JP2008135594A - Board for sealing micro electromechanical part, multi-pattern board for sealing micro electromechanical part, micro electromechanical device, and method for manufacturing micro electromechanical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board for sealing a micro electromechanical part which can prevent an application of a strain or stress to a micro electromechanical mechanism by a residual stress by a mounting heat history of electronic parts to be mounted and heat generating from their electronic parts, and can materialize a reduction in a size. <P>SOLUTION: In the board for sealing the micro electromechanical part, the micro electromechanical mechanism of the micro electromechanical part which has a semiconductor board, the micro electromechanical mechanism formed on a main face of the semiconductor board and a first electrode connected electrically to the micro electromechanical mechanism is airtightly sealed, and also an electronic part having a second electrode connected electrically to the first electrode is mounted thereon. A first main face of an insulating board has a first region jointed to the main face of the semiconductor board and a second region to which the electronic parts are mounted, and a wiring conductor formed within the insulating board comprises: one end led to the first region on the first main face and connected electrically to the first electrode and another end led to the second region on the first main face and connected electrically to the second electrode. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a micro electro mechanical component sealing substrate on which a micro electro mechanical component is hermetically sealed, and an electronic component electrically connected to the micro electro mechanical component is mounted. The present invention relates to a component sealing substrate, a micro electromechanical device including such a micro electro mechanical component sealing substrate and a micro electro mechanical component, and a manufacturing method thereof.

  2. Description of the Related Art In recent years, microelectronics in which a very small electromechanical mechanism, so-called MEMS (Micro Electromechanical System), is formed by applying a processing technology for forming fine wiring such as a semiconductor integrated circuit element on the main surface of a semiconductor substrate such as a silicon wafer. Machine parts are attracting attention, and development is progressing toward practical application.

  Such microelectromechanical mechanisms include sensors such as accelerometers, pressure sensors, and actuators, micromirror devices with movable micromirrors, optical devices, microchemical systems incorporating micropumps, etc. Prototypes have been developed and developed over a very wide field.

  An example of a conventional micro-electromechanical component sealing substrate for configuring a microelectromechanical device using the microelectromechanical component having such a microelectromechanical mechanism and a microelectromechanical device formed using the same 5 shows a sectional view.

In the example illustrated in FIG. 5, power is supplied to the main surface of the semiconductor substrate 121 on which the micro electro mechanical mechanism 122 is formed, or an electric signal is transmitted from the micro electro mechanical mechanism 122 to an external electric circuit. Is formed by being electrically connected to the micro electro mechanical mechanism 122, and the semiconductor substrate 121, the micro electro mechanical mechanism 122 and the electrode 123 constitute one micro electro mechanical component 124. Is done.

  Note that such micro-electromechanical components 124 are usually formed in a multi-cavity form in which a large number are arranged on the main surface of the semiconductor substrate 121 in the vertical and horizontal directions, as will be described later, and then the individual semiconductor substrates 121 are formed. In order to prevent foreign matter such as cutting powder from adhering to the microelectromechanical mechanism 122 during this cutting, it is covered with a glass plate 125 or the like. Protected.

  Then, the micro electro mechanical component 124 is accommodated in the recess A of the package 131 having the micro electro mechanical component accommodating recess A, and the electrode 123 of the micro electro mechanical component 124 is bonded to the electrode pad 132 of the package 131. After connecting via a conductive connecting material such as 133, the recess A of the package 131 is covered with a lid 134, and the micro electromechanical component 124 is hermetically sealed in the recess A, thereby completing the micro electro mechanical device. . In this case, the microelectromechanical component 124 needs to be hermetically sealed in a hollow state so as not to hinder the operation of the microelectromechanical mechanism 122.

  In this microelectromechanical device, the lead-out portion of the wiring conductor 135 formed so as to lead out from the electrode pad 132 of the package 131 to the outer surface in advance is connected to an external electric circuit, whereby the micro-mechanical device is hermetically sealed. The electromechanical mechanism 122 is electrically connected to an external electric circuit through the electrode 123, the bonding wire 133, the electrode pad 132, and the wiring conductor 135.

  In addition, such micro-electromechanical components 124 are usually manufactured by arranging a large number of elements on a main surface of a large-area semiconductor substrate vertically and horizontally, and a manufacturing method of the micro-electromechanical device in this case is as follows. Conventionally, it has been as follows.

That is,
1. Prepare a micro electro mechanical component having a plurality of micro electro mechanical component regions formed by forming a micro electro mechanical mechanism 122 and an electrode 123 electrically connected to the micro electro mechanical mechanism 122 on the main surface of the semiconductor substrate. And a process of
2. a step of encapsulating the micro electro mechanical mechanism 122 of each micro electro mechanical component with a glass plate 125 or the like so that the periphery thereof is in a hollow state; and
3. A semiconductor substrate is subjected to a cutting process such as a dicing process and divided into individual micro-electromechanical components 124;
4. It is manufactured by hermetically sealing individual micro-electromechanical components 124 in a micro-electromechanical component housing package 131.

  In such a conventional manufacturing method, it is necessary to seal and protect one by one with a glass plate 125 or the like one by one in a number of micro-electromechanical component regions arranged on the main surface of the semiconductor substrate, Further, after the micro electromechanical component once sealed with the glass plate 125 is divided into individual micro electro mechanical components 124, the micro electro mechanical component is hermetically sealed in the package 131, and the electrode 123 is connected to the electrode pad 132 of the package 131. There is a problem that productivity is poor and it is difficult to put into practical use because it is necessary to connect to the outside and the like.

  In order to solve this problem, a substrate has been proposed in which a large number of microelectromechanical mechanisms 122 arranged on the main surface of a semiconductor substrate are collectively covered and sealed.

As such a sealing substrate, a substrate made of a semiconductor substrate, a substrate made of a conductive metal plate, or the like is known.

  In the case where the sealing substrate is made of a semiconductor substrate, for example, in addition to the first semiconductor substrate in which a large number of microelectromechanical component regions are arranged and formed on the main surface, it is made to correspond to the arrangement of the microelectromechanical component regions. And preparing a second semiconductor substrate for sealing in which a large number of recesses are arrayed, the second semiconductor substrate on the main surface of the first semiconductor substrate, and the recesses in the second semiconductor substrate being the first semiconductor There is a technology in which the micro electro mechanical component region of the substrate is joined so as to cover the micro electro mechanical component region (particularly, the micro electro mechanical mechanism) of the first semiconductor substrate inside the second semiconductor substrate. It has been proposed (see, for example, Patent Document 1).

