JP2005212016A - Electronic part sealing substrate, electronic part sealing substrate for installing a large number and method of manufacturing electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part sealing substrate superior in productivity, electric responsiveness and noise cut performance, when manufacturing an electronic device by airtightly sealing a microelectronic machine mechanism of a main surface of a semiconductor substrate. <P>SOLUTION: This electronic part sealing substrate 6 is composed of an insulating substrate 1 forming a wiring conductor 2 derived to the other main surface or a side surface from one main surface, a connecting pad 3 formed on its one main surface and connected with the wiring conductor 2, a frame member 4 joined to the one main surface of the insulating substrate 1 by surrounding the connecting pad 3, a connecting terminal 5 formed on the connecting pad 3 and having the same height as the frame member 4, an electronic element storing recessed part 12 formed on the other main surface of the insulating substrate 1, and an element connecting pad 13 formed inside the recessed part 12 and electrically connected to the wiring conductor 2. The substrate is constituted by airtightly sealing the microelectronic machine mechanism 8 inside the frame member 4, by joining the main surface of the semiconductor substrate 7 to the main surface of the frame member 4, by joining an electrode 9 of an electronic part 10 forming the microelectronic machine mechanism 8 and the electrode 9 connected to this mechanism on the main surface of the semiconductor substrate 7, to the connecting terminal 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention provides an electronic component sealing method for sealing an electronic component formed by forming an electronic component region formed by forming a microelectromechanical mechanism and an electrode electrically connected to the main surface of a semiconductor substrate. The present invention relates to a method for manufacturing an electronic device formed by sealing a substrate for use, a substrate for encapsulating multiple electronic components, and a microelectromechanical mechanism of the electronic component.

  2. Description of the Related Art In recent years, an electronic component in which a very small electromechanical mechanism, a so-called MEMS (Micro Electromechanical System), is formed by applying a processing technique for forming fine wiring such as a semiconductor integrated circuit element on a main surface of a semiconductor substrate such as a silicon wafer. Has been attracting attention, and is being developed for practical use.

  Such microelectromechanical mechanisms include sensors such as accelerometers, pressure sensors, and actuators, micromirror devices with movable micromirrors, optical devices, microchemical systems incorporating micropumps, etc. Prototypes have been developed and developed over a very wide field.

  FIG. 4 is a cross-sectional view of an example of a conventional electronic component sealing substrate for configuring an electronic device using an electronic component having such a micro-electromechanical mechanism and an electronic device using the same. In the example shown in FIG. 4, power is supplied to the main surface of the semiconductor substrate 21 on which the micro electro mechanical mechanism 22 is formed, or an electric signal is transmitted from the micro electro mechanical mechanism 22 to an external electric circuit. Is formed by being electrically connected to the micro electro mechanical mechanism 22, and the semiconductor substrate 21, the micro electro mechanical mechanism 22, and the electrode 23 constitute one electronic component 24. .

  Such electronic components 24 are usually formed in a multi-cavity form in which a large number are arranged on the main surface of the semiconductor substrate 21 in vertical and horizontal directions, as will be described later, and then cut into individual semiconductor substrates 21. In order to prevent foreign matter such as cutting powder from adhering to the microelectromechanical mechanism 22 and hindering operation during this cutting, it is covered and protected by a glass plate 25 or the like. ing.

  The electronic component 24 is accommodated in the recess A of the package 31 having the recess A for storing the electronic component, and the electrode 23 of the electronic component 24 is electrically connected to the electrode pad 32 of the package 31 such as a bonding wire 33. After the connection via the material, the recess A of the package 31 is covered with the lid 34 and the electronic component 24 is hermetically sealed in the recess A, thereby completing the electronic device. In this case, the electronic component 24 needs to be hermetically sealed in a hollow state so as not to hinder the operation of the microelectromechanical mechanism 22.

  With respect to this electronic device, a lead-out portion of the wiring conductor 35 formed so as to lead out from the electrode pad 32 of the package 31 to the outer surface in advance is connected to an external electric circuit, so that the microelectronic machine is hermetically sealed. The mechanism 22 is electrically connected to an external electric circuit through the electrode 23, the bonding wire 33, the electrode pad 32, and the wiring conductor 35.

