JP6257150B2 - Electronic component package and method of manufacturing electronic component package - Google Patents

Description

  The present invention relates to an electronic component package represented by a quartz resonator piece and a piezoelectric element, and a method for manufacturing the electronic component package.

  Conventionally, crystal resonator pieces are excellent in frequency characteristics, and thus are frequently used as devices, specifically, printed circuit board mounting components. Similarly, piezoelectric elements are often used as acceleration sensors. However, in order to stabilize the characteristics of these electronic components (quartz crystal piece and piezoelectric element), it is desirable to put them in a sealed container to block the influence of outside air. Furthermore, since recent electronic devices are required to be downsized and integrated, it is necessary to package these electronic components at the wafer level and then separate them as necessary. As an example of such a packaging technique, a technique has been proposed in which an electronic component is sealed by bonding a glass substrate on which the electronic component is placed and a glass having a storage unit for storing the electronic component (patent). Reference 1).

  Here, an outline of a conventional electronic component package will be described with reference to FIG. FIG. 8A is a bottom view of the electronic component package, and FIG. 8B is a longitudinal sectional view taken along the line AA in FIG. 8A. In the conventional electronic component package, the electronic component 10 is electrically connected to the through electrode via the connection electrode 112 on the first substrate 110 formed of glass and provided with one or more through electrodes 111. It is placed. In the electronic component package 100, a glass-made second substrate 120 having a storage portion 121 for covering the periphery of the electronic component 10 is bonded to the upper portion of the first substrate 110 to join the electronic component package 100. Is completed.

JP 2012-44105 A

  Incidentally, the above-described electronic component package has the following problems. When the electronic component package 100 is left in a humidity environment for a long time, components in the glass, such as Na and Ca, are deposited on the surface of the glass portion opposite to the surface on which the electronic component of the first substrate 110 is placed. And since they are deliquescent by moisture in the atmosphere and have conductivity, the insulation between the through electrodes is deteriorated, and each through electrode becomes conductive and a short circuit occurs. As a result, the long-term reliability of the package is impaired. The present invention provides an electronic component package with improved long-term reliability and a method for manufacturing the electronic component package.

In order to solve the above-described problems, the present invention provides the following means.
The invention according to claim 1 is a first substrate formed of glass containing at least one of Na and Ca as a component, a plurality of through electrodes penetrating the first substrate, the through electrodes and the electrical A connection electrode connected to the first substrate, a second substrate bonded to the first substrate to form a storage portion between the first substrate, and sealed in the storage portion, and on the connection electrode In the electronic component package comprising the electronic component mounted on the first substrate, at least one of Na and Ca formed on the surface opposite to the storage portion side surface of the first substrate is not included as a component, In addition, an insulating protective film made of silicon oxide that does not form glass is provided, and the protective film divides a region including an end face of each through electrode in the first substrate.
Thereby, even when the electronic component package is placed in a humidity environment, precipitation of glass-containing components such as Na and Ca from the portion where the protective film is formed can be prevented. At this time, since the protective film divides the region including the end face of the through electrode, insulation between the plurality of through electrodes can be ensured. Thereby, the reliability of the package can be improved.

  A second aspect of the present invention is the electronic component package according to the first aspect, wherein the protective film surrounds an outer peripheral edge of an end surface of the through electrode on the opposite surface, and each of the through electrodes It is characterized by being formed between the end surfaces.

The invention according to claim 3 is the electronic component package according to claim 2, wherein the protective film is formed in the vicinity of an end face of the through electrode, and the through electrode of the protective film is formed from the end face of the through electrode. And a conductive electrode film formed so as to cover a portion formed in the vicinity of the end face.
Thus, the electrode film ensures the conduction of the through electrode and covers the first substrate exposed near the end face of the through electrode. Therefore, it is possible to prevent deterioration of the boundary portion between the through electrode and the first substrate on the surface opposite to the surface on the storage portion side of the first substrate, and improve durability.