  In addition, when the sealing substrate is made of a conductive metal plate, a groove having a predetermined pattern is formed in the conductive metal plate for the cover, and the groove is filled with glass or a ceramic material to be flattened. After that, a conductor pattern for bonding (electrode pad, etc.) is formed thereon, the electrodes of the micro electromechanical parts are connected to the conductor pattern, and a metal plate is joined to the main surface of the semiconductor substrate. A technique has been proposed in which an electromechanical component region is sealed with ceramic, glass, or the like, and an external wiring electrode pattern for leading a conductor pattern to the outside is formed (for example, see Patent Document 2). .

In addition, in an electronic device having a microelectromechanical mechanism, so-called MEMS, a technique has been proposed in which a terminal electrically connected to a MEMS element and a passive element such as a semiconductor circuit, a capacitor, or a resistor are connected. (For example, refer to Patent Document 3).
JP 2001-144117 A JP 2002-43463 A JP 2004-209585 A

  However, in such a conventional technique, in recent years, there has been a possibility that the following problems cannot be sufficiently suppressed in a microelectromechanical mechanism or the like used for sensor applications or the like.

  That is, the micro-electromechanical mechanism used for sensor applications and the like has recently been improved in response accuracy of the micro-electromechanical mechanism and driven for a long time. Low power consumption has been demanded.

  In addition, micro-electromechanical mechanisms used in sensor applications are expected to be applied to consumer devices and portable devices. ICs, inductors, capacitors, etc. that process signals sensed by micro-electromechanical mechanisms at high speed are expected. A further reduction in thickness is required in combination with electronic mechanical parts.

  On the other hand, in the MEMS element-mounted electronic device described in Patent Document 3, a configuration in which a terminal electrically connected to the MEMS element and a passive element such as a semiconductor circuit, a capacitor, and a register are connected in the vertical direction is mounted. (See paragraph 0096 and FIG. 15). Thus, when the MEMS element and the semiconductor circuit or passive element are mounted in the vertical direction, there is a problem that it is difficult to reduce the thickness of the electronic device.

  In addition, since an electronic element such as an IC or an electric element such as an inductor or a capacitor is mounted on the other main surface of the substrate for encapsulating micro-electromechanical components (in FIG. 15 of Patent Document 3, the upper surface of the lid body 2), Due to the influence of the residual stress due to the mounting thermal history, there is a problem that strain and stress are generated in the microelectromechanical mechanism, causing deterioration of sensor response accuracy and malfunctioning of the microelectromechanical mechanism.

  Furthermore, the heat generated from electronic elements that perform high-speed signal processing on signals sensed by the micro-electromechanical mechanism, and electrical elements such as inductors and capacitors gives strain and stress to the micro-electromechanical mechanism, thereby improving the sensor response accuracy. There was also a problem that deterioration and malfunction of the microelectromechanical mechanism occurred.

  The present invention has been completed in view of the above-described problems in the prior art, and its purpose is to make a microelectron by the residual stress due to the mounting heat history of the mounted electronic component and the heat generated from the electronic component. A substrate for encapsulating a micro-electromechanical component capable of preventing strain and stress from being applied to the mechanical mechanism and realizing a reduction in thickness, a substrate for encapsulating a micro-electromechanical component in a plurality of forms, and It is an object of the present invention to provide a microelectromechanical device having such a microelectromechanical component sealing substrate and a method of manufacturing such a microelectronic mechanical device. Here, the electronic component includes both an electric element and an electric element.

  A substrate for encapsulating a micro electro mechanical component of the present invention includes a micro substrate having a semiconductor substrate, a micro electro mechanical mechanism formed on a main surface of the semiconductor substrate, and a first electrode electrically connected to the micro electro mechanical mechanism. A substrate for encapsulating a micro-electromechanical component on which the micro-electromechanical mechanism of the electro-mechanical component is hermetically sealed and mounted with an electronic component having a second electrode electrically connected to the first electrode. An insulating substrate having a first main surface joined to the main surface of the semiconductor substrate so as to hermetically seal the micro mechanical mechanism, and a wiring conductor formed inside the insulating substrate; The first main surface has a first region bonded to the main surface of the semiconductor substrate and a second region on which the electronic component is mounted, and the wiring conductor is The first electric power derived to the first region on the first main surface; And one end electrically connected to the second electrode and led to the second region on the first main surface. . This substrate for encapsulating a micro electro mechanical component is referred to as a “first micro electro mechanical component encapsulating substrate”.

  In the first microelectronic mechanical component sealing substrate, preferably, there are a plurality of the first and second electrodes, and a plurality of the wiring conductors are arranged, and the insulating substrate Seen in a plan view, the wiring conductor is arranged symmetrically with respect to a straight line passing through the center of the micro-electromechanical component and the electronic component. This micro electro mechanical component sealing substrate is referred to as a “second micro electro mechanical component sealing substrate”.

  Further, in the second substrate for encapsulating a micro-electromechanical component, preferably, at least one wiring arranged at a position closest to the straight line among the plurality of wiring conductors when the insulating substrate is seen through a plane is preferably The length of the plurality of wiring conductors is the shortest. This micro electro mechanical component sealing substrate is referred to as a “third micro electro mechanical component sealing substrate”.

  In any one of the first to third micro-electromechanical component sealing substrates, preferably, there are a plurality of the first electrodes and the second electrodes, respectively, and a ground formed inside the insulating substrate. A first conductor that is led out to the first region on the first main surface and is electrically connected to at least one of the first electrodes; and And a second end led to the second region on the first main surface and electrically connected to at least one of the second electrodes. This micro electro mechanical component sealing substrate is referred to as a “fourth micro electro mechanical component sealing substrate”.

  In the fourth microelectronic mechanical component sealing substrate, preferably, the grounding conductor is a second main surface or a side surface of the insulating substrate facing the first main surface of the insulating substrate. And a third end portion derived from the second end portion. This micro electro mechanical component sealing substrate is referred to as “fifth micro electro mechanical component sealing substrate”.

