronic component element storage package has a ceramic substrate having a frame portion on the outer periphery of the upper surface and a frame-like shape attached to the upper surface of the frame portion. An electronic component element housing that includes an annular metallized film, an annular metal frame brazed to the annular metallized film, and a metal lid welded to the annular metal frame, and the electronic component element is hermetically accommodated therein. There has been proposed a package in which a non-contact region of a brazing material is formed in a region having a width of at least 30 μm from the outer periphery of the annular metallized film (see, for example, Patent Document 2).

  However, in the electronic component element storage package as described above, the area of the annular metallized film is increased to reduce the thickness of the brazing material having a predetermined width from the outer peripheral end of the annular metallized film, or the non-contact of the brazing material Since the region is formed, the outer dimensions of the package are increased, and the package cannot be made smaller. In addition, in the electronic component element storage package that forms the non-contact area of the brazing material, the non-contact area is prevented from being adhered to the brazing material by applying carbon ink, alumina powder paste, etc. Since the process is performed by removing the brazing material, the miniaturized package requires a very difficult and labor-intensive operation, which increases the cost of the electronic component element storage package itself.

  Therefore, it is possible to prevent peeling of the annular metallized film due to thermal stress, and to cope with downsizing, the conventional electronic component element storage package is formed by laminating a plurality of ceramic layers, and the electronic component element is provided on the upper surface. An electronic component element storage package formed by brazing a substantially square frame-shaped annular metal frame to an annular metallized film of an insulating base having a recess for accommodating and a substantially square frame-shaped annular metallized film surrounding the recess. The insulating base has a rounded portion with a radius of curvature of approximately 5 to 50 μm from the upper surface to the outer peripheral side surface, and the annular metallized film has been proposed in which the outer peripheral edge extends at least halfway through the rounded portion. (For example, refer to Patent Document 3).

JP-A-5-160284 JP 11-126847 A JP 2002-299520 A

  However, the conventional electronic component element storage package as described above has the following problems.

  An electronic component element storage package in which a plurality of conventional individual pieces are divided by dividing grooves from a mother board in which a plurality of pieces are arranged adjacent to each other in a vertical and horizontal direction has a thickness of 0.3 μm or more. The wettability of the AgCu brazing material to be bonded to the annular metallized film coated with a Ni plating film is good, the AgCu brazing material extends to the end of the annular metallized film, and forms a brazing material bridge in the split groove part, It becomes difficult to divide normally in the dividing groove, and each piece after the division is cracked, burred, cracked, etc., and the electronic component element is accommodated and hermetically sealed with a metal lid. Electronic component element storage packages have extremely low airtight reliability.

  In addition, the conventional electronic component element storage package has a narrow seal path width of the annular metallized film due to downsizing of the device for mounting the device, and further includes an upper surface of the annular metallized film and a lower surface of the annular metal frame. Because of the flat surfaces, it is not possible to secure a brazing material pool between them, the bonding strength of the annular metal frame is low, and the thermal stress when the metal lid is directly bonded to the annular metal frame is absorbed. There is no brazing material reservoir to prevent the peeling of the annular metallized film from the ceramic, and the electronic component element storage package that stores the electronic component element and hermetically seals with a metal lid is extremely airtight. The reliability is low.

  Furthermore, in recent electronic component element storage packages, in addition to downsizing the device for mounting the electronic component element storage package, the electronic component element storage package is required to be reduced in thickness by reducing the thickness of the device. The brazing material bridge is easily formed in the split groove by spreading the AgCu brazing material to join the annular metal frame to the annular metallized film with a thickness of 0.3 μm or more. This makes it difficult to perform normal division in the dividing groove, and causes chipping, burrs, cracks, etc. in the individual pieces after the division, and an electronic component element storage package with extremely low airtight reliability It has become.

  An electronic component element storage package as disclosed in Japanese Patent Application Laid-Open No. 2002-299520 divides each piece of a mother board in which a plurality of pieces are arranged adjacent to each other in the vertical and horizontal directions in a plane. The molten AgCu brazing material at the time of joining the annular metal frame flows into the round part of the dividing groove to form a brazing material bridge so as to close the dividing groove, and normal division in the dividing groove becomes difficult. An electronic component element storage package that generates burrs, burrs, cracks, etc. in each individual piece after the division, and stores the electronic component element and hermetically seals with a metal lid, is extremely airtight and reliable. It is low.

