JP4167614B2 - Electronic component storage package - Google Patents

Description

  The present invention relates to an electronic component storage package including a ceramic substrate on which an electronic component element is mounted on an upper surface of a ceramic substrate, and a lid is joined to hermetically seal the electronic component element.

  In recent years, electronic component storage packages for storing electronic component elements such as semiconductor elements, crystal resonators, and piezoelectric elements have become smaller and higher in devices such as mobile phones and personal computers on which electronic component elements are mounted. In response to demands for higher reliability, there is an urgent need to respond to lighter, thinner, higher reliability, and the like. In order to cope with this, an electronic component storage package made of a ceramic base with high hermetic reliability is used as the package. In this electronic component storage package, electronic component elements are stored, and a ring-shaped metal frame joined to a conductor pattern formed on the upper surface side or a ring-shaped conductive pattern directly on the upper surface side is made of metal. The lid is joined via the brazing material, and the electronic component element is hermetically sealed. The electronic component storage package on which the electronic component element is mounted is joined to a board or the like via solder or the like with an external connection terminal pad which is a conductor pattern on the lower surface side of the package.

  A typical conventional electronic component storage package 50 will be described with reference to FIGS. 6A is a perspective view of the upper surface side of the electronic component storage package 50, FIG. 6B is a perspective view of the lower surface side, FIG. 6C is a sectional view taken along the line WW ′, and X FIG. As shown in FIGS. 6A and 6B, the electronic component storage package 50 is formed, for example, on the outer peripheral edge portion of the upper surface of the ceramic base 51 made of two layers of flat plates on the KV (Fe—Ni—Co system). An alloy, a trade name “Kovar”), a ceramic made of 42 alloy (Fe—Ni alloy) or the like and a ring-shaped metal frame 52 having a similar thermal expansion coefficient are joined together. And a cavity 53 for mounting an electronic component element such as a semiconductor element or a crystal resonator. In order to produce this ceramic substrate 51, for example, a ceramic green sheet made of alumina or the like is screen-printed using a conductive paste made of a refractory metal such as W (tungsten) or Mo (molybdenum), and the surface A conductive film 55 is formed on a conductor pattern, a via 54 filling a through hole provided in advance, and a wall surface of the through hole. The conductor patterns include a bonding conductor pattern 56 for bonding the metal frame 52 and a connection conductor pattern 57 for connecting to the electronic component element on the upper surface side. On the lower surface side, there are external connection terminal pads 58 for bonding to a board or the like.

  As shown in FIG. 6C, in order to connect the bonding conductor pattern 56 and the external connection terminal pad 58, a via 54 connected to the bonding conductor pattern 56 is formed on the ceramic green under the bonding conductor pattern 56. A conductor film 55 is formed on the sheet and connected to the ceramic green sheet below the sheet via a conductor pattern. Further, in order to connect the connection conductor pattern 57 and the external connection terminal pad 58, a via 54 connected to the connection conductor pattern 57 is formed in the ceramic green sheet below the connection conductor pattern 57, and further on the ceramic green sheet below the connection conductor pattern 57. A via 54 connected through a conductor pattern is formed. Then, the two ceramic green sheets are laminated to form a laminated body. After the conductor pattern, the via 54 and the conductor film 55 are connected to each other, the ceramic green sheet and the refractory metal are simultaneously fired. Thus, the ceramic substrate 51 is produced. Then, after a Ni plating film is formed on the conductor pattern exposed on the outer surface of the ceramic substrate 51, the metal frame 52 is placed on the bonding conductor pattern 56 via a brazing material made of Ag—Cu brazing or the like. Then, it is heated and brazed. The electronic component storage package 50 is manufactured by applying Ni plating and Au plating to all metal surfaces exposed to the outside of the joined body of the ceramic base 51 and the metal frame 52.

