JP4404647B2 - Electronic device and electronic component sealing substrate - Google Patents

Description

The present invention relates to an electronic device having a structure in which an electronic component in which a micro-electromechanical mechanism and electrodes electrically connected thereto are formed on a main surface of a semiconductor substrate are hermetically sealed, and to seal the electronic device those related to the electronic component sealing board.

  2. Description of the Related Art In recent years, an electronic component that forms a very small electromechanical mechanism, so-called MEMS (Micro Electromechanical System), by applying a processing technology for forming fine wiring such as a semiconductor integrated circuit element on the main surface of a semiconductor substrate such as a silicon wafer. Has been attracting attention, and is being developed for practical use.

  Such microelectromechanical mechanisms include sensors such as accelerometers, pressure sensors, and actuators, micromirror devices with movable micromirrors, optical devices, microchemical systems incorporating micropumps, etc. Prototypes and developments have been made that span a very wide range of fields.

  An electronic component formed with such a micro electro mechanical mechanism is an external device in the form of an electronic device that is hermetically sealed with a sealing member in order to operate the micro electro mechanical mechanism normally over a long period of time. Implemented in and used.

  An example of a conventional electronic device is shown in a sectional view in FIG. In the example shown in FIG. 4, power is supplied to the main surface of the semiconductor substrate 21 on which the micro electro mechanical mechanism 22 is formed, or an electric signal is transmitted from the micro electro mechanical mechanism 22 to an external electric circuit. Is formed by being electrically connected to the micro electro mechanical mechanism 22, and the semiconductor substrate 21, the micro electro mechanical mechanism 22, and the electrode 23 constitute one electronic component 24. .

  Note that the electronic component 24 is usually formed in a multi-cavity form in which a large number are arranged in a vertical and horizontal direction on the main surface of the semiconductor substrate 21 as described later, and then cut into individual semiconductor substrates 21. Since it is manufactured, in order to prevent foreign matter such as cutting powder from adhering to the microelectromechanical mechanism 22 and hindering the operation during this cutting, it is covered and protected by a glass plate 25 or the like.

  The electronic component 24 is stored in the recess A of the package 31 having the recess A for storing the electronic component, and the electrode 23 of the electronic component 24 is connected to the electrode pad 32 of the package 31 with a conductive connecting material such as a bonding wire 33. Then, the concave portion A of the package 31 is covered with the lid 34 and the electronic component 24 is hermetically sealed in the concave portion A, thereby completing the electronic device. In this case, the electronic component 24 needs to be hermetically sealed in a hollow state so as not to hinder the operation of the microelectromechanical mechanism 22.

  In this electronic device, a microelectronic machine hermetically sealed by connecting a lead-out portion of the wiring conductor 35 previously formed so as to lead out from the electrode pad 32 of the package 31 to an external electric circuit. The mechanism 22 is electrically connected to an external electric circuit through the electrode 23, the bonding wire 33, the electrode pad 32, and the wiring conductor 35.

  In addition, the electronic component 24 is usually manufactured by arranging a large number of elements vertically and horizontally on the main surface of a large-area semiconductor substrate. In this case, a method for manufacturing an electronic device is conventionally as follows. Met. That is, (1) a large number of electronic component regions each formed by forming a microelectromechanical mechanism 22 and electrodes 23 electrically connected thereto on a main surface of a semiconductor substrate having a large area, and a plurality of electronic component regions arranged vertically and horizontally. (2) a step of covering and sealing the microelectromechanical mechanism 22 in each electronic component region with a glass plate 25 or the like so that the periphery thereof is in a hollow state; and (3) ) A process of cutting a wide area semiconductor substrate such as a dicing process to divide each electronic component region into individual electronic components 24; and (4) the individual electronic components 24 in the electronic component storage package 31. And a hermetic sealing process.

  In such a conventional manufacturing method, it is necessary to seal and protect each of a large number of electronic component regions arranged on the main surface of a large-area semiconductor substrate with a glass plate 25 or the like. Each electronic component region once sealed with the glass plate 25 is divided into individual electronic components 24 and then hermetically sealed in the package 31. The electrode 23 is connected to the electrode pad 32 of the package 31, etc. There is a problem that productivity is poor and it is difficult to put to practical use because it is necessary to connect to the outside and connect externally.

  In order to solve this problem, a substrate has been proposed in which a large number of microelectromechanical mechanisms 22 arrayed on the main surface of a semiconductor substrate are collectively covered and sealed. As a substrate for sealing, a substrate made of a semiconductor substrate, a substrate made of a conductive metal plate or the like is known.

  In the case of using a semiconductor substrate as a material, for example, apart from the first semiconductor substrate in which a large number of electronic component areas are arranged on the main surface, a large number of recesses are arranged corresponding to the arrangement of the electronic component areas. A second semiconductor substrate for sealing is prepared, the second semiconductor substrate is covered on the main surface of the first semiconductor substrate, and the concave portion of the second semiconductor substrate covers the electronic component region of the first semiconductor substrate. Thus, a technique has been proposed in which the electronic component region (particularly the microelectromechanical mechanism) of the first semiconductor substrate is sealed inside the second semiconductor substrate (see, for example, Patent Document 1). ).