  The present invention has been made in view of such circumstances, and lacks an individual piece formed by dividing a plurality of individual pieces in a dividing groove from a mother board in which a plurality of pieces are arranged adjacent to each other in the vertical and horizontal directions. Another object of the present invention is to provide an electronic component element storage package that prevents the occurrence of burrs, has a high bonding strength of an annular metal frame, is small, and has excellent airtight reliability.

An electronic component element storage package according to the present invention that meets the above-described object includes a flat ceramic substrate, an annular metallized film made of a refractory metal of W or Mo on the outer periphery of the upper surface including the outer periphery of the ceramic substrate, and an annular A protruding metallized film made of a refractory metal partially projecting from the upper surface of the metallized film, an Ni plated film on the upper surface of the annular metallized film including the projected metallized film, and brazed with AgCu brazing on the upper surface of the Ni plated film The thickness of the Ni plating film in the portion covered with the AgCu brazing is less than 0.3 μm, the pull-down width a of the AgCu brazing from the outer peripheral edge of the ceramic base, and the outer peripheral side of the ceramic base top and of the ceramic base upper surface of the AgCu brazing meniscus formed between the outer peripheral side wall surface of the annular metal frame between the brazing flow width b Cormorants ratio of the flow width b (b / a + b) × 100 consists of 6 0% or less.

Another electronic component element storage package according to the present invention that meets the above-described object includes a flat ceramic substrate, a window frame ceramic frame laminated on the outer peripheral portion of the upper surface of the ceramic substrate, and an outer periphery of the ceramic frame. An annular metallized film made of a refractory metal of W or Mo on the entire upper surface, a projecting metallized film made of a refractory metal partially projecting on the upper surface of the annular metallized film, and an annular metallized film comprising a projecting metallized film The upper surface of the Ni plating film and the upper surface of the Ni plating film have an annular metal frame that is brazed with AgCu brazing, and the thickness of the Ni plating film in the portion covered with AgCu brazing is less than 0.3 μm, It is formed between the pull-down width a from the outer peripheral edge of the ceramic frame of AgCu brazing, and the outer peripheral side upper surface of the ceramic frame and the outer peripheral side wall surface of the annular metal frame. gCu proportion of wax flow width b between the wax meniscus wax flow width b of the insulating wall upper surface of (b / a + b) × 100 consists of 6 0% or less.

The electronic component element storage package includes a flat ceramic substrate, an annular metallized film made of a refractory metal of W or Mo on the outer peripheral surface of the upper surface including the outer peripheral edge of the ceramic substrate, and a partial upper surface of the annular metallized film. A projecting metallized film made of a refractory metal projecting on the surface, an Ni plating film on the upper surface of the annular metallized film including the projecting metallized film, and an annular metal frame that is brazed and joined to the upper surface of the Ni plating film with AgCu brazing. The thickness of the Ni plating film of the portion covered with the AgCu brazing is less than 0.3 μm, the pull-down width a of the AgCu brazing from the outer peripheral edge of the ceramic base, the outer peripheral side upper surface of the ceramic base, and the annular metal frame the proportion of wax flow width b between the brazing flow width b of the ceramic substrate upper surface of the AgCu brazing meniscus formed between the outer peripheral side wall surface of ( / A + b) because × 100 consists of 6 0% or less, by Ni plating film thickness is below the 0.3 [mu] m, is suppressed wettability AgCu wax, AgCu wax of the ceramic substrate is the tip of the AgCu brazing meniscus The pulling-down width a from the outer peripheral edge can be 40% or more with respect to the distance (a + b) from the outer peripheral edge of the ceramic base to the wall surface of the annular metal frame. This prevents brazing material bridges formed in the split grooves between the mother board pieces that are arranged in large numbers adjacent to each other. In addition, the brazing material reservoir is provided between the annular metallized film on the upper surface of the annular metallized film including the projective metallized film coated with the Ni plating film and the annular gold frame is provided. It is possible to provide an electronic component element storing package having excellent airtightness reliability compact can be firmly bonded to the frame. In addition, this electronic component element storage package can relieve the thermal stress when the metal lid is directly joined by seam welding by the brazing material reservoir, and avoid the occurrence of peeling of the annular metallized film from the ceramic substrate. It is possible to provide an electronic component element storage package that is small and excellent in airtight reliability.

