JP5559588B2 - Electronic component element storage package - Google Patents

Description

  In the present invention, an electronic component element such as a semiconductor element or a piezoelectric vibrating piece is mounted on a cavity portion formed by the upper surface of a ceramic base and the inner peripheral wall surface of the ceramic frame, and the electronic component element is joined by bonding a lid. The present invention relates to an electronic component element storage package that is hermetically sealed.

In recent years, electronic component element storage packages for storing electronic component elements such as semiconductor elements and piezoelectric vibrating reeds are downsized and highly reliable for devices on which electronic component elements are mounted, such as mobile phones and personal computers. In response to the demands for the improvement of the characteristics, there is a demand for more and more light and thin and high reliability. In order to cope with this, in the electronic component element storage package, a ceramic base made of ceramic such as alumina (Al ₂ O ₃ ) or aluminum nitride (AlN) with high hermetic reliability, and a ceramic frame are bonded. A package consisting of a body is used.

  In this electronic component element storage package, a metallized film made of a refractory metal such as tungsten (W) or molybdenum (Mo) is usually formed on the lower surface of a flat ceramic substrate, and Ni and Au are plated on the upper surface. An external connection terminal pad on which a plating film is formed is provided. In addition, the electronic component element storage package has a metallized film made of a refractory metal similar to the above on the upper surface of the ceramic substrate, and an electronic component element connection pad formed with a plating film similar to the above on the upper surface. Is provided. Further, the electronic component element storage package is provided with a lid bonding pad having a metallized film similar to the above on the upper surface of the frame-shaped ceramic frame and a plating film similar to the above formed on the upper surface thereof. The lid bonding pad has an electronic component element mounted on the electronic component element connection pad of the cavity formed by the upper surface of the ceramic base and the inner peripheral wall surface of the ceramic frame, and then the ceramic and A metal lid made of KV (Fe—Ni—Co based alloy, trade name “Kover”) or 42 alloy (Fe—Ni based alloy) having a similar thermal expansion coefficient is directly made of AuSn or the like. It is designed to be brazed with a material. Alternatively, a metal ring made of KV, 42 alloy or the like is first brazed and bonded to the lid bonding pad with an Ag brazing material or the like, and an electronic component element is mounted on the cavity, and then the metal ring is attached to the lid. A metal lid is seam welded. The electronic component element storage package to which the lid is bonded is soldered and bonded to a board substrate or the like with external connection terminal pads.

  As shown in FIGS. 3A to 3C, the above-described conventional electronic component element storage package 50 includes the ceramic base 51 of the cutout 53 at the corner of the joined body of the ceramic base 51 and the ceramic frame 52. A castoration conductor 54 provided as a metallized film on the wall surface and a via conductor 55 filled with metallize in a through-hole provided through the ceramic frame 52. The caster conductor 54 and via conductor 55 allow the electronic component element storage package 50 to include the external connection terminal pad 56 and the electronic component element connection pad 57 or the external connection terminal pad 56 and the lid bonding pad 58. Electrically connected.

  Then, as shown in FIGS. 4A and 4B, the electronic component element 59 is bonded and mounted on the electronic component element connection pad 57 in this electronic component element storage package 50, and a metal lid is formed. After the cavity portion 61 is hermetically sealed with the body 60, the external connection terminal pads 56 are soldered to the board substrate 62 and the like, and the solder meniscus 63 is formed with the castellation conductor 54 portion.

  However, in the above-described conventional electronic component element housing package 50, the frame width of the ceramic frame 52 is reduced with the miniaturization of the package, and it is difficult to provide a through hole for forming the via conductor 55 there. It has become to.

  Therefore, in the conventional electronic component element storage package, the ceramic frame body is also provided with a metallized film on the wall surface of the notch, and the external connection terminal pad and the lid bonding pad are electrically connected, and the ceramic Disclosed is a method in which a ceramic insulating film is provided on a metallized film on the frame body side, and only the ceramic base side is used as a castellation conductor to prevent solder from creeping up to the lid bonding pad to form a solder meniscus. (For example, refer to Patent Document 1).

