JP5318685B2 - Electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component having a brittle material such as glass as a component of a package and a method for manufacturing the same.

  Electronic parts such as crystal resonators are used as reference oscillation sources for electronic devices and clock sources for microcomputers.

  This crystal resonator is configured by enclosing a crystal resonator element in a small surface-mount package that is hermetically sealed in a hollow and vacuum.

  As a conventional hermetically sealed small surface-mount package, a ceramic container with a metal lid joined is manufactured.

However, since a package using this ceramic is expensive, a package using glass has been devised. (Patent Document 1)
FIG. 16 is a cross-sectional view of a crystal resonator using a glass package. FIG. 16 shows a crystal resonator on a circuit board. In FIG. 16, the state which connected the circuit board and the crystal oscillator with the solder is shown. The glass substrate 1 is bonded to a glass or metal lid 2 and a bonding material 3. Further, the external electrode 4 and the internal electrode 6 are connected by the through electrode 5. Further, the internal electrode 6 and the crystal vibrating piece 8 are connected by a connecting material 7. The external electrode has a structure in which, for example, a thick conductive paste using glass frit as a binder, or a sputtered metal film as a base, and Ni and Sn plating are formed thereon. This crystal resonator is connected and fixed to the land 10 on the circuit board 11 by the solder 9. Further, since such a surface-mount type crystal resonator is extremely miniaturized, the thickness of the glass substrate 1 is about 0.2 mm to 0.5 mm. Further, the soda glass thin plate glass produced by the float process is extremely low in cost, so that it is advantageous in terms of cost for use in such a surface mount component package. In addition, when glass is used, a large number of electronic components can be collectively formed on a glass substrate, so that there is an advantage that the glass substrate and the quartz crystal vibrating piece and the lid can be collectively bonded in many electronic components. is there. Furthermore, a crystal resonator using glass as a package member has a great advantage that the frequency can be adjusted by a laser after the crystal resonator element is hermetically sealed.

  However, this soda glass has the disadvantage that it has the lowest strength among the glasses. In addition, such a surface-mount package that does not have a metal piece terminal has almost no stress relaxation mechanism, so it is directly affected by thermal stress due to thermal expansion difference from the circuit board and deformation stress of the circuit board. Become. In addition, surface mount packages soldered onto a circuit board are subject to large stresses such as deformation of the board, drop impact, thermal shock, etc., which can cause cracks in the glass and stop transmission of the crystal unit. is there. In addition, the occurrence of cracks is likely to occur with Pb-free solder that has a high melting point and creep strength and is less susceptible to thermal stress relaxation.

Therefore, it has been devised to chemically strengthen the glass as a method for improving this defect. (Patent Document 2)
Alternatively, it has been devised to use glass ceramics (crystallized glass) instead of glass. (Patent Document 3)

JP 2002-124845 A Japanese Patent Laid-Open No. 7-212159 JP-A-10-335970

  When the above-mentioned chemically strengthened soda glass is used, the strength is improved, but there is a drawback that cracks are generated at the time of cutting and breakage tends to occur from the cut portion. Moreover, there is also a drawback that the effect of chemical strengthening is impaired when subjected to heat of several hundred degrees C after chemical strengthening.

  Further, the above-mentioned crystallized glass has a drawback that it is very expensive although it has high strength.

  Accordingly, an object of the present invention is to realize an electronic component in which a substrate is made of low-cost glass and is resistant to stress such as deformation even when mounted on an electronic circuit board.

  In order to solve the above problems, the present invention provides the following means.

  A substrate formed of a brittle material, a lid that is installed on one surface of the substrate and that forms a hollow portion that blocks external air between the surface, and the substrate and the lid. An electronic component including a package, an internal electrode installed in the package, an electronic element installed in the internal electrode, and an external electrode electrically connected to the internal electrode. There is provided an electronic component comprising a laminated structure portion laminated in the order of an insulating resin layer, a conductive resin layer, and an external electrode on a surface opposite to the surface.

  Further, silicon and glass are employed as the brittle material. These have the advantage of being low in cost compared to ceramics, particularly alumina, plastics and metals frequently used as packages.

  Furthermore, the present invention includes a structure in which the internal electrode is formed on the substrate. Further, the present invention can be applied to a structure in which the internal electrode is formed on the lid.

  The conductive resin layer has a structure divided on the insulating resin layer, and the external electrode has substantially the same shape as the divided conductive resin layer.