In addition, such an electronic component 24 is usually manufactured by arranging a large number of elements vertically and horizontally on the main surface of a large-area semiconductor substrate. In this case, a method for manufacturing an electronic device is conventionally as follows. It was something like that. That is,
1. a step of preparing an electronic component in which a plurality of electronic component regions formed by forming micro-electromechanical mechanisms 22 and electrodes 23 electrically connected to the micro-mechanical mechanism 22 on a main surface of a semiconductor substrate are arranged vertically and horizontally;
2, the step of covering and sealing the microelectromechanical mechanism 22 of each electronic component with a glass plate 25 or the like so that the periphery thereof is in a hollow state;
3. The semiconductor substrate is subjected to a cutting process such as a dicing process and divided into individual electronic components 24;
4. The electronic component 24 is manufactured by hermetically sealing the electronic component 24 in the electronic component storage package 31.

  In such a conventional manufacturing method, it is necessary to seal and protect each one of a large number of electronic component regions arranged on the main surface of the semiconductor substrate with a glass plate 25 or the like, The electronic component once sealed with the glass plate 25 is divided into individual electronic components 24 and then hermetically sealed in the package 31 and the electrode 23 is connected to the electrode pad 32 of the package 31 and the like. Due to the necessity of connection, etc., there was a problem that productivity was poor and practical application was difficult.

  In order to solve this problem, a substrate has been proposed in which a large number of microelectromechanical mechanisms 22 arranged and formed on the main surface of a semiconductor substrate are collectively covered and sealed. As such a sealing substrate, a substrate made of a semiconductor substrate, a substrate made of a conductive metal plate, or the like is known.

  In the case where the sealing substrate is made of a semiconductor substrate, for example, apart from the first semiconductor substrate in which a large number of electronic component regions are arranged and formed on the main surface, a large number of recesses corresponding to the arrangement of the electronic component regions. A second semiconductor substrate for sealing, in which the first semiconductor substrate is arranged, the second semiconductor substrate is disposed on the main surface of the first semiconductor substrate, and the concave portion of the second semiconductor substrate is an electronic component of the first semiconductor substrate. A technique has been proposed in which an electronic component region (especially a micro-electromechanical mechanism) of a first semiconductor substrate is sealed inside a second semiconductor substrate so as to cover the region (for example, a patent) Reference 1).

  In addition, when the sealing substrate is made of a conductive metal plate, a groove having a predetermined pattern is formed in the conductive metal plate for the cover, and the groove is filled with glass or a ceramic material to be flattened. After that, a conductor pattern for bonding (electrode pad, etc.) is formed thereon, an electrode of an electronic component is connected to this conductor pattern, and a metal plate is bonded to the main surface of the semiconductor substrate, and then an electronic component region Has been proposed in which an electrode pattern for external wiring for leading a conductor pattern to the outside is formed (see, for example, Patent Document 2).

  In addition, in an electronic component that forms a microelectromechanical mechanism, so-called MEMS (Micro Electromechanical System), in recent years, the response accuracy of the microelectromechanical mechanism has been increased and long-time driving has been performed. There has been a demand for improved power consumption and improved power responsiveness.

  In addition, since the power consumed in the MEMS region is insufficiently supplied and the microelectromechanical mechanism is not driven normally, a change in electrical characteristics of the microelectromechanical mechanism or destruction of the microelectromechanical region may occur. ing. Furthermore, in order to solve this problem, a method of mounting a large-capacity chip capacitor in the vicinity of the microelectromechanical mechanism is taken, and the mounting area is increased.

Also, high-frequency noise transmitted from the outside of the MEMS to the wiring conductor and propagated from the outside causes changes in electrical characteristics and destruction of the MEMS region, and at the same time, harmonic noise contained in the signal propagating through the wiring conductor is emitted to the outside of the electronic component. It is easy to be done. Further, in order to solve this problem, a technique of mounting a chip inductor in the vicinity of the MEMS is taken, and the mounting area is increased.
JP 2001-144117 A JP 2002-43463 A

  However, when the electronic component region on the main surface of the semiconductor substrate is sealed using such a conventional sealing substrate, a large number of electronic component regions can be collectively sealed, for example, In the case of a sealing substrate made of a semiconductor material, wiring conductors cannot be three-dimensionally formed inside the substrate, so the electronic component region of the sealing (second) semiconductor substrate The wiring conductor cannot be led out from the main surface bonded to the (first) semiconductor substrate on which the first electrode is arranged to the other main surface opposite to the main surface, and the electrode of the electronic component is connected to the main surface of the first semiconductor substrate. It is necessary to extend a part of the formed electrode to the outside of the sealing part, and to connect this extended part to the electrode pad of the electronic component storage package or an external electric circuit via a bonding wire. Process (from sealing of electronic component area Complete as a child device long step) until the connection to an external electric circuit, also a problem that there remains the size of individual electronic devices increases. There is also a problem that surface mounting is not possible, which is advantageous for downsizing an electronic system incorporating an electronic device.