  A fourth aspect of the present invention is the electronic component package according to the first aspect, wherein the protective film connects a surface on the storage portion side of the first substrate and a surface on the opposite side. Continuous from one end of the side surface of the side surface of the plurality of side surfaces to the end of the other side surface on the storage portion side through between the end surfaces of the through electrodes of the opposite surface. It is characterized by being formed.

  A fifth aspect of the present invention is the electronic component package according to the first aspect, wherein a bonding film formed of a metal film is disposed between the first substrate and the second substrate, and the first substrate The one substrate and the second substrate are bonded via the bonding film, and the protective film is further formed on the bonding film and covers the bonding film.

The invention according to claim 6 is the electronic component package according to claim 1, wherein the through electrode and the connection electrode are made of the same material.
The invention according to claim 7 is the electronic component package according to claim 1, wherein the second substrate is made of glass.
The invention according to claim 8 is the electronic component package according to claim 1, wherein the electronic component is a crystal vibrating piece.

The invention according to claim 9 is the method of manufacturing an electronic component package, wherein a plurality of through electrodes penetrating the first substrate are formed on a first substrate formed of glass containing at least one of Na and Ca as a component. A through electrode forming step to be formed; a connection electrode forming step of forming a connection electrode electrically connected to the through electrode; an electronic component mounting step of mounting an electronic component on the connection electrode; and a second substrate And bonding the first substrate, forming a storage portion on the first substrate and the second substrate, and sealing the electronic component in the storage portion, and the first substrate, respectively An insulating protective film made of silicon oxide that divides the region including the end face of the through electrode and does not contain both Na and Ca as components and does not form glass is at least stored in the first substrate. Department side And a protective film forming step formed on the surface opposite to the surface.

  A tenth aspect of the present invention is the electronic component package manufacturing method according to the ninth aspect, wherein, in the protective film forming step, the protective film is formed in the vicinity of an end surface of the through electrode, and the through hole is formed. An electrode film forming step of forming a conductive electrode film covering from the end face of the electrode to a portion formed in the vicinity of the end face of the through electrode of the protective film is provided.

Invention of Claim 11 is a manufacturing method of the electronic component package of Claim 9 or 10, Comprising: The said penetration electrode formation process and the said connection electrode formation process are performed by the same process. .
Thereby, a manufacturing process can be simplified by providing the process which forms a penetration electrode and a connection electrode simultaneously in a 1st board | substrate.

  According to the present invention, precipitation of glass-containing components such as Na and Ca from the portion where the protective film is formed can be prevented even when the electronic component package is placed in a humidity environment. At this time, since the protective film divides the region including the end face of the through electrode, insulation between the plurality of through electrodes can be ensured. Thereby, the reliability of the package can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is the figure which showed typically the electronic component package board | substrate in 1st Embodiment of this invention, (a) is the top view seen from the 1st board | substrate side, (b) is the AA sectional line shown to (a) It is a longitudinal cross-sectional view along line. It is the figure which showed typically the electronic component package board | substrate in the modification of 1st Embodiment of this invention, (a) is the top view seen from the 1st board | substrate side, (b) is A-A shown to (a). It is a longitudinal cross-sectional view along A sectional line. It is the figure which showed typically the electronic component package board | substrate in the modification of 1st Embodiment of this invention, (a) is the top view seen from the 1st board | substrate side, (b) is a side view. It is the figure which showed typically the electronic component package board | substrate in 2nd Embodiment of this invention, (a) is the top view seen from the 1st board | substrate side, (b) is the AA sectional line shown to (a) It is a longitudinal cross-sectional view along line. It is the figure which showed typically the electronic component package board | substrate in 3rd Embodiment of this invention, (a) is the top view seen from the 1st board | substrate side, (b) is the AA sectional line shown to (a) It is a longitudinal cross-sectional view along line. It is the figure which showed typically the manufacturing process of the 1st board | substrate 110 in 1st Embodiment of this invention, (a) is the top view seen from the 1st board | substrate side, (b) is A shown to (a). -It is a longitudinal cross-sectional view along A sectional line. It is the figure which showed typically the mounting process of the electronic component 10 in the 1st board | substrate 110 in 1st Embodiment of this invention, (a) is the top view seen from the 1st board | substrate side, (b) is ( It is a longitudinal cross-sectional view along the AA cross section line shown to a). It is the figure which showed the conventional electronic component package typically, (a) is the top view seen from the 1st board | substrate side, (b) is a longitudinal cross-sectional view along the AA sectional line shown to (a). is there.