When a substrate such as a conductive metal plate is used as a material, a pattern groove is formed in the conductive cover substrate and the pattern groove is filled with glass or a ceramic material and flattened. Then, a bonding pattern (electrode pad, etc.) is formed thereon, the electrodes of the electronic component are connected to the bonding pattern, and a conductive cover substrate is bonded to the main surface of the semiconductor substrate. A technique has been proposed in which an electrode pattern for external wiring for leading a bonding pattern to the outside is formed while sealing with glass or glass (see, for example, Patent Document 2).
JP 2001-144117 A JP 2002-43463 A

  However, when an electronic device is formed by hermetically sealing the electronic component region on the main surface of the semiconductor substrate using such a conventional sealing substrate, a large number of electronic component regions are collectively sealed. For example, in the case of a sealing substrate made of a semiconductor substrate as a material, a three-dimensional wiring conductor cannot be formed inside the semiconductor substrate. Therefore, a (second) semiconductor substrate for sealing The wiring conductor cannot be led out from the main surface joined to the (first) semiconductor substrate in which the electronic component regions are arranged to the opposite main surface, and the electrode of the electronic component is the first semiconductor A part of the electrode formed on the main surface of the substrate is extended to the outside of the sealing portion, and the extended portion is connected to an electrode pad of an electronic component storage package or an external electric circuit via a bonding wire. Necessary, mounting process ( Child process from sealing parts region to be connected to an external electric circuit to complete as an electronic device) is long and a problem that there remains the size of individual electronic devices increases. There is also a problem that surface mounting is not possible, which is advantageous for downsizing an electronic system incorporating an electronic device.

  In the case of a sealing substrate made of a conductive metal plate or the like, a pattern once formed on the surface of the metal plate with glass or ceramics so that a conductor pattern such as an electrode pad can be formed on the metal plate. It is difficult to shorten the mounting process of electronic components in this case because it is necessary to form an insulating part by filling a groove or the like, or to form a conductor part on the surface of the insulating part during the mounting process. There is a problem that.

  The present invention has been completed in view of the above-described problems in the prior art, and its object is to easily and reliably seal a microelectromechanical mechanism formed on the main surface of a semiconductor substrate. An object of the present invention is to provide an electronic device capable of easily and reliably externally connecting electrodes formed on a main surface of a semiconductor substrate connected to a mechanical mechanism, and an electronic component sealing substrate therefor.

  Furthermore, the purpose is to enable external connection of the microelectromechanical mechanism in a form that allows surface mounting.

  Another object of the present invention is to provide easy and reliable sealing even if a large number of electronic component regions comprising such micro-electromechanical mechanisms and electrodes are arranged vertically and horizontally on the main surface of the semiconductor substrate. In addition to providing a sealing substrate that can be used, and using the sealing substrate, a large number of electronic devices formed by sealing micro-electromechanical mechanisms can be bundled in a form that can be surface-mounted, for example. Another object of the present invention is to provide an electronic device manufacturing method that can be formed.

An electronic device according to the present invention includes a semiconductor substrate, a microelectromechanical mechanism provided on the main surface of the semiconductor substrate, and provided on the main surface of the semiconductor substrate and electrically connected to the microelectromechanical mechanism. An electronic component having an electrode, an insulating base having one main surface bonded to the main surface of the semiconductor substrate, and the insulating base provided inside the insulating base from the one main surface to the other main surface. a plurality of wiring conductors, wherein the main surface of the semiconductor substrate and the provided between the one main surface of the insulating substrate, the first conductive adhesive for connecting the before and Sharing, ABS line conductor electrode electrically And a frame-like second conductive adhesive provided so as to surround the first conductive adhesive between the main surface of the semiconductor substrate and the one main surface of the insulating substrate. , From the one main surface of the insulating base to the other main surface, It provided inside the rim base, and a part of the electrically connected to said wiring conductor to said second conductive adhesive over conductor layer formed on the one main surface. The micro electro mechanical mechanism of the electronic component is hermetically sealed inside the second conductive adhesive. Preferably, the difference in melting temperature between the first conductive adhesive and the second conductive adhesive is 50 ° C. or less.

Also, before Symbol electronic device, preferably, when viewed in cross section, wherein the semiconductor substrate and the insulating substrate are aligned at both ends by having been subjected to cutting processing to conjugate them. Prior Symbol electronic device, preferably, when viewed in cross section, the second conductive adhesive is positioned on the inner side of the cross-section of both ends of the semiconductor substrate and the insulating substrate.

An electronic component sealing substrate according to the present invention includes a semiconductor substrate, a microelectromechanical mechanism provided on a main surface of the semiconductor substrate, and a microelectromechanical mechanism provided on the main surface of the semiconductor substrate. An electronic component sealing substrate for hermetically sealing the microelectromechanical mechanism of an electronic component having an electrically connected electrode, wherein the main surface is joined to the main surface of the semiconductor substrate an insulating substrate having said from the one main surface of the insulating substrate and a plurality of wiring conductors provided inside of the insulating base to the other main surface provided on the one main surface of the insulating substrate, prior Sharing, ABS line A first conductive adhesive electrically connected to the conductor, and a frame-shaped second conductive adhesive provided on the one main surface of the insulating base so as to surround the first conductive adhesive. Material and from the one main surface to the other main surface of the insulating substrate. Provided inside the insulating base Te, Ru Tei and a portion of which are electrically connected to the wiring conductor to said second conductive adhesive over conductor layer formed on the one main surface. Preferably, the difference in melting temperature between the first conductive adhesive and the second conductive adhesive is 50 ° C. or less. Preferably, the height of the first conductive adhesive is the same as the height of the second conductive adhesive.

Further, in the substrate for electronic component sealing of the present invention, preferably, the electrically Some connected the wiring conductor in the second conductive adhesive, through conductor provided inside the insulating substrate Have Preferably, the insulating base is a laminated body formed by laminating a plurality of insulating layers, and a part of the wiring conductor electrically connected to the second conductive adhesive is the insulating layer. A through conductor penetrating through the substrate. Also preferably, said part of the electrically connected to said wiring conductor in the second conductive adhesive, said through conductors are arranged parallel to the other through conductors which said wiring conductor has.

