JP2015122413A - Package and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package using an insulating material, which can inhibit deformation caused by a temperature change.SOLUTION: A package using an insulating material comprises: a base substrate 2 on which an internal electrode 6 connects with an electronic component 5 is provided and an external electrode 12 is provided on a surface on the opposite side to the internal electrode via a through electrode; a lid substrate 3 which is arranged opposite to the base substrate across the electronic component and formed by an insulating material; and a frame part 4 which connects the base substrate and the lid substrate and which is formed to surround the electronic component and formed by a metallic material.

Description

  The present invention relates to a package having a through electrode for mounting and enclosing an electronic component, and a manufacturing method thereof.

Metal packages and ceramics are often used as packages for mounting, enclosing, and storing electronic components such as vibrators and sensors for measuring mechanical quantities such as acceleration.
In these metal packages, a through-electrode is provided on a metal substrate, an electronic component is mounted, and a metal cap is hermetically sealed by welding or soldering.

  The ceramic package consists of a ceramic with a cavity and a metal cap. The ceramic package is manufactured by firing the ceramic with a cavity on which an electronic component is mounted and enclosed, and at the same time, an electrical wiring that connects the inside and outside of the package. A metal layer for connecting to the metal cap is formed.

  These packages usually have a method of mounting and encapsulating electronic components in individual states, but in recent years, mounting and sealing a large number of electronic components using two substrates at once. A method has been proposed in which productivity is improved by performing cutting and dividing into pieces.

These substrates are composed of a base substrate on which electronic components are mounted and through electrodes and the like for connection to the outside are formed, and a substrate called a lid substrate for sealing the base substrate as a lid. These substrates are made of insulating substrates such as ceramics and glass.
In a package composed of these two substrates, it is necessary to form a space called a cavity for forming a through electrode in the base substrate and mounting and enclosing an electronic component.

  As a manufacturing method of such a package, a glass substrate is used as a base substrate material, a through hole is formed by softening the glass substrate, a cavity is formed at the same time, a through electrode is formed by filling the through hole with metal, and a lid A method using a flat substrate as a substrate (Patent Document 1), or heating a tapered through-hole to a temperature equal to or higher than the softening point of glass as a base material, followed by pressure molding with a mold made of a carbon material. The through electrode is formed by a method of integrating the glass base and the metal pin by transferring the metal pin into the through hole and setting the whole to be equal to or higher than the softening point of the glass base, and etching the lid substrate. A method of forming a cavity by a method such as grinding (Patent Document 2) or a method of forming a cavity in a ceramic using a fired ceramic as a substrate material Patent Document 3) we have been adopted.

  However, it is well known that miniaturization and proximity of through electrodes are desired with recent miniaturization of electronic components and miniaturization of packages. In addition to improvement of electrode accuracy and sealing performance, package Higher strength of the main body is desired.

  In the case of a package in which both the base substrate and the lid substrate are made of glass, low strength due to the brittleness of the glass becomes an issue, and furthermore, when the glass is softened and melted to form a through electrode or cavity, There was a problem that the accuracy decreased with fluidity and thermal expansion.

  Also, when using fired ceramics, if through holes and cavities are formed before firing, there is a problem that sufficient accuracy cannot be obtained due to deformation and dimensional changes associated with firing. After firing, through holes and cavities are formed. There was a problem of poor accuracy and high cost due to poor workability.

JP 2003-209198 A JP 2011-166307 A JP 2012-222368 A

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a package capable of suppressing distortion caused by a temperature change and a manufacturing method thereof while ensuring fineness.

The present invention employs the following means in order to solve the above problems.
A package according to the present invention is made of an insulating material, provided with an internal electrode connected to an electronic component, and provided with an external electrode on a surface opposite to the internal electrode via a through electrode; The electronic component is disposed with respect to a base substrate, and a lid substrate made of an insulating material is connected to the base substrate and the lid substrate so as to surround the electronic component. And a frame portion as a material.
According to this package, because the frame is made of metal, it has high precision and excellent strength, so it can cope with downsizing and thinning, and is provided with glass, ceramics, and insulating layers, which are brittle materials with inferior strength. Since it serves to reinforce the base substrate and the lid substrate made of silicon or the like, the strength can be increased, and thus a small and highly reliable electronic component can be provided. The metal frame part is sandwiched and fixed from above and below by an insulating material having a relatively low coefficient of thermal expansion. Therefore, since the heat shrinkage of the frame portion is suppressed, the stress and strain received by the electronic components mounted inside are reduced. Therefore, the reliability as a package is improved.