  However, the above-described conventional electronic component element storage package as disclosed in Patent Document 1 is formed on a board substrate or the like so that the solder meniscus at the castellation conductor portion protrudes from the outer periphery of the ceramic base. As the solder meniscus pops out, the mounting density is lowered, which hinders the downsizing of devices equipped with this package, such as mobile phones and personal computers.

  Therefore, as shown in FIGS. 5A to 5C, a conventional electronic component element housing package 50a includes a ceramic base body having a cutout portion 53 at a corner of a joined body of a ceramic base body 51 and a ceramic frame body 52. In some cases, the caster conductor 54 such as the electronic component element storage package 50 is not provided on the wall surface 51. Further, some conventional electronic component element storage packages 50a do not include via conductors 55 like the electronic component element storage package 50 formed by penetrating the ceramic frame 52. This electronic component element storage package 50a eliminates the formation of the solder meniscus 63 and can improve the mounting density, so that it can cope with the downsizing of a device on which the package is mounted, such as a mobile phone or a personal computer. I am doing so. In the electronic component element storage package 50 a, a via conductor 64 is formed in a through hole provided in the ceramic base 51, and the external connection terminal pad 56 and the electronic component element connection pad 57 are electrically connected via the via conductor 64. State. The electronic component element storage package 50a has a conductor film 66 formed on the wall surface of a notch 65 provided on the inner peripheral side wall surface of the ceramic frame 52, and the electronic component element connection package 50a is provided via the conductor film 66 and the like. The pad 57 and the lid bonding pad 58 are electrically connected, and the external connection terminal pad 56 and the lid bonding pad 58 are electrically connected.

  6A and 6B, an electronic component element 59 is mounted on the electronic component element storage package 50a, and the cavity 61 is hermetically sealed with a metal lid 60. After that, the external connection terminal pads 56 are soldered and joined to the board substrate 62 and the like.

Japanese Patent No. 4167614

However, the conventional electronic component element storage package as described above has the following problems.
In a package for housing an electronic component element in which a via conductor is formed in a through hole provided in a conventional ceramic base, it is difficult to fill a minute through hole with a conductive paste, and the hermetic reliability of the via conductor portion may be lowered. In addition, an electronic component element housing package that forms a conductor film on the wall surface of a notch provided on the inner peripheral side wall surface of a conventional ceramic frame is not easy to form and requires a complicated and long work process. The package cost has been increased.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide an inexpensive electronic component element storage package that can improve the mounting density of the device, has high hermetic reliability, and is highly reliable.

The electronic component element storage package according to the present invention that meets the above-described object is provided with a third metal plate on the upper surface of a rectangular flat plate-shaped ceramic substrate having a first metallized film on the lower surface and a second metallized film on the upper surface. A cutout portion is formed at a corner portion of a joined body formed by stacking a rectangular frame-shaped ceramic frame body provided with a metallized film, and a first metallized film and a second metallized film, A fourth metallized film for electrically connecting the metallized film and the third metallized film, and an upper surface of the fourth metallized film, extending upward from a connection portion with the first metallized film. having a ceramic insulating layer comprising a fourth same ceramic substrate and the ceramic substrate used in the ceramic substrate and the insulating wall is coated so as to cross the metallized film.

The above-mentioned electronic component element storage package has a rectangular picture frame in which a third metallized film is provided on the upper surface of a rectangular plate-shaped ceramic substrate having a first metallized film on the lower surface and a second metallized film on the upper surface. Cut out at the corners of the joined body formed by laminating the ceramic frame, and the first metallized film and the second metallized film, or the first metallized film and the third on the wall surface of the notched part. A fourth metallized film for electrically connecting the metallized film; and a fourth metallized film formed on the upper surface of the fourth metallized film and extending upward from a connection portion with the first metallized film. since having a ceramic insulating layer consisting of a ceramic substrate and the same ceramic substrate used in the ceramic substrate and the insulating wall is coated so as to traverse an external connection terminal pads sera Conductor wiring pattern including a first metallized film on the lower surface of the base substrate and a third metallized film on the upper surface of the ceramic frame that is a lid bonding pad, a first metallized film, and an electronic component element connection pad The second metallized film on the upper surface of the ceramic substrate is electrically conductive via a fourth metallized film having a ceramic insulating film on the upper surface provided on the wall surface of the notch, and the ceramic substrate and the ceramic frame The plating film cannot be formed on the metallized film covered with the ceramic insulating film made of the same ceramic base material used for the body, preventing the formation of the solder meniscus when soldering the external connection terminal pads It is possible to provide a package that can improve the mounting density of the device. In addition, since this electronic component element storage package is not provided with a via conductor in the ceramic substrate, the hermetic reliability can be increased. Furthermore, this electronic component element storage package does not require the formation of via conductors, and can be manufactured easily with fewer steps.