  In addition, the internal electrode and the external electrode are electrically connected through a through electrode penetrating the substrate.

  Further, the insulating resin layer has an opening on the through electrode, and the through electrode and the conductive resin layer are electrically connected through the opening. Further, a structure is adopted in which the opening opens part of the side surface of the insulating resin layer.

  Further, the insulating resin layer has an opening on the through electrode, and is formed between at least the side closest to the center of the substrate and the substrate among the plurality of sides of the conductive resin layer. Furthermore, the insulating resin layer is also formed between the side parallel to the side closest to the center of the substrate and the substrate among the plurality of sides of the conductive resin layer.

  A substrate formed of a brittle material; an internal electrode disposed on one surface of the substrate; an electronic element disposed on the internal electrode and hermetically sealed with a sealing material; and the first surface of the substrate. And an external electrode that is electrically connected to the internal electrode, and the substrate has an insulating resin layer, a conductive resin layer on the surface opposite to the surface of 1, Provided is an electronic component comprising a laminated structure portion laminated in the order of external electrodes.

  The insulating resin layer and the conductive resin layer are formed by a screen printing method.

  The external electrode is formed by electroless plating.

  Further, the substrate and the lid for sealing the electronic element are joined by anodic bonding.

  In addition, a large number of electronic elements and a large number of external electrodes can be collectively formed on the substrate, and the formed electronic component can be divided into individual pieces.

  According to the present invention, by forming a structure in which an insulating resin layer, a conductive resin layer, and an external electrode are laminated in this order on a substrate made of glass or silicon, flexibility and excellent stress relaxation characteristics can be provided. Further, by relaxing the stress, the glass is not cracked even in a state where it is soldered to the electronic circuit board, so that the reliability of the product can be improved.

It is sectional drawing of the external electrode of the electronic component of this invention. It is a figure explaining the external electrode formation process of this invention. It is a top view of the external electrode of the board | substrate which mounts the electronic component of this invention. It is sectional drawing which shows the mounting state of the electronic component of this invention. It is a top view of the state which formed the insulating resin layer of the electronic component of this invention. It is a top view of the state which formed the conductive resin layer of the electronic component of this invention. It is a top view of the state which formed the insulating resin layer of the electronic component of this invention. It is a figure explaining the screen printing process in insulating resin and conductive resin layer formation of this invention. It is sectional drawing which shows the stress concentration part by the bending stress load in the mounting state of an electronic component. It is a top view of the state which formed the insulating resin layer of the electronic component of this invention. It is sectional drawing of the external electrode of the electronic component of this invention. It is sectional drawing of the electronic component of this invention It is sectional drawing of the electronic component of this invention. It is sectional drawing of the electronic component of this invention. It is a figure explaining the process of collectively forming the electronic component of this invention on a board | substrate. It is sectional drawing which shows the mounting state of the electronic component in a prior art example.

  Hereinafter, embodiments for carrying out the present invention will be described in detail. In the following examples, glass is used as the substrate, but silicon can be similarly applied.

  FIG. 1 shows a cross-sectional view of an external electrode on a glass substrate which is a brittle material used in the electronic component of the present invention. Here, the brittle material refers to a material that is cheaper than a ceramic or the like that is frequently used for a package, such as glass or silicon. FIG. 1 shows an external electrode on a glass substrate. Substrate portions other than the external electrodes are omitted. The same applies to FIG. 2, FIG. 8, and FIG.

  An insulating resin layer 12 is formed on the glass substrate 1 provided with a through electrode 5 that is a lead-out electrode connected to an internal electrode (not shown), and a conductive resin layer 13 is formed on the insulating resin layer. Furthermore, the external electrode 4 used for soldering with a circuit board is formed on the conductive resin layer.

An opening 15 is formed in the insulating resin layer 12 so that the through electrode 5 and the conductive resin layer 13 are directly connected. Note that it is not necessary for the entire through electrode to be open, as long as a part of the through electrode is open, and the insulating resin layer may cover a part of the through electrode. For the insulating resin layer 12, for example, an epoxy resin, a phenol resin, a polyimide resin, a polyamideimide resin, a polyallyl ether resin, a cyanate resin, a silicon resin, an acrylic resin, or an insulating resin obtained by modifying them can be used. These insulating resins may be mixed with fillers for improving various properties.
For the conductive resin layer 13, for example, a conductive adhesive such as a silver paste can be used. Moreover, what mixed the conductive filler with the insulating resin as mentioned above can also be utilized for conductive resin. In that case, Ag, Ag alloy, Ag coat Cu, Cu etc. can be utilized as a conductive filler.