  In the case of a sealing substrate made of a conductive metal plate, etc., once formed on the surface of the metal plate with glass or ceramics so that a conductor pattern such as an electrode pad can be formed on the metal plate. In this case, too, it is necessary to shorten the mounting process of the electronic component because it is necessary to form an insulating part by filling the groove or the like, or to form a conductor part on the surface of the insulating part during the mounting process. There is a problem that is difficult.

  Furthermore, in the electronic parts formed with the micro electro mechanical mechanism (MEMS), in recent years, the response accuracy of the micro electro mechanical mechanism is increased and the driving is performed for a long time. There is a demand for improved responsiveness. In addition, since the power consumed in the MEMS region is insufficiently supplied and the microelectromechanical mechanism is not driven normally, a decrease in drive response performance due to an increase in response time of the microelectromechanical mechanism, a change in electrical characteristics, In order to solve this problem, there has been a method of mounting a large-capacity chip capacitor in the vicinity of the microelectromechanical mechanism. There is also a problem that the mounting area becomes large.

  In addition, a change in electrical characteristics, destruction of the MEMS region, and the like occur due to high-frequency noise transmitted from the outside of the MEMS through the wiring conductor and transmitted from the outside. In addition, since harmonic noise contained in the signal propagating through the wiring conductor has become easy to be emitted outside the electronic component, if there is a noise source near the outside of the electronic component, the insulating substrate is covered. Electronic devices that are susceptible to electromagnetic noise in the vicinity of the outside of the electronic component, due to electromagnetic noise entering into the signal propagating through the formed wiring conductor and propagating to the micro-electromechanical mechanism. If there is, there is a problem that electromagnetic noise emitted from the electronic component may adversely affect the electronic device. In addition, in order to solve this problem, techniques such as mounting a chip inductor in the vicinity of the MEMS or using a conductive pattern on a printed board are taken, resulting in an increase in mounting area. was there.

  The present invention has been completed in view of the above-described problems in the prior art, and its purpose is to easily and reliably seal the microelectromechanical mechanism formed on the main surface of the semiconductor substrate, An electrode formed on the main surface of the semiconductor substrate connected to the microelectromechanical mechanism can be easily externally connected in a form capable of surface mounting, for example.

  In addition, since the power consumed in the MEMS region becomes insufficient and the micro-electromechanical mechanism does not drive normally, deterioration of drive response performance, change in electrical characteristics, and destruction of the micro-electromechanical mechanism region are unlikely to occur. It is an object of the present invention to provide an electronic component sealing substrate that can be miniaturized and hardly changes in electrical characteristics due to high-frequency noise that has propagated from the outside through a wiring conductor and is not easily damaged.

  Furthermore, even if a large number of electronic component regions composed of such micro-electromechanical mechanisms and electrodes are arranged vertically and horizontally on the main surface of the semiconductor substrate, they can be sealed easily and reliably. An object of the present invention is to provide an electronic component sealing substrate.

  Moreover, using such a multi-piece electronic component sealing substrate, a large number of electronic devices formed by sealing micro-electromechanical mechanisms are collectively formed in a form that can be surface-mounted, for example. It is an object of the present invention to provide a method for manufacturing an electronic device.

  The electronic component sealing substrate of the present invention includes an insulating substrate on which a wiring conductor led out from one main surface to the other main surface or side surface is formed, and the wiring conductor formed on the one main surface of the insulating substrate A connection pad electrically connected to the frame, a frame member joined to the one main surface of the insulating substrate so as to surround the connection pad, and the same as the frame member formed on the connection pad A connection terminal having a height, a recess formed on the other main surface of the insulating substrate for accommodating an electronic element, and an electronic element formed inside the recess and electrically connected to the wiring conductor A connection pad, and the electrode of an electronic component formed by forming a microelectromechanical mechanism and an electrode electrically connected to the main surface of a semiconductor substrate to the connection terminal; The main surface of the substrate is By bonding to the surface, the micro electronic mechanical system of the electronic component on the inside of the frame member is characterized in that the hermetically sealed.

  In the electronic component sealing substrate of the present invention, preferably, the concave portion is formed inside the connection pad in a plan view.

  In the electronic component sealing substrate according to the present invention, preferably, the electronic element housed in the recess is a decoupling capacitor or a choke coil in the above configuration.

  In the electronic component sealing substrate according to the present invention, preferably, another concave portion is formed on the one main surface of the insulating substrate so as to overlap the concave portion in plan view. To do.