  In the fifth substrate for micro-electromechanical component sealing, preferably, the main surface of the semiconductor substrate and the first region of the first main surface of the insulating substrate are electrically conductive. The grounding conductor is joined via a joining material, and the grounding conductor is led out to a joining portion between the first region on the one principal surface of the insulating substrate and the principal surface of the semiconductor substrate. 4 ends are provided.

  The substrate for encapsulating a micro electro mechanical component of the present invention having a plurality of shapes is characterized in that it has a plurality of sealing regions constituting the micro electro mechanical component encapsulating substrate.

  According to another aspect of the present invention, there is provided a microelectromechanical device comprising the microelectronic mechanical component sealing substrate, the microelectronic mechanical component, and the electronic component.

  According to another aspect of the present invention, there is provided a method of manufacturing a microelectromechanical device in which a plurality of microelectromechanical component regions in which a microelectromechanical mechanism and a first electrode electrically connected to the microelectromechanical mechanism are formed are formed on a semiconductor substrate. A step of preparing a plurality of micro-electromechanical component substrates arranged in a fixed direction in the one direction, wherein the micro-electromechanical component region is arranged in at least one direction on the top; A step of preparing a substrate for encapsulating a micro-electromechanical component in a single-piece form, a step of preparing a plurality of electronic components each having a second electrode connected to the corresponding first electrode, and the micro-electromechanical device The first electrodes of the component board are electrically connected to one end of the first wiring conductor corresponding to the first electrodes, and the plurality of micro-electromechanical component boards and the plurality of micro-patterns are minute. Electronic machine Bonding the component sealing substrate to hermetically seal each of the microelectromechanical mechanisms, and a region other than the microelectromechanical component region in the plurality of microelectromechanical component substrates A step of removing, a step of mounting the plurality of electronic components on the one main surface of the substrate for encapsulating micro-electromechanical components in the plurality of forms exposed by the removal, and the plurality of steps And a step of dividing a portable substrate for micro-electromechanical component sealing into each of the sealing regions.

  According to the substrate for encapsulating a microelectromechanical component of the present invention, a semiconductor substrate, a microelectromechanical mechanism formed on the main surface of the semiconductor substrate, and a first electrode electrically connected to the microelectromechanical mechanism are provided. A substrate for sealing a micro-electromechanical component on which the micro-electro-mechanical mechanism of the micro-electromechanical component has a hermetic seal and mounts an electronic component having a second electrode electrically connected to the first electrode. An insulating substrate having a first main surface bonded to the main surface of the semiconductor substrate so as to hermetically seal the micromechanical mechanism, and wiring formed inside the insulating substrate And the first main surface has a first region bonded to the main surface of the semiconductor substrate and a second region on which the electronic component is mounted, and the wiring conductor Is derived in the first region on the first main surface and is Since one end electrically connected to one electrode and the other end led to the second region on the first main surface and electrically connected to the second electrode, It is possible to prevent strain and stress from being applied to the microelectromechanical mechanism due to the residual stress due to the mounting heat history of the electronic components to be mounted and the heat generated from those electronic components, and to realize a reduction in thickness. .

  In addition, the multiple-electron mechanical component sealing substrate of the present invention is formed on the main surface of the semiconductor substrate because it has a plurality of sealing regions constituting the micro-electromechanical component sealing substrate. The microelectromechanical mechanisms that have been mounted can be collectively sealed, so that the residual stress due to the mounting heat history of the electronic components to be mounted and the heat generated from those electronic components can cause strain and stress on the microelectromechanical mechanisms. It is possible to easily and surely manufacture a large number of microelectromechanical devices that can be prevented from being added and can be thinned.

  In addition, a microelectromechanical device of the present invention comprises the above-described microelectromechanical component sealing substrate, the microelectromechanical component, and the electronic component. The microelectromechanical mechanism formed on the surface can be easily and reliably sealed, and the electrode connected to the microelectromechanical mechanism can be externally connected in a form that allows surface mounting, for example, It is possible to provide a substrate for encapsulating a microelectromechanical component that can be further reduced in thickness in combination with an electronic component.

  In addition, it is possible to prevent strain and stress from being applied to the microelectromechanical mechanism due to the residual stress due to the mounting heat history of the electronic components to be mounted and the heat generated from those electronic components.

  According to another aspect of the present invention, there is provided a method of manufacturing a microelectromechanical device in which a plurality of microelectromechanical component regions in which a microelectromechanical mechanism and a first electrode electrically connected to the microelectromechanical mechanism are formed are formed on a semiconductor substrate. A step of preparing a plurality of micro-electromechanical component substrates arranged in a fixed direction in the one direction, wherein the micro-electromechanical component region is arranged in at least one direction on the top; A step of preparing a substrate for encapsulating a micro-electromechanical component in a single-piece form, a step of preparing a plurality of electronic components each having a second electrode connected to the corresponding first electrode, and the micro-electromechanical device The first electrodes of the component board are electrically connected to one end of the first wiring conductor corresponding to the first electrodes, and the plurality of micro-electromechanical component boards and the plurality of micro-patterns are minute. Electronic machine Bonding the component sealing substrate to hermetically seal each of the microelectromechanical mechanisms, and a region other than the microelectromechanical component region in the plurality of microelectromechanical component substrates A step of removing, a step of mounting the plurality of electronic components on the one main surface of the substrate for encapsulating micro-electromechanical components in the plurality of forms exposed by the removal, and the plurality of steps And a step of dividing the microelectromechanical component sealing substrate in the form into each of the sealing regions, so that a plurality of microelectromechanical mechanisms are simultaneously hermetically sealed in the plurality of microelectromechanical component regions. Therefore, it is possible to prevent a strain and stress from being applied to the microelectromechanical mechanism, and to form a thin microelectromechanical device comprising a microelectromechanical component and a microelectronic mechanical component sealing substrate bonded to each other. Easily and reliably, it can be a large number produced.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view showing a configuration example of a micro electro mechanical device having a micro electro mechanical component sealing substrate according to Embodiment 1 of the present invention. As shown in FIG. 1, the micro electro mechanical device 1 includes a micro electro mechanical component 2, a micro electro mechanical component sealing substrate 3, and an electronic component 4. The microelectromechanical component 2 includes a semiconductor substrate 5, a microelectromechanical mechanism 6 formed on one main surface of the semiconductor substrate 5 (the lower surface of the semiconductor substrate 5 in FIG. 1), and an electrical connection to the microelectromechanical mechanism 6. Connected electrode 7 (hereinafter referred to as “first electrode”). On the other hand, the microelectronic mechanical component sealing substrate 3 includes an insulating substrate 8, a first wiring conductor 9, a second wiring conductor 10, and a third wiring conductor 11.