(First embodiment)
Hereinafter, a first embodiment of an electronic component package according to the present invention will be described with reference to FIG. Here, FIG. 1A is a plan view of the electronic component package 100 on which the electronic component 10 is mounted as viewed from the first substrate 110 side, and FIG. It is a longitudinal cross-sectional view along A sectional line.

  The electronic component package 100 includes a first substrate 110 made of glass, a plurality of through electrodes 111 that penetrate the first substrate 110, a connection electrode 112 that is electrically connected to the through electrodes 111, a first A second substrate 120 that forms a housing portion 121 between the substrate 110 and the first glass substrate, and an electronic component that is placed in the housing portion 121 and placed on the connection electrode 112 10. In addition, the electronic component package 100 includes an insulating protective film 200 formed on the surface opposite to the surface on the storage unit 121 side of the first substrate 110. The first substrate 110 has an insulating property, and is formed of, for example, soda lime glass or Tempax glass. The electronic component 10 is, for example, a crystal vibrating piece or a piezoelectric element having electrodes formed on the surface.

  The through electrode 111 has conductivity, and is formed of, for example, a conductive resin, a metal film, a metal pin, or the like. The through electrode 111 is an electrode that penetrates the first substrate 110 in the thickness direction. That is, the through electrode 111 penetrates from the surface on the storage unit 121 side of the first substrate 110 to the surface opposite to the surface on the storage unit 121 side. Further, the end surface of the through electrode 111 is exposed from the surface on the storage unit 121 side of the first substrate 110 and the surface opposite to the surface on the storage unit 121 side. In the present embodiment, two through electrodes 111 are arranged. Two or more through electrodes 111 may be arranged depending on the electronic component 121. The through electrode 111 electrically connects the electronic component 10 and an external electrode that is electrically connected to the outside (not shown).

  The connection electrode 112 is made of, for example, a metal film. The connection electrode 112 is disposed between the electronic component 10 and the through electrode 111 to electrically connect both. In the present embodiment, the connection electrode 112 is formed on the end surface of each through electrode 111 on the storage unit 121 side of the first substrate 110.

  The second substrate 120 is formed of various materials such as glass such as soda lime glass and Pyrex (registered trademark) glass, a semiconductor such as silicon, a ceramic such as alumina, a metal such as aluminum, or a resin. In the present embodiment, the second substrate 120 has a recess on the side to be joined to the first substrate 110.

  The storage unit 121 includes the recess and the first substrate. The storage unit 121 is a cavity hermetically sealed by the first substrate 110 and the second substrate 120. Note that the storage unit 121 is not limited to the present embodiment, and may be formed of the first substrate 110 and the second substrate 120 and store electronic components therein. For example, the storage unit 121 may be configured such that a recess is provided on the side of the first substrate 110 to be bonded to the second substrate 120 and the cavity is formed by the recess.

The protective film 200 surrounds the outer peripheral edge of the end surface of the through electrode 111 on the surface of the first substrate 110 opposite to the surface on the storage unit 121 side. Thereby, the protective film 200 is formed between the end faces of the respective through electrodes 111. That is, the protective film 200 divides the region including the end face of each through electrode 111 in the first substrate. In this case, each region includes the end face of one through electrode 111. The protective film 200 is an insulating film made of, for example, SiO _{2 or} an insulating resin.