  In addition, the multi-component electronic component sealing substrate of the present invention includes a plurality of vertical and horizontal arrays formed on one main surface of the insulating mother substrate, and a plurality of lead-out electronic components sealing substrates derived from the one main surface to the other main surface or side surfaces. Insulating substrate region in which wiring conductors are formed, connection pads electrically connected to the wiring conductors formed on the one main surface of each insulating substrate region, and the one main surface of each insulating substrate region A frame member joined so as to surround the connection pad, a connection terminal formed on the connection pad and having the same height as the frame member, and an electron formed on the other main surface of the insulating substrate. A recess for accommodating an element, and an electronic element connection pad formed inside the recess and electrically connected to the wiring conductor; and a microelectromechanical mechanism on the main surface of the semiconductor substrate; An electrode electrically connected to this is formed The electrode of the electronic component is bonded to the connection terminal, and the main surface of the semiconductor substrate is bonded to the main surface of the frame member, so that the electrons are placed inside the frame member in each insulating substrate region. The micro electromechanical mechanism of the component is hermetically sealed.

  The electronic device manufacturing method according to the present invention also includes a plurality of electronic component regions formed by arranging a plurality of electronic component regions formed vertically and horizontally on a main surface of a semiconductor substrate, on which microelectromechanical mechanisms and electrodes electrically connected thereto are formed. Insulating substrate on which a plurality of wiring conductors led out from the one main surface to the other main surface or side surfaces are formed and arranged in a plurality of vertical and horizontal directions on one main surface of the insulating mother substrate A region, a connection pad formed on the one main surface of each insulating substrate region and electrically connected to the wiring conductor, and surrounding the connection pad on the one main surface of each insulating substrate region. A frame member joined together, a connection terminal formed on the connection pad and having the same height as the frame member, and a recess for accommodating an electronic element formed on the other main surface of the insulating substrate Formed inside the recess Preparing a multi-piece electronic component sealing substrate comprising an electronic element connection pad electrically connected to the wiring conductor; and connecting each electrode of the multi-piece electronic component to each connection terminal And bonding the main surface of the semiconductor substrate around each micro electro mechanical mechanism to the main surface of each frame member so that each micro electro mechanical mechanism is placed inside each frame member. A step of hermetically sealing, and a step of obtaining individual electronic devices by dividing the multi-piece electronic component and the multi-piece electronic component sealing substrate bonded to each other into the electronic component region and the insulating substrate region It is characterized by comprising.

  According to the electronic component sealing substrate of the present invention, an insulating substrate on which a wiring conductor led out from one main surface to the other main surface or a side surface is formed, and a wiring conductor formed on one main surface of the insulating substrate; A connection pad electrically connected; a frame member joined to one main surface of the insulating substrate so as to surround the connection pad; and a connection terminal formed on the connection pad and having the same height as the frame member; A recess for accommodating an electronic element formed on the other main surface of the insulating substrate, and an electronic element connection pad formed inside the recess and electrically connected to the wiring conductor. Bonding an electrode of an electronic component formed by forming a microelectromechanical mechanism and an electrode electrically connected to the main surface of the substrate to the connection terminal, and bonding the main surface of the semiconductor substrate to the main surface of the frame member By using the Since the mechanical mechanism is hermetically sealed, the microelectromechanical mechanism of the electronic component can be easily and reliably sealed between the frame member and the insulating substrate simply by joining the main surface of the frame member to the main surface of the semiconductor substrate. Can be stopped.

  In addition, since the height of the main surface of the frame member is the same as the height of the connection terminal formed on the connection pad, when the main surface of the frame member is joined to the main surface of the semiconductor substrate, the main surface of the semiconductor substrate. The electrode formed on the surface can be easily and reliably connected to the connection terminal. Moreover, the electrode of an electronic component can also be derived | led-out outside from this connection terminal via a connection pad and a wiring conductor.

  In addition, since there is a recess for accommodating an electronic element on the other main surface of the insulating substrate, driving due to insufficient power consumption by mounting an electronic element, for example, a chip component such as a chip capacitor or a chip inductor in the recess. Deterioration of response performance, changes in electrical characteristics and destruction of micro-electromechanical mechanisms are unlikely to occur, deterioration of drive response performance due to insufficient power consumption, changes in electrical characteristics, destruction of micro-electromechanical mechanisms, etc. This is unlikely to occur, and changes in electrical characteristics due to high-frequency noise transmitted from the outside of the MEMS through the wiring conductor and from the outside, and destruction of the MEMS are unlikely to occur.

  In addition, since the electronic device is housed and mounted on the other main surface side of the insulating substrate, it is not necessary to secure a space for mounting the electronic device in the vicinity of the MEMS. A substrate can be provided.