  The through electrode 5 is made of Ag, Ag—Pd metal alloy, a thick film electrode filled with a thick film paste formed of glass frit, and fired, or a metal lead such as an Fe—Ni alloy, Kovar alloy, or dumet wire. A hermetically sealed electrode sealed with glass frit or a metal sealed with solder or plating can be used. In the case of an electronic component that does not require vacuum sealing such as an LED, a conductive resin can also be used.

  The insulating resin has flexibility and stress relaxation characteristics, and has an advantage of suppressing breakage of the glass substrate member against various stresses. However, the insulating resin has a drawback that external electrodes cannot be formed by plating.

  On the other hand, the conductive resin has an advantage that an external electrode can be formed by plating. However, it has the disadvantages that it is harder than insulating resin and has poor stress relaxation properties. Moreover, since there is little resin content compared with insulating resin, adhesiveness with glass is also inferior.

  In the present invention, the insulating resin layer 12 is formed on the glass substrate 11, the conductive resin layer 13 is formed on the insulating resin layer 12, and the external electrode 4 is further formed on the conductive resin layer 13. In this configuration, since the insulating resin layer 12 is formed on the glass substrate 11, the high stress relaxation effect of the insulating resin and the adhesion to glass can be used. Furthermore, by forming the external electrode 4 on the conductive resin layer 13, there is also an advantage that the external electrode can be easily formed by plating with a conductive resin. Further, the insulating resin layer 12 and the conductive resin layer 13 can be firmly adhered. As described above, the adhesion between the insulating resin and the conductive resin can be used, and a structure with excellent stress relaxation effect and adhesion can be obtained.

  When the resin layers are formed by screen printing, the thickness of the insulating resin and conductive resin layers is preferably 10 to 30 μm. If it is 10 μm or less, it becomes difficult to relieve the stress of the substrate. Further, it is not easy to form a thickness of 30 μm or more with each resin, and the production cost increases. As described above, with this thickness, each resin layer can be manufactured at a low cost, and a structure having a high stress relaxation effect can be obtained.

  As described above, the electrode having the two-layer structure of the insulating resin layer and the conductive resin layer shown in the present invention has a stress relaxation property, glass, or the like compared to the case of the insulating resin single layer or the conductive resin single layer. Adhesion with the substrate is very high. Further, since the synthetic resin and the insulating resin constituting the conductive resin can take various combinations, the package having the electrode having the two-layer structure of the present invention has high reliability such as high temperature and high humidity and temperature cycle.

  In particular, there are restrictions on the resins that can be used as the conductive resin when considering adhesion to glass, temperature cycling, and the like. However, various conductive resins can be used by adopting the two-layer structure of the insulating resin and the conductive resin of the present invention.

  In addition, in an electronic component that requires vacuum sealing, such as a crystal resonator, a high temperature process after vacuum sealing may reduce the degree of vacuum. Therefore, in a thick film electrode using glass frit that requires heat treatment at about 500 ° C., it is necessary to form an external electrode before vacuum sealing, which increases manufacturing time. However, in the present invention, since a conductive resin can be used, heat treatment (curing treatment) up to a relatively low temperature of about 200 ° C. is sufficient. For this reason, it becomes possible to form an external electrode after vacuum sealing, and the manufacturing time can be shortened.

  The external electrode forming process of the present invention will be described with reference to FIG.

  FIG. 2A is a process of forming the insulating resin layer 12 on the glass substrate 1 (printing process 1). In the process of FIG. 2A, the insulating resin layer 12 is pattern-printed by screen printing on the glass substrate 1 provided with the through electrode 5 connected to an internal electrode (not shown). Further, after the insulating resin layer 12 is printed, a curing process is performed. When forming the insulating resin layer, the opening 15 that opens on the through electrode is formed. Note that it is not necessary for the entire through electrode to be open, as long as a part of the through electrode is open, and the insulating resin layer may cover a part of the through electrode.

  FIG. 2B is a process of forming the conductive resin layer 13 on the insulating resin layer 12 (printing process 2). The conductive resin layer 13 is formed by pattern printing by screen printing and curing treatment. The conductive resin layer 13 is also formed in the opening 15 and has a portion directly connected to the through electrode 5.