  Here, the electronic component 4 may be an electronic element such as an ASIC (Application Specific Integrated Circuit) that processes a signal sensed by the micro electro mechanical mechanism 6.

  The micro electro mechanical component sealing substrate 6 is used to seal the micro electro mechanical mechanism 6 provided on the main surface of the semiconductor substrate 5 (the lower surface of the semiconductor substrate 5 in FIG. 1), and the micro electro mechanical component. An electronic component 4 having an electrode (hereinafter referred to as a “second electrode”) 12 electrically connected to the first electrode 7 is mounted on the sealing substrate 6, and the microelectromechanical mechanism 6 can be externally connected. Thus, the microelectromechanical device 1 that is sealed in such a state is formed.

  One main surface (hereinafter referred to as “first main surface”) of the insulating substrate 8 is mounted with the first region bonded to the main surface of the semiconductor substrate 5 on which the microelectromechanical mechanism 6 is formed and the electronic component 4. Second region. The first wiring conductor 9 is formed inside the insulating substrate 8, and one end is connected to the second wiring conductor 10 and the other end is connected to the third wiring conductor 11. The second wiring conductor 10 is a through conductor that penetrates the insulating substrate 8, and one end thereof is led out to the first region on the first main surface of the insulating substrate 8, and the other end is the other main surface of the insulating substrate 8, that is, the first main surface. The first main surface is derived to a main surface (hereinafter referred to as “second main surface”). The third wiring conductor 11 is formed inside the insulating substrate 8, and one end is led to the second region on the first main surface of the insulating substrate 8, while the other end is connected to the first wiring conductor 9.

  The other end of the second wiring conductor 10 led out to the second main surface of the insulating substrate 8 is connected to the external terminal 13 and is connected to an external electric circuit via the external terminal 13.

  The micro electro mechanical mechanism 6 includes, for example, an electric switch, an inductor, a capacitor, a resonator, an antenna, a micro relay, an optical switch, a hard disk magnetic head, a microphone, a biosensor, a DNA chip, a microreactor, a print head, an acceleration sensor, a pressure sensor, and the like. These are microelectromechanical components having functions of various sensors, display devices, etc., and are components made by so-called micromachining based on semiconductor micromachining technology, and have a size of about 10 μm to several hundreds of μm per element.

  The insulating substrate 8 functions as a lid for sealing the micro electro mechanical mechanism 6 and also functions as a base for forming the first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11. .

  The first main surface of the insulating substrate 8 is bonded to one main surface of the semiconductor substrate 5 by, for example, a bonding material 14. Here, the bonding material 14 is disposed on the first main surface of the insulating substrate 8 so as to surround the micro electro mechanical mechanism 6 so as to hermetically seal the micro electro mechanical mechanism 6. In addition, a recess may be formed on the first main surface of the insulating substrate 8 so as to accommodate the micro electro mechanical mechanism 6 of the micro electro mechanical component 2 inside. If a part of the micro electro mechanical mechanism 6 is accommodated in the recess, the height of the bonding material 14 surrounding the micro electro mechanical mechanism 6 can be suppressed low, which is advantageous for reducing the height of the micro electro mechanical apparatus 1. It will be something.

  This insulating substrate 8 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic sintered body. It is formed of an organic resin material such as polyimide or glass epoxy resin, or a composite material formed by bonding inorganic powder such as ceramics or glass with an organic resin such as epoxy resin.

  If the insulating substrate 8 is made of, for example, an aluminum oxide sintered body, the insulating substrate 8 is formed by laminating and firing a green sheet formed by forming aluminum oxide and a raw material powder such as glass powder on the sheet. .

  The insulating substrate 8 is not limited to the one formed of an aluminum oxide sintered body, and it is preferable to select a substrate that is suitable for the application and the characteristics of the microelectromechanical mechanism 6 to be hermetically sealed.

  For example, since the insulating substrate 8 is mechanically bonded to the semiconductor substrate 5, in order to increase the reliability of bonding with the semiconductor substrate 5, that is, the hermeticity of sealing of the micro electro mechanical mechanism 6, the mullite quality. Semiconductors such as sintered ceramics and glass ceramics sintered bodies such as aluminum oxide-borosilicate glass systems in which the coefficient of thermal expansion is approximated to the semiconductor substrate 5 by adjusting the type and amount of glass components, for example. It is preferable to form the substrate 5 with a material having a small difference in thermal expansion coefficient.

  The insulating substrate 8 is made of an organic material such as polyimide or glass epoxy resin in order to prevent delay of electrical signals transmitted by the first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11. Ratios such as resin materials, composites made by bonding inorganic powders such as ceramics and glass with organic resins such as epoxy resins, or sintered glass ceramics such as aluminum oxide-borosilicate glass or lithium oxide It is preferable to form with a material with a low dielectric constant.

  When the insulating substrate 8 generates a large amount of heat from the micro-electromechanical mechanism 6 to be sealed and the heat dissipating property is good, the thermal conductivity of an aluminum nitride sintered body or the like is used. It is preferable to form with a large material.

  The first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11 are formed inside the insulating substrate 8, and one end of the second wiring conductor 10 led out to the first region in the insulating substrate 8. Are electrically connected to the microelectromechanical mechanism 6 through the first electrode 7. One end of the third wiring conductor 11 led to the second region of the insulating substrate 8 is electrically connected to the electronic component 4 through the second electrode 12.

  The first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11 are made of a metal material such as copper, silver, gold, palladium, tungsten, molybdenum, and manganese.

  As a means for the formation, a means for depositing a metal such as metallization, plating, vapor deposition or the like as a thin film layer can be used.