  In another conventional electronic component storage package 50a, for example, as shown in FIG. 7, a bonding conductor pattern 56 for bonding a metal frame 52 to the upper surface side of a ceramic base 51a made of a single flat plate, A connection conductor pattern 57 for connection to an electronic component element is formed and connected to an external connection terminal pad (not shown) on the lower surface side via vias 54 provided in connection with each pattern. is there. Furthermore, still another conventional electronic component storage package 50b will be described with reference to FIGS. 8 (A) and 8 (B). 8A is a perspective view of the upper surface side of the electronic component storage package 50b, and FIG. 8B is a cross-sectional view taken along the line Y-Y 'and a cross-sectional view taken along the line Z-Z'. As shown in FIGS. 8A and 8B, the electronic component storage package 50b is formed by laminating one or more ceramic flat plates and one or more ring-shaped ceramic frames 59. There is a configuration comprising a ceramic base 51b. A bonding conductor pattern 56 is formed on the upper surface of the ceramic frame 59 on the upper surface side of the ceramic substrate 51b. The bonding conductor pattern 56 is connected to the external connection terminal pad 58 on the lower surface side via the via 54 provided in the ceramic frame 59 and the conductor film 55 via the conductor pattern. Alternatively, the bonding conductor pattern 56 is connected to the external connection terminal pad 58 on the lower surface side by a via 54 provided by communicating a ceramic frame 59 and a ceramic flat plate. Note that the connection conductor pattern 57 of the electronic component storage package 50b is connected to the external connection terminal pad 58 via the conductor film 55 connected to the conductor pattern.

However, in the conventional electronic component storage package, the frame width of the ceramic frame and the pattern width of the bonding conductor pattern are reduced along with the downsizing of the apparatus, and the metal frame is added to the bonding conductor pattern formed on the ceramic frame. Airtight sealing after mounting electronic component elements because the joint width is small when joining the body and joining the metal lid or joining the metal lid directly to the joining conductor pattern The problem came out. Therefore, in the electronic component storage package, the size of the notch formed on the side surface of the ceramic base is made smaller on the upper surface side on which the bonding conductor pattern is formed than on the lower surface side, so that the pattern of the bonding conductor pattern is reduced. A package for increasing the width is disclosed (for example, see Patent Document 1). In addition, in the electronic component storage package, the frame width of the ceramic frame is reduced with the downsizing of the device, and it is difficult to form a through-hole for a via in the ceramic frame. There has been proposed a structure in which a notch is provided on the inner peripheral side to electrically connect a bonding conductor pattern on the upper surface side and an external connection terminal pad on the lower surface side (for example, see Patent Document 2).
Japanese Patent No. 2948998 Japanese Patent No. 3415762

However, the conventional electronic component storage package as described above has the following problems.
(1) An electronic component in which the size of the notch formed on the side surface of the ceramic substrate is made smaller on the upper surface side on which the bonding conductor pattern is formed than on the lower surface side to increase the pattern width of the bonding conductor pattern. In the storage package, since the conductor film is formed in the notch portion where the upper surface side and the lower surface side of the ceramic base body communicate with each other, the brazing material when the metal lid is joined to the external connection terminal pad through the conductor film The brazing filler metal is insufficient and the joint strength is insufficient. In addition, when the package is attached to the board or the like via a bonding material such as solder with the external connection terminal pads, there is a problem in bonding reliability because a film of brazing material is formed on the surface of the external connection terminal pads. Furthermore, when the package is attached to a board or the like via a bonding material such as solder with an external connection terminal pad, the bonding material flows into the metal lid via the conductor film, so the volume of the bonding material at the bonding portion is insufficient. The bonding strength is insufficient.
(2) The size of the ceramic frame is reduced along with the downsizing of the device, making it difficult to form a through-hole for the via in the ceramic frame. The conductive pattern for bonding on the upper surface side and the external connection terminal pad on the lower surface side are electrically connected to each other because the flow of brazing material when the metal lid is bonded or bonding when mounted on a board, etc. The material flow can be dammed by the second ceramic frame, but since a two-layer ceramic frame is required, there is a limit to the lightness and smallness of the package. Further, when the ceramic substrate is composed of only one layer of flat plate or a combination of a single layer of ceramic frame and flat plate, it is difficult to implement.
The present invention has been made in view of such circumstances, can cope with light and thin packages, can prevent brazing material and bonding material from flowing in, and can increase bonding reliability, and can be used in various forms of packages. An object of the present invention is to provide a package for accommodating electronic components.

An electronic component storage package according to the present invention that meets the above-mentioned object is provided with a first cutout portion in which all the layers of the ceramic substrate communicate with the outer peripheral side surface of the substantially rectangular ceramic substrate having a plurality of layers, The first notch portion and the second notch portion that are divided and formed so as to cross the center of the through hole for the second notch portion that does not communicate with each other in the layer, notches first conductive film on the wall surface of the through hole of, the wall surface of the second notch portion of the through hole with a second conductive film, the upper and lower surfaces of the ceramic substrate with a first conductive film The formed conductive patterns are electrically connected to each other, and at least one layer of the ceramic substrate or a part of the first conductor film of one layer is provided so as to cover the surface . comprising an insulating film made of the same material as the substrate Having a first cut-out portion.