  In FIG.2 (c), the external electrode 4 is formed on the conductive resin layer 13 using electroless plating (plating process). The external electrode 4 formed by electroless plating has high adhesion with the conductive resin layer 13. In the electroless plating, since the external electrode 4 can be formed only on the conductive resin layer 13, an essential mask is not necessary for film formation by sputtering. In addition, it can be processed in batches, and it is low in cost and mass-productive compared to other methods.

  Note that the external electrode may be formed by a printing method, a sputtering method, a vapor deposition method, a photolithography method, or the like.

  FIG. 3 is a plan view of a glass substrate on which the external electrode of the present invention is mounted.

  In FIG. 3, two insulating resin layers 12 are formed on the glass substrate 1. In addition, a conductive resin layer (not shown) is formed on the insulating resin layer 12, and the external electrode 4 is formed on the conductive resin layer. Note that the conductive resin layer and the external electrode 4 have substantially the same shape. The external electrode 4 has a structure that is divided on the insulating resin layer 12 into an external electrode 4a and an external electrode 4b. Therefore, in FIG. 3, two conductive resin layers divided on the insulating resin layer 12 are formed, and an external electrode is arranged on each conductive resin layer. The external electrodes 4a and 4b are formed by plating or the like.

  When the external electrode is formed on the entire surface of the insulating film, the stress applied to the glass substrate increases. Therefore, dividing the external electrode improves the stress relaxation characteristics as compared with the case where the external electrode is not divided. However, the external electrode of the present invention is not necessarily divided. Note that the glass substrate in FIG. 3 has a plate-like structure having a width of 3 mm and a length of 1.3 mm to 1.5 mm, for example.

  4 is a view of a cross section taken along a chain line AA ′ in FIG. 3 when an electronic component is formed using the external electrode in FIG. In FIG. 4, the electronic element is a crystal vibrating piece 8. Further, the package is configured by sealing the crystal vibrating piece 8 such as the substrate 1, the lid 2, and the bonding material 3. Further, the electronic component refers to an electronic component configured on the circuit board 11 such as a package, an electronic element enclosed in the package, and an electrode. In FIG. 4, an insulating resin layer 12 is formed on one surface of the glass substrate 1. Two conductive resin layers 13 a and 13 b are formed on the insulating resin layer 12. In addition, external electrodes 4a and 4b are formed on the conductive resin layers 13a and 13b, respectively. Further, the external electrodes 4 a and 4 b are connected to one land 10 by solder 9. An internal electrode 6 is formed on the surface of the glass substrate 1 where the insulating resin layer 12 is not formed. The internal electrode 6 is connected to the through electrode 5 embedded in the glass substrate 1. The insulating resin layer 12 includes an opening 15 in the through electrode 5 portion. In the opening 15, a conductive resin layer 13 a or 13 b is formed. Further, the conductive resin layer 13 a or 13 b and the through electrode 5 are electrically connected through the opening 15. FIG. 4 shows the part of the electronic component formed on the circuit board 11. Therefore, other parts of the circuit board are omitted by wavy lines. The same applies to FIG.

  Further, since the external electrode 4a and the external electrode 4b are connected to one land 10 on the circuit board 11, they have the same function in terms of circuit. For example, in a crystal resonator, it means an anode electrode or a cathode electrode, and each has a single function. For example, one of the external electrodes may be a discarded electrode that has no circuit meaning. In this case, it is possible to maintain the balance of the structure of the electronic component by disposing the discarded electrode having the same shape as the external electrode at a symmetrical position on the substrate. Further, the interval between the divided external electrodes is, for example, about 200 μm.

  Thus, by dividing the external electrode, the area is reduced as compared with the integrated external electrode, and the stress generated in the glass substrate is relieved. Moreover, the stress generated by soldering is also alleviated. Furthermore, stress generated by thermal cycling, deformation stress, etc. are alleviated.

  FIG. 5 is a plan view of a substrate provided with the insulating resin layer of the present invention. In FIG. 5, the insulating resin layer 12 has a structure covering almost the entire surface of the glass substrate 1. Furthermore, an opening 15 is formed in the insulating resin layer 12 formed on the glass substrate 1. Under the opening 15, a through electrode (not shown) formed in the same plane as the glass substrate 1 is provided. The opening 15 is formed to electrically connect a conductive resin layer (not shown) formed on the insulating resin layer 12 and the through electrode. In FIG. 5, for example, when the electronic component is a crystal resonator, if the insulating resin layer covers almost the entire surface of the glass substrate, fine adjustment of the frequency by the laser becomes difficult. Therefore, when the insulating resin layer is not separated, it is preferable to form an opening (not shown) at the center of the insulating resin layer separately from the opening 15 for frequency adjustment with a laser.