  Preferably, in the present invention, the concave portion is formed on the inner side of the connection pad in a plan view, so that the electronic element mounted on the connection pad becomes stronger due to noise coming from the outside. That is, in this case, the electronic component sealing substrate can be further reduced in size, and between the MEMS and an electronic element having functions such as stabilization of power supply to the MEMS and blocking of external noise. As the distance becomes shorter, the MEMS connected to the connection pad becomes stronger due to noise propagating from the outside.

  In the present invention, preferably, since the electronic element housed in the recess is a decoupling capacitor or a choke coil, the mounting area of the decoupling capacitor or choke coil mounted around the MEMS can be reduced, and more From the viewpoint of protecting the MEMS, the reliability is improved.

  In the present invention, preferably, the other main surface of the insulating substrate is formed with another concave portion so as to overlap with the concave portion in plan view, so that the insulating substrate is less likely to be warped during manufacture and insulated from the MEMS. The reliability of the primary mounting surface between the substrates is further increased. That is, in this case, for example, when the insulating substrate is formed by firing an unsintered ceramic material or formed by thermally curing an uncured organic resin, shrinkage due to firing or curing occurs. On the other hand, the main surface side and the other main surface side behave in the same manner, and stress due to shrinkage can be effectively canceled out, so that the insulating substrate is less likely to warp during fabrication, and 1 between the MEMS and the insulating substrate. The reliability of the next mounting surface will be further increased.

  In addition, the electronic component sealing substrate of the present invention is formed by using an insulating substrate such as a ceramic multilayer wiring substrate, for example, so that the connection pads and the frame members are formed and bonded to the wiring conductor. From one main surface to the other main surface or side surface, it can be freely formed on the inside or surface of the substrate and led out, and by attaching metal bumps for external connection to this derived end, etc. It can be completed as an electronic device that can be surface-mounted.

  According to the multi-component electronic component sealing substrate of the present invention, a plurality of wirings arranged in the vertical direction and the horizontal direction on one main surface of the insulating mother substrate and led out from one main surface to the other main surface or side surface. Insulating substrate region in which conductor is formed, connection pad formed on one main surface of each insulating substrate region and electrically connected to wiring conductor, and surrounding the connection pad on one main surface of each insulating substrate region The joined frame member, the connection terminal formed on the connection pad and having the same height as the frame member, the concave portion for accommodating the electronic element formed on the other main surface of the insulating substrate, and the concave portion An electronic device comprising an electronic element connecting pad formed inside and electrically connected to a wiring conductor, and having a microelectromechanical mechanism and an electrode electrically connected thereto formed on a main surface of a semiconductor substrate Joining the component electrodes to the connection terminals, the semiconductor substrate By joining the main surface to the main surface of the frame member, the micro electro mechanical mechanism of the electronic component is hermetically sealed inside the frame member of each insulating substrate region, so that a large number of electronic components are formed on the main surface of the semiconductor substrate. With respect to a multi-piece electronic component in which the regions are arranged vertically and horizontally, each electronic component region can be sealed together so that external connection is possible.

  According to the method for manufacturing an electronic device of the present invention, since each of the above steps is provided, connection for external connection of each electrode and a microelectromechanical mechanism for a large number of electronic component regions arranged in rows and columns. Can be simultaneously performed, so that it is possible to easily and reliably manufacture a multi-cavity electronic device comprising a multi-cavity electronic component and a multi-cavity electronic component sealing substrate that are joined together. it can.

  In addition, the electronic components are sealed with the electronic component sealing substrate by dividing the multi-component electronic component and the multi-component electronic component sealing substrate joined to each other into the electronic component region and the insulating substrate region. A large number of individual electronic devices can be manufactured at the same time. At the time of this division, each micro-electromechanical mechanism in the electronic component area is sealed by a multi-component electronic component sealing substrate, so that the cutting powder of the semiconductor substrate such as silicon generated by the dicing process etc. Does not adhere to the microelectromechanical mechanism, and the microelectromechanical mechanism can be reliably operated in the divided electronic device.

  Moreover, since the wiring conductor is led out to the other main surface or side surface of the insulating substrate, the electronic device obtained by dividing the surface can be obtained by simply attaching a terminal such as a metal bump to the lead end. The electronic device can be mounted on an external biographic circuit board by mounting or the like, and the mounting process can be made extremely short and easy.

  The electronic component sealing substrate, the multi-component electronic component sealing substrate of the present invention, and the method of manufacturing the electronic device will be described in detail below.

  FIG. 1 is a sectional view showing an example of an embodiment of an electronic component sealing substrate of the present invention.