In the electronic component storage package according to the present invention that meets the above-described object, the center of a notch through-hole through which all the layers of the ceramic substrate communicate is formed on the outer peripheral side surface of the substantially rectangular ceramic substrate having a plurality of layers. A first notch portion comprising a notch formed by being divided so as to cross, and having a first conductor film on the wall surface of the notch through-hole, in which all layers of the ceramic substrate communicate with each other; A second notch portion having a second conductor film that is not communicated with a part of the base layer on the wall surface of the notch is formed on the upper and lower surfaces of the ceramic substrate. Each conductor pattern is electrically conductive, and is the same as the ceramic substrate provided so as to cover at least one layer of the ceramic substrate or the surface of the first conductor film of a part of one layer. From the material Having a first notch having an insulating film.

The electronic component storage package according to the present invention that meets the above-mentioned object crosses the center of a notch through-hole through which one layer of the ceramic substrate communicates with the outer peripheral side surface of the substantially rectangular ceramic substrate consisting of one layer. A first notch having a first conductor film on a wall surface of the notch through hole, and a ceramic substrate having a first conductor film that is communicated with one layer of the ceramic substrate. A second conductor film that does not communicate with one layer is provided on the wall surface of the through hole in the notch, or a second notch portion that does not have the second conductor film on the wall surface of the notch through hole; The conductive films formed on the upper and lower surfaces of the ceramic substrate are electrically connected to each other, and the surface of the first conductor film as a part of one layer of the ceramic substrate is covered. ceramic base provided so as to Having a first notch having an insulating film made of the same material as.

The electronic component storage package according to claim 1, wherein a first cutout portion in which all layers of the ceramic substrate communicate with each other and a part of the layers are formed on the outer peripheral side surface of the substantially rectangular ceramic substrate including a plurality of layers. The first notch and the second notch are formed by being divided so as to cross the center of the through hole for the second notch not communicating with the first notch. first conductive layer on the wall surface of the through hole parts, the wall surface of the second notch portion of the through hole with a second conductive film, formed on the upper and lower surfaces of the ceramic substrate with a first conductive film Each conductor pattern is electrically conductive, and is the same as the ceramic substrate provided so as to cover at least one layer of the ceramic substrate or the surface of the first conductor film of a part of one layer. first cut with an insulating film made of a material Because it has a write section, at the same time electrically conductive state between the conductor patterns formed on the upper and lower surfaces of the ceramic substrate, it is possible to prevent the brazing material flow and bonding material flows. In addition, it is possible to normally create a pool of bonding material (meniscus), to firmly bond the package to a board, etc., and to check the state of the bonded portion by visual inspection, so that the apparatus has high bonding reliability. be able to. In addition, since a via is not used to form electrical continuity with the first conductor film, a light, thin and small package can be obtained. Even when a ceramic frame is used, the package can be configured with a single-layer ceramic frame, so that a light, thin and small package can be obtained. Further, since it is possible not to provide a notch portion on the uppermost surface in a portion where the conductive pattern formed on the upper surface and the lower surface of the ceramic substrate does not need to be electrically conductive, the bonding conductor pattern Since many portions with an increased pattern width can be formed, it is possible to improve the bonding reliability when the metal frame is bonded and the airtight reliability when the metal lid is bonded.

The electronic component storage package according to claim 2 crosses the center of the through hole for the notch through which all the layers of the ceramic substrate communicate with the outer peripheral side surface of the substantially rectangular ceramic substrate having a plurality of layers. A first notch part having a first conductor film on the wall surface of the notch through hole, and a ceramic substrate having a first conductor film that communicates with all layers of the ceramic substrate. Each of the conductors formed on the upper and lower surfaces of the ceramic substrate with the first conductor film, the second conductor film having a second conductor film that does not communicate with the layer on the wall surface of the notch through hole. The patterns are electrically conductive, and are made of the same material as the ceramic substrate provided so as to cover the surface of at least one layer of the ceramic substrate or a part of the first conductor film of one layer. Insulating film Because it has a first cutout portion that, at the same time electrically conductive state between the conductor patterns formed on the upper and lower surfaces of the ceramic substrate, it is possible to prevent the brazing material flow and bonding material flows. In addition, it is possible to normally create a pool of bonding material (meniscus), to firmly bond the package to a board, etc., and to check the state of the bonded portion by visual inspection, so that the apparatus has high bonding reliability. be able to. In addition, since a via is not used to form electrical continuity with the first conductor film, a light, thin and small package can be obtained. Further, even when a ceramic frame is used, a package can be configured with a single layer of ceramic frame, so that a light, thin and small package can be obtained.