  For example, if the wiring conductor in the insulating substrate 8 is made of tungsten, the wiring paste may be formed by printing a tungsten paste on a green sheet to be the insulating substrate 8 and baking it together with the green sheet.

  The first electrode 7 and the second electrode 12 are formed of a metal material such as copper, silver, gold, palladium, tungsten, copper, or aluminum, and tin-silver, tin-silver-copper, or the like, gold-tin Corresponding to low melting point brazing materials such as brazing, high melting point brazing materials such as silver-germanium, conductive organic resins, or metal materials that enable joining by welding methods such as seam welding and electron beam welding They are connected to the microelectromechanical component 2 and the electronic component 4, respectively.

  In addition, the first main surface of the insulating substrate 8 and the main surface of the semiconductor substrate 5 are bonded to hermetically seal the micro electromechanical mechanism 6. As the bonding material 14 for bonding the first main surface of the insulating substrate 8 and the main surface of the semiconductor substrate 5, solder such as tin-silver, tin-silver-copper, or a low melting point brazing material such as gold-tin brazing Metal materials known as joining members such as high melting point brazing materials such as silver-germanium-based materials, conductive adhesive materials such as epoxy resins containing metal powder, or resin materials such as epoxy resin adhesive materials.

  Further, as the bonding material 14, metals such as iron-nickel alloys such as iron-nickel-cobalt alloy and iron-nickel alloy, oxygen-free copper, aluminum, stainless steel, copper-tungsten alloy, copper-molybdenum alloy, etc. A conductive film or the like formed by plating a metal layer such as Au, Ag, Cu, Al, Pt, Pd on an inorganic material such as a material or an aluminum oxide sintered body or a glass ceramic sintered body was formed. The thing which apply | coated solder, such as a tin-silver type and a tin-silver-copper type, can be used for a thing.

  As a method of joining the semiconductor substrate 5 to the main surface of the insulating substrate 8, solder such as tin-silver solder, low melting point solder such as gold-tin solder, high melting point solder such as silver-germanium, conductive organic A method of joining via a joining material such as resin, or a welding method such as seam welding or electron beam welding can be used.

  By connecting the lead-out portion of the second wiring conductor 10 of the micro electromechanical device 1 to an external electric circuit via an external terminal 13 such as a solder ball, the micro electromechanical component 2 including the micro electromechanical mechanism 6 is connected. , And the electronic component 4 are electrically connected to an external electric circuit, respectively.

  According to the substrate for encapsulating a micro electro mechanical component according to the present embodiment, the micro electro mechanical mechanism formed on the main surface of the semiconductor substrate can be easily and surely sealed and connected to the micro electro mechanical mechanism. The first electrode formed on the main surface of the formed semiconductor substrate can be easily and surely connected, for example, in a form that can be surface-mounted, and the productivity of the microelectromechanical device can be increased.

  In addition, according to the micro electro mechanical component sealing substrate according to the present embodiment, since the electronic component is mounted on the same plane as the surface of the micro electro mechanical component to be bonded to the semiconductor substrate, the micro electro mechanical component micro It is possible to realize a thinner substrate for encapsulating a minute electromechanical component that can seal the electromechanical mechanism and mount an electronic component. Further, in the insulating substrate, the first region facing the micro-electromechanical mechanism and the second region where the electronic component is mounted are not opposed to each other, and are adjacent to each other. When mounting on a substrate, no strain or stress is applied to the microelectromechanical mechanism, so that the microelectromechanical mechanism is prevented from malfunctioning, and a microelectromechanical component sealing substrate and microelectromechanical device with high sensor response accuracy are obtained. be able to.

  In addition, heat generated from an electronic element that performs high-speed signal processing on a signal sensed by the micro electro mechanical mechanism 6 or an electric element such as an inductor or a capacitor does not adversely affect the micro electro mechanical mechanism 6 such as strain or stress. Therefore, the micro electro mechanical component sealing substrate 6 and the micro electro mechanical device 1 having high sensor response accuracy can be obtained.

  A plurality of first electrodes 7 of the microelectronic mechanical component 2 and a plurality of second electrodes 12 of the electronic component 4 may exist. In addition to the first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11, another wiring conductor is provided inside the microelectronic mechanical component sealing substrate 3 as shown in FIG. 1. May be formed. Such a wiring conductor may be, for example, a through conductor, and one end is connected to the first electrode 7 of the microelectronic mechanical component 2 or the second electrode 12 of the electronic component 4 and the other end is connected to the external terminal 13. It may be connected.

  Furthermore, when there are a plurality of first electrodes 7 and a plurality of second electrodes 9, respectively, one end is connected to the first electrode 7 and the other end is connected to the second electrode 9, a plurality of wiring conductors are arranged. The wiring conductor is arranged in line symmetry with respect to a straight line passing through the center of the micro electro mechanical component 2 and the electronic component 4 parallel to the arrangement direction of the micro electro mechanical component 2 and the electronic component 4 when the insulating substrate 8 is seen through the plane. It is preferable. When the wiring conductors are arranged symmetrically in this way, the micro electromechanical component 2 and the electronic component 4 having a large number of terminals can be mounted and mounted, and further the micro electro mechanical component 2 and the electronic component 4 are mounted. Since the stress distribution generated in this process is symmetric with respect to a straight line passing through the centers of the microelectromechanical component 2 and the electronic component 4 parallel to the arrangement direction of the microelectronic mechanical component 2 and the electronic component 4, Since the stress concentration can be alleviated, it is possible to prevent a malfunction of the micro electro mechanical mechanism 6 and obtain a micro electro mechanical component sealing substrate and a micro electro mechanical apparatus with high sensor response accuracy.