Further, in the package according to the present invention, the frame portion is mainly composed of nickel, the base substrate is formed of any one of glass, ceramics, and silicon, and the lid substrate is any of glass, ceramics, and silicon. It is formed by these.
According to this package, since the material of the frame metal is a metal whose main component is nickel, it is possible to exhibit excellent characteristics not only in strength but also in corrosion resistance.

In addition, a method for manufacturing a package according to the present invention includes:
A frame portion forming step of forming a frame main portion by electroplating on a base substrate or a lid substrate made of an insulating material, and the base substrate and the lid substrate are joined via the frame portion. And a joining step.
According to this package manufacturing method, it is possible to form a frame portion with high accuracy by forming a frame portion by electroplating on the base substrate or the lid substrate, and even higher accuracy if the photolithography method is incorporated into the electroplating method. It can be. Further, if nickel plating is used in the electroplating method, it can be manufactured at high speed and stably, and at the same time, a nickel frame portion having high strength and high corrosion resistance can be formed.

  According to the present invention, it is possible to provide a package capable of suppressing distortion caused by a temperature change while ensuring fineness.

It is a figure which shows the outline | summary of the package concerning embodiment of this invention. It is a figure which shows the process for producing a penetration electrode among the processes for producing the package concerning embodiment of this invention among base substrate shaping | molding processes. It is a figure shown in order to produce a frame part in a base substrate formation process among the processes for producing the package concerning the embodiment of the present invention. It is a figure which shows a lid substrate formation process among the processes for producing the package concerning embodiment of this invention. It is a figure which shows an electronic component mounting and sealing joining process among the processes for producing the package concerning embodiment of this invention.

Embodiments according to the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing an outline of a package according to an embodiment of the present invention in which a tuning fork type crystal resonator as an electronic component is mounted and vacuum-sealed, and FIG. 1A is a diagram seen through from above. FIG. 1B is a diagram showing an outline of a cross section in the cross-sectional direction at AA ′ in FIG.

  This package 1 has a structure in which a tuning fork type crystal resonator 5 is sealed by a lid substrate 3 made of alumina of the same material as a base substrate 2 made of 96% alumina and a frame portion 4 made of nickel.

  The tuning fork type crystal resonator 5 is fixed on the base substrate 2 via protruding electrodes 10 and 11 formed on the internal electrodes 8 and 9 connected to the through electrodes 6 and 7 formed on the base substrate 2. ing.

  The through electrodes 6 and 7 are connected to external electrodes 12 and 13 formed on the outer surface of the base substrate 2, respectively, so that the package 1 can be connected to an external circuit board (not shown). .

  The package 1 in which the tuning fork type crystal resonator 5 is mounted and enclosed is manufactured in a wafer state for taking a large number of base substrates 2 and lid substrates 2 to be the package 1, and the tuning fork type crystal resonator 5 which is a mounted component is prepared. After mounting and sealing, it is cut by individual packages.

  The process for manufacturing the package 1 in which such a tuning-fork type crystal resonator 5 is mounted and enclosed includes the base substrate manufacturing process shown in FIGS. 2 and 3, the lid substrate manufacturing process shown in FIG. It consists of the electronic component mounting and the sealing joining process shown.

Hereinafter, description will be made with reference to a cross section taken along line AA ′ of FIG. 1A shown in FIG.
In the step of manufacturing the through electrode in the base substrate manufacturing step shown in FIG. 2, first, as shown in FIG. 2A, a through hole is formed by a laser at a desired position of the 96% alumina substrate 101 serving as the base substrate. 102 is produced.

