JP2011210906A - Electronic component and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a mounting reliability of an airtight sealing type surface-mount component package having a through-hole electrode to a circuit board.SOLUTION: The through-hole electrode as an ejecting electrode connected to an internal electrode 6 is formed by the structure in which an inorganic substance layer is formed at an internal electrode side of the through-hole formed in a substrate and a conductive resin layer is formed on it doubling as a foundation of an external electrode.

Description

  The present invention relates to an electronic component having a package having a structure in which an internal electrode and an external electrode are connected by a through electrode as a constituent member, and a manufacturing method thereof.

Electronic parts such as crystal resonators are used as reference oscillation sources for electronic devices and clock sources for microcomputers.
This crystal resonator is configured by enclosing a crystal resonator element in a small surface-mount package that is hermetically sealed in a hollow and vacuum.
A conventional surface-mounting package in which a metal lid is bonded to a ceramic or glass container is known as a conventional small-sized surface-mounting package that is hermetically sealed.

FIG. 8 is a sectional view of a crystal resonator using such a package.
In this figure, a crystal resonator is connected to a circuit board with solder.
A glass or metal lid 2 is bonded to a ceramic or glass substrate 1 with a bonding material 3, and the external electrode 4 and the internal electrode 6 are connected by a through electrode 5. A crystal vibrating piece 8 is connected to the internal electrode 6 by a connecting material 7.

The external electrode has a structure such that a thick conductive paste using glass frit as a binder or a sputtered metal film is used as a base and Ni and Sn plating is formed thereon.
Such a crystal resonator is connected and fixed to the land 10 of the circuit board 11 by the solder 9 and mounted.
Such a surface-mount type crystal resonator is extremely miniaturized. Therefore, the thickness of the substrate 1 is 0.5 mm to 0.2 mm.

Such a through electrode is formed by filling and sealing the through hole with a conductive substance.
Since the quartz oscillator is required to be vacuum sealed, the material filled in the through-hole is required to have a low gas emission and a small gas permeation in a vacuum. (Airtight sealing)
Therefore, the filling of the through-holes is a metal and low-melting-point glass that is conductive and has a high confidentiality and vacuum-sealing ability, formed by sputtering or plating, embedded in a molten state, or embedded in thin metal wires with low-melting-point glass. It was carried out by a method using an inorganic material such as encapsulating a conductive paste mixed with. (Patent Document 1)

JP 2009-88865 A

  Sputtering, plating, or filling metal in a molten state, filling the through hole is extremely unproductive because the depth to be filled is as thick as several hundred μm, and requires metallization of the substrate, or low melting point glass However, there is a drawback in that an organic substance called a vehicle is mixed to reduce the volume and require repeated filling.

In the present invention, the following means are used to solve the above problems.
An electronic component according to the present invention includes a substrate, a lid that is installed on the first surface of the substrate and forms a cavity portion that is blocked from outside air between the first surface, and the first portion of the cavity portion. An internal electrode installed on one surface, an electronic element provided in the cavity and electrically connected to the internal electrode, and provided on a surface opposite to the first surface, electrically connected to the internal electrode And an external electrode connected to the substrate, wherein the substrate includes a through-hole penetrating from the first surface toward a surface opposite to the first surface, and a through-electrode provided in the through-hole. And the through electrode is electrically connected to the internal electrode and the external electrode, and extends from the first surface toward the surface opposite to the first surface, an inorganic material layer, a conductive resin layer It has the double filling sealing structure formed in this order.

  According to the present invention, the inorganic material mainly fulfills the role of hermetic sealing or vacuum sealing by sealing the through hole forming the through electrode with a double filling and sealing with the inorganic material and the conductive resin. Therefore, the structure can be such that the conductive resin fills and fills the through hole sealing, and therefore, the through hole of the hermetically sealed surface mount package can be easily filled using the conductive resin.