The other electronic component element storage package includes a flat ceramic base, a window frame-shaped ceramic frame laminated on the outer peripheral portion of the upper surface of the ceramic base, and a W on the entire upper surface including the outer peripheral edge of the ceramic frame. Or an annular metallized film made of a refractory metal of Mo, a projecting metallized film made of a refractory metal partially protruding on the upper surface of the annular metallized film, and a Ni plating film on the upper surface of the annular metallized film including the projecting metallized film And an Ni-plated coating having an annular metal frame brazed with AgCu brazing, the Ni-plated coating thickness of the portion covered with AgCu brazing being less than 0.3 μm, and an AgCu brazing ceramic frame Width Cu from the outer peripheral edge of the steel, and the AgCu brazing meniscus formed between the outer peripheral side upper surface of the ceramic frame and the outer peripheral side wall surface of the annular metal frame The ratio of the wax flow width b between the brazing flow width b of the insulating wall upper surface (b / a + b) × 100 consists of 6 0% or less, by Ni plating film thickness is below the 0.3 [mu] m, The wettability of the AgCu brazing is suppressed, and the pulling-down width a from the outer peripheral edge of the ceramic frame of the AgCu brazing that is the tip of the AgCu brazing meniscus is the distance (a + b) from the outer peripheral edge of the ceramic frame to the wall surface of the annular metal frame. ) And a brazing material formed in the divided grooves between the individual pieces of the mother board in which a plurality of pieces are arranged adjacently via the dividing grooves in the vertical and horizontal directions in a plane. It is possible to prevent bridging and to prevent chipping and burrs from occurring on individual pieces divided by dividing grooves from the mother substrate, and at the top surface of the annular metallized film including the protruding metallized film coated with Ni plating film. Protruding meta It is possible to provide a size layer and the electronic component element storing package having excellent airtightness reliability compact can be firmly bonded to the annular metal frame body provided with a reservoir brazing material between the abutting annular metal frame. In addition, this electronic component element storage package relieves the thermal stress caused by the brazing material reservoir when the metal lid is directly joined by seam welding, and avoids the occurrence of peeling of the annular metallized film from the ceramic frame. Therefore, it is possible to provide an electronic component element storage package that is small in size and excellent in airtight reliability. Moreover, this electronic component element storage package can provide a small electronic package with excellent airtight reliability that can make the cavity portion relatively deep by the joined body of the ceramic base and the ceramic frame.

(A), (B) is explanatory drawing which carries out the cross sectional view of the electronic component element storage package which concerns on one embodiment of this invention, respectively, and A section expanded vertical sectional drawing. (A), (B) is the explanatory view which carries out the cross sectional view of the other electronic component element storage package which concerns on one embodiment of this invention, respectively, and B section expansion longitudinal cross-sectional view. (A)-(C) are each the top view of the motherboard for forming the electronic component element storage package which concerns on one embodiment of this invention, and another electronic component element storage package, AA 'line expansion It is a longitudinal cross-sectional view.

Next, with reference to the accompanying drawings, embodiments for embodying the present invention will be described for understanding of the present invention.
As shown in FIGS. 1A and 1B, an electronic component element storage package 10 according to an embodiment of the present invention includes one or a plurality of substantially rectangular shapes in plan view with high hermetic reliability. A flat ceramic substrate 11 made of a single ceramic substrate is provided. The ceramic substrate 11 is not particularly limited in its material, but a ceramic having excellent insulating properties and electrical characteristics such as alumina (Al ₂ O ₃ ) and aluminum nitride (AlN) is used.

  The electronic component element storage package 10 has an annular metallized film 12 having a window frame shape on the outer periphery of the upper surface including the outer periphery of the ceramic substrate 11. This annular metallized film 12 is made of tungsten (W) or molybdenum (which can be fired simultaneously with a ceramic green sheet in a reducing atmosphere by an annular metallized printed film formed by screen printing on a ceramic green sheet which is a ceramic substrate before firing. Mo) refractory metal.