According to a third aspect of the present invention, there is provided the electronic component storing package, wherein the outer peripheral side surface of the substantially rectangular ceramic base having one layer crosses the center of the notch through-hole through which one layer of the ceramic base communicates. A first notch portion comprising a notch formed by dividing and having a first conductor film on the wall surface of the notch through-hole, and a first layer of the ceramic substrate. with the wall surface of the through hole of the cutouts communicating with no second conductor film, or it comprises a second notch without a wall surface of the through hole of the notch a second conductive film, the first conductive film The conductive patterns formed on the upper and lower surfaces of the ceramic substrate are electrically connected to each other, and the surface of the first conductor film of a part of one layer of the ceramic substrate is covered. the same material as the ceramic substrate is provided Because it has a first cutout portion comprises a Ranaru insulating film, it can also be formed without using vias to form electrical conduction by the conductive film be a ceramic substrate made of single-layer, ceramic substrate The conductive pattern formed on the upper surface and the lower surface can be electrically connected, and at the same time, the package can prevent the brazing material flow and the bonding material flow. In particular, even in the case of an electronic component storage package made of a ceramic base made of one layer, if the second conductor film that does not communicate with one layer of the ceramic base is provided on the wall surface of the cutout, the pool of bonding material is accumulated. Since the (meniscus) can be normally formed, the package can be firmly bonded to a board or the like, the state of the bonded portion can be confirmed by appearance inspection, and a device with high bonding reliability can be obtained.

Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A and 1B are a perspective view, an AA ′ line and a BB ′ line cross-sectional view of an electronic component storage package according to an embodiment of the present invention, respectively, and FIG. ), (B) is a perspective view of the electronic component storage package of the same modification, CC ′ line, DD ′ line cross-sectional view, FIG. 3 (A), (B) is another of the present invention, respectively The perspective view of the electronic component storage package which concerns on embodiment, EE 'line, FF' line sectional drawing, FIG. 4 (A), (B) is the perspective view of the electronic component storage package of the modification, respectively. FIG. 5 is a cross-sectional view taken along line GG ′, HH ′, and FIG. 5 is an explanatory view of an electronic component storage package according to still another embodiment of the present invention.

  As shown in FIGS. 1A and 1B, an electronic component storage package 10 according to an embodiment of the present invention is a ceramic substrate 11 formed of a plurality of layers, for example, two layers of a substantially rectangular flat plate. A cavity portion 13 for mounting an electronic component element 12 such as a semiconductor element or a crystal resonator is provided at the center of the cavity portion, and the electronic component element 12 mounted in the cavity portion 13 is disposed around the cavity portion 13. A ring-shaped metal frame 14 is provided so as to be able to surround the outer peripheral edge of the upper surface of the ceramic substrate 11.

  The electronic component storage package 10 includes both a first cutout portion 15 that communicates with all layers and a second cutout portion 16 that does not communicate with some layers on the side surface of the ceramic substrate 11. In addition, a first conductor film 17 is provided on the wall surface of the first notch 15, and a second conductor film 18 is provided on the second notch 16. The first conductor film 17 is a conductor pattern on the upper surface side of the ceramic substrate 11 and is mounted on the cavity portion 13 by joining the metal frame 14 and joining the metal lid 19 to the metal frame 14. Electrical connection between the connecting conductor pattern 20 for hermetically sealing the electronic component element 12 and the external connection terminal pad 21 for bonding to a board or the like with the conductor pattern on the lower surface side of the ceramic substrate 11 State. Moreover, the electronic component storage package 10 includes an insulating film 22 provided so as to cover the surface of at least one layer of the ceramic substrate 11 or a part of the first conductor film 17 of one layer. A first cutout portion 15 is provided. Further, in this electronic component storage package 10, an electronic component element 12 such as a crystal resonator formed on the upper surface of a flat plate as a conductor pattern on the upper surface side of the ceramic substrate 11 is made of a conductive adhesive or the like. A connection conductor pattern 23 that can be connected via a connection means is provided.