The through hole has a shape that extends from the first surface toward a surface opposite to the first surface.
According to the present invention, by forming the through hole from the inside of the package to the outside, the conductive resin layer easily enters the through hole forming the through electrode, which is convenient for filling by printing.

Further, the inorganic material layer is composed of a thin metal wire provided in the through hole and glass filled in the through hole.
The inorganic material layer is characterized in that the through hole is filled with a thick film conductive paste.
The inorganic material layer may be composed of a metal layer or an alloy layer formed in the through hole.

The conductive resin layer is formed from the inside of the through hole to the surface opposite to the first surface, and the external electrode is formed on the surface opposite to the first surface. It is provided on a surface opposite to the first surface through a layer.
In the conductive resin layer, a portion formed on a surface opposite to the first surface has a thickness of 10 μm to 50 μm.

Further, the external electrode is made of a metal or an alloy.
Further, the substrate is made of glass.
The lid is made of glass and is anodic bonded to the substrate.
In addition, the electronic component of the present invention can be used for a crystal resonator in which the electronic element is a crystal resonator element.

  The method of manufacturing an electronic component according to the present invention includes an inorganic substance on the first surface side of a through-hole penetrating from a first surface of the substrate formed on the substrate toward a surface opposite to the first surface. A step of filling a layer, a step of forming an internal electrode on the surface of the inorganic material layer on the first surface side, and a step of providing an electronic element on the surface of the internal electrode opposite to the surface in contact with the inorganic material layer And a step of providing a lid on the first surface, and forming a cavity portion that is shielded from outside air between the lid and the portion of the first surface where the electronic element is provided, and the inorganic substance layer Forming a conductive resin layer from a surface opposite to the first surface to a surface opposite to the first surface; and the conductive resin layer on a surface opposite to the first surface; Forming an external electrode to be electrically connected.

Further, the step of filling the inorganic material layer is characterized in that a metal fine wire is provided in the through hole, and the through hole is filled with glass and fired.
The step of filling the inorganic material layer is characterized in that the through hole is filled with a thick film conductive paste and fired.
The step of filling the inorganic material layer is characterized in that a metal layer or an alloy layer is formed in the through hole.

The step of forming the conductive resin layer is characterized in that the conductive resin layer is formed by any one of printing, dispenser, inkjet, and transfer.
Further, the step of forming the conductive resin layer is a step of forming the conductive resin layer from the inside of the through hole to the surface opposite to the first surface, and the step of forming the external electrode includes the step of forming the external electrode. An external electrode is formed on the surface opposite to the first surface through the conductive resin layer formed on the surface opposite to the first surface.

The step of forming the conductive resin layer includes a first conductive resin formation step of filling the through hole with the conductive resin layer, and forming the conductive resin layer on a surface opposite to the first surface. And a second conductive resin forming step.
In the step of forming the conductive resin layer, the printing is a screen printing method.

  According to the present invention, the inorganic material mainly fulfills the role of hermetic sealing or vacuum sealing by sealing the through hole forming the through electrode with a double filling and sealing with the inorganic material and the conductive resin. Therefore, the structure can be such that the conductive resin fills and fills the through hole sealing, and therefore, the through hole of the hermetically sealed surface mount package can be easily filled using the conductive resin.

It is a figure which shows the cross section of the electronic component of the electronic component which concerns on this invention, and the periphery of the penetration electrode of an electronic component. It is sectional drawing of the periphery of the penetration electrode of the electronic component which concerns on this invention. It is sectional drawing of the periphery of the penetration electrode of the electronic component which concerns on this invention. It is a figure which shows the manufacturing method of the penetration electrode of the electronic component which concerns on this invention. It is sectional drawing of the periphery of the penetration electrode of the electronic component which concerns on this invention. It is a top view of the state which formed the conductive resin layer of the electronic component which concerns on this invention. It is a figure explaining the method to collectively form the electronic component which concerns on this invention. It is sectional drawing of the electronic component of a prior art example.