  Next, a copper layer 103 is formed on the surface of the substrate 101 including the through hole 102 by an electroless copper plating method (FIG. 2B), a dry film photoresist is applied to both surfaces of the substrate 101, and exposure development is performed. The first surface is fully cured, and a plating resist layer 105 is formed so as to have an opening 104 in a portion of the second surface that is to become an external electrode (FIG. 2C).

  Next, a copper layer 106 is formed by copper plating, the through hole 102 is sealed, and further, a surface plating layer 107 is formed by applying nickel plating and gold plating (FIG. 2D), and the plating resist layer 105 is formed. After peeling, a basic structure of the through electrode 108 and the external electrode 109 is produced (FIG. 2E).

  Furthermore, a dry film photoresist is applied to both surfaces of the substrate 101 again, and an opening 110 is formed on the first surface to be an internal electrode by exposure and development. A layer 111 is formed (FIG. 2F).

  Further, the surface plating layer 112 is formed by performing nickel plating and gold plating on the opening 110 (FIG. 2G), and the basic structure of the internal electrode 113 is formed by peeling the plating resist layer 111. A basic structure of the base substrate 114 is manufactured (FIG. 2H).

In the base substrate forming step shown in FIG. 3 (frame portion forming step), a frame portion should be formed by applying dry film photoresist on both surfaces of the base substrate 114 and performing exposure development. A plating resist layer 116 is formed so as to have an opening 115 in the portion (FIG. 3B), and nickel plating 117 is formed by electroplating.
Next, the surface of the nickel plating 117 is flattened, and the surface 118 is ground and polished so as to have a desired height, thereby forming a frame portion 118 (FIG. 3D).

  Next, the plating resist layer 116 is peeled off (FIG. 3E), and unnecessary portions of the copper layer 119 are etched to separate and make the external electrode 120, the internal electrode 121, and the frame portion 118 independent. Is formed, and the base substrate 123 in which the external electrode 120 and the internal electrode 121 are connected by the through electrode 122 is manufactured (FIG. 3F). As described above, since the frame portion 118 is directly formed on the base substrate 123 made of an insulating material, the frame portion 118 and the internal electrode 121 and the frame portion 118 and the through electrode 122 are as close as possible while maintaining the insulation state. Can be made. Therefore, a small package with excellent fineness can be provided.

  In the lid substrate manufacturing process shown in FIG. 4, first, as shown in FIG. 2A, a conductive film 125 made of 50 nm chromium and 200 nm copper is formed on one surface of a 96% alumina substrate 124 by sputtering (FIG. 4 (a)).

Next, a dry film photoresist is applied to the surface of the conductive film 125, and a plating resist layer 127 is formed by exposure and development so as to have an opening 126 in a portion where the frame portion 118 is to be connected (FIG. 4B). Then, a base layer 128 composed of a nickel plating layer of 3 μm and a gold plating layer of 0.1 μm is formed (FIG. 4C).
Next, the plating resist layer 127 is peeled off (FIG. 4D), and unnecessary portions of the conductive film 125 are removed by etching to complete the base layer 129 (FIG. 4E).

  Finally, a gold-tin alloy paste composed of 80% by weight of gold and 20% by weight of tin is printed on the underlayer 129 by a screen printing method to form a gold-tin solder base layer 130 (FIG. 4 (f)), and a nitrogen atmosphere The base substrate 132 is manufactured by forming a uniform gold-tin solder layer 131 on the base layer 129 by performing reflow treatment at a medium temperature of 300 ° C. and cleaning and removing the flux contained in the paste (FIG. 4 ( g)).

  In the electronic component mounting and sealing bonding process, first, an upper protrusion electrode 133 is produced by bonding and cutting a gold wire on the internal electrode 121 of the base substrate 123 (FIG. 5A), and a tuning fork type crystal resonator. The substrate 134 is mounted and fixed on the base substrate 123 by ultrasonic pressure bonding (FIG. 5B).

  Next, the position of the frame 118 of the base substrate 123 on which the tuning fork type crystal resonator 134 is mounted and the position of the gold-tin solder layer 131 of the lid substrate 132 are aligned (FIG. 5C), and the pressure and heating are performed in vacuum. By melting the gold tin solder layer 131, the base substrate 123 and the lid substrate 132 are joined (joining process), the tuning fork type crystal resonator 134 is vacuum-sealed, and finally the wafer produced by the dicing apparatus is used. The package 135 separated into pieces is produced by cutting.