In the electronic component sealing substrate of the present invention, preferably, the insulating base is made of a glass ceramic sintered body. In the substrate for an electronic component sealing of the present invention, preferably, when viewed in cross section, the second conductive adhesive is positioned at the inner side of the end portion of the semiconductor substrate and the insulating substrate.

  According to the electronic device of the present invention, the wiring conductor is formed from one main surface to the other main surface or the side surface of the insulating base, and electrically connected to the wiring conductor on the one main surface of the insulating base. A connection pad to which an adhesive is attached, an electronic component sealing substrate to which a frame-like second adhesive is attached so as to surround the connection pad, and a microelectromechanical mechanism on the main surface of the semiconductor substrate And an electronic component having an electrode electrically connected thereto, the electrode of the electronic component being joined to a connection pad of the electronic component sealing substrate via a first adhesive and the semiconductor substrate The main surface of the electronic component is joined to one main surface of the insulating base via a frame-shaped second adhesive, and the microelectromechanical mechanism of the electronic component is hermetically sealed inside the frame-shaped second adhesive. Because it stops, the main surface of the second adhesive Only by joining the main surface of the semiconductor substrate, the micro electronic mechanical system of the electronic component can be easily and reliably sealed by the second adhesive material and the insulating substrate. In addition, since the electrodes of the electronic component are connected to the connection pads of the electronic component sealing substrate, and the connection pads are led out to the other main surface or side surface of the insulating base via the wiring conductor, the electrodes can be easily and reliably externally connected. Can be connected.

  In the electronic device of the present invention, for example, the insulating base of the electronic component sealing substrate is formed using a ceramic multilayer wiring board or the like, so that the wiring conductor is connected to the connection pad or the second adhesive. From one main surface that is formed and attached to the other main surface or side surface, it can be freely formed inside and on the surface of the insulating substrate and led out, and metal bumps for external connection are attached to the derived end portions. By attaching it or the like, an electronic device that can be easily surface-mounted can be obtained.

  The electronic component sealing substrate of the present invention is used in the electronic device having the above-described configuration, and includes an insulating base and a wiring led out from one main surface to the other main surface or side surface of the insulating base. A conductor, a connection pad formed on one main surface of the insulating base, electrically connected to the wiring conductor and having a first adhesive attached thereto, and the connection pad on one main surface of the insulating base; A frame-shaped second adhesive material that is attached to surround the wiring substrate, the wiring conductor, a connection pad to which the first adhesive material is attached, and a frame-shaped second adhesive material. Since at least one electronic component sealing region with the second adhesive as a unit is formed, the micro-electromechanical mechanism can be easily achieved by simply joining the second adhesive to the main surface of the semiconductor substrate. In addition, it can be securely sealed and connected to the connection pad. The electrodes to be, can be easily and reliably externally connected through the wiring conductor.

  According to the electronic component sealing substrate of the present invention, the insulating base has a wiring conductor, a connection pad to which the first adhesive is attached, and a frame-like second adhesive as a unit. If a large number of electronic component sealing regions are arranged in the vertical and horizontal directions, even if a large number of regions to be the electronic components are arranged on the main surface of a large-area semiconductor substrate, these electronic component regions are Sealing can be performed in a lump, and a large number of microelectromechanical mechanisms can be easily sealed.

  In the electronic component sealing substrate of the present invention, when the first adhesive and the second adhesive have a difference in melting temperature of 50 ° C. or less, the difference in melting temperature is small. The first adhesive and the second adhesive are heated and melted at the same time, and the first adhesive and the electrodes of the electronic component are bonded together, and the second adhesive and the main surface of the semiconductor substrate are bonded simultaneously. Further, it is easier to perform firmly, and the sealing of the micro-electromechanical mechanism and the external connection of the electrodes of the electronic component can be made more reliable and easy.

  Further, in the electronic component sealing substrate of the present invention, when the heights of the first adhesive and the second adhesive are the same, the electrode and the connection pad that are joined via the first adhesive And the distance between the one main surface of the insulating base and the main surface of the semiconductor substrate joined via the second adhesive are the same, so that the electrical connection between the electrode and the connection pad In addition, the sealing of the microelectromechanical mechanism can be made easier and more reliable.

  In addition, according to the method for manufacturing an electronic device of the present invention, since each of the above steps is provided, the connection for the external connection of each electrode and the microelectronics are made for a large number of electronic component regions arranged in rows and columns. Since the mechanical mechanism can be sealed at the same time, a multi-piece electronic device composed of the electronic component region and the electronic component sealing region joined to each other can be easily and reliably manufactured.

  Each of the electronic components is hermetically sealed with an electronic component sealing substrate by dividing each region to be an electronic device composed of the electronic component region and the electronic component sealing region joined together. A large number of electronic devices can be manufactured simultaneously.

  At the time of this division, the microelectromechanical mechanism in the electronic component area is sealed by the corresponding electronic component sealing area, so that the cutting powder of the semiconductor substrate such as silicon generated by the dicing process is transferred to the microelectronic machine. There is no adhesion to the mechanism, and the microelectromechanical mechanism can be reliably operated in the divided electronic device.

  In addition, since the wiring conductor is led out to the other main surface or side surface of the insulating base, the electronic device obtained by dividing the surface can be obtained simply by attaching a terminal such as a metal bump to the lead end. The electronic device can be mounted on the external electric circuit board by mounting or the like, and the mounting process can be made extremely short and easy.

For the electronic devices and electronic components for encapsulating board of the present invention will be described in detail below.

  FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic device of the present invention and an electronic component sealing substrate used in the electronic device.