  In FIG. 1, 1 is an insulating substrate, 2 is a wiring conductor, 3 is a connection pad, 4 is a frame member, and 5 is a connection terminal. These insulating substrate 1, wiring conductor 2, connection pad 3, frame member 4 and connection terminal 5 form an electronic component sealing substrate 6.

  Using this electronic component sealing substrate 6, a micro electro mechanical mechanism 8 and an electrode 9 are electrically connected to each other on the main surface of the semiconductor substrate 7 (the lower surface in the example of FIG. 1). By sealing the electronic component 10 formed as described above, an electronic device is formed in which the micro-electromechanical mechanism 8 is sealed in a state where it can be externally connected.

  The micro electro mechanical mechanism 8 in the present invention includes, for example, an electric switch, an inductor, a capacitor, a resonator, an antenna, a micro relay, an optical switch, a magnetic head for a hard disk, a microphone, a biosensor, a DNA chip, a microreactor, a print head, an acceleration sensor, It is an electronic device having functions such as various sensors such as pressure sensors and display devices, and is a part made by so-called micromachining based on semiconductor micromachining technology, and has a size of about 10 μm to several 100 μm per element.

  The insulating substrate 1 functions as a lid for sealing the microelectromechanical mechanism 8 and also functions as a base for forming the wiring conductor 2, the connection pad 3, the frame member 4, and the connection terminal 5.

  The insulating substrate 1 includes ceramic materials such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a glass ceramic sintered body. It is formed of an organic resin material such as polyimide or glass epoxy resin, or a composite material formed by bonding inorganic powder such as ceramics or glass with an organic resin such as epoxy resin.

  If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, the insulating substrate 1 is formed by laminating and baking a green sheet formed by forming aluminum oxide and a raw material powder such as glass powder on the sheet. . The insulating substrate 1 is not limited to the one formed of an aluminum oxide sintered body, and it is preferable to select a substrate that is suitable for the application and the characteristics of the electronic component 10 to be hermetically sealed.

  For example, since the insulating substrate 1 is mechanically bonded to the semiconductor substrate 7 via the frame member 4 as will be described later, the reliability of bonding with the semiconductor substrate 7, that is, the sealing of the micro electro mechanical mechanism 8 is achieved. In order to increase the airtightness, a mullite sintered body, an aluminum oxide-borosilicate glass system in which the thermal expansion coefficient is approximated to the semiconductor substrate 7 by adjusting, for example, the kind and addition amount of the glass component, etc. It is preferable to form a material having a small difference in thermal expansion coefficient from the semiconductor substrate 7 such as a glass ceramic sintered body.

  Further, in the case of preventing the delay of the electrical signal transmitted by the wiring conductor 2, the insulating substrate 1 is made of an organic resin material such as polyimide or glass epoxy resin, or an inorganic powder such as ceramic or glass such as epoxy resin. It is preferably formed of a composite material formed by bonding with an organic resin, or a material having a low relative dielectric constant such as a sintered glass ceramic such as aluminum oxide-borosilicate glass or lithium oxide.

  Further, the insulating substrate 1 has a large calorific value of the microelectromechanical mechanism 8 to be sealed, and in the case where the heat dissipating property is good, a heat such as an aluminum nitride sintered body is used. It is preferable to form with a material having high conductivity.

  From one main surface of the insulating substrate 1 (the side on which the micro electro mechanical mechanism 8 is sealed), the wiring conductor 2 is led out to the other main surface or side surface.

  In addition, a connection pad 3 connected to the wiring conductor 2 is formed in a portion inside the frame member 4 on the one main surface side of the insulating substrate 1.

  The wiring conductor 2 and the connection pad 3 are electrically connected to the electrode 9 of the electronic component 10 through the connection terminal 5 formed on the connection pad 3, and this is connected to the other main surface or side surface of the insulating substrate 1. It has a function to derive.

  These wiring conductors 2 and connection pads 3 are formed of a metal material such as copper, silver, gold, palladium, tungsten, molybdenum, and manganese. As a means for the formation, a means for depositing a metal such as a metallized layer, a plating layer, or vapor deposition as a thin film layer can be used. For example, in the case of a tungsten metallized layer, it is formed by printing a tungsten paste on a green sheet to be the insulating substrate 1 and firing it together with the green sheet.

  The connection terminal 5 is composed of solder such as tin-silver, tin-silver-copper, low melting point solder such as gold-tin, high melting point solder such as silver-germanium, conductive organic resin, or seam welding. Further, it is formed of a metal material or the like that enables joining by a welding method such as electron beam welding.