  FIG. 6 is a view showing a glass substrate provided with the insulating resin layer and the conductive resin layer of the present invention. An insulating resin layer (not shown) having substantially the same shape as the conductive resin layer 13 is formed between the conductive resin layer 13 and the glass substrate 1. Moreover, the opening part is formed in the insulating resin layer similarly to FIG. A through electrode (not shown) formed on the same plane as the glass substrate 1 is provided below the opening. The opening is formed to electrically connect the conductive resin layer 13 formed on the insulating resin layer and the through electrode. As described above, by adopting the configuration shown in FIG. 6, for example, in the case of a crystal resonator, frequency adjustment with a laser can be performed from a glass substrate in a portion where the conductive resin layer 13 is not formed.

  FIG. 7 is a plan view of a substrate provided with the insulating resin layer of the present invention.

  FIG. 7A is a plan view of a substrate in which an opening 15 is provided in the insulating resin layer 12. A through electrode (not shown) embedded in the glass substrate is formed under the opening 15. When a conductive resin layer is formed on the insulating resin layer 12, an insulating resin layer and a conductive resin layer are sequentially laminated on the glass substrate 1 shown in FIG. Thereby, a conductive resin layer is formed in the opening 15, and the through electrode and the conductive resin layer are electrically connected. The shape of the opening 15 in FIG. 7A is circular, but may be, for example, a square as long as the through hole portion is open.

  However, when the insulating resin layer is formed by a screen printing method, if the diameter of the opening is reduced, liquid dripping or the like is likely to occur, and a defect that the opening does not occur correctly is likely to occur. In order to avoid this defect, it is effective to widen the region where the insulating resin layer is not formed and to have an open structure.

  FIG. 7B includes an opening 15 in which a part of the side surface of the insulating resin layer 12 is opened. With the structure of FIG. 7B, dripping due to the printing method can be prevented without substantially reducing the stress relaxation characteristics. Moreover, in FIG.7 (b), in one pair of insulating resin layers, the open structure is provided in the side surface on the opposite side of an opposing part. However, the open structure may be provided on any side surface, and may be provided on the side surface of the facing portion in a pair of insulating resin layers, for example.

  The screen printing method includes an opening mask for forming an opening in a metal mask, a stencil mask, a mesh mask formed into a pattern (mesh) with a photosensitive resin or the like. In the present invention, when a mesh mask is used, printing can be performed with high accuracy, and an floating island pattern that cannot be formed with an opening mask can be formed.

  There is also a method of printing a conductive resin layer on the through electrode in advance before printing the insulating resin layer. FIG. 8 shows the process.

  FIG. 8 is a cross-sectional view showing a process of forming each resin layer of the present invention on a glass substrate.

  FIG. 8A shows a process of forming the conductive resin layer 13 on the through electrode 5 (printing process a). In this step, before the insulating resin layer 12 is printed, the conductive resin layer 13 is first printed on the portion corresponding to the opening. This eliminates the need for forming an opening and simplifies the manufacturing process. However, the conductive resin layer does not necessarily need to cover the entire through electrode, and may have a form covering a part of the through electrode.

  FIG. 8B is a process of forming an insulating resin layer around the conductive resin layer 13. By this step, the adhesion between the glass substrate 1 and the external electrode can be improved (printing step b).

  FIG. 8C is a process of forming the conductive resin layer 13 on the insulating resin layer 12. In this step, the two formed conductive resin layers are integrated. Thereby, it is possible to easily form an external electrode on the conductive resin layer 13 using plating (plating process).

  8 has the same structure as that in which the insulating resin layer 12 is provided with the opening, and the through electrode 5 and the conductive resin layer 13 are electrically connected. Furthermore, it is not necessary to form an opening, and the manufacturing process can be simplified.

  FIG. 9 is a view showing a stress concentration portion of a cross section of an electronic component using the external electrode of the present invention. Each configuration in FIG. 9 is the same as that in FIG. 4, and the laminated structure portion 14 collectively shows a structure in which an insulating resin layer, a conductive resin layer, and an external electrode are laminated in this order on the glass substrate 1. At this time, the laminated structure portion 14 is composed of a pair of electrodes such as a cathode electrode and an anode electrode, for example. When the laminated structure portion 14 is connected to the circuit board 11 with the solder 9, in the glass substrate 1, the conductive resin layer or the external electrode close to the center of the laminated structure portion 14, particularly near the center of the substrate. There is a stress concentration portion 24 where stress due to bending or the like is concentrated at the position of the side. Therefore, in order to relieve stress, at least the insulating resin layer 12 for relieving stress may be formed in the stress concentration portion 24. FIG. 10 shows the structure.