(A)-(C) are the upper surface side top view, lower surface side top view, and A-A 'line longitudinal cross-sectional view of the electronic component element storage package which concerns on one embodiment of this invention, respectively. (A), (B) is the top view side top view of the mounting form of the electronic component element accommodation package, and a B-B 'line longitudinal cross-sectional view, respectively. (A)-(C) is the upper surface side top view, lower surface side top view, and C-C 'line longitudinal cross-sectional view of the conventional electronic component element accommodation package, respectively. (A), (B) is the upper surface side top view of the mounting form of the conventional electronic component element accommodation package, and a D-D 'line longitudinal cross-sectional view, respectively. (A)-(C) are the upper surface side top view, lower surface side top view, and E-E 'longitudinal cross-sectional view of the other conventional electronic component element storage package, respectively. (A), (B) is the upper surface side top view of the mounting form of the other conventional electronic component element accommodation package, and the F-F 'line longitudinal cross-sectional view, respectively.

Next, with reference to the accompanying drawings, embodiments for embodying the present invention will be described for understanding of the present invention.
As shown in FIGS. 1A to 1C, an electronic component element storage package 10 according to an embodiment of the present invention is formed on the outer peripheral portion of the upper surface of a rectangular flat plate-shaped ceramic substrate 11 composed of one or a plurality of layers. It consists of a joined body formed by laminating a rectangular frame-shaped ceramic frame 12 composed of one or a plurality of layers. The ceramic base 11 of the electronic component element storage package 10 includes a first metallized film 14 having an external connection terminal pad 13 and the like on the lower surface, and a conductor wiring pattern having an electronic component element connection pad 15 on the upper surface and the like. A second metallized film 16 is provided. The ceramic frame 12 of the electronic component element storage package 10 is provided with a third metallized film 18 as a lid bonding pad 17 on the upper surface. This electronic component element storage package 10 has a notch 19 at the corner of the joined body. Further, the electronic component element storage package 10 has a cavity portion 20 formed by the upper surface of the ceramic base 11 of the joined body and the inner peripheral wall surface of the ceramic frame 12, and a conductive wiring pattern is provided on the bottom surface thereof. An electronic component element connection pad 15 is provided. An electronic component element 23 (see FIGS. 2A and 2B), for example, a piezoelectric vibrating piece is enclosed by the inner peripheral wall surface of the ceramic frame 12 on the electronic component element connection pad 15 of the cavity portion 20. In this way, it is joined with a conductive resin or the like.

  The electronic component element storage package 10 includes a first metallized film 14 provided on the lower surface of the ceramic base 11 on at least one wall surface of the notch 19 at the corner of the joined body, and a first metal layer 14 provided on the upper surface of the ceramic base 11. The fourth metallized film 21 is provided only on the wall surface of the notch 19 of the ceramic base 11 for electrically connecting the second metallized film 16. The electronic component element storage package 10 includes a first metallized film 14 and a third metallized film provided on the upper surface of the ceramic frame 12 on at least one wall surface of the notch 19 at the corner of the joined body. A fourth metallized film 21 a is provided on the wall surfaces of the cutout portions 19 of both the ceramic base 11 and the ceramic frame 12 for making the electrical connection 18 electrically conductive. Although not shown in the drawings, the electronic component element housing package 10 described above has a fourth metallized film 21 provided on the wall surface of the cutout portion 19 of the joined body corner and only on the wall surface of the cutout portion 19 of the ceramic substrate 11. And a conductor wiring pattern extending between the joint portions of the ceramic base body 11 and the ceramic frame body 12 by being connected to the fourth metallized film 21 and a wall surface of a notch provided on the inner peripheral wall surface of the ceramic frame body 12 The first metallized film 14 and the third metallized film 18 can be brought into an electrically conductive state through a conductor wiring pattern provided on the substrate.