Hereinafter, an electronic component according to the present invention will be described with reference to FIGS.
FIG. 1A is a cross-sectional view of an electronic component according to the present invention.
An electronic component according to the present invention is provided on a substrate 1, a first surface of the substrate 1, a lid 2 that forms a hollow portion that is blocked from outside air between the first surface, and a first hollow portion. The internal electrode 6 installed on the surface of the substrate, the electronic element 8 provided in the cavity and electrically connected to the internal electrode, and provided on the surface opposite to the first surface and electrically connected to the internal electrode 6 The external electrode 15 is provided. Here, the first surface of the substrate is a surface inside the package constituted by the substrate and the lid, and the surface opposite to the first surface is a surface outside the package.

  The electronic component according to the present invention is connected and fixed to the land 10 of the circuit board 11 by the solder 9 and mounted.

The substrate 1 is made of ceramic, silicon, other inorganic single crystals, glass or the like. The lid 2 is made of ceramic, silicon or other inorganic single crystal, glass, metal, alloy or the like. The package composed of the substrate 1 and the lid 2 has a hollow structure. When the substrate 1 and the lid 2 are made of glass, the bonding to the substrate 1 can be performed by anodic bonding or using Au-20 wt% Sn solder as a bonding material, using glass paste, brazing, or the like. .
Hereinafter, glass will be mainly described as an example of the substrate 1, but other materials are similarly applied unless otherwise specified.

To form a recess for forming a space in the package, use glass press molding, use etching, use sand blasting, form a sidewall by a thick film method, join a glass preform as a sidewall, etc. There is a way.
The use of a thin soda glass manufactured by the float process for the thin glass sheet for the substrate or the lid can reduce the cost.
The float method makes it easy to produce a thin soda glass with good smoothness.

  This soda glass has good polishing properties, and a smooth thin glass plate having a thickness of 0.5 mm to 0.2 mm can be obtained relatively easily. When the electronic component is a crystal resonator, soda glass has a thermal expansion coefficient close to that of the crystal resonator and is advantageous in terms of vibration characteristics.

The electric element 8 and the internal electrode 6 are connected via a connecting material 7. It is possible to use an organic conductive adhesive as the connecting material 7, use Au-20 wt% Sn or other high-temperature solder, or use ultrasonic bonding by Au bumps.
The substrate 1 has a through hole 12 that penetrates from the first surface toward the surface opposite to the first surface, and a through electrode provided in the through hole 12. This will be described below with reference to FIG.

FIG. 1B is a cross-sectional view around the through electrode of the electronic component according to the present invention.
The through electrode is electrically connected to the internal electrode 6 and the external electrode 15 and is formed in the order of the inorganic material layer 13 and the conductive resin layer 14 from the first surface of the substrate toward the surface opposite to the first surface. The double filling and sealing structure is provided.

  As a material of the inorganic substance layer 13, a metal and an alloy such as Ag or AgPd can be used. In this case, a metal such as a solder such as a low melting point alloy or plating can be used. Further, it is also possible to use a material obtained by filling and baking a thick film conductive paste made of glass / frit such as lead-free low melting point glass / frit. The use of a thick film conductive paste in which metal powder and lead-free low-melting glass are mixed is advantageous because the thermal expansion coefficient with the substrate can be easily adjusted. Here, the low melting point glass means a glass having a working temperature at which a soda glass as a substrate is not deformed and having a softening point of about 600 ° C. or less. In addition to the low melting point glass, other glass can be used as long as it has a working temperature that does not deform the substrate.

  As a material for the conductive resin layer 14, an epoxy resin, a phenol resin, a polyimide resin, a polyamideimide resin, a polyallyl ether resin, a cyanate resin, or a resin obtained by modifying them as a main component can be used. In this case, Ag, Ag alloy, Ag-coated Cu, Cu, Ag and Cu, Ag and Ni mixed filler, etc. can be used as the conductive filler.