  Further, when the insulating substrate 8 is seen through the plane, at least one wiring arranged at a position closest to the straight line passing through the centers of the microelectromechanical component 2 and the electronic component 4 among the plurality of wiring conductors is the plurality of wiring conductors. It is preferable that the length of the wiring conductor is the shortest. For example, a wiring conductor for transmitting a signal sensed by the microelectromechanical component 2 to the electronic component 4 is usually disposed at a position closest to the straight line passing through the centers of the microelectronic mechanical component 2 and the electronic component 4. Therefore, in the wiring conductor for transmitting the signal sensed by the microelectromechanical component 2 to the electronic component 4, the wiring length can be formed as short as possible, and the transmission loss can be minimized. Since power saving of the power source for operating the mechanical mechanism 6 and the micro-electromechanical component 2 can be achieved, it is possible to realize long-time driving and downsizing and downsizing of the power source component. In addition, since the signal detected by the micro electro mechanical mechanism 6 can be transmitted to the electronic component 4 quickly and accurately, the sensor response characteristics are improved. Therefore, it is possible to prevent the increase in module size, cost, and heat generation due to the increase in the size of power supply components, which has become a problem in recent years for sensor modules, etc. Performance can be realized. The plurality of wiring conductors formed inside the insulating substrate 8 are preferably arranged in parallel to the straight line passing through the centers of the microelectronic mechanical component 2 and the electronic component 4 when the insulating substrate 8 is seen through the plane. . At this time, the length of the wiring conductor is a length in a direction parallel to the straight line.

(Embodiment 2)
Next, a micro electro mechanical component sealing substrate according to a second embodiment of the present invention and a micro electro mechanical device using the micro electro mechanical component sealing substrate will be described.

  FIG. 2 is a cross-sectional view showing a configuration example of a micro electro mechanical device having a micro electro mechanical component sealing substrate according to the present embodiment. In FIG. 2, the same components as those of the micro electromechanical device shown in FIG. The microelectromechanical device 21 shown in FIG. 2 is different from the microelectromechanical device 1 shown in FIG. 1 in that a grounding conductor 22 is disposed inside the insulating substrate 8 and the insulating substrate 8. The connection pads 23 and 24 are provided on the end portion of the grounding conductor 22 led out to the first main surface. Here, the grounding conductor 22 is not necessarily a conductor to which a ground potential is supplied, but a conductor to which a reference potential is supplied.

  The grounding conductor 22 is formed of a metal material such as copper, silver, gold, palladium, tungsten, molybdenum, manganese, etc., like the first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11 described above. The

  As a means for the formation, a means for depositing a metal such as metallization, plating, vapor deposition or the like as a thin film layer can be used.

  For example, if the grounding conductor 22 is made of tungsten, it may be formed by printing a tungsten paste on a green sheet to be the insulating substrate 8 and firing it together with the green sheet.

  The first connection pad 23 and the second connection pad 24 are formed of a metal material such as copper, silver, gold, palladium, tungsten, copper, aluminum, and the like, similar to the first electrode 7 and the second electrode 12 described above. -Silver-based, tin-silver-copper-based solder, gold-tin solder, etc., low melting solder, silver-germanium, etc., high-melting solder, conductive organic resin, seam welding, electron beam welding, etc. It is made of a metal material that can be joined by a welding method.

  The microelectronic mechanical component sealing substrate 3 according to this embodiment includes a plurality of first electrodes 7 and a plurality of second electrodes 12, and includes a grounding conductor 22 formed inside the insulating substrate 8. The conductor 22 is led to the first region on the first main surface of the insulating substrate 8 and electrically connected to at least one of the first electrodes 7, and the conductor 22 on the first main surface of the insulating substrate 8. And a second end portion 32 led to the second region and electrically connected to at least one of the second electrodes 12. A first connection pad 23 is provided on the first end portion 31, and a second connection pad 24 is provided on the second end portion 32. In such a configuration, when a ground potential is supplied to the grounding conductor 22, the ground state between the microelectromechanical component 2 having the microelectromechanical mechanism 6 and the electronic component 4 can be stabilized. 6, the electrical characteristics change due to high frequency noise propagated from the outside through the first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11 from the outside and the destruction of the microelectromechanical mechanism 6 are unlikely to occur. The electronic mechanical device 21 can be operated more normally and stably.

  In the micro electro mechanical component sealing substrate 3 according to the present embodiment, the grounding conductor 22 is led out to the second main surface facing the first main surface of the insulating substrate 8 or the side surface of the insulating substrate 8. It is preferable to provide the three end portions 33. With such a configuration, since the ground potential can be supplied to the grounding conductor 22 via the third end portion, the propagation mode mismatch induced by the instability of the high-frequency ground is reduced. Therefore, it is possible to effectively remove harmonic noise that enters from the outside of the microelectromechanical device in which the microelectromechanical mechanism 6 is formed, to operate the microelectromechanical device normally and stably, and to propagate through the microelectromechanical device. Therefore, it is possible to provide a microelectromechanical device in which harmonic noise included in a signal to be transmitted is hardly emitted to the outside of the microelectromechanical device.

  Further, the substrate 3 for sealing micro-electromechanical components according to the present embodiment includes a grounding through conductor 34 formed inside the insulating substrate 8. The grounding through conductor 34 is provided on the first main surface of the insulating substrate 8 and the first end portion 35 led out to the joining portion between the first region of the first main surface of the insulating substrate 8 and the main surface of the semiconductor substrate 5. And a second end portion 36 led out to the opposing second main surface or the side surface of the insulating substrate 8. Here, the grounding through conductor 34 is not necessarily a through conductor to which a ground potential is supplied, but a through conductor to which a reference potential is supplied. Here, the bonding material 14 for bonding the main surface of the semiconductor substrate 5 and the first region of the first main surface of the insulating substrate 8 is made of a conductive material. The grounding conductor 22 is preferably electrically connected to the grounding through conductor 34. With such a configuration, for example, when a ground potential is supplied to the second end portion 36 via the external terminal 13, a stable ground network can be formed, so that a good shielding property can be obtained. In addition, since the ground network path is shortened and an increase in inductance component can be prevented, a grounded state can be stably formed, and good electromagnetic shielding properties can be maintained. Therefore, it is difficult to be influenced by the harmonic noise that enters from the outside of the microelectromechanical device in which the microelectromechanical mechanism 6 is formed, and at the same time, the harmonic noise included in the signal propagating through the microelectromechanical device is It is possible to provide a microelectromechanical device that is hardly released to the outside.

  Although only the grounding conductor 22 or only the grounding through conductor 34 may be provided in the insulating substrate 8, if both the grounding conductor 22 and the grounding through conductor 34 are provided, the main surface of the semiconductor substrate 5 Since a ground network including a conductive bonding material for bonding the first main surface of the insulating substrate 8 is formed, good shielding properties can be obtained. Here, the grounding through conductor 34 has been described separately from the grounding conductor 22, but the grounding through conductor 34 can also be regarded as a part of the grounding conductor 22. In this case, it can be considered that the grounding conductor 22 has a fourth end portion 36 led out to a joint portion between the first region of the first main surface of the insulating substrate 8 and the main surface of the semiconductor substrate 5.