  The first conductor film 17 and the second conductor film 18 of the electronic component storage package 10 are used to connect the bonding conductor pattern 20 and the connection conductor pattern 23 to the external connection terminal pads 21, respectively. Yes. The bonding conductor pattern 20 is connected to the external connection terminal pad 21 and used as an electrode terminal because the external connection terminal pad 21 is electrically connected to the bonding conductor pattern 20 and the metal frame 14. This is because the one including the metal lid 19 to be joined to is used as a ground for an electric circuit. The first conductor film 17 and the second conductor film 18 formed on the side surface of the ceramic substrate 11 are firmly attached to the board or the like when the external connection terminal pad 21 is joined to the board or the like via solder or the like. It is also used to form a meniscus for bonding.

  As shown in FIGS. 2 (A) and 2 (B), an electronic component storage package 10a according to a modification according to an embodiment of the present invention includes a plurality of layers, for example, two layers of a substantially rectangular flat plate, and a ring. A ceramic base 11 a made of a ceramic frame 25 has a cavity 13 formed of a flat plate and a ceramic frame 25, and the electronic component element 12 can be mounted in the cavity 13. . As in the case of the electronic component storage package 10, the electronic component storage package 10 a is connected to the side surface of the ceramic substrate 11 a including the ceramic frame 25, as in the case of the electronic component storage package 10. The notch 15 is provided with both the first conductor film 17 on the wall surface, the second notch portion 16 not communicating with a part of the layers, and the second conductor film 18 on the wall surface. The first conductor film 17 is a conductor pattern on the upper surface side of the ceramic substrate 11a, and a bonding conductor pattern 20 formed to bond the metal lid 19 to the upper surface of the ceramic frame 25, and a ceramic product. The conductor pattern on the lower surface side of the base 11a is electrically connected between the external connection terminal pads 21 for bonding to a board or the like. In addition, the electronic component storage package 10a includes an insulating film 22 provided so as to cover the surface of the first conductor film 17 of at least one layer of the ceramic substrate 11a or a part of one layer. A first cutout portion 15 is provided. The ceramic substrate 11a of the electronic component storage package 10a has been described as a laminate of two layers of flat plates and the ceramic frame 25. However, the flat plate and the ceramic frame 25 may form a plurality of layers. For example, it may be a combination of a single flat plate and a single ceramic frame 25. Moreover, the ceramic frame 25 may be composed of a plurality of layers.

  Next, electronic component storage packages 10b and 10c according to other embodiments of the present invention will be described with reference to FIGS. 3 (A) and 3 (B) and FIGS. 4 (A) and 4 (B). As shown in FIGS. 3A and 3B, the electronic component storage package 10b includes a plurality of layers, for example, a central portion of a ceramic base 11 made of a substantially rectangular flat plate having two layers. A cavity 13 for mounting (not shown, see FIG. 1 (B)) is formed, and around the cavity 13, a ring-shaped metal frame 14 that can surround the electronic component element 12 is ceramic. It is joined to the outer peripheral edge of the upper surface of the substrate 11. The electronic component storage package 10b includes a cutout that communicates all the layers on the side surface of the ceramic substrate 11, and a first conductor that communicates all the layers of the ceramic substrate 11 to the wall surface of the cutout. Both the first cutout portion 15a having the film 17 and the second cutout portion 16a having the second conductor film 18 that does not communicate with a part of the ceramic substrate 11 are provided. As in the case of the electronic component storage package 10, the first conductor film 17 includes a bonding conductor pattern 20 that is a conductor pattern on the upper surface side of the ceramic substrate 11 and a conductor on the lower surface side of the ceramic substrate 11. The external connection terminal pads 21 which are patterns are electrically connected. Moreover, the electronic component storage package 10b includes an insulating film 22 provided so as to cover the surface of at least one layer of the ceramic substrate 11 or a part of the first conductor film 17 of one layer. It has the 1st notch part 15a.