  Forming the inorganic material layer 13 on the first surface side of the substrate, that is, the inside of the package is indispensable for vacuum sealing and hermetic sealing, but the workability of filling the through holes is poor. On the other hand, the conductive resin layer 14 can be easily filled, but has no vacuum sealing or hermetic sealing. Therefore, in the present invention, the inorganic material layer 13 having conductivity is formed on the inside of the package of the through hole 12, and then the conductive resin layer 14 is formed on the outside of the package of the through hole. This is very effective with respect to the compatibility between the hermetic sealing performance when performing vacuum sealing or the like and the workability of filling and sealing through holes. In particular, it is very effective in a surface-mount package that requires airtight sealing such as vacuum sealing such as a crystal resonator.

  On the portion of the conductive resin layer 14 formed on the surface opposite to the first surface of the substrate, the external electrode 15 is formed mainly for soldering. In this case, the conductive resin layer 14 is formed as a base of the external electrode 15.

  The external electrode 15 is made of metal. The external electrode 15 can be formed by sputtering or the like, and in some cases, plating can be further formed thereon. However, since the plating can be directly formed on the conductive resin, it is preferably formed by direct plating on the conductive resin. .

As the plating, the base is Ni or Cu, and Au, Sn or the like can be used as the protective layer, but electroless plating is more preferable.
As the electroless plating, there is a method in which an electroless plating of Ni-P or Ni-B is formed on a conductive resin and then Au or the like is formed as a protective layer by displacement plating.

  When the conductive resin containing Ag or the like is exposed, ion migration occurs. By covering this with plating, the occurrence of ion migration can be suppressed.

  Further, the thickness (t in FIG. 1) of the conductive resin layer 14 as a base on the substrate 1 on the surface opposite to the first surface of the substrate is set to 10 μm to 50 μm. In printing in which the thickness of the conductive resin layer 14 is 10 μm or less, the through holes 12 cannot be sufficiently filled, pinholes are generated, the thickness is small, and the stress relaxation effect against deformation becomes insufficient. On the other hand, when the thickness exceeds 50 μm, there is a problem that the plating formability is deteriorated due to separation of the resin and metal particles in the conductive resin, the total package thickness is increased, or the strength of the resin itself is decreased. Therefore, the thickness of the conductive resin layer 14 is preferably 10 μm to 50 μm.

FIG. 2 is a view showing another form around the through electrode of the electronic component according to the present invention.
In FIG. 1, the external electrode on the through electrode is formed. However, in the electronic component shown in FIG. 2, the external wiring 20 is formed and the external electrode 4 is formed at a position different from the through hole 12. That is, the conductive resin layer 16 is not used as a base for forming the external electrode. In this case, it is possible to cope with the ion migration countermeasure of Ag by coating or the like.

FIG. 3 is a diagram showing another form around the through electrode of the electronic component according to the present invention.
In the electronic component shown in FIG. 3, the inorganic material layer is composed of the fine metal wires 21 provided in the through holes 12 and the glass 20 filled in the through holes 12. That is, the through electrode formed in the through hole 12 is an example of a structure in which the fine metal wire 21 is sealed with the glass 20 and the conductive resin layer 14. In this case, for example, lead-free low-melting glass can be used for the glass 20.

  In this example, the through-hole extends from the inside of the package to the outside, that is, from the first surface to the surface opposite to the first surface in a squirrel-like manner. Thus, by making the through-hole 12 wide from the inside to the outside of the package, the conductive resin layer can easily enter the through-hole forming the through-electrode, which is convenient for filling with printing.

A method for manufacturing an electronic component according to the present invention will be described below.
In the electronic component according to the present invention, first, an inorganic material layer is filled on the first surface side of the through hole penetrating from the first surface formed on the substrate toward the surface opposite to the first surface. I do.
As a method for filling the inorganic substance layer, there is a method in which a fine metal wire is installed inside the through hole, and the through hole is filled with glass and fired. Thus, electrical conduction is made to the inorganic material layer.