  The electronic component element storage package 10 has a protruding metallized film 13 that protrudes from the top surface and extends in the length direction at a part of the annular metallized film 12 in the width direction. The protruding metallized film 13 uses tungsten or molybdenum refractory metal, which is the same material as the metallized material used to form the annular metallized film 12. The shape of the protruding metallized film 13 is not particularly limited, and may be a continuous or intermittent linear shape or a meandering shape in plan view.

  The electronic component element storage package 10 has a Ni plating film 14 on the upper surface of the annular metallized film 12 including the protruding metallized film 13. This Ni plating film 14 is usually activated by an electrolytic plating method in which a current is applied in a plating bath made of a Ni plating solution or a NiCo plating solution, or by activating the upper surface of the annular metallized film 12 including the protruding metallized film 13. The electroless plating method is used to form a plating film without energization.

  Furthermore, the electronic component element storage package 10 has an annular metal frame 15 that is brazed to the upper surface of the Ni plating film 14 by AgCu brazing. The annular metal frame 15 is made of a metal plate such as KV (Fe—Ni—Co alloy, trade name “Kover”) or 42 alloy (Fe—Ni alloy) whose thermal expansion coefficient is close to that of ceramic. Is formed into a window frame shape by etching or punching. Then, the annular metal frame 15 is brought into contact with the top of the protruding metallized film 13 covered with the Ni plating film 14 via a molten brazing material so that the lower surface is horizontal, and is covered with the Ni plating film 14. A brazing material reservoir 16 formed by solidifying the molten brazing material is provided between the upper surface of the annular metallized film 12 and AgCu between the upper surface of the annular metallized film 12 coated with the Ni plating film 14 and the outer peripheral side wall surface. A brazing meniscus 17 is provided and brazed so that the wall surfaces are substantially vertical. The annular metal frame 15 is placed on the upper surface of the foil-like AgCu brazing material placed on the upper surface of the Ni plating film 14 and then heated and joined. Alternatively, the annular metal frame 15 may be clad with a foil-like AgCu brazing material in advance and placed on the upper surface of the Ni plating film 14 and heated to be joined.

  In the electronic component element storage package 10 described above, the thickness of the Ni plating film 14 covered with the AgCu brazing is less than 0.3 μm. At the same time, the electronic component element storage package 10 includes a pull-down width a of the AgCu braze from the outer peripheral edge of the ceramic base 11 and the outer peripheral side upper surface of the ceramic base 11 and the outer peripheral side wall of the annular metal frame 15. The ratio of the pulling-down width a between the upper surface of the ceramic base 11 of the AgCu brazing meniscus 17 formed in a bow shape and the brazing flow width b, that is, (a / a + b) × 100 is 40% or more. As a result of diligent research, the present inventor has found that the brazing flow width b of the AgCu brazing meniscus 17 of the AgCu brazing spreading on the annular metallized film 12 to which the Ni plating coating 14 has been applied varies depending on the thickness of the Ni plating coating 14. It was determined that the brazing flow width b increases as the thickness of the coating 14 increases. Accordingly, the ratio of the pull-down width a of the AgCu brazing meniscus 17 from the outer peripheral edge of the ceramic base 11 to the distance from the outer peripheral side wall surface of the annular metal frame 15 to the outer peripheral edge of the ceramic base 11 is a portion covered with the AgCu solder. It was ascertained that 40% or more can be secured by making the thickness of the Ni plating film 14 below 0.3 μm.

Next, another electronic component element storage package according to an embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 2A and 2B, another electronic component element storage package 10a according to an embodiment of the present invention includes a single sheet having a substantially rectangular shape in plan view with high hermetic reliability. Or it has the plate-shaped ceramic base | substrate 11 which consists of several ceramic substrates, and the window frame-shaped ceramic frame 11a which consists of the same ceramic as said ceramic base | substrate 11 laminated | stacked on the upper surface outer periphery of this ceramic base | substrate 11. . The ceramic base body 11 and the ceramic frame body 11a are not particularly limited in material as in the case of the ceramic base body 11 in the case of the electronic component element storage package 10 described above, but alumina (Al ₂ O ₃ ), Further, ceramics having excellent insulating properties and electrical characteristics such as aluminum nitride (AlN) are used.

  The electronic component element storage package 10a has an annular metallized film 12 on the entire upper surface including the outer peripheral edge of the ceramic frame 11a. This annular metallized film 12 is made of tungsten (W) or molybdenum that can be fired simultaneously with the ceramic green sheet in a reducing atmosphere by the annular metallized printed film formed by screen printing on the ceramic green sheet that is the ceramic frame before firing. (Mo) refractory metal.