  Thereby, even when the electronic component package 100 is placed in a humidity environment, Na, Ca, and the like from the portion where the protective film 200 on the surface opposite to the surface on the storage unit 121 side of the first substrate 110 is formed. Precipitation of glass-containing components can be prevented. At this time, since the protective film 200 divides the region including the end face of the through electrode 111, insulation between the plurality of through electrodes 111 can be ensured. Thereby, the reliability of the package can be improved. Note that the surface of the first substrate 110 on the side of the storage unit 121 is a cavity in which the storage unit 121 is hermetically sealed and is not in a humidity environment, and thus no glass-containing component is precipitated on this surface.

  In the present embodiment, the protective film 200 completely surrounds the outer peripheral edge along the outer peripheral edge of the end surface of each through electrode 111 on the surface opposite to the surface on the storage unit 121 side of the first substrate 110. Yes.

  In the present embodiment, the protective film 200 covers a region other than the end surface of the through electrode 110 and the vicinity of the through electrode 110 on the surface of the first substrate 110 opposite to the surface on the storage unit 121 side. Thereby, precipitation of a glass containing component can be prevented reliably. Note that the present invention is not limited to this embodiment, and a part of the surface of the first substrate 110 opposite to the surface on the storage unit 121 side may be covered so as to surround the outer peripheral edge of the end surface of the through electrode 111.

  FIG. 2 is a diagram illustrating a modification of the first embodiment. 2A is a plan view seen from the first substrate side, and FIG. 2B is a longitudinal sectional view taken along the line AA shown in FIG. 2A. The description of the same configuration as that of the electronic component package 100 according to the first embodiment is omitted.

  In FIG. 2, a plurality of protective films 200 are formed corresponding to the respective through electrodes 111. The protective film 200 completely surrounds the periphery of the outer peripheral edge along the outer peripheral edge of the end surface of the through electrode 111 on the surface opposite to the surface on the storage portion 121 side of the first substrate 110. Thereby, the protective film 200 is formed between the end faces of the respective through electrodes 111. That is, the protective film 200 divides the region including the end face of each through electrode 111 in the first substrate. In this case, each region includes the end face of one through electrode 111. Even in this case, even when the electronic component package 100 is placed in a humidity environment, the Na or Ca from the portion where the protective film 200 on the surface opposite to the surface on the storage portion 121 side of the first substrate 110 is formed. Precipitation of glass-containing components such as can be prevented. Therefore, since the protective film 200 divides the region including the end face of the through electrode 111, insulation between the plurality of through electrodes 111 can be ensured. Thereby, the reliability of the package can be improved.

  In the present embodiment, the same number of protective films 200 as the respective through electrodes 111 are formed. However, the present invention is not limited to this, and it is only necessary to divide the region including the end face of each through electrode 111. For example, one through electrode 111 among the plurality of through electrodes 111 may not be surrounded by the protective film.

  Further, the protective film 200 surrounds the outer peripheral edge at a position separated from the outer peripheral edge of the end face of the through electrode 111. For this reason, the first substrate 110 is exposed in the vicinity of the outer peripheral edge of the through electrode 111. As described above, when the protective film 200 and the outer peripheral edge of the end surface of the through electrode 111 are formed apart from each other, the through electrode 111 can be reliably exposed. Therefore, the electrical connection of the through electrode 1111 with an external electrode (not shown) can be ensured.

  However, the present invention is not limited to this, and the protective film 200 only needs to surround the outer peripheral edge of the end surface of the through electrode 111 in a state where the end surface of the through electrode 111 is exposed. For example, the protective film 200 may surround the outer periphery at a position adjacent to the through electrode 111. In this case, precipitation of the glass-containing component can be reliably prevented.