As another method of filling the inorganic material layer, there is a method of filling the through hole with a thick film conductive paste and baking it.
As another method for filling the inorganic material layer, a metal layer or an alloy layer is formed in the through hole. As a method for forming the metal layer or the alloy layer, there is plating or the like. In this case, it is necessary to form a plating catalyst on the side surface of the through hole.

  Next, a step of forming an internal electrode on the surface of the inorganic material layer on the first surface side of the substrate is performed. The internal electrode can be formed by plating, sputtering, or the like.

  Next, a step of providing an electronic element on the surface opposite to the surface in contact with the inorganic material layer of the internal electrode is performed. The electronic element uses an organic conductive adhesive as the connecting material 7, uses Au-20 wt% Sn or other high-temperature solder, uses ultrasonic bonding with Au bumps, or connects with internal electrodes by bumps. Connecting.

  Thereafter, a lid is provided on the first surface of the substrate, and a step of forming a cavity portion that is shielded from outside air between the lid and the portion on the first surface where the electronic elements are provided is performed. In this step, when the substrate and the lid are made of glass, the bonding to the substrate can be performed by anodic bonding or by using Au-20 wt% Sn solder as a bonding material, using glass paste, brazing, or the like. When the lid is made of metal, it can be joined by welding or the like.

The process after installing the lid will be described with reference to FIGS.
FIG. 4 is a diagram showing a method for manufacturing a through electrode of an electronic component according to the present invention.
In FIG. 4A, an inorganic material layer 13 for vacuum sealing is formed on the first surface side of the substrate, that is, on the package inner side, in the through hole 12 after the bonding process between the substrate and the lid is performed. A substrate 1 is shown.

FIG. 4B is a diagram showing a first conductive resin forming step for forming a conductive resin inside the through hole. In this step, the conductive resin layer 16 is filled in the through hole 12 in which the inorganic material layer 13 is formed by a printing method.
The first printing for filling the through holes 12 can be performed by a dispenser, ink jet, transfer, or the like, but the screen printing method is efficient.

  When the depth that must be filled is deep, increase the filling amount by using an opening mask such as a metal mask or a 3D screen mask that can increase the printing thickness by bending one weaving yarn deeply. It is preferable. However, if the depth to be filled is shallow, printing with a normal mesh mask is also possible.

  FIG. 4C shows a first example in which a conductive resin layer is formed on the surface opposite to the first surface of the substrate 1, that is, on the surface outside the package and on the conductive resin layer 16 formed in the first conductive resin formation step. It is a figure which shows the 2 conductive resin formation process. In this step, the conductive resin layer 14 serving as a base for the external electrode is printed on the substrate and the conductive resin layer 16 formed in the first conductive resin formation step. In this second printing, the conductive resin layer 16 formed in the first conductive resin formation step and the conductive resin layer 14 formed in the second conductive resin formation step are integrated.

  The second conductive resin forming step may be a normal mesh screen mask. Also, the conductive resin layer 16 filling the inside of the first conductive resin forming step and the conductive resin layer 14 serving as the base of the external electrode of the second conductive resin forming step may be different materials. For example, the first conductive resin forming step can be a conductive resin containing Cu, and the second conductive resin forming step can be a conductive resin containing Ag. In this case, since the conductive resin containing Cu is sealed, a problem such as oxidation of Cu does not occur, and the cost can be reduced. Note that, depending on the depth of the through-hole, etc., it may be formed up to a portion serving as a base of the external electrode by only one conductive resin forming step.

  When the conductive resin layer is formed on the through electrode as the base of the external electrode, the unevenness of the conductive resin layer accompanying the filling of the conductive resin into the through hole can be flattened by the base formation printing in the second conductive resin forming step. Have advantages. Furthermore, since plating can be directly formed on the conductive resin, external electrode formation is facilitated.

  FIG. 5 is a cross-sectional view showing another form around the through electrode after the step corresponding to FIG. When the thick film conductive paste is filled as the inorganic material layer, the center is depressed. This facilitates filling of the conductive resin layer.