In FIG. 1, 1 is an insulating substrate, 2 is a wiring conductor, 3 is a connection pad, 4 is a first adhesive (first conductive adhesive, the same applies hereinafter) , and 5 is a second adhesive (second Of the conductive adhesive, the same shall apply hereinafter) . An electronic component sealing substrate 6 is formed by the insulating base 1, the wiring conductor 2, the connection pad 3, the first adhesive 4 and the second adhesive 5.

  The electronic component sealing substrate 6 is used to form a microelectromechanical mechanism 8 and an electrode 9 on the main surface (lower surface in the example of FIG. 1) of the semiconductor substrate 7 so as to be electrically connected to each other. By sealing the electronic component 10 formed, an electronic device is formed in which the microelectromechanical mechanism 8 is sealed in a state where it can be externally connected.

  The insulating base 1 functions as a lid for sealing the microelectromechanical mechanism 8 and forms and attaches the wiring conductor 2, the connection pad 3, the first adhesive 4, and the second adhesive 5. It functions as a base for this purpose.

  This insulating substrate 1 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, a glass ceramic sintered body, or the like. It is formed of an organic resin material such as polyimide or glass epoxy resin, or a composite material formed by bonding inorganic powder such as ceramics or glass with an organic resin such as epoxy resin.

  If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, the insulating substrate 1 is formed by laminating and firing a green sheet formed by forming aluminum oxide and a raw material powder such as glass powder on the sheet. . The insulating substrate 1 is not limited to the one formed of an aluminum oxide sintered body, and it is preferable to select a suitable one according to the application and the characteristics of the electronic component 10 to be hermetically sealed.

  For example, since the insulating base 1 is mechanically bonded to the semiconductor substrate 7 via the second adhesive 5 as described later, the reliability of bonding with the semiconductor substrate 7, that is, the micro electro mechanical mechanism 8 In order to increase the hermeticity of sealing, mullite sintered body, for example, aluminum oxide-borosilicate acid whose thermal expansion coefficient is approximated to the semiconductor substrate 7 by adjusting the kind and addition amount of the glass component It is preferable to use a material having a small difference in thermal expansion coefficient from the semiconductor substrate 7, such as a glass ceramic sintered body of glass or the like.

  In addition, in the case of preventing the delay of the electrical signal transmitted by the wiring conductor 2, the insulating base 1 is made of an organic resin material such as polyimide or glass epoxy resin, or an inorganic powder such as ceramic or glass such as epoxy resin. It is preferably formed of a composite material formed by bonding with an organic resin, or a material having a low relative dielectric constant such as a sintered glass ceramic such as aluminum oxide-borosilicate glass or lithium oxide.

  In addition, the insulating substrate 1 has a large calorific value of the micro-electromechanical mechanism 8 to be sealed, and in the case where the heat dissipating property is good, heat such as an aluminum nitride sintered body is used. It is preferable to form with a material having high conductivity.

In addition, a concave portion 1 a may be formed on one main surface of the insulating substrate 1 so as to accommodate the microelectromechanical mechanism 8 of the electronic component 10 inside. If a part of the micro electro mechanical mechanism 8 is accommodated in the recess 1a, the height of the second adhesive 5 for enclosing the micro electro mechanical mechanism 8 can be kept low, and the low height of the electronic device can be reduced. This is advantageous for the conversion.

  A wiring conductor 2 is led out from one main surface of the insulating substrate 1 (side sealing the micro electro mechanical mechanism 8) to the other main surface or side surface.

  In addition, a connection pad 3 connected to the wiring conductor 2 is formed in a portion inside the second adhesive 5 on the one main surface side of the insulating base 1.

  The wiring conductor 2 and the connection pad 3 are electrically connected to the electrode 9 of the electronic component 10 via the first adhesive 4 formed on the connection pad 3, and this is connected to the other main surface of the insulating substrate 1. And has a function to derive to the side.

  These wiring conductors 2 and connection pads 3 are formed of a metal material such as copper, silver, gold, palladium, tungsten, molybdenum, and manganese. As a means for the formation, a means for depositing a metal such as a metallized layer, a plating layer, or vapor deposition as a thin film layer can be used. For example, in the case of a metallized layer of tungsten, it is formed by printing a tungsten paste on a green sheet to be the insulating substrate 1 and firing it together with the green sheet.

The first adhesive 4 has a function of electrically connecting the electrode 9 of the electronic component 10 and the connection pad 3 , such as tin-silver, tin-silver-copper solder, gold-tin solder, etc. It is formed of a low melting point brazing material, a high melting point brazing material such as silver-germanium, and a conductive bonding material such as a conductive organic resin.

  By bonding the first adhesive 4 to the electrode 9 of the electronic component 10, the electrode 9 of the electronic component 10 is connected to the insulating base 1 via the first adhesive 4, the connection pad 3 and the wiring conductor 2. The other main surface or side surface is derived. And the electrode 9 of the electronic component 10 is electrically connected with an external electric circuit by joining this derived | led-out edge part to an external electric circuit via tin-lead solder etc. FIG.

  The first adhesive material 4 is made by kneading a powder such as a tin-silver solder, a low-melting solder such as gold-tin solder, or a high-melting solder such as silver-germanium together with an organic solvent and a binder. The conductive paste thus produced is attached by printing on the surface of the connection pad 3 by a technique such as screen printing.

  A second adhesive 5 is attached to one main surface of the insulating base 1 so as to surround the connection pad 3.

  The second adhesive 5 functions as a side wall for hermetically sealing the microelectromechanical mechanism 8 of the electronic component 10 inside thereof.

  The main surface (the upper surface in the example of FIG. 1) of the second adhesive material 5 is bonded to the main surface (the lower surface in the example of FIG. 1) of the semiconductor substrate 7, so that microelectrons are formed inside the second adhesive material 5. The mechanical mechanism 8 is hermetically sealed. In this case, the semiconductor substrate 7 serves as a bottom plate and the insulating substrate 1 serves as a lid.