  The electronic component element storage package 10 extends upward from the connection portion with the first metallized film 14 on the upper surface of the fourth metallized films 21 and 21a and crosses the fourth metallized films 21 and 21a. Thus, the ceramic insulating film 22 is coated. The ceramic insulating film 22 is provided by covering the upper surfaces of the fourth metallized films 21 and 21a with a ceramic similar to the ceramic used for the ceramic base 11 and the ceramic frame 12 described above. The electronic component element storage package 10 is a package for storing the electronic component element 23 by forming a plating film on a metal part such as a metallized film exposed to the outside.

  As shown in FIGS. 2A and 2B, in the electronic component element storage package 10, for example, a piezoelectric vibrating piece of the electronic component element 23 such as a semiconductor element or a piezoelectric vibrating piece is placed in the cavity portion 20. The electronic component element connection pad 15 is bonded with a conductive resin or the like and is electrically connected to be mounted. Then, a metal lid 24 made of KV, 42 alloy or the like is directly brazed and joined to the electronic component element storage package 10 with a brazing material such as AuSn, and the electronic component element 23 is placed in the cavity portion 20. Airtightly sealed. Although not shown in the figure, the electronic component element storage package 10 is first bonded to the lid bonding pad 17 by brazing a metal ring made of KV, 42 alloy or the like with an Ag brazing material or the like, and the cavity portion. After the electronic component element 23 is mounted on the electronic component element 23, the metal lid member 24 can be joined to the metal ring by seam welding, and the electronic component element 23 can be hermetically sealed in the cavity portion 20. In the electronic component element storage package 10 on which the electronic component element 23 is mounted, the external connection terminal pad 13 is bonded to the bonding pad 26 provided on the board substrate 25 or the like via the solder 27. The electronic component element storage package 10 is bonded to the board substrate 25 or the like with the external connection terminal pads 13 on the bottom surface of the ceramic substrate 11 without providing the caster conductor on the side surface of the ceramic substrate 11 or the ceramic frame 12. Therefore, there is no solder meniscus on the side surface, the mounting density on the device can be improved, and the size of the device can be reduced. Further, since the electronic component element storage package 10 does not include a via conductor that is formed by filling a through hole provided in the ceramic base 11 with a conductive paste, the airtight reliability in the cavity portion 20 is increased. Can do.

  Next, a method for manufacturing the electronic component element storage package 10 will be described. The electronic component element storage package 10 includes alumina, aluminum nitride, low-temperature fired ceramic, and the like as the ceramic base 11 and the ceramic base of the ceramic frame 12, and the material is not particularly limited. For example, when using alumina as the ceramic substrate, first, a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to aluminum oxide powder, a plasticizer such as dioctiphthalate, an acrylic resin, etc. A binder, and a solvent such as toluene, xylene, alcohols, etc., kneaded thoroughly and defoamed to prepare a slurry having a viscosity of 2000 to 40000 cps, and a desired thickness, for example, 0.12 mm by a doctor blade method or the like. After making into a sheet shape, it is dried and cut into a rectangular shape of a desired size to form a ceramic green sheet. The ceramic green sheet is formed by arranging a large number of electronic component element storage packages 10, and finally is separated into individual pieces along a dividing groove for dividing into individual pieces. Individual packages are produced by dividing.