FIG. 6 is a top view showing a state after the first conductive resin forming step of the conductive resin.
Since the opening mask and the 3D screen mask are inferior in printing accuracy, it is preferable that the opening mask and the 3D screen mask be smaller than the conductive resin layer as the base of the external electrode formed in the second conductive resin formation step.
FIG. 6A is a diagram illustrating a case where the conductive resin layer 16 has substantially the same shape as the through hole 12.
FIG. 6B is a diagram illustrating a case where the conductive resin layer 16 has a slightly larger shape than the through hole 12.
FIG. 6C is a diagram in which the printing portion of the conductive resin layer 16 of one through hole 12 is divided into two. This is a case where bubbles are easily removed.
The shape may be smaller than the through hole depending on the depth to be sealed.

  The printing as shown in FIGS. 6A and 6B can be performed by a dispenser, ink jet, transfer, etc., in addition to the screen printing method. Further, as shown in FIG. 6C, when a dispenser, inkjet, transfer, or the like is used for the conductive resin layer 16 in which the printing portion is divided in two, printing is preferably performed in two separate steps.

  Then, the process of forming the external electrode electrically connected to the conductive resin layer on the surface opposite to the first surface of the substrate is performed. In the present invention, the external electrode is formed by plating or the like after the conductive resin layer as a base is formed. As the plating, the base is Ni or Cu, and Au, Sn or the like can be used as the protective layer, but electroless plating is more preferable. As the electroless plating, there is a method in which an electroless plating of Ni-P or Ni-B is formed on a conductive resin and then Au or the like is formed as a protective layer by displacement plating.

  In the case of packaging electronic components according to the present invention, when glass is used as a substrate, a large number of electronic components are formed on one large glass substrate, and external electrodes corresponding to the respective electronic components are collectively formed. It is very effective for an extremely mass-produced method of cutting a glass substrate into individual electronic parts.

FIG. 7 shows a batch forming method of the electronic component of the present invention on the substrate.
First, as shown in FIG. 7A, a large number of packaged electronic components 18 are formed on a single large glass substrate 17.
Next, as shown in FIG. 7B, the electronic parts 19 are separated into individual pieces by cutting.
In such a method in which a large number of electronic components are collectively formed with one large glass substrate, the screen printing method of the conductive resin layer on a flat substrate is extremely excellent in productivity.

  Furthermore, anodic bonding of a glass substrate and a lid formed of glass and electroless plating of each electrode are extremely effective for a manufacturing method in which packaging is performed on a large substrate such as glass and separated into pieces.

  Electrolytic plating by barrel plating is used to form external electrodes of electronic components such as resistors and capacitors by plating. In the present invention, after forming the conductive resin layer, the external electrodes can be formed by barrel plating.

  However, it is made of a particularly fragile material such as glass or silicon, and a large number of electronic components are formed on a single substrate and then cut into final components. Electroless plating is convenient for forming plating on a substrate without power supply wiring.

  In the above description, a quartz crystal resonator including a crystal resonator element as an electronic component is taken as an example. However, semiconductors such as SAW filters, light receiving and light emitting devices, IC chips, acceleration sensors, pressure sensors, other MEMS sensors, and optical components Of course, the present invention can also be applied to a surface mount package or the like in which an electronic device composed of a plurality of chips and elements such as a high-frequency component and a multi-chip module is sealed. In this case, the hermetic sealing is not necessarily a vacuum, and may be a sealing for completely blocking moisture.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Lid 3 Bonding material 4 External electrode 5 Through electrode 6 Internal electrode 7 Connection material 8 Crystal vibrating piece 9 Solder 10 Land 11 Circuit board 12 Through hole 13 Inorganic substance layer 14 Conductive resin layer 15 External electrode 16 Conductive resin layer 17 Substrate 18 Electronic component area 19 Electronic component 20 Glass 21 Metal fine wire

Claims (19)