  By joining the connection terminal 5 to the electrode 9 of the electronic component 10, the electrode 9 of the electronic component 10 is connected to the other main surface or side surface of the insulating substrate 1 via the connection terminal 5, the connection pad 3 and the wiring conductor 2. Derived. And the electrode 9 of the electronic component 10 is electrically connected with an external electric circuit by joining this derived | led-out edge part to an external electric circuit via tin-lead solder etc. FIG.

  A frame member 4 is joined to one main surface of the insulating substrate 1 so as to surround the connection pad 3.

  The frame member 4 functions as a side wall for hermetically sealing the microelectromechanical mechanism 8 of the electronic component 10 inside thereof.

  By joining the main surface (upper surface in the example of FIG. 1) of the frame member 4 to the main surface (lower surface in the example of FIG. 1) of the electronic component 10, the micro electromechanical mechanism 8 is hermetically sealed inside the frame member 4. Stopped. In this case, the semiconductor substrate 7 serves as a bottom plate and the insulating substrate 1 serves as a lid.

  The frame member 4 is made of an iron-nickel alloy such as iron-nickel-cobalt alloy or iron-nickel alloy, a metal material such as oxygen-free copper, aluminum, stainless steel, copper-tungsten alloy, copper-molybdenum alloy, or aluminum oxide. It is formed of an inorganic material such as a quality sintered body or a glass ceramic sintered body, or an organic resin material such as PTFE (polytetrafluoroethylene) or glass epoxy resin.

  Further, as a method of joining the main surface of the frame member 4 to the main surface of the semiconductor substrate 7 of the electronic component 10, solder such as tin-silver type, low melting point brazing material such as gold-tin brazing, silver-germanium type, etc. A bonding method such as a high melting point brazing material, a conductive organic resin or the like, or a welding method such as seam welding or electron beam welding can be used.

  In the electronic component sealing substrate 6 of the present invention, a recess 12 is formed on the other main surface of the insulating substrate 1. The recess 12 is for accommodating electronic elements such as a decoupling capacitor, a choke coil, a semiconductor integrated circuit element, a piezoelectric vibrator, and a chip resistor.

  Inside the recess 12, an electronic element connection pad 13 is formed so as to be electrically connected to the wiring conductor 2, and an electronic element accommodated in the recess 12, for example, an electrode of a decoupling capacitor is connected to solder or the like. It is electrically connected through the connecting material.

  This electronic element is electrically connected to the microelectromechanical mechanism 8 through the wiring conductor 2 to ensure the electrical characteristics of the microelectromechanical mechanism 8 and to block noise, and to operate electrically and mechanically. To ensure.

  The recess 12 is formed by punching a ceramic green sheet using a punching die or an NC puncher, and is laminated on the insulating substrate 1, and is fired simultaneously with the insulating substrate 1.

  The element connecting pad 13 is formed in the same manner as the wiring conductor 2.

  Then, for the electronic component 10 in which the microelectromechanical mechanism 8 and the electrode 9 electrically connected thereto are formed on the main surface of the semiconductor substrate 7, the electrode 9 is joined to the connection terminal 5. By bonding the surface to the main surface of the frame member 4, the micro-electromechanical mechanism 8 of the electronic component 10 is hermetically sealed inside the frame member 4, and an electronic device is formed by housing the electronic element in the recess. The

  By connecting the lead-out portion of the wiring conductor 2 of this electronic device to an external electric circuit via an external terminal 11 such as a solder ball, the microelectromechanical mechanism 8 is electrically connected to the external electric circuit.

  As shown in FIG. 1, a conductor layer 3a is formed of the same material as that of the connection pad 3 on the main surface of the insulating substrate 1 to which the frame member 4 is bonded, and the insulating substrate 1 is formed from the conductor layer 3a. A part of the wiring conductor 2 may be led out over the other main surface. The lead-out portion of the wiring conductor 2 led out from the conductor layer 3a can be connected to the grounding terminal of the external electric circuit or the like via the external terminal 11 or the like.

  In this case, in order to enable the bonding of the connection terminal 5 and the electrode 9 and the bonding of the main surface of the frame member 4 and the main surface of the semiconductor substrate 7 to be performed reliably and easily in one step, the connection terminal The height of 5 and the height of the frame member 4 need to be the same height.

  Moreover, it is preferable that the recessed part 12 of the board | substrate 6 for electronic component sealing of this invention is formed inside the connection pad 3 by planar view. In this way, when the electronic component 10 is secondarily mounted, the electronic element is cut off from an external dynamic stimulus, and the electronic element mounted in the recess 12 can be more reliably protected. .

  Moreover, it is preferable that the electronic element accommodated in the recessed part 12 of the electronic component sealing substrate 6 of the present invention is a decoupling capacitor or a choke coil. By doing so, an electronic element for protecting the MEMS can be mounted near the microelectromechanical mechanism 8, and the reliability of the MEMS can be further strengthened.