  FIG. 10 is a plan view of a substrate provided with the insulating resin layer of the present invention.

  FIG. 10A shows a structure in which the insulating resin layer 12 is formed only on the stress concentration portion 24 shown in FIG. The stress generated in the glass substrate 1 can be sufficiently relaxed only by forming the insulating resin layer 12 in the stress concentration portion 24 where the stress is greatly concentrated with respect to other portions. In this embodiment, the side of the conductive resin layer located at the stress concentration portion is necessarily formed on the insulating resin layer 12 in order to sufficiently relieve the stress. In the present embodiment, the insulating resin layer 12 is not formed on the through electrode 5. Thereby, it is not necessary to form an opening on the through electrode 5, and the manufacturing process can be shortened. However, it is not necessary for the entire through electrode to be open, as long as a part of the through electrode is open, and the insulating resin layer may cover a part of the through electrode. In this embodiment, the external electrode may have a divided structure.

  FIG. 10B is a view showing a structure in which the stress concentration portion 24 shown in FIG. 9 and two rectangular insulating resin layers 12 are formed at the end of the glass substrate 1. As in FIG. 10A, the insulating resin layer 12 is not formed on the through electrode 5. As described above, the configuration of FIG. 10B can sufficiently relax the stress generated in the glass substrate. Moreover, compared with FIG. 10A, the stress can be further relaxed, and the adhesion between the glass substrate 1 and the conductive resin layer formed on the insulating resin layer 12 can be improved. Note that the insulating resin layer of this embodiment does not have to be rectangular in particular, and may be formed around the stress concentration portion and the end portion of the external electrode. Note that this embodiment is also effective for, for example, an IC chip or the like having one or more pairs of terminals and external electrodes.

  FIG. 11 shows a cross-sectional view of the external electrode on the glass substrate of the electronic component of the present invention. In FIG. 11, a lead electrode and an insulating resin layer are formed on the glass substrate 1. A conductive resin layer 13 is formed on the routing electrode 16 and the insulating resin layer 12. At this time, the routing electrode 16 connected to the internal electrode (not shown) by rewiring and the conductive resin layer 13 are electrically connected. Here, the routing electrode 16 which is an interlayer wiring is taken out from the joint between the glass substrate and a lid (not shown). An external electrode 4 is formed on the conductive resin layer 13. Furthermore, an insulating resin layer 12 is formed on the routing electrode 16 at the end of the glass substrate 1. Thereby, it is possible to prevent the solder or the like connected to the external electrode 4 from adhering to the routing electrode 16. With this configuration, it is not necessary to form a through hole in the glass substrate 1, and the strength of the glass substrate 1 can be maintained.

  12 is a cross-sectional view of an electronic component having the configuration of FIG. FIG. 12 is characterized in that a lead-out electrode 16 for connecting the internal electrode 6 and the laminated structure portion 14 is formed between the bonding portion 3 and the glass substrate 1 without forming a through electrode. . Thereby, it becomes unnecessary to form a through-hole in the glass substrate 1, and the quality of an electronic component can be improved.

  As another method for taking out the electrode from the inside of the package to the outside, for example, a method of forming a through electrode outside the region of the external electrode and connecting to the external electrode region by rewiring can be used.

    FIG. 13 is a cross-sectional view of another electronic component having the configuration of FIG. In FIG. 13, the crystal vibrating piece 8 is joined to the lid 2 via the connecting material 7 and the internal electrode 6.

  Some packages have a hollow structure such as a crystal resonator and have a lid. At this time, when a metal is used for the lid, welding with a brazing material is possible. When glass is used for the lid, anodic bonding is effective for bonding to the substrate. Moreover, it is also possible to join by using Au-20 wt% Sn solder as the bonding material. It is also possible to join by using an organic adhesive or glass paste.

  Moreover, in order to form glass into a concave shape in order to form a space, glass press molding can be utilized. In addition, there are other methods such as etching, sandblasting, sidewall formation by a thick film method, or sidewall formation by glass preform bonding.