A substrate, a lid that is installed on the first surface of the substrate and forms a cavity portion that is blocked from outside air between the first surface, and an interior that is installed on the first surface of the cavity portion An electrode, an electronic element provided in the cavity and electrically connected to the internal electrode, and an external electrode provided on a surface opposite to the first surface and electrically connected to the internal electrode, In the electronic components provided,
The substrate has a through hole penetrating from the first surface toward a surface opposite to the first surface, and a through electrode provided in the through hole,
The through electrode is electrically connected to the internal electrode and the external electrode, and is formed in the order of an inorganic material layer and a conductive resin layer from the first surface toward the surface opposite to the first surface. An electronic component having a double filling and sealing structure.   The electronic component according to claim 1, wherein the through hole has a shape expanding from the first surface toward a surface opposite to the first surface.   3. The electronic component according to claim 1, wherein the inorganic material layer includes a metal fine wire provided in the through-hole and glass filled in the through-hole.   The electronic component according to claim 1, wherein the inorganic substance layer fills the through hole with a thick film conductive paste.   The electronic component according to claim 1, wherein the inorganic material layer is configured by a metal layer or an alloy layer formed in the through hole.   The conductive resin layer is formed from the inside of the through hole to a surface opposite to the first surface, and the external electrode is formed of the conductive resin layer formed on the surface opposite to the first surface. The electronic component according to claim 1, wherein the electronic component is provided on a surface opposite to the first surface.   7. The electronic component according to claim 6, wherein a thickness of a portion of the conductive resin layer formed on a surface opposite to the first surface is 10 μm to 50 μm.   The electronic component according to claim 1, wherein the external electrode is made of a metal or an alloy.   The electronic component according to any one of claims 1 to 8, wherein the substrate is made of glass.   The electronic component according to claim 9, wherein the lid is made of glass and is anodically bonded to the substrate.   The electronic component according to claim 1, wherein the electronic element is a crystal vibrating piece. Filling an inorganic substance layer on the first surface side of a through-hole penetrating from a first surface of the substrate formed on the substrate toward a surface opposite to the first surface;
Forming an internal electrode on a surface of the inorganic material layer on the first surface side;
Providing an electronic element on the surface of the internal electrode opposite to the surface in contact with the inorganic material layer;
A step of installing a lid on the first surface, and forming a cavity portion that is blocked from outside air between the lid and a portion of the first surface where the electronic element is provided;
Forming a conductive resin layer from a surface opposite to the first surface side of the inorganic material layer toward a surface opposite to the first surface;
Forming an external electrode electrically connected to the conductive resin layer on a surface opposite to the first surface;
An electronic component manufacturing method comprising:   13. The method of manufacturing an electronic component according to claim 12, wherein in the step of filling the inorganic substance layer, a metal fine wire is provided in the through hole, and the through hole is filled with glass and fired.   The method of manufacturing an electronic component according to claim 12, wherein the step of filling the inorganic substance layer includes filling the through-hole with a thick film conductive paste and baking.   The method of manufacturing an electronic component according to claim 12, wherein the step of filling the inorganic material layer forms a metal layer or an alloy layer in the through hole.   16. The manufacturing of an electronic component according to claim 12, wherein the step of forming the conductive resin layer forms the conductive resin layer by any one of printing, dispenser, inkjet, and transfer. Method. The step of forming the conductive resin layer is a step of forming the conductive resin layer from the inside of the through hole to the surface opposite to the first surface,
The step of forming the external electrode is characterized in that the external electrode is formed on the surface opposite to the first surface through the conductive resin layer formed on the surface opposite to the first surface. The method of manufacturing an electronic component according to claim 16.   The step of forming the conductive resin layer includes a first conductive resin formation step of filling the through hole with the conductive resin layer, and a second step of forming the conductive resin layer on a surface opposite to the first surface. The method for manufacturing an electronic component according to claim 16, further comprising: a conductive resin forming step.   The method of manufacturing an electronic component according to any one of claims 16 to 18, wherein, in the step of forming the conductive resin layer, the printing is a screen printing method.

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