  Similarly to the electronic component element storage package 10, the electronic component element storage package 10 a has a protruding metallized film 13 that protrudes from the upper surface and extends in the length direction at a part of the annular metallized film 12 in the width direction. doing. The protruding metallized film 13 uses tungsten or molybdenum refractory metal, which is the same material as the metallized material used to form the annular metallized film 12. The shape of the protruding metallized film 13 is not particularly limited, and may be a continuous or intermittent linear shape or a meandering shape in plan view.

  Similar to the electronic component element storage package 10, the electronic component element storage package 10 a has a Ni plating film 14 on the upper surface of the annular metallized film 12 including the protruding metallized film 13. This Ni plating film 14 is usually an electroplating method in which a plating film is formed by energization in a plating bath made of Ni plating solution or NiCo plating solution, or no plating film is formed without energization in the plating bath. It is formed by electrolytic plating.

  Furthermore, the electronic component element storage package 10 a has an annular metal frame 15 that is brazed and joined to the upper surface of the Ni plating film 14 by AgCu brazing, similarly to the electronic component element storage package 10. The annular metal frame 15 is made of a metal plate such as KV (Fe—Ni—Co alloy, trade name “Kover”) or 42 alloy (Fe—Ni alloy) whose thermal expansion coefficient is close to that of ceramic. Is formed into a window frame shape by etching or punching. Then, the annular metal frame 15 is brought into contact with the top of the protruding metallized film 13 covered with the Ni plating film 14 via a molten brazing material so that the lower surface is horizontal, and is covered with the Ni plating film 14. A brazing material reservoir 16 formed by solidifying the molten brazing material is provided between the upper surface of the annular metallized film 12 and AgCu between the upper surface of the annular metallized film 12 coated with the Ni plating film 14 and the outer peripheral side wall surface. A brazing meniscus 17 is provided and brazed so that the wall surfaces are substantially vertical. The annular metal frame 15 is placed on the upper surface of the foil-like AgCu brazing material placed on the upper surface of the Ni plating film 14 and then heated and joined. Alternatively, the annular metal frame 15 may be clad with a foil-like AgCu brazing material in advance and placed on the upper surface of the Ni plating film 14 and heated to be joined.

  In the electronic component element storage package 10a, as in the electronic component element storage package 10, the thickness of the Ni plating film 14 covered with the AgCu brazing is less than 0.3 μm. At the same time, the electronic component element storage package 10a includes a lowering width a of the AgCu braze from the outer peripheral edge of the ceramic frame 11a, an upper surface on the outer peripheral side of the ceramic frame 11a, and an outer peripheral side wall surface of the annular metal frame 15. The ratio of the lowering width a between the upper surface of the ceramic frame 11a of the AgCu brazing meniscus 17 formed in a bow shape and the brazing flow width b, that is, (a / a + b) × 100 is 40% or more. As a result of diligent research, the present inventor has found that the brazing flow width b of the AgCu brazing meniscus 17 of the AgCu brazing spreading on the annular metallized film 12 to which the Ni plating coating 14 has been applied varies depending on the thickness of the Ni plating coating 14. It was determined that the brazing flow width b increases as the thickness of the coating 14 increases. Accordingly, the ratio of the pull-down width a of the AgCu brazing meniscus 17 from the outer peripheral edge of the ceramic frame 11a to the distance from the outer peripheral side wall surface of the annular metal frame 15 to the outer peripheral edge of the ceramic frame 11a is covered with the AgCu brazing. It was ascertained that 40% or more can be secured by making the thickness of the Ni plating film 14 in the portion to be less than 0.3 μm.