  The second adhesive 5 is formed of a conductive bonding material such as a tin-silver solder, a low melting solder such as gold-tin solder, or a high melting solder such as silver-germanium. For example, as in the case of the first adhesive 4, the conductivity of paste-like tin-silver solder, low-melting solder such as gold-tin solder, high-melting solder such as silver-germanium, etc. The bonding material is formed by printing on the one main surface of the insulating substrate 1 in a frame shape surrounding the connection pad 3 by a technique such as screen printing.

  The semiconductor substrate 7 is made of a silicon substrate such as a single crystal or polycrystal, and a microelectromechanical mechanism 8 and an electrode 9 electrically connected thereto are formed on the main surface.

  The micro electro mechanical mechanism 8 in the present invention includes, for example, an electric switch, an inductor, a capacitor, a resonator, an antenna, a micro relay, an optical switch, a magnetic head for a hard disk, a microphone, a biosensor, a DNA chip, a microreactor, a print head, an acceleration sensor, It is an electronic device that has the functions of various sensors such as pressure sensors and display devices, and is a component produced by so-called micromachining based on semiconductor microfabrication technology, and has a size of about 10 μm to several 100 μm per element Have.

  The electrode 9 is made of a conductor such as metal and is formed in a pattern such as a circle or a rectangle. The electrical connection between the electrode 9 and the microelectromechanical mechanism is performed via a fine wiring formed on the main surface of the semiconductor substrate.

  And about the electronic component 10 formed by forming the micro electromechanical mechanism 8 and the electrode 9 electrically connected to the main surface of the semiconductor substrate 7, the electrode 9 is joined to the first adhesive 4, and the semiconductor substrate 7 is joined to the main surface of the second adhesive material 5 to form an electronic device in which the microelectromechanical mechanism 8 of the electronic component 10 is hermetically sealed inside the second adhesive material 5. .

  By connecting the lead-out portion of the wiring conductor 2 of this electronic device to an external electric circuit via an external terminal 11 such as a solder ball, the microelectromechanical mechanism 8 is electrically connected to the external electric circuit.

  According to the electronic device of the present invention, the microelectromechanical mechanism 8 of the electronic component 10 can be bonded to the second adhesive simply by joining the main surface of the second adhesive 5 to the main surface of the semiconductor substrate 7 as described above. The material 5 and the insulating substrate 1 can be easily and reliably sealed. Further, since the electrode 9 of the electronic component 10 is connected to the connection pad 3 of the electronic component sealing substrate 6, and the connection pad 3 is led out to the other main surface or side surface of the insulating base 1 through the wiring conductor 2, The electrode 9 can be easily and reliably externally connected.

  In the electronic device of the present invention, for example, the insulating base 1 of the electronic component sealing substrate 6 is formed by using a ceramic multilayer wiring board or the like, whereby the wiring conductor 2 is connected to the connection pad 3 or the second wiring board 2. The adhesive 5 is formed and attached to the other main surface or side surface from one main surface to the other main surface or side surface, and can be freely formed and led to the inside of the insulating substrate 1. By attaching the external terminal 11 made of a metal bump for connection, an electronic device that can be easily surface-mounted can be obtained.

  As shown in FIG. 1, a conductor layer 3a is formed on the main surface of the insulating substrate 1 to which the second adhesive material 5 is bonded using the same material as the connection pad 3, and is insulated from the conductor layer 3a. A part of the wiring conductor 2 may be led out to the other main surface of the substrate 1. The lead-out portion of the wiring conductor 2 led out from the conductor layer 3a can be connected to the grounding terminal of the external electric circuit or the like via the external terminal 11 or the like.

  The electronic component sealing substrate 6 of the present invention is used for forming an electronic device having the above-described configuration. As shown in FIG. 2, the insulating base 1 and the main surface of the insulating base 1 to the other The wiring conductor 2 led out to the main surface or the side surface and the connection pad 3 formed on one main surface of the insulating base 1 and electrically connected to the wiring conductor 2 and having the first adhesive 4 attached thereto. And a frame-shaped second adhesive 5 attached to one main surface of the insulating base 1 so as to surround the connection pad 3. The wiring base 2 and the first adhesive are attached to the insulating base 1. At least one electronic component sealing region 6a having the connection pad 3 to which the material 4 is attached and the frame-like second adhesive material 5 as one unit is formed. In FIG. 2, the same parts as those in FIG.

  Since the electronic component sealing substrate of the present invention has the above-described configuration, it is possible to easily and reliably seal the microelectromechanical mechanism 8 simply by bonding the second adhesive 5 to the main surface of the semiconductor substrate 7. In addition, the electrode 9 connected to the connection pad 3 can be easily and reliably externally connected via the wiring conductor 2.

  According to the electronic component sealing substrate of the present invention, the wiring conductor 2, the connection pad 3 to which the first adhesive 4 is attached, and the frame-shaped second adhesive 5 are attached to the insulating base 1. If a large number of electronic component sealing regions 6a are arranged in the vertical and horizontal directions as a unit, a large number of electronic component regions 10a to be the electronic components 10 are formed on the main surface of the semiconductor substrate 7 having a large area. Even in such a case, these electronic component regions 10a can be collectively sealed, and a large number of microelectromechanical mechanisms 8 can be easily sealed.