  The ceramic green sheet to be the ceramic base 11 is formed with a through hole for forming the notch 19 or the like using a punching press or a punching machine. Next, when this ceramic green sheet is used that is fired at a high temperature such as alumina or aluminum nitride, a conductive paste made of a refractory metal such as W or Mo is used as the conductive paste. A conductor wiring print pattern is formed using a paste. A through-hole conductor printing pattern for the fourth metallized films 21 and 21a is formed by screen printing on the wall surface of the through hole for forming the notch 19 or the like. The ceramic green sheet for the ceramic substrate 11 has a conductor wiring printed pattern for the second metallized film 16 including the electronic component element connection pads 15 on the upper surface portion, and the external connection terminal pads 13 on the lower surface portion. A conductor wiring print pattern for the first metallized film 14 is formed by screen printing using the same conductor paste as described above. Next, a ceramic insulating paste using a ceramic substrate similar to the ceramic substrate 11 or the ceramic substrate of the ceramic frame 12 is used on the upper surface of the through-hole conductor print pattern for the fourth metallized films 21 and 21a. A through-hole insulating printing pattern is formed by screen printing from the lower surface side of the ceramic green sheet for the ceramic substrate 11. When the ceramic insulating film 22 is formed up to the middle of the ceramic green sheet for the ceramic substrate 11, the viscosity of the ceramic insulating paste used is adjusted so as not to cover the entire surface of the fourth metallized films 21 and 21a. It can also be formed.

  On the other hand, in the ceramic green sheet to be the ceramic frame 12, a through-hole for forming the notch portion 19 or the like, a portion that becomes the inner peripheral side wall surface of the cavity portion 20 is punched, a punching machine, or the like is used. It is formed using. Next, on the ceramic green sheet, a through-hole conductor print pattern for the fourth metallized film 21a is formed on the wall surface of at least one through hole by screen printing. In addition, a conductive wiring print pattern for the third metallized film 17 that is the lid bonding pad 17 is formed on the upper surface of the ceramic green sheet by screen printing. Note that the ceramic green sheet has a through-hole conductor printing pattern for the fourth metallized film 21a before the portion that becomes the inner peripheral side wall surface of the cavity portion 20 is formed using a punching press or a punching machine. Is formed by screen printing, and after the conductor wiring print pattern for the third metallized film 17 is formed by screen printing, the portion that becomes the inner peripheral side wall surface of the cavity portion 20 is punched using a punching machine, a punching machine, or the like. It can also be formed.

  Next, each ceramic green sheet is overlaid and pressed while applying temperature to form a laminate. In this laminated body, a large number of packages are formed as an aggregate. Therefore, in order to form a package consisting of individual pieces, the center of the through hole for forming notches 19 and the like provided at four corners is formed. A dividing groove is formed to be divided so as to cross. Next, the laminate is formed into a fired body by simultaneously firing the ceramic green sheet, the dried conductor paste and the insulating paste in a firing furnace in a reducing atmosphere. Next, in this fired body, an electron consisting of a large number of aggregates is formed by applying a Ni plating film on the surface of the metal part such as all conductor patterns exposed on the outer surface, and further applying an Au plating film on the upper surface of the Ni plating film. A component element storage package 10 is formed. Furthermore, the electronic component element storage package 10 made up of a large number of aggregates is divided by dividing grooves to form the electronic component element storage package 10 made up of individual pieces.

  The electronic component element storage package of the present invention is mounted with an electronic component element such as a semiconductor element or a piezoelectric vibrating piece, and is small and requires high reliability. For example, a mobile phone or a notebook type personal computer. It can be used by being incorporated in an electronic device such as.

  10: Electronic component package, 11: Ceramic substrate, 12: Ceramic frame, 13: External connection terminal pad, 14: First metallized film, 15: Electronic component connection pad, 16, Second metallized film, 17: Lid bonding pad, 18: third metallized film, 19: notch, 20: cavity, 21, 21a: fourth metallized film, 22: ceramic insulating film, 23: electronic component element, 24 : Cover body, 25: board substrate, 26: bonding pad, 27: solder

Claims (1)

A rectangular frame-shaped ceramic frame with a third metallized film provided on the upper surface is laminated on the outer periphery of the upper surface of a rectangular plate-shaped ceramic base provided with the first metallized film on the lower surface and the second metalized film on the upper surface. Electrically connecting the first metallized film and the second metallized film or the first metallized film and the third metallized film on the notch at the corner of the joined body and on the wall surface of the notch. A fourth metallized film for establishing a conductive state, and an upper surface of the fourth metallized film extending upward from a connection portion with the first metallized film and crossing the fourth metallized film. the ceramic substrate and the electronic component element storage package characterized by having a ceramic insulating layer consisting of a ceramic substrate and the same of the ceramic substrate used in the insulating wall is coated as Over di.

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