  The electronic component element storage packages 10 and 10a are not particularly limited to the metallized thickness of the annular metallized film 12, but are usually 8 to 40 μm, preferably 10 to 30 μm. ing. When the metallized thickness of the annular metallized film 12 is less than 8 μm, there is an anchor effect in which the annular metallized film 12 is embedded in the ceramic green sheet before firing of the ceramic substrate 11 or the ceramic frame 11a and firmly bonded. When a metal lid (not shown) is welded and joined to the annular metal frame 15 to be brazed and joined to the upper surface of the annular metallized film 12 including the protruding metallized film 13 to which the Ni plating film 14 is applied. The cyclic metallized film 12 peels off from the ceramic substrate 11 or the ceramic frame 11a due to the thermal stress. Further, when the metallized thickness of the annular metallized film 12 exceeds 40 μm, multiple overprints are required to secure this thickness by screen printing, the pattern accuracy is lowered, and the electronic component element storage package 10 The cost is increased by 10a. On the other hand, the electronic component element storage packages 10 and 10a do not particularly limit the metallized thickness of the protruding metallized film 13, but if the thickness is similar to the annular metallized film 12, the Ni plating film 14 is used. A brazing material reservoir 16 made of a brazing material amount for firmly brazing and joining the annular metal frame 15 with AgCu brazing is secured to the upper surface of the annular metallizing film 12 including the projecting metallized film 13 to which the metal is applied, and a metal. The thermal stress at the time of welding the lid-making body can be relaxed by the brazing material reservoir 16, and the occurrence of peeling of the annular metallized film 12 from the ceramic substrate 11 can be avoided.

  In these electronic component element storage packages 10 and 10a, after the annular metal frame 15 is brazed with AgCu, the metal portion exposed to the outside air of the mother board before being divided by the dividing groove is prevented from being oxidized. A second Ni plating film 18 is applied to the metal portion, and an Au plating film 19 is applied to the upper surface of the second Ni plating film 18. Accordingly, in the electronic component element storage package 10, 10 a, the Ni plating film thickness on the annular metallized film 12 other than the portion covered with the AgCu solder is set to the thickness of the Ni plating film 14, and the second Ni plating film 18 is formed. The thickness is the sum of the thicknesses. These electronic component element storage packages 10 and 10a are formed by the upper surface of the ceramic base 11, the inner peripheral side wall of the annular metal frame 15, and / or the inner peripheral side wall of the ceramic frame 11a. The cavity part 20 accommodates an electronic component element 21 such as a semiconductor element, a crystal resonator, or a piezoelectric element. Further, in these electronic component element storage packages 10 and 10a, after the electronic component element 21 is mounted in the cavity portion 20, the upper surface of the annular metal frame 15 is made of a metal made of KV, 42 alloy or the like. The lid is directly joined by seam welding, laser welding or the like, and the electronic component element 21 is hermetically sealed in the cavity portion 20 in a hollow state.

  Since these electronic component element storage packages 10 and 10a storing the electronic component elements 21 are used by being incorporated into small electronic devices such as mobile phones, the electronic component element storage packages 10 and 10a include Therefore, it is necessary to reduce the size of a substantially rectangular package in plan view as much as possible and to reduce the cost. In order to cope with the downsizing of the electronic component element storage packages 10 and 10a, for example, between the inner peripheral side wall surface of the annular metal frame 15 and the annular metallized film 12 covered with the Ni plating film 14. The area of the cavity 20 is secured by avoiding the provision of an inner AgCu solder meniscus or by using a smaller inner AgCu solder meniscus. In addition, the electronic component element storage packages 10 and 10a described above have a plurality of pieces of electronic component element storage packages 10 and 10a that are horizontally and vertically arranged in order to reduce the size and cost. Divided by dividing grooves 31 from mother substrates 30 and 30a (see FIGS. 3A to 3C), in which a large number of them are arranged adjacently via dividing grooves 31 (see FIGS. 3A to 3C). So many can be obtained at once.

Here, with reference to FIGS. 3A to 3C, a method of manufacturing the electronic component element housing packages 10 and 10a from the mother boards 30 and 30a will be briefly described.
As shown in FIGS. 3 (A) to 3 (C), the mother substrates 30 and 30a for forming the electronic component element housing packages 10 and 10a are particularly limited to the ceramic base material of the ceramic green sheet for forming them. Although not necessarily used, alumina, aluminum nitride, or the like is usually used. For example, when using alumina as the ceramic substrate, first, a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to aluminum oxide powder, a plasticizer such as dioctiphthalate, an acrylic resin, etc. And a solvent such as toluene, xylene, alcohols, etc. are added, kneaded thoroughly and defoamed to prepare a slurry having a viscosity of 2000 to 40000 cps, and a desired thickness, for example, 0.25 mm, is obtained by a doctor blade method or the like. The ceramic green sheet is formed by drying into a sheet and cutting into a rectangular shape of a desired size. These ceramic green sheets are used as a plurality of ceramic green sheets for the ceramic substrate 11, for example, in the case of the electronic component element storage package 10, as shown in FIG. 3B. Further, as shown in FIG. 3C, these ceramic green sheets are, for example, as a plurality of ceramic green sheets for the ceramic substrate 11 and the ceramic frame 11a in the case of the electronic component element storage package 10a. Is also used.