  FIG. 3 is a diagram illustrating a modification of the first embodiment. FIG. 3A is a plan view seen from the first substrate side, and FIG. 3B is a side view. The description of the same configuration as that of the electronic component package 100 according to the first embodiment is omitted.

  In FIG. 3, the protective film 200 is an end on the side of the storage unit 121 on one side among a plurality of side surfaces connecting the surface on the storage unit 121 side of the first substrate 110 and the surface opposite to this surface. To the end on the other side of the storage unit 121 through the end surface of each through electrode 111 on the surface opposite to the surface on the storage unit 121 side of the first substrate 110. Yes.

  In FIG. 3, the protective film 200 is continuous in a straight line with the side surface shown in FIG. 3B, the surface on the storage portion 121 side of the first substrate 110, and the side surface facing the side surface shown in FIG. Is formed. Thereby, the protective film 200 is formed between the end faces of the respective through electrodes 111. That is, the protective film 200 divides the region including the end face of each through electrode 111 in the first substrate. In this case, each region includes the end face of one through electrode 111. In the case of this modification, the region including the end face of each through electrode 111 is a region including up to the side surface of the first substrate 110.

  Even in this case, even when the electronic component package 100 is placed in a humidity environment, precipitation of glass-containing components such as Na and Ca from the portion where the protective film 200 is formed can be prevented. Therefore, since the protective film 200 divides the region including the end face of the through electrode 111, insulation between the plurality of through electrodes 111 can be ensured.

  Next, a method for manufacturing the electronic component package 100 of this embodiment will be described with reference to FIGS.

  The manufacturing method of the electronic component package 100 includes a through electrode forming step of forming a plurality of through electrodes 111 penetrating the first substrate 110 on the first substrate 110, and a connection electrode 112 electrically connected to the through electrodes 111. A connecting electrode forming step to be formed; an electronic component placing step of placing the electronic component 10 on the connecting electrode 112; and the second substrate 120 and the first substrate 110 are joined together, and the first substrate 110 and the first substrate 110 The storage portion 112 is formed on the second substrate 120, and the bonding step of sealing the electronic component 10 in the storage portion 112 and the insulating property of dividing the region including the end face of each through electrode 111 in the first substrate 110 are performed. And a protective film forming step of forming the protective film 200 on at least the surface of the first substrate 110 opposite to the surface on the storage unit side.

  First, a through electrode forming process is performed. A plurality of through electrodes 111 penetrating in the thickness direction is formed on the first substrate 110. Here, the through electrode 111 is formed by forming a through hole in the first substrate 110 by a processing method such as sand blasting, hot press processing, plasma dry etching, or wet etching, and then filling a conductive material or while heating. It can be produced by a method of inserting a pin-like conductive material.

  Next, a connection electrode formation process is performed. 6A and 6B are diagrams showing a connection electrode forming process, FIG. 6A is a plan view seen from the first substrate side, and FIG. 6B is a cross-sectional view taken along line AA shown in FIG. It is a longitudinal cross-sectional view along line.

  In this embodiment, the connection electrode 112 is disposed on the through electrode 111. The connection electrode 112 is formed by bump bonding. The connection electrode 112 is formed by forming a conductive film on the entire surface of the first substrate 110 on which the connection electrode is to be formed by a thin film forming method such as solder paste printing, sputtering, or vapor deposition, and then lift-off, photolithography, By combining processes such as wet etching and dry etching, the conductive film can be patterned and disposed. Further, the connection electrode 112 can be provided by patterning a conductive paste.

  Next, an electronic component placement step is performed. FIG. 7 is a view showing the electronic component placement step, FIG. 7 (a) is a plan view seen from the first substrate side, and FIG. 7 (b) is an A- It is a longitudinal cross-sectional view along A sectional line.