  As shown in FIGS. 4A and 4B, an electronic component storage package 10c includes a ceramic substrate 11a including a plurality of layers, for example, two layers of a substantially rectangular flat plate and a ring-shaped ceramic frame 25. In addition, a cavity portion 13 for mounting an electronic component element 12 (not shown, see FIG. 2B) formed of a flat plate and a ceramic frame 25 is provided. In the electronic component storage package 10c, a plurality of notches communicating all the layers are formed on the side surface of the ceramic base 11a including the ceramic frame 25 as in the case of the electronic component storage package 10b. The first cutout portion 15a having the first conductor film 17 that communicates all the layers of the ceramic substrate 11a with the wall surface of the cutout and a part of the layers of the ceramic substrate 11a do not communicate with each other. Both of the second cutout portions 16 a having the second conductor film 18 are provided. As in the case of the electronic component storage package 10b, the first conductor film 17 includes a bonding conductor pattern 20 which is a conductor pattern on the upper surface side of the ceramic substrate 11a and a conductor on the lower surface side of the ceramic substrate 11a. The external connection terminal pads 21 which are patterns are electrically connected. Moreover, the electronic component storage package 10c includes an insulating film 22 provided so as to cover the surface of at least one layer of the ceramic substrate 11a or a part of the first conductor film 17 of one layer. It has the 1st notch part 15a. Although the ceramic substrate 11a of the electronic component storage package 10c has been described as a laminate of two layers of flat plates and the ceramic frame 25, the flat plate and the ceramic frame are similar to the case of the electronic component storage package 10a. The body 25 may form a plurality of layers. For example, the body 25 may be a combination of a single flat plate and a single ceramic frame 25. Moreover, the ceramic frame 25 may be composed of a plurality of layers.

  The electronic component storage packages 10, 10a, 10b, and 10c are formed on the upper surface of a flat plate as a conductor pattern on the upper surface side of the ceramic bases 11 and 11a. A connection conductor pattern 23 is provided so that the element 12 is connected via a connection means such as a conductive adhesive. The connecting conductor pattern 23 is connected to the outside of the conductor pattern on the lower surface side of the ceramic substrates 11 and 11a via the vias 24 provided in the ceramic substrates 11 and 11a and the conductor pattern between the ceramic substrates 11 and 11a. The connection terminal pad 21 and the second conductor film 18 connected to the external connection terminal pad 21 are electrically connected. Alternatively, the connecting conductor pattern 23 is connected to the second conductor film 18 via the via 24 and the conductor pattern between the ceramic bases 11 and 11a, and further connected to the second conductor film 18 for external connection. The terminal pads 21 may be electrically connected. Further, the connecting conductor pattern 23 having the ceramic frame 25 such as the ceramic substrate 11a is provided via a conductor pattern provided extending from the connecting conductor pattern 23 to the lower surface of the ceramic frame 25. It may be connected to the second conductor film 18 and electrically connected between the external connection terminal pads 21.

  Next, an electronic component storage package 10d according to still another embodiment of the present invention will be described with reference to FIG. As shown in FIG. 5, the electronic component storage package 10d has a cavity portion for mounting an electronic component element 12 (not shown) in the center of the upper surface of a ceramic base 11b made of a single layer of a substantially rectangular flat plate. 13. The electronic component storage package 10d is formed of a cutout in which one layer communicates with the side surface of the ceramic substrate 11b, and the first conductor film 17 with which one layer of the ceramic substrate 11b communicates is formed on the wall surface of the cutout. 1 notch portion 15b and a second notch portion 16b having a second conductor film 18a on the wall surface of the notch, in which one layer of the ceramic substrate 11b does not communicate. Alternatively, the electronic component storage package 10d includes a cutout in which one layer communicates with the side surface of the ceramic substrate 11b, and the first conductor film 17 with which one layer of the ceramic substrate 11b communicates is formed on the wall surface of the cutout. Both the first cutout portion 15b having the second cutout portion 16b and the second cutout portion 16b not having the second conductor film 18a on the wall surface of the cutout are provided. The first conductor film 17 is electrically connected between the bonding conductor pattern 20 which is a conductor pattern on the upper surface side of the ceramic substrate 11b and the external connection terminal pad 21 which is a conductor pattern on the lower surface side of the ceramic substrate 11b. Is in a conductive state. Moreover, the electronic component storage package 10d includes a first cutout provided with an insulating film 22 provided so as to cover the surface of the first conductor film 17 as a part of one layer of the ceramic substrate 11b. It has a portion 15b.