  In this embodiment mode, 96% alumina is used as the base substrate material and the lid substrate material, but it goes without saying that the present invention can also be applied to a silicon wafer or the like whose surface is insulated by glass or an oxide film.

  Furthermore, although the frame portion is formed on the base substrate side, it does not change even if it is produced on the lid substrate. Furthermore, a gold tin solder layer is formed on the lid substrate side as a bonding agent. There may be no problem even if it is formed on the surface of the frame.

  In this embodiment, a method of creating a space in the central portion without completely embedding the through hole by copper plating is adopted, but the through hole may be completely embedded, and the through electrode is formed by a plating method. There is no problem even if this is another method, for example, a fired metal paste.

The package manufactured in this way is extremely excellent in environmental resistance such as strength and corrosion resistance because the base substrate and the lid substrate are fastened by a frame made of metal, particularly nickel, and is deformed by external force. This reduces the damage given to brittle materials such as ceramics, glass and silicon, which are poor in yield strength, so that it has excellent reliability. In addition, since the frame portion made of metal having a relatively large thermal expansion coefficient is sandwiched and fixed from both sides by the base substrate and the lid substrate of the insulating material, the thermal expansion due to the temperature change of the frame portion is suppressed, Distortion of the base substrate and the lid substrate at the stage where the package is manufactured can be suppressed. Therefore, the distortion which an internal electrode, the electronic component mounted, a penetration electrode, etc. receive is also suppressed, and a reliable package is obtained. Note that the thermal expansion coefficient of glass, ceramics, and silicon as insulating materials used for the base substrate and the lid substrate is about 10 (10 ⁶ / K) or less, and the thermal expansion coefficient of the metal used for the frame portion is about 10 (10 ⁻⁶ / K) or more.

  In addition, since electroplating is used to fabricate the metal frame, photolithography can be applied, so the frame can be made with very high precision, and the height can be controlled by introducing grinding and polishing. Therefore, it is possible to cope with the reduction in thickness, so that a great effect can be achieved in reducing the thickness and size of the package.

  In this embodiment, a tuning fork type crystal resonator is used as an electronic component. However, vacuum sealing or airtight sealing is required for semiconductor devices such as LSIs and mechanical quantity sensors such as acceleration sensors. Needless to say, the present invention can be applied to any electronic component.

  As described above, according to the present invention, it is possible to simultaneously produce a plurality of packages in which electronic components are hermetically sealed in a wafer state, and at the same time, it is excellent in miniaturization and thinning.

1, 135 Package 2, 123, 132 Base substrate 3, 132 Lid substrate 4, 118 Frame portion 5, 134 Tuning fork type crystal resonator 6, 7, 108, 122 Through electrode 8, 9, 113, 121 Internal electrode 10, 11 133 Protruding electrodes 12, 13, 109, 120 External electrodes 101, 124 Alumina substrate 102 Through holes 103, 106, 119 Copper layers 104, 110, 126 Openings 105, 111, 116, 127 Plating resist layers 107, 112 Surface Plating layer 117 Nickel plating 125 Conductive film 128, 129 Underlayer 130 Gold-tin solder paste layer 131 Gold-tin solder layer

Claims (3)

An insulating material is used as a material, and an internal electrode connected to an electronic component is provided.
A lid substrate that is arranged with the electronic component sandwiched between the base substrate and is made of an insulating material;
A frame part that connects the base substrate and the lid substrate, is formed so as to surround the electronic component, and is made of a metal material;
A package characterized by comprising:   The frame portion is mainly composed of nickel, the base substrate is formed of any one of glass, ceramics, and silicon, and the lid substrate is formed of any of glass, ceramics, and silicon. The package of claim 1. A frame portion forming step of forming a main portion of the frame portion by electroplating on a base substrate or a lid substrate made of an insulating material;
A package manufacturing method comprising: a bonding step of bonding the base substrate and the lid substrate through the frame portion.

Images