  FIG. 3 is a cross-sectional view showing an example of an embodiment of a substrate for encapsulating a microelectromechanical component having a plurality of shapes according to the present invention. In FIG. 3, the same components as those in FIG. .

  A plurality of micro electro mechanical component sealing substrates 41 shown in FIG. 3 have a plurality of sealing regions 42 constituting the micro electro mechanical component sealing substrate 6. The plurality of microelectromechanical component sealing substrates 41 having a plurality of shapes are electrically connected to a plurality of microelectromechanical mechanisms 6 and microelectromechanical mechanisms 6 that are formed on the main surface of the semiconductor mother board and arranged in rows and columns. It is possible to hermetically seal each microelectromechanical mechanism 6 in a microelectromechanical component substrate having a plurality of shapes having a plurality of first electrodes 7 arranged in rows and columns.

  According to the substrate 41 for sealing a plurality of microelectromechanical components, the microelectromechanical mechanisms 6 formed on the main surface of the microelectromechanical component substrate having a plurality of caps can be collectively sealed. Therefore, a large number of micro electro mechanical devices having the micro electro mechanical component sealing substrate 6 can be manufactured easily and reliably, and the productivity can be improved.

  Next, a method for manufacturing the above-described microelectromechanical device will be described with reference to FIGS.

  4 is a diagram showing an example of a manufacturing method of the micro electro mechanical device 1 according to the first embodiment in the order of steps. In FIG. 4, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  First, as shown in FIG. 4A, a plurality of microelectromechanical component substrates 51 are prepared. A micro-electromechanical component substrate 51 in a multi-cavity form includes a micro-electromechanical component region 52 in which a micro-electromechanical mechanism 6 and a first electrode 7 electrically connected thereto are formed on the main surface of a semiconductor substrate 5. Are arranged in rows and columns.

  The semiconductor substrate 5 is made of a silicon substrate such as single crystal or polycrystal. A silicon oxide layer is formed on the surface of the silicon substrate, and a micro-electromechanical mechanism 6 such as a micro vibrating body and a conductor such as a circular pattern are applied by applying a micro wiring processing technique such as photolithography. A plurality of micro electro mechanical component substrates 51 are formed by arranging a plurality of micro electro mechanical component regions 52 in which 7 is formed.

  In this example, the microelectromechanical mechanism 6 and the first electrode 7 are electrically connected to each other through fine wiring (not shown) formed on the main surface of the semiconductor substrate 5.

Next, as shown in FIG. 4B, a plurality of vertical and horizontal arrays are formed on one main surface of the insulating mother substrate.
A substrate 53 for encapsulating micro-electromechanical components in a plurality of forms is prepared.

  For example, if the insulating mother substrate is made of an aluminum oxide sintered body and the first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11 are made of tungsten, aluminum oxide, silicon oxide, calcium oxide, etc. The raw material powder is kneaded with an organic resin and a binder to obtain a slurry, and the slurry is formed into a sheet shape by a doctor blade method or a lip coater method to form a plurality of green sheets, on the surface of the green sheet, And if necessary, it can be formed by printing and filling a metallized paste of tungsten into a through-hole previously formed in the green sheet, and then laminating and firing these green sheets.

  Of these green sheets, some of them are punched to form square-shaped openings vertically and horizontally, which are arranged on the outermost layer on the one main surface side of the insulating mother board. Alternatively, several layers may be laminated from the outermost layer toward the inside, and a recess may be formed on one main surface of the fired insulating mother substrate. If a part of the micro electro mechanical mechanism 6 is accommodated in the recess, the height of the bonding material 11 for surrounding the micro electro mechanical mechanism 6 can be kept low, and the low height of the micro electro mechanical apparatus 1 can be reduced. This is advantageous for the conversion.

  Next, as shown in FIG. 4C, a plurality of electronic components 4 each having a second electrode 12 connected to the corresponding first electrode 7, and each first electrode 7 of the micro-electromechanical component substrate 51, While electrically connecting one end of the corresponding wiring conductor, a plurality of micro electro mechanical component substrates 51 and a plurality of micro electro mechanical component sealing substrates 53 are joined to each micro electro machine. Each mechanism 6 is hermetically sealed.

  The joining of the substrate 53 for encapsulating a plurality of microelectromechanical components and the microelectromechanical component substrate 51 having a plurality of configurations is performed by soldering tin-silver or the like, a low melting point solder such as gold-tin solder, It can be performed by a method of bonding via a bonding material such as a high melting point brazing material such as silver-germanium, a conductive organic resin, or a welding method such as seam welding or electron beam welding.

  Next, as shown in FIG. 4D, regions other than the micro-electromechanical component region 52 in the micro-electromechanical component substrate 51 having a plurality of shapes are removed by cutting such as dicing.

  Next, as shown in FIG. 4E, the electronic component 4 is mounted on one main surface of the micro-electromechanical component sealing substrate 53 in the form of multiple pieces exposed by removal. The electronic component 4 includes a semiconductor element in which a signal processing circuit is formed, and components such as a capacitor and an inductor. The electronic component 4 is mounted by, for example, heat-treating them in a reflow furnace at a temperature of about 250 ° C. to 300 ° C., for example, when made of tin-silver solder.

  Next, as shown in FIG. 4F, the micro electro mechanical component sealing substrate 53 having a plurality of shapes is divided by performing a cutting process such as a dicing process for each sealing region 54.

  According to the method of manufacturing a microelectromechanical device of the present invention, a plurality of microelectromechanical mechanisms can be hermetically sealed simultaneously in a plurality of microelectromechanical component regions. A large number of microelectromechanical devices each including an electronic mechanical component sealing substrate can be manufactured easily and reliably.

  In addition, since the micro electro mechanical mechanism 6 is sealed by a plurality of micro electro mechanical component sealing substrates 41 at the time of the division, the semiconductor substrate 5 such as silicon generated by the division by dicing or the like is used. The cutting scraps do not adhere to the micro electro mechanical mechanism 6, and the micro electro mechanical mechanism 6 can be reliably operated in the micro electro mechanical device after the division.