  An organic conductive adhesive can be used as a bonding agent for the connection between the quartz crystal vibrating piece and the internal electrode. In addition, for example, use of Au-20 wt% Sn solder, use of other high-temperature solder, use of ultrasonic bonding with Au bumps, or connection using the above method and wire bonding is possible. is there.

  By using a thin soda glass manufactured by a float process as a thin glass sheet for a substrate or a lid, the cost can be reduced. In addition, the float method makes it easy to produce a thin soda glass with good smoothness. Furthermore, this soda glass has good polishing properties, and a smooth thin glass plate having a thickness of 0.2 mm to 0.5 mm can be obtained relatively easily. Further, soda glass has a thermal expansion coefficient close to that of a crystal resonator and is advantageous in terms of vibration characteristics. In particular, when the package has a glass lid, the method of joining the lid and the substrate by anodic bonding is suitable for a method of forming a large number of packages on a single large glass substrate or silicon substrate. This method is rich in mass productivity.

  Electrolytic plating by barrel plating is used to form plating on external electrodes of electronic components such as resistors and capacitors.

  However, the substrate used in the present invention is a fragile substrate such as glass or silicon. It is difficult to use electrolytic plating in a method in which a large number of package regions are collectively formed on the substrate, electronic components are formed, and each device is cut. Therefore, in the present invention, electroless plating is used to form a plating on one large substrate without supplying power.

  As the external electrode, for example, Ni, Cu, or a laminate of Ni and Cu is used as a base. As the protective layer of the external electrode, for example, Au, Sn, Ag, Pt, or a laminate of Au and Pd can be used. As the process, a method of forming Au—P or Ni—B electroless plating on the conductive resin layer and then forming Au as a protective layer by displacement plating is more preferable.

  In the above description, the quartz crystal resonator element is described as an example of the electronic element, but the present invention is also very effective for a SAW (Surface Acoustic Wave) element. Also, multiple chips and elements such as semiconductors such as light receiving / emitting devices, IC (Integrated Circuit) chips, acceleration sensors, pressure sensors, optical sensors, other MEMS sensors, optical components, high frequency components, multi-chip modules, etc. It is applicable also to the electronic device which consists of. Therefore, for example, the present invention can also be applied to an electronic component including a package including a substrate and a lid and the above-described electronic element sealed therein.

  In addition, when silicon is used as a substrate, it is used as a packaging material for microparts mainly composed of etching called MEMS (Micro Electro Mechanical Systems). In this case, since silicon as a package is processed by being integrated with an electronic element, a mechanism element and the like to be mounted, silicon having particularly good process compatibility is used.

  The method for sealing the electronic element is not a hollow sealing, but a structure of a solid surface-mounted component package in which a semiconductor such as an LED is encapsulated and filled with resin or glass.

  This structure can also be applied to a surface mount component package in which a side wall is formed on a substrate and filled with resin or glass. This structure can also be applied to a package in which a chip element is mounted on a substrate and resin-sealed or resin-coated. Alternatively, the present invention can be applied to a package in which an electrolytic solution such as a battery or a capacitor is enclosed. FIG. 14 shows the structure.

  FIG. 14 is a cross-sectional view of an electronic component in a form in which the electronic device of the present invention is sealed. In FIG. 14, for example, an electronic element 22 such as an optical sensor is connected to the internal electrode 6 on the glass substrate 1 by wire bonding 17. Further, hermetic sealing is performed by a sealing agent 18 such as resin or glass. In the case of an optical sensor or the like, for example, a wire bonding or a bump electrode can be used for connection between the electronic element and the internal electrode of the package.

  In the formation of the electronic component according to the present invention, a large number of electronic components can be collectively formed.

  FIG. 15 is a diagram illustrating a process of collectively forming electronic components on a substrate.

FIG. 15A is a diagram in which the electronic components 23 packaged on the glass substrate 1 are collectively formed. The electronic component 23 is formed by performing internal wiring, mounting of an electronic component, sealing (joining of a lid), and formation of an external electrode. In addition, the electronic component 23 is characterized by having a laminated structure of the insulating resin layer, the conductive resin layer, and the external electrode of the present invention.
FIG. 15B is a process of dividing the electronic component into pieces. Specifically, the glass substrate 1 is cut and separated into individual electronic components 23.

  In a method for forming a large number of electronic components on a single large glass substrate, the screen printing method is extremely excellent in productivity and facilitates mass production.