  In addition, in this way, an electronic component 10 manufactured in a multi-cavity form in which a large number of microelectromechanical mechanisms 8 and electrodes 9 electrically connected thereto are arranged on the main surface of the semiconductor substrate 7. Are collectively sealed, the semiconductor substrate 7 (and the electronic component sealing substrate 6) is subjected to a cutting process such as a dicing process and divided into individual electronic components 10 (electronic devices). Thus, it is possible to effectively prevent the occurrence of a problem that cutting powder or the like generated along with cutting adheres to the microelectromechanical mechanism 8 and interferes with its operation.

Further, in the electronic component sealing substrate 6 of the present invention, when the difference in melting temperature between the first adhesive 4 and the second adhesive 5 is 50 ° C. or less , the difference in melting temperature is small. The first adhesive 4 and the second adhesive 5 are simultaneously heated and melted to join the first adhesive 4 and the electrode 9 of the electronic component 10, and the main surface of the second adhesive 5 and the semiconductor substrate 7. Can be more easily and securely joined together, and the connection of the electrode 9 of the electronic component 10 and the sealing of the microelectromechanical mechanism 8 can be made more reliable and easy.

Accordingly, in the electronic component sealing substrate 6 of the present invention, the difference between the melting temperature of the first adhesive 4 and the second adhesive 5 is preferably kept as 50 ° C. or less.

  As a combination that makes such a difference in melting temperature, in addition to the case where the first adhesive 4 and the second adhesive 5 are formed of the same material, tin-silver-copper solder and tin-silver-bismuth solder, Examples include tin-silver-copper solder and tin-zinc-bismuth solder.

  In the electronic component sealing substrate 6 of the present invention, when the first adhesive 4 and the second adhesive 5 have the same height, the distance between the first adhesive 4 and the electrode 9 is the same. Since the distance between the second adhesive 5 and the main surface of the semiconductor substrate 7 is the same, the electrical connection to the electrode 9 and the reliability of hermetic sealing can be ensured better.

  Therefore, in the electronic component sealing substrate 6 of the present invention, it is preferable that the first adhesive 4 and the second adhesive 5 have the same height.

  Next, a method for manufacturing an electronic device using such an electronic component sealing substrate 6 will be described with reference to FIGS. FIG. 3 is a sectional view showing an example of an embodiment of an electronic device manufacturing method according to the present invention in the order of steps. In FIG. 3, the same parts as those in FIGS.

  First, as shown in FIG. 3A, a large number of electronic component regions 10a each having a microelectromechanical mechanism 8 and electrodes 9 electrically connected thereto are formed on the main surface of the semiconductor substrate 7. A multi-cavity electronic component 10b arranged in an array is prepared.

  The semiconductor substrate 7 is made of a silicon substrate such as a single crystal or polycrystal.

  A silicon oxide layer is formed on the surface of the silicon substrate, and by applying a fine wiring processing technique such as photolithography, a micro electromechanical mechanism 8 such as a minute vibrating body and an electrode 9 made of a conductor such as a circular pattern are provided. A plurality of electronic component regions 10a are formed by arranging a large number of formed electronic component regions 10a vertically and horizontally. In this example, the microelectromechanical mechanism 8 and the electrode 9 are electrically connected via fine wiring (not shown) formed on the main surface of the semiconductor substrate 7, respectively.

  Next, as shown in FIG. 3 (b), the wiring conductor 2, the connection pad 3 to which the first adhesive 4 is attached, and the frame-like second adhesive 5 are attached to the insulating base 1. An electronic component sealing substrate 6 is prepared in which a large number of electronic component sealing regions 6a are arranged in a vertical and horizontal direction.

  The wiring conductor 2 is formed so as to be led out from the connection pad 3 to the other main surface or side surface of the insulating base 1 in order to connect to the connection pad 3 and lead it to the outside.

  Insulating base 1 on which wiring conductor 2 led out from one main surface to the other main surface or side face is formed, for example, insulating base 1 is made of an aluminum oxide sintered body, and wiring conductor 2 is made of a metallized layer of tungsten. In some cases, a raw material powder such as aluminum oxide, silicon oxide, calcium oxide or the like is kneaded with an organic resin / binder to obtain a slurry, and the slurry is formed into a sheet shape by a doctor blade method, a lip coater method, or the like. A green metal sheet is formed, and a metallized paste of tungsten is printed on the surface of the green sheet and, if necessary, in the through holes previously formed in the green sheet, filled, and then these green sheets Can be formed by laminating and firing.

  Of these green sheets, some of them are punched to form square-shaped openings, etc., which are arranged on the outermost layer on one main surface side, or from the outermost layer to the inside. A plurality of layers may be laminated so that the recesses 1a corresponding to the arrangement of the electronic component regions 10a may be formed on one main surface of the fired insulating base 1 in an array. If the concave portion 1a is formed in this way, the micro electro mechanical mechanism 8 can be accommodated inside the concave portion 1a, so that the height of the second adhesive 5 for surrounding the micro electro mechanical mechanism 8 is lowered. This can be suppressed, which is advantageous for reducing the height of the electronic device.

  Further, the connection pad 3 is usually made of the same material as that of the wiring conductor 2. For example, a tungsten paste is connected to the printed tungsten paste to be the wiring conductor 2 on the outermost surface of the green sheet to be the insulating base 1. In this manner, a large number are arranged in rows and columns and printed by screen printing or the like.

  A first adhesive 4 made of a tin-silver solder, a low melting solder such as gold-tin solder, a high melting solder such as silver-germanium, or the like is attached to the connection pad 3. If the first adhesive 4 is made of, for example, tin-silver solder, the first adhesive 4 is formed by printing the solder paste on the connection pads 3 by a screen printing method or the like.

  Further, on the main surface of the insulating substrate 1, surrounding the connection pads 3, solder such as tin-silver solder, low melting point solder such as gold-tin solder, high melting point solder such as silver-germanium, etc. A frame-like second adhesive material 5 is attached.