  Next, in each ceramic green sheet for the ceramic substrate 11 and the ceramic frame 11a, a via for electrically connecting the upper and lower wiring conductors, a through-hole conductor, or this ceramic is formed. In each ceramic green sheet for the frame 11a, a through hole for forming the cavity portion 20 is formed using a punching press, a punching machine, or the like. And each ceramic green sheet in which the through hole is formed is made with a metallizing paste made of tungsten, molybdenum or the like using a screen printing machine for the annular metallized film 12, for various wiring conductor patterns, vias, Conductor printing patterns for through-hole conductors are formed. The conductor print pattern for the annular metallized film 12 is formed so that the adjacent annular metallized films 12 for individual pieces are in contact with each other. Further, the through hole for the cavity portion 20 may be formed by punching after forming the conductor print pattern for the annular metallized film 12.

  Next, all the ceramic green sheets are stacked so as to be in a predetermined position, and are bonded by applying temperature and pressure from below to form a laminated body. Next, a pressing blade having a blade edge angle of about 15 to 50 ° and a blade thickness of about 0.2 to 0.8 mm is pressed against the laminated body from above the conductor printing pattern for the annular metallized film 12 to form a dividing groove. A pressing groove before firing for 31 is formed. The pressing groove formed by the pressing blade is formed by expanding the ceramic green sheet and penetrating into the inside so as to cut the conductor printing pattern for the annular metallized film 12 for the adjacent individual piece. The annular metallized films 12 for the individual pieces are electrically insulated. Next, a conductor print pattern for the projecting metallized film 13 is formed on a part of the width direction on the upper surface of the conductor print pattern for the annular metallized film 12 of the laminate provided with the pressing groove, and then the laminate is formed. A fired body having a protruding metallized film 13 on the upper surface of the annular metallized film 12 is formed by simultaneously firing the ceramic and the conductor in a reducing atmosphere.

  Next, a Ni plating film 14 made of Ni or NiCo having a thickness of less than 0.3 μm is formed on the metal portion exposed to the outside of the fired body. On the upper surface of the annular metallized film 12 including the protruding metallized film 13 covered with the Ni plating film 14, an annular metal frame 15 made of a window frame-shaped metal plate such as KV or 42 alloy is formed by AgCu brazing or the like. It is brazed. In this brazing joint, the lower surface of the annular metal frame 15 is brought into contact with the projecting metallized film 13 having the Ni plating film 14 formed on the surface, and the Ni plating film 14 is formed on the lower surface and the surface of the annular metal frame 15. A brazing material reservoir 16 is formed between the upper surface of the annular metallized film 12 having the above structure. In this brazing joint, the Ni plating film 14 having a thickness of less than 0.3 μm causes the ratio of the pull-down width a from the dividing groove 31 to be the distance a + b from the dividing groove 31 to the outer peripheral side wall surface of the annular metal frame 15. The AgCu meniscus 17 is formed so as to be 40% or more of the amount. In addition, this brazing joining is formed in the dividing grooves 31 between the individual pieces of the mother boards 30 and 30a in which a plurality of individual pieces are arranged adjacently via the dividing grooves 31 in the vertical and horizontal directions in a plane. By preventing the brazing material bridge, it is possible to prevent chips and burrs from being generated in the individual pieces divided by the dividing grooves 31 from the mother boards 30 and 30a.