  The electronic component 10 and the connection electrode 112 are aligned to join the electronic component 10 to the connection electrode 112. As a result, the electronic component 10 is placed on the first substrate 110. As a joining method at this time, when a conductive paste is used for the connection electrode 112, there is a method of performing reflow after placing the electronic component 10 on the connection electrode 112. Further, there is a method of joining the electronic component 10 to the connection electrode 112 by flip chip bonding, thermocompression bonding process, or the like.

  Subsequently, a joining process is performed. First, a recess is formed in the second substrate. The concave portion can be formed by using a processing method such as etching, sand blasting or hot pressing.

  Next, as shown in FIG. 1, the second substrate 120 is overlaid on the surface of the first substrate 110 on the side where the electronic component 10 is mounted in a surrounding environment such as a vacuum, a nitrogen atmosphere, or the atmosphere. Close. In this state, the first substrate 110 and the second substrate 130 are bonded. As a bonding method at this time, methods such as anodic bonding, direct bonding, metal eutectic bonding, and thermocompression bonding can be used. The peripheral environment and the bonding method are selected according to the type of electronic component and the material of the second substrate. Further, the first substrate and the second substrate may be bonded via a bonding film (not shown) formed of a metal film. At this time, the bonding film is disposed on each bonding surface of the first substrate and the second substrate.

  Note that the second substrate 120 can be anodically bonded using the same glass as the first substrate 110. When the same material is used for the first substrate 110 and the second substrate 120, heat resistance and the like can be improved by matching the expansion coefficients of the materials.

  Next, a protective film forming step is performed. As shown in FIG. 1, an insulating protective film 200 is formed on the surface of the first substrate 110 opposite to the surface on the storage unit side. At this time, the protective film 200 divides the region including the end face of each through electrode 111 in the first substrate 110. The protective film 200 is formed by a thin film deposition method such as CVD or sputtering, and after an insulating film is formed on the entire surface of the first substrate 110 opposite to the storage portion side, patterning is performed using a combination of photolithography and etching. Form. Further, after forming a photoresist in a region where the protective film 200 including the end face of the through electrode 111 is not formed, an insulating film is formed by the above-described film forming method, and the photoresist and the insulating film on the photoresist are removed. The protective film 200 can be formed using liftoff or the like.

  In this way, the electronic component package 100 can be manufactured. Note that, after the protective film forming step, an external electrode that is electrically connected to the end surface exposed on the surface of the through electrode 111 opposite to the surface on the housing portion side of the first substrate 110 may be formed.

(Second Embodiment)
The electronic component package of 2nd Embodiment concerning this invention is demonstrated using FIG. FIG. 4A is a plan view seen from the first substrate side, and FIG. 4B is a longitudinal sectional view taken along the line AA shown in FIG. The description of the same configuration as that of the electronic component package 100 according to the first embodiment is omitted.

In the present embodiment, a bonding film (not shown) formed of a metal film is disposed between the first substrate 110 and the second substrate 120. The first substrate 110 and the second substrate 120 are bonded via the bonding film.
For the bonding film, in addition to aluminum, silicon, chromium, another conductive material, or a composite containing any of these materials can be used.

  Further, as shown in FIG. 4, the protective film 200 is formed on the bonding film in addition to the region where the protective film 200 of FIG. 1 is formed, and covers the bonding film. In the present embodiment, the entire side surfaces of the first substrate 110 and the second substrate 120 are covered. In this case, it is not necessary to pattern the protective film 200 on the side surface, so that the protective film 200 can be easily formed. However, the present invention is not limited to this embodiment, and the protective film 200 may be formed so as to cover the bonding film in addition to the formation region of the first embodiment. For example, when aluminum is used for the bonding film, the bonding film reacts with moisture from a portion exposed on the outer surface and corrodes. At this time, the airtightness of the storage unit 121 is deteriorated. According to the present embodiment, since the bonding film is not exposed to the outer surface, corrosion of the bonding film can be prevented.