  In the electronic component storage package 10d, a connection conductor pattern 23 is provided on the upper surface of the flat plate as a conductor pattern on the upper surface side of the ceramic substrate 11b. The connecting conductor pattern 23 is connected between the external connection terminal pads 21 of the conductor pattern on the lower surface side of the ceramic substrate 11b or via the vias 24 provided in the ceramic substrate 11b. The second conductive film 18a connected to the connection terminal pad 21 is in an electrically conductive state. The insulating films 22 of the electronic component storage packages 10, 10 a, 10 b, 10 c, and 10 d are also formed on the bonding conductor pattern 20 on the upper surface side periphery of the first notches 15, 15 a, 15 b. It may be.

  Here, the manufacturing method of the electronic component storage package 10 will be described as a representative of the electronic component storage packages 10, 10a, 10b, 10c, and 10d. The ceramic substrate used for the ceramic substrate 11 includes alumina, aluminum nitride, low-temperature fired ceramic, and the material is not particularly limited. For example, when using alumina as the ceramic substrate, first, a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to aluminum oxide powder, a plasticizer such as dioctiphthalate, an acrylic resin, etc. A binder, and a solvent such as toluene, xylene, alcohols, etc., kneaded thoroughly and defoamed to prepare a slurry having a viscosity of 2000 to 40000 cps, and a desired thickness, for example, 0.12 mm by a doctor blade method or the like. A ceramic green sheet formed into a sheet and then dried to be cut into a rectangular shape having a desired size is formed. The ceramic green sheet is formed by arranging a large number of electronic component storage packages 10 and is finally divided into individual pieces along a dividing groove for dividing into individual pieces. As a result, individual packages are produced. On the other hand, the metal frame 14 joined to the ceramic substrate 11 is formed by etching or punching a metal plate whose metal base material has a thermal expansion coefficient similar to that of the ceramic substrate 11 such as KV or 42 alloy. Prepared in a ring shape.

  In order to manufacture the ceramic substrate 11, first, for example, through holes for forming the first cutout portion 15, the second cutout portion 16, the via 24, and the like in each of the two ceramic green sheets. Is formed using a punching press or a punching machine. Next, when a ceramic green sheet that is fired at a high temperature such as alumina or aluminum nitride is used, a conductive paste made of a refractory metal such as W or Mo is used as the conductive paste. A through-hole conductor is formed by screen printing on the wall surface of each through hole for forming the first conductor film 17 provided in the notch 15 and the second conductor film 17 provided in the second notch 16. The through hole for the via 24 is filled with a conductor paste by screen printing. Further, on the surface of each ceramic green sheet, the bonding conductor pattern 20, the connection conductor pattern 23, the external connection terminal pad 21, the vias 24 provided in each ceramic green sheet, and the second conductor film 18 A conductor pattern or the like for connection is formed by screen printing. Next, an insulating paste made of substantially the same material as the ceramic green sheet is formed on the surface of the first conductive film 17 in the through hole in which the first conductive film 17 of the ceramic green sheet that requires the insulating film 22 is formed. Is used to form a through-hole insulator by screen printing. In the case where the insulating film 22 is formed up to the middle of one layer of ceramic green sheet, the insulating paste used is adjusted so as not to cover the entire surface of the first conductor film 17 by adjusting the viscosity of the insulating paste. . In addition, when forming a through-hole insulator by screen printing, an insulating paste can also be printed around the upper-side through-hole by using a screen mask having a diameter slightly larger than the diameter of the through-hole.

  Next, the two ceramic green sheets are overlaid and pressed while applying temperature to form a laminate. In this laminate, a large number of ceramic bases 11 are formed as an aggregate. Therefore, in order to form the ceramic base 11 made of individual pieces, the first cutout portion 15 and the second cutouts 15 are formed. A dividing groove for dividing the notch 16 so as to cross the center of the through hole is formed. Next, the ceramic green sheet obtained by laminating the two sheets, and the conductor paste and insulating paste after drying are simultaneously fired in a firing furnace to form a fired body. Thereby, the ceramic substrate 11 made of a fired body is formed. Next, the ceramic substrate 11 of the fired body is subjected to Ni plating on all the conductor patterns including the bonding conductor pattern 20 exposed on the outer surface, and then the Ag—Cu on the bonding conductor pattern 20. A metal frame 14 is placed via a brazing material such as brazing, and is brazed and joined by heating. Next, Ni plating and Au plating are performed on all the conductive patterns exposed on the outer surface of the ceramic substrate 11 including the metal frame 14 to form the electronic component storage package 10 composed of a large number of aggregates. Yes. Next, the electronic component storage package 10 composed of a large number of aggregates is divided by dividing grooves so as to cross the center of the first notch 15 and the through hole for the second notch 16. Thus, an electronic component storage package 10 made of individual pieces is formed. By this division, a first notch portion 15 and a second notch portion 16 are formed on the side surface of the ceramic substrate 11. The electronic component storage package 10 made up of individual pieces may be divided into individual pieces after the electronic component element 12 is mounted on the electronic component storage package 10 in the state of a large number of aggregates, or may be divided into individual pieces. After being divided into two, the electronic component element 12 is mounted.