  Furthermore, anodic bonding of the substrate and lid and formation of the external electrode by electroless plating are suitable when packaging is performed collectively on a large substrate such as glass.

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Lid 3 Bonding material 4, 4a, 4b External electrode 5 Through electrode 6 Internal electrode 7 Connection material 8 Crystal vibrating piece 9 Solder 10 Land 11 Circuit board 12 Insulating resin layer 13, 13a, 13b, 23 Conductive resin layer 14 Laminated structure part 15 Opening part 16 Lead-out electrode 17 Wire bonding 18 Sealant 22 Electronic element 23 Electronic component 24 Stress concentration part

Claims (20)

A substrate formed of a brittle material, a lid that is installed on the first surface of the substrate and that forms a cavity that is blocked from outside air between the first surface, and the substrate and the lid. And a package having the cavity therein, an internal electrode installed inside the package, an electronic device installed inside the package and electrically connected to the internal electrode, and the internal electrode An electronic component comprising an external electrode for electrical connection,
The electronic component is provided with a laminated structure portion in which an insulating resin layer, a conductive resin layer, and an external electrode are laminated in this order on a surface opposite to the first surface of the substrate.   The electronic component according to claim 1, wherein the brittle material is glass or silicon.   The electronic component according to claim 2, wherein the internal electrode has a structure formed on the substrate.   The electronic component according to claim 2, wherein the internal electrode has a structure formed on the lid. The conductive resin layer has a structure divided on the insulating resin layer,
The external electrode is an electronic component according to claim 3, wherein the divided is the conductive resin layer and the same shape.   6. The electronic component according to claim 3, wherein the external electrode is electrically connected to the internal electrode through a through electrode penetrating the substrate. 6. The insulating resin layer has an opening on the through electrode;
The electronic component according to claim 6, wherein the through electrode and the conductive resin layer are electrically connected through the opening. The electronic component according to claim 7 , wherein the opening has a structure that opens a part of a side surface of the insulating resin layer.   The insulating resin layer has an opening on the through electrode and has a structure formed between the substrate and at least a peripheral portion facing the center of the substrate among the peripheral portions of the conductive resin layer. The electronic component according to claim 6, further comprising:   The insulating resin layer has an opening on the through electrode, and of the peripheral portion of the conductive resin layer, a peripheral portion facing the center of the substrate, and a peripheral portion facing the end portion of the substrate; The electronic component according to claim 9, further comprising a structure formed between the substrate and the substrate.   The electronic component according to claim 1, wherein the electronic element is a crystal vibrating piece. A substrate formed of a brittle material; an internal electrode disposed on a first surface of the substrate; an electronic element disposed on the internal electrode and hermetically sealed with a sealing material; and a first of the substrate In an electronic component provided with an external electrode that is installed on a surface opposite to the surface and electrically connected to the internal electrode,
The electronic component is provided with a laminated structure portion in which an insulating resin layer, a conductive resin layer, and an external electrode are laminated in this order on a surface opposite to the first surface of the substrate. An insulating resin layer forming step for forming an insulating resin layer on the substrate; a conductive resin layer forming step for forming a conductive resin layer on the insulating resin layer; an external electrode forming step for forming external electrodes on the conductive resin layer; Forming a laminated structure portion comprising:
Fixing an electronic element to a package having the substrate;
An electronic element connecting step of electrically connecting the external electrode and the electronic element;
The manufacturing method of the electronic component which has this.   The method for manufacturing an electronic component according to claim 13, wherein the insulating resin layer forming step and the conductive resin layer forming step use a screen printing method.   The method of manufacturing an electronic component according to claim 14, wherein in the electronic element connection step, the connection is made by a through electrode penetrating the substrate.   The method for manufacturing an electronic component according to claim 15, wherein the insulating resin layer forming step does not form the insulating resin layer on the through electrode. The step of forming the laminated structure part includes
Forming a first conductive resin layer on the through electrode;
Forming the insulating resin layer around the first conductive resin layer;
Forming a second conductive resin layer on the insulating resin layer;
The method of manufacturing an electronic component according to claim 16, comprising:   The method of manufacturing an electronic component according to claim 13, wherein the external electrode forming step uses electroless plating.   The method of manufacturing an electronic component according to claim 13, wherein the substrate and a lid for sealing the electronic element are joined by anodic bonding. Forming a large number of the electronic elements and a large number of the external electrodes on the substrate to form an electronic component;
Dividing the electronic component into pieces;
The method of manufacturing an electronic component according to claim 14, comprising:

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