  Finally, the second Ni plating film 18 and the Au plating film 19 on the upper surface of the second Ni plating film 18 are formed on the metal portion exposed to the outside of the fired body to which the annular metal frame 15 is bonded. The mother substrates 30 and 30a are formed. The mother substrates 30 and 30a are divided at the dividing positions where the dividing grooves 31 are provided, so that chipping and burrs are prevented and airtight reliability is high. A body electronic component element storage package 10, 10a is obtained. Further, the mother substrate 30, 30 a is subjected to the brazing joint of the annular metal frame 15 due to thermal stress when the metal lid is joined to the individual pieces divided at the division positions where the division grooves 31 are provided. It can be relaxed by the brazing material reservoir 16 to be formed, and the bonding reliability of the annular metal frame 15 to the annular metallized film 12 can be improved, and the bonding reliability of the annular metallized film 12 to the ceramic can be improved. It can be done.

  The inventor sets the outer size of each individual electronic component element storage package to 2.5 mm × 2.0 mm, the outer size of the annular metal frame to 2.36 mm × 1.86 mm, and a + b to 70 μm. Each sample is a mother substrate on which individual pieces that can be reduced in size are arranged, and the thickness of the Ni plating film applied to the annular metallized film of each individual piece is 0.1 μm, 0.3 μm, and 0.5 μm 10 pc was prepared. Then, an annular metal frame is plated with AgCu on the annular metallized film with the Ni plating film of each thickness, and the outer peripheral edge of the package, that is, the ratio of the pull-down width a from the divided groove is measured, and the divided groove The incidence of AgCu brazing bridge was measured. The respective results are shown in Tables 1 and 2.

  As shown in Table 1, it was confirmed that the ratio (a / a + b) × 100 of the pulling-down width a from the dividing groove was 40% or more when the thickness of the Ni plating film was less than 0.3 μm. . Further, as shown in Table 2, it was confirmed that the occurrence rate of the AgCu brazing bridge in the dividing groove disappears when the thickness of the Ni plating film is less than 0.3 μm.

  The electronic component element storage package of the present invention is mounted with an electronic component such as a semiconductor element, a crystal resonator, or a piezoelectric element, and is small and requires high reliability. For example, a mobile phone or a notebook It can be used by being incorporated in an electronic device such as a personal computer.

  10, 10a: Electronic component element storage package, 11: Ceramic substrate, 11a: Ceramic frame, 12: Cylindrical metallized film, 13: Projected metallized film, 14: Ni plating film, 15: Cyclic metal frame, 16: Brazing material reservoir, 17: AgCu brazing meniscus, 18: second Ni plating coating, 19: Au plating coating, 20: cavity portion, 21: electronic component element, 30, 30a: mother substrate, 31: dividing groove

Claims (2)

A flat ceramic substrate, an annular metallized film made of a refractory metal of W or Mo on the outer peripheral surface of the upper surface including the outer peripheral edge of the ceramic substrate, and the refractory metal partially protruding on the upper surface of the annular metallized film A projecting metallized film, an Ni plating film on the upper surface of the annular metallized film including the projecting metallized film, and an annular metal frame brazed to the upper surface of the Ni plating film by AgCu brazing, The thickness of the Ni plating film in the portion covered with the AgCu brazing is less than 0.3 μm, the pull-down width a of the AgCu brazing from the outer peripheral edge of the ceramic base, the outer peripheral upper surface of the ceramic base, and the annular metal the wax flow between the wax flow width b of the ceramic substrate upper surface of the AgCu brazing meniscus formed between the outer side wall of the frame Electronic component element storing package the ratio of the width b (b / a + b) × 100 is characterized in that it consists of 6 0% or less. An annular metallization made of a refractory metal of W or Mo on a flat ceramic substrate, a window frame-shaped ceramic frame laminated on the outer periphery of the upper surface of the ceramic substrate, and the entire upper surface including the outer periphery of the ceramic frame A projecting metallized film made of the refractory metal partially projecting on the upper surface of the annular metallized film, an Ni plating film on the upper surface of the annular metallized film including the projecting metallized film, and the Ni plated film An annular metal frame that is brazed with AgCu brazing on the upper surface, and the thickness of the Ni plating film in the portion covered with the AgCu brazing is less than 0.3 μm, and the ceramic frame of the AgCu brazing The AgCu brazing member formed between the pull-down width a from the outer peripheral edge, the outer peripheral side upper surface of the ceramic frame and the outer peripheral side wall of the annular metal frame. The wax fraction of the flow width b (b / a + b) electronic component element package for housing × 100 is characterized in that it consists of 6 0% or less between the brazing flow width b of the insulating wall upper surface of the scum.

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