  The electronic component storage package of the present invention is mounted with an electronic component element such as a semiconductor element or a crystal resonator, and is small and requires high reliability. For example, a mobile phone, a notebook personal computer, etc. It can be used by being incorporated in an electronic device.

(A), (B) is the perspective view of the electronic component storage package which concerns on one embodiment of this invention, respectively, A-A 'line, B-B' line sectional drawing. (A), (B) is a perspective view, a C-C 'line, and a D-D' line sectional view of the electronic component storage package of the modification, respectively. FIGS. 7A and 7B are a perspective view, an E-E ′ line, and an F-F ′ line cross-sectional view, respectively, of an electronic component storage package according to another embodiment of the present invention. (A) and (B) are a perspective view, a G-G ′ line, and a H-H ′ line cross-sectional view, respectively, of the electronic component storage package of the modification. It is explanatory drawing of the electronic component storage package which concerns on other embodiment of this invention. (A)-(C) is explanatory drawing of the package for the conventional electronic component accommodation, respectively. It is explanatory drawing of the other conventional electronic component storage package. It is explanatory drawing of the conventional another electronic component storage package.

Explanation of symbols

  10, 10a, 10b, 10c, 10d: Electronic component storage package, 11, 11a, 11b: Ceramic substrate, 12: Electronic component element, 13: Cavity, 14: Metal frame, 15, 15a, 15b: No. 1 notch, 16, 16a, 16b: second notch, 17: first conductor film, 18, 18a: second conductor film, 19: metal lid, 20: bonding conductor pattern, 21: External connection terminal pad, 22: Insulating film, 23: Connection conductor pattern, 24: Via, 25: Ceramic frame

Claims (3)

A substantially outer peripheral side surface of a rectangular ceramic substrate comprising a plurality of layers, first of all the layers of the ceramic substrate communicates notches, and the second not communicating with a layer of some notches for The first notch portion and the second notch portion that are divided and formed so as to cross the center of the through hole are provided, and each of the first notch portions has a wall surface of the through hole. A first conductor film, a second conductor film on the wall surface of the through hole of the second cutout portion, and each conductor formed on the upper surface and the lower surface of the ceramic substrate by the first conductor film The pattern is electrically conductive, and at least one layer of the ceramic substrate, or the same as the ceramic substrate provided so as to cover the surface of the first conductor film of a part of one layer. wherein the an insulating film made of a material Electronic component storing package and having a notch. From the notch formed by being divided on the outer peripheral side surface of a substantially rectangular ceramic base composed of a plurality of layers so as to cross the center of the notch through-hole through which all the layers of the ceramic base communicate. Thus, the first cutout portion having the first conductor film that communicates with all the layers of the ceramic base on the wall surface of the through hole of the cutout does not communicate with a part of the layers of the ceramic base. A second notch portion having a second conductor film on the wall surface of the through hole of the notch, and between the conductor patterns formed on the upper surface and the lower surface of the ceramic substrate by the first conductor film. Is made of the same material as the ceramic substrate provided to cover the surface of at least one layer of the ceramic substrate, or a part of one layer of the first conductor film. It becomes absolute Electronic component storing package that comprises said first notch comprises a membrane. The outer peripheral side surface of the substantially rectangular ceramic base composed of one layer is formed by the notches formed by being divided so as to cross the center of the notch through-hole through which one layer of the ceramic base communicates. A first notch portion having a first conductor film communicating with one layer of the ceramic substrate on the wall surface of the through hole of the notch and a second conductor not communicating with one layer of the ceramic substrate. having a film on the wall surface of the through hole of the notch, or the second conductive film comprises a second notch without a wall surface of the through hole of the notch, in the first conductive film The conductive patterns formed on the upper and lower surfaces of the ceramic substrate are electrically connected to each other, and the surface of the first conductor film of a part of one layer of the ceramic substrate is covered. said ceramic provided as Electronic component storing package that comprises said first notch having an insulating film made of the same material as the substrate.

Images