  The microelectromechanical device thus manufactured is already hermetically sealed, and its electrodes are led out through the first wiring conductor 9, the second wiring conductor 10, and the third wiring conductor 11. Since it is in a state of being mounted, it is not necessary to add a process for mounting it in a separate package, and it can be mounted on an external electric circuit board simply by connecting to an external electric circuit via a solder ball or a metal bump. Can be used.

  In addition, this invention is not limited to the example of above-mentioned embodiment, A various deformation | transformation is possible if it is in the range of the summary of this invention.

  For example, in the above-described embodiments, one microelectromechanical mechanism is hermetically sealed in one microelectromechanical apparatus. However, a plurality of microelectromechanical mechanisms are hermetically sealed in one microelectromechanical apparatus. May be.

  In the example shown in FIG. 1, the wiring conductor is led out to the other main surface side of the insulating substrate 8, but this is led out to the side surface or led to both the side surface and the other main surface. Also good.

  Further, the electrical connection of the derived portion to an external electric circuit is not limited to being performed via a solder ball as an external terminal, and may be performed via a lead terminal, a conductive adhesive, or the like.

It is sectional drawing which shows an example of embodiment of the board | substrate for micro electro mechanical component sealing of this invention. It is sectional drawing which shows the other example of embodiment of the board | substrate for micro electro mechanical component sealing of this invention. It is sectional drawing which shows an example of embodiment of the board | substrate for microelectromechanical component sealing of the multiple picking form of this invention. (A)-(f) is the figure which showed an example of the manufacturing method of the micro electromechanical device of this invention in order of a process, respectively. It is sectional drawing which shows an example of the conventional board | substrate for micro electro mechanical parts sealing, and the micro electro mechanical apparatus which uses it.

Explanation of symbols

1: Micro-electromechanical device 2: Micro-electro-mechanical component 3: Substrate for micro-electro-mechanical component sealing 4: Electronic component 5: Semiconductor substrate 6: Micro-electromechanical mechanism 7: First electrode 8: Insulating substrate 9: First wiring Conductor 10: Second wiring conductor 11: Third wiring conductor 12: Second electrode 22: Grounding conductor 23: First connection pad 24: Second connection pad 34: Grounding through conductor

Claims (9)

Airtight sealing of the microelectromechanical mechanism of a microelectromechanical component having a semiconductor substrate, a microelectromechanical mechanism formed on a main surface of the semiconductor substrate, and a first electrode electrically connected to the microelectromechanical mechanism And a substrate for encapsulating a micro-electromechanical component on which an electronic component having a second electrode electrically connected to the first electrode is mounted,
An insulating substrate having a first main surface bonded to the main surface of the semiconductor substrate so as to hermetically seal the micromechanical mechanism;
A wiring conductor formed inside the insulating substrate;
The first main surface has a first region bonded to the main surface of the semiconductor substrate and a second region on which the electronic component is mounted,
The wiring conductor is led to the first region on the first main surface and electrically connected to the first electrode, and is led to the second region on the first main surface and connected to the second electrode. A substrate for sealing a micro-electromechanical component, comprising: the other end electrically connected. A plurality of the first and second electrodes are present, a plurality of wiring conductors are arranged, and the wiring conductor is centered between the micro-electromechanical component and the electronic component when viewed in plan through the insulating substrate. 2. The substrate for encapsulating micro-electromechanical components according to claim 1, wherein the substrate is arranged symmetrically with respect to a straight line passing therethrough. The at least one wiring arranged at a position closest to the straight line among the plurality of wiring conductors when viewed through the insulating substrate in a plan view has a shortest length among the plurality of wiring conductors. Item 3. The microelectromechanical device according to Item 2. A plurality of the first electrode and the second electrode, respectively;
A grounding conductor formed inside the insulating substrate;
The grounding conductor is led to the first region on the first main surface and is electrically connected to at least one of the first electrodes, and the second region on the first main surface. And a second end electrically connected to at least one of the second electrodes, and for sealing a microelectromechanical component according to any one of claims 1 to 3. substrate. 5. The minute electrode according to claim 4, wherein the grounding conductor includes a third end portion led out to a second main surface facing the first main surface of the insulating substrate or a side surface of the insulating substrate. Electromechanical component sealing substrate. The main surface of the semiconductor substrate and the first region of the first main surface of the insulating substrate are bonded via a conductive bonding material,
The said grounding conductor is provided with the 4th edge part derived | led-out by the junctional part of the said 1st area | region in the said one main surface of the said insulated substrate, and the main surface of the said semiconductor substrate, The Claim 5 characterized by the above-mentioned. Substrate for encapsulating micro electromechanical parts. A substrate for encapsulating a micro electro mechanical component having a plurality of forms, comprising a plurality of sealing regions constituting the micro electro mechanical component encapsulating substrate according to claim 1. A microelectromechanical device comprising the microelectronic mechanical component sealing substrate according to claim 1, the microelectromechanical component, and the electronic component. A plurality of microelectromechanical component regions in which a microelectromechanical mechanism and a first electrode electrically connected to the microelectromechanical mechanism are formed are arranged in at least one direction on a semiconductor substrate. The electromechanical component region is a step of preparing a plurality of microelectromechanical component substrates arranged in a fixed interval in the one direction;
A step of preparing a substrate for encapsulating a microelectromechanical component having a plurality of shapes according to claim 7;
Preparing a plurality of electronic components each having a second electrode connected to the corresponding first electrode;
The first electrodes of the micro-electromechanical component substrate and one end of the first wiring conductor corresponding to the first electrodes are electrically connected, and the plurality of micro-electromechanical component substrates and the micro-electro-mechanical component substrate A step of hermetically sealing each of the microelectromechanical mechanisms by bonding an electronic mechanical component sealing substrate;
Removing a region other than the micro-electromechanical component region in the micro-electromechanical component substrate of the multiple-capture form;
A step of mounting the plurality of electronic components on the one main surface of the substrate for encapsulating micro-electromechanical components in the plurality of forms exposed by the removal;
And a step of dividing the plurality of micro-electromechanical component sealing substrates in a plurality of forms into the sealing regions.

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