(Third embodiment)
An electronic component package according to a third embodiment of the present invention will be described with reference to FIG. 5A is a plan view seen from the first substrate side, and FIG. 5B is a longitudinal sectional view taken along the line AA shown in FIG. 5A. The description of the same configuration as that of the electronic component package 100 according to the first embodiment is omitted. In the present embodiment, the protective film 200 is formed in the vicinity of the end face of the through electrode 111 as in FIG.

  In addition, a conductive electrode film 113 is formed so as to cover from the end surface of the through electrode 111 to a portion formed in the vicinity of the end surface of the through electrode 111 of the protective film 200. As the material of the electrode film 113, the same material as that of the connection film 112 can be used.

  Thereby, the electrode film 113 secures the conduction of the through electrode 111 and covers the first substrate exposed in the vicinity of the end face of the through electrode 111. Therefore, it is possible to prevent deterioration of the boundary portion between the through electrode 111 and the first substrate 110 on the surface opposite to the surface on the storage portion side of the first substrate 110 and improve durability.

  Here, a method for manufacturing the electronic component package 100 according to the third embodiment will be described. The process up to the protective film forming process is the same as that of the first embodiment.

After the protective film forming step, an electrode film forming step is performed. In this embodiment, after forming the protective film 200, the electrode film 113 made of a conductive metal or the like is formed. The electrode film 113 is formed by bump bonding. Further, the connection electrode 112 is formed by forming a conductive film on the surface of the first substrate 110 on which the protective film 200 is formed and on the entire surface of the protective film 200 by a thin film forming method such as solder paste printing, sputtering, or vapor deposition. By combining processes such as lift-off, photolithography, wet etching, and dry etching, the conductive film can be patterned and disposed. Further, the electrode film 113 can be provided by patterning a conductive paste. The electrode film 113 can be disposed by using a method such as electroless plating.
In addition, the manufacturing method of the electronic component 100 is not limited to each embodiment.

  For example, the through electrode formation step and the connection electrode formation step may be performed in the same step. In this case, the conductive material can be filled in the through hole of the first substrate, and the conductive material can be used to cover the through hole on the surface of the first substrate to the portion where the peripheral connection electrode is formed. . Alternatively, a conductive film may be formed on the surface of the through hole of the first substrate and the surface on which the connection electrode is formed, and then a plated film may be formed on the conductive film by electrolytic plating or electroless plating. At this time, the plating film fills the through hole and can form the connection electrode simultaneously with the formation of the through electrode. Thereby, the manufacturing process can be simplified. In this case, the through electrode and the connection electrode are formed of the same material.

DESCRIPTION OF SYMBOLS 10 Electronic component 100 Electronic component package 110 1st board | substrate 111 Through electrode 112 Connection electrode 113 Electrode film | membrane 120 2nd board | substrate 121 Storage part 200 Protective film

Claims (4)

A first substrate formed of glass containing at least one of Na and Ca as a component; a plurality of through electrodes penetrating the first substrate; a connection electrode electrically connected to the through electrode; A second substrate that is bonded to the first substrate to form a storage portion between the first substrate, an electronic component that is sealed in the storage portion and placed on the connection electrode; In an electronic component package comprising:
At least the surface of the first substrate opposite to the surface on the storage unit side has an insulating protective film made of silicon oxide that does not contain Na and Ca as components and is not formed of glass,
The protective film divides a region including an end face of each through electrode in the first substrate ,
A bonding film formed of a metal film is disposed between the first substrate and the second substrate, and the first substrate and the second substrate are bonded via the bonding film,
The electronic component package , wherein the protective film is further formed on the bonding film and covers the bonding film . The electronic component package according to claim 1,
The electronic component package, wherein the through electrode and the connection electrode are made of the same material. The electronic component package according to claim 1,
The electronic component package, wherein the second substrate is made of glass. The electronic component package according to claim 1,
The electronic component package is a crystal vibrating piece.

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