  If the second adhesive 5 is made of, for example, tin-silver solder, the solder paste is printed on the insulating substrate 1 in a predetermined frame pattern by screen printing or the like. It is formed.

  Next, as shown in FIG. 3 (c), the multi-piece electronic component 10b is superimposed on the electronic component sealing substrate 6 so that each electronic component region 10a and each electronic component sealing region 6a correspond to each other. The electrode 9 is bonded to the first adhesive 4, and the main surface of the semiconductor substrate 7 around the micro electro mechanical mechanism 8 is bonded to the main surface of the second adhesive 5, so that the micro electro mechanical mechanism 8 is 2 is hermetically sealed inside the adhesive 5.

Here, the bonding between the electrode 9 and the first adhesive 4 and the bonding between the second adhesive 5 and the main surface of the semiconductor substrate 7 around the microelectromechanical mechanism 8 are, for example, the first adhesive 4 and the second adhesive 5 are both made of tin-silver solder, the first adhesive 4 and the second adhesive 5 are aligned and placed on the electrode 9 , For example, the heat treatment is performed in a reflow furnace at a temperature of about 200 ° C. to 300 ° C.

As described above, according to the method for manufacturing an electronic device of the present invention, bonding for leading out the electrode 9 in the electronic component region 10a and bonding for hermetic sealing of the microelectromechanical mechanism 8 are simultaneously performed. Therefore, it is possible to reliably reduce at least one step of joining such as soldering that requires several hours as compared with the conventional manufacturing method, so that the productivity of electronic devices is greatly increased. Can do.

In this case, if the difference in melting temperature between the first adhesive 4 and the second adhesive 5 is set to 50 ° C. or less , the bonding between the first adhesive 4 and the electrode 9 of the electronic component 10, and the first when the Hare simultaneously row bond the second major surface of the adhesive 5 and the semiconductor substrate 7, the difference in melting and bonding temperature is low, heating and melting the first adhesive 4 and the second adhesive member 5 at the same time Te, bonded to the electrode 9 of the first adhesive 4 and the electronic component 10, and a second junction between the main surface of the adhesive 5 and the semiconductor substrate 7 simultaneously and firmly rows that Ukoto becomes easier can Nau more reliably and easily line more connection and sealing of the micro electronic mechanical system 8 of the electrode 9 of the electronic component 10.

Accordingly, in the manufacturing method of the electronic apparatus of the present invention, the first adhesive 4 and the second adhesive 5, it is preferable to the 50 ° C. or less the difference in melting temperature.

  Further, when the height of the first adhesive 4 and the second adhesive 5 is the same, the distance between the electrode 9 and the connection pad 3 joined via the first adhesive 4, Since the distance between one main surface of the insulating substrate 1 and the main surface of the semiconductor substrate 7 joined through the second adhesive 5 is the same, the electrical connection between the electrode 9 and the connection pad 3 and The reliability of the hermetic sealing of the micro electro mechanical mechanism 8 can be ensured more favorably.

  Therefore, in the method for manufacturing an electronic device according to the present invention, it is preferable that the first adhesive 4 and the second adhesive 5 are set at the same height.

In addition, as a means to make the said 1st adhesive material 4 and the said 2nd adhesive material 5 the same height, if it is a case where the 1st adhesive material 4 is printed by the screen printing method, for example, the bonding material to print It can be adjusted by the coating thickness of the paste.

In addition, when the micro electro mechanical mechanism 8 is sealed as described above, a tin-silver solder or the like functions as a side wall that is bonded to the main surface of the semiconductor substrate 7 and seals the micro electro mechanical mechanism 8. A second adhesive material 5 having a frame shape formed of a conductive bonding material such as a low melting point brazing material such as gold-tin brazing, a high melting point brazing material such as silver-germanium, and the like. Since the bonding material and the like can be firmly bonded to the main surface of the semiconductor substrate 7, the reliability of the hermetic sealing of the microelectromechanical mechanism can be improved.

  Then, as shown in FIG. 3 (d), the multi-piece electronic component 10b and the electronic component sealing substrate 6 joined to each other are divided into electronic component sealing regions 6a, and each electronic component 10 is an electronic component. Individual electronic devices sealed with the sealing substrate 6 are obtained.

  The joined body of the multi-piece electronic component 10b and the electronic component sealing substrate 6 joined to each other can be cut by performing a cutting process such as dicing on the joined body.

  In the method for manufacturing an electronic device according to the present invention, each microelectromechanical mechanism 8 is inside the second adhesive material 5 during the cutting process such as dicing, and the second adhesive material 5 and the semiconductor substrate 7. And the insulating base 1 are hermetically sealed, so that cutting powder such as silicon and ceramics generated when the semiconductor substrate 7 and the insulating base 1 are cut does not adhere to the microelectromechanical mechanism 8. In the completed electronic device, the microelectromechanical mechanism 8 can be reliably operated normally.

  As described above, according to the method for manufacturing an electronic device of the present invention, when cutting the electronic component region 10a in which a large number are vertically and horizontally formed on the main surface of the semiconductor substrate 7 as in the prior art, the microelectronic machine is cut. It is not necessary to add a separate process for protecting the mechanism 8 by covering it with a glass plate or the like, and it is possible to reliably eliminate this process only for protection, so that the productivity of the electronic device is extremely high. It can be.

  Further, the electronic device manufactured in this way is already hermetically sealed, and the electrode 9 is in a state of being led out to the outside through the wiring conductor 2, so that this is separately mounted in a package. There is no need to add such a process, and the portion where the wiring conductor 2 is led out is simply connected to an external electric circuit via an external terminal 11 such as a solder ball, and mounted on an external electric circuit board for use. Can do.

  Further, in this case, since the wiring conductor 2 is led out to the other main surface or side surface of the insulating base 1, it can be connected to an external electric circuit in the form of surface mounting, and can be mounted at a high density, The substrate of the electric circuit can be effectively downsized.

  In addition, this invention is not limited to the example of above-mentioned embodiment, A various deformation | transformation is possible if it is in the range of the summary of this invention.

  For example, in the example of the above-described embodiment, one microelectromechanical mechanism is hermetically sealed in one electronic device, but a plurality of microelectromechanical mechanisms may be hermetically sealed in one electronic device.

  Further, in the example shown in FIG. 1, the wiring conductor 2 is led out to the other main surface side of the insulating base 1, but this is led out to the side surface or led to both the side surface and the other main surface. May be. Further, the electrical connection of the derived portion to an external electric circuit is not limited to being performed via a solder ball as an external terminal, and may be performed via a lead terminal, a conductive adhesive, or the like.

It is sectional drawing which shows an example of embodiment of the electronic device of this invention, and the board | substrate for electronic component sealing. It is sectional drawing which shows the other example of embodiment of the board | substrate for electronic component sealing of this invention. (A)-(d) is sectional drawing which showed an example of embodiment of the manufacturing method of the electronic device of this invention in order of the process, respectively. It is sectional drawing which shows an example of the conventional electronic device and a substrate for electronic component sealing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating base | substrate 2 ... Wiring conductor 3 ... Connection pad 3a ... Conductor layer 4 ... 1st adhesive material 5 ... 2nd adhesive material 6 ... .... Electronic component sealing substrate 6a ... Electronic component sealing region 6b ... Electronic component sealing substrate 7 ... Semiconductor substrate 8 ... Micro-electromechanical mechanism 9 ... Electrode 10 ... Electronic parts 10a ... Electronic parts area 10b ... Electronic parts

Claims (12)

An electronic component comprising: a semiconductor substrate; a microelectromechanical mechanism provided on the main surface of the semiconductor substrate; and an electrode provided on the main surface of the semiconductor substrate and electrically connected to the microelectromechanical mechanism. ,
An insulating substrate having one main surface bonded to the main surface of the semiconductor substrate;
A plurality of wiring conductors provided inside the insulating base from the one main surface to the other main surface of the insulating base;
Provided between said main surface and said one main surface of the insulating substrate of the semiconductor substrate, a first conductive adhesive for connecting the before and Sharing, ABS line conductor electrode electrically,
A frame-shaped second conductive adhesive provided so as to surround the first conductive adhesive between the main surface of the semiconductor substrate and the one main surface of the insulating base;
Wherein from the one main surface of the insulating substrate to the other main surface provided inside the insulating substrate, electrically connected to said second conductive adhesive over conductor layer formed on the one main surface and a portion of the wiring conductor,
Wherein the micro electronic mechanical system of an electronic component, an electronic device, wherein the Ru Tei hermetically sealed inside the second conductive adhesive.   The electronic device according to claim 1, wherein the first conductive adhesive and the second conductive adhesive have a difference in melting temperature of 50 ° C. or less. When viewed in cross section, the semiconductor substrate and the insulating substrate, the electronic device according to claim 1 or claim 2 are aligned at both ends by having been subjected to cutting processing to conjugate them. When viewed in cross section, the second conductive adhesive, the electronic device according to claim 3 which is located on the inner side of the cross-section of both ends of the semiconductor substrate and the insulating substrate. An electronic component comprising: a semiconductor substrate; a microelectromechanical mechanism provided on a main surface of the semiconductor substrate; and an electrode provided on the main surface of the semiconductor substrate and electrically connected to the microelectromechanical mechanism. An electronic component sealing substrate for hermetically sealing the microelectromechanical mechanism,
An insulating substrate having one main surface bonded to the main surface of the semiconductor substrate;
A plurality of wiring conductors provided inside the insulating base from the one main surface to the other main surface of the insulating base;
Wherein provided on the one main surface of the insulating substrate, a first conductive adhesive which is electrically connected to the front Sharing, ABS line conductors,
A frame-like second conductive adhesive provided on the one main surface of the insulating base so as to surround the first conductive adhesive;
Wherein from the one main surface of the insulating substrate to the other main surface provided inside the insulating substrate, electrically connected to said second conductive adhesive over conductor layer formed on the one main surface electronic component sealing substrate, wherein the Ru Tei and a portion of the wiring conductor.   The electronic component sealing substrate according to claim 5, wherein the first conductive adhesive and the second conductive adhesive have a difference in melting temperature of 50 ° C. or less.   The electronic component sealing substrate according to claim 5 or 6, wherein a height of the first conductive adhesive is the same as a height of the second conductive adhesive. 8. The electron according to claim 5, wherein a part of the wiring conductor electrically connected to the second conductive adhesive has a through conductor provided inside the insulating base. Component sealing substrate. The insulating base is a laminate formed by laminating a plurality of insulating layers,
9. The electronic component sealing according to claim 5, wherein a part of the wiring conductor electrically connected to the second conductive adhesive has a through conductor penetrating the insulating layer. Substrate. The special electrically connected to said wiring conductor in the second conductive adhesive, wherein the through conductor is pre Sharing, ABS lines claim 8 is arranged parallel to the other through conductors having conductor or The electronic component sealing substrate according to claim 9 .   The electronic component sealing substrate according to claim 5, wherein the insulating base is made of a glass ceramic sintered body. When viewed in cross section, the second conductive adhesive, the electronic component sealing according to claims 5 which is located at the inner side of the end portion of the semiconductor substrate and the insulating substrate to claim 11 Stopping board.

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