  In addition, it is preferable that a second recess is formed on one main surface of the insulating substrate 1 of the electronic component sealing substrate 6 of the present invention so as to overlap the recess 12 in plan view. By doing so, warpage of the insulating substrate 1 can be suppressed, and further, the sealing performance of the MEMS can be improved.

  As shown in FIG. 2, the multi-component electronic component sealing substrate of the present invention is led out from one main surface to the other main surface or side surface, in which a large number are vertically and horizontally arranged on one main surface of the insulating mother substrate. Insulated substrate region 1a in which a plurality of wiring conductors 2 are formed, connection pads 3 electrically connected to wiring conductor 2 formed on one main surface of each insulated substrate region 1a, and each insulated substrate region A frame member 4 joined so as to surround the connection pad 3 on one main surface of 1a, a connection terminal 5 formed on the connection pad 3 and having the same height as the frame member 4, and each insulating substrate region 1a The semiconductor substrate 7 includes a recess 12 for accommodating an electronic element formed on the other main surface, and an electronic element connection pad 13 formed inside the recess 12 and electrically connected to the wiring conductor 2. Is electrically connected to the microelectromechanical mechanism 8 and The electrode 9 of the electronic component 10 formed with the formed electrodes 9 is joined to the connection terminals 5, and the main surface of the semiconductor substrate 7 is joined to the main surface of the frame member 4, whereby the frame member 4 of each insulating substrate region 1a. The micro-electromechanical mechanism 8 of the electronic component 10 is hermetically sealed inside. FIG. 2 is a cross-sectional view showing an example of an embodiment of the multi-piece electronic component sealing substrate of the present invention. In FIG. 2, the same parts as those in FIG.

  According to the multi-component electronic component sealing substrate 6a of the present invention, since it has the above-described configuration, the micro-electromechanical mechanism 8 and the electrode 9 electrically connected to the main surface of the semiconductor substrate 7 are provided. Can be hermetically sealed at the same time, and the productivity can be improved.

  In addition, the electronic components 10 manufactured in a multi-cavity form in which a large number of microelectromechanical mechanisms 8 and a plurality of electrodes 9 electrically connected thereto are arranged on the main surface of the semiconductor substrate 7 are collectively shown. After sealing, the semiconductor substrate 7 (and the multi-component electronic component sealing substrate 6) is subjected to cutting processing such as dicing and divided into individual electronic component parts 10 (electronic devices). In doing so, it is possible to effectively prevent the occurrence of a problem that cutting powder or the like generated along with cutting adheres to the microelectromechanical mechanism 8 and interferes with its operation.

  Next, a method for manufacturing an electronic device according to the present invention will be described with reference to FIGS. FIG. 3 is a sectional view showing an example of an embodiment of an electronic device manufacturing method according to the present invention in the order of steps. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  First, as shown in FIG. 3A, a large number of electronic component regions 10a each having a microelectromechanical mechanism 8 and electrodes 9 electrically connected thereto are formed on the main surface of the semiconductor substrate 7. A multi-cavity electronic component 10b arranged in an array is prepared.

  The semiconductor substrate 7 is made of a silicon substrate such as a single crystal or polycrystal.

  A silicon oxide layer is formed on the surface of the silicon substrate, and by applying a fine wiring processing technique such as photolithography, a micro electromechanical mechanism 8 such as a minute vibrating body and an electrode 9 made of a conductor such as a circular pattern are provided. A plurality of electronic component parts 10b are formed by arranging a large number of the formed electronic component regions 10a. In this example, the microelectromechanical mechanism 8 and the electrode 9 are electrically connected via fine wiring (not shown) formed on the main surface of the semiconductor substrate 7, respectively.

  Next, as shown in FIG. 3B, a plurality of wiring conductors 2 are formed on one main surface of the insulating mother board, arranged in rows and columns and extending from one main surface to the other main surface or side surfaces. Insulated substrate region 1a, connection pad 3 electrically connected to wiring conductor 2 formed on one main surface of each insulating substrate region 1a, and connection pad 3 formed on one main surface of each insulating substrate region 1a Frame member 4 joined so as to surround the terminal, connection terminal 5 formed on connection pad 3 at the same height as frame member 4, and an electronic element formed on the other main surface of the insulating mother board (FIG. (Not shown), and a multi-piece electronic component sealing substrate comprising: a recess 12 for housing the electronic element connection pad 13 formed inside the recess 12 and electrically connected to the wiring conductor 2 Prepare 6a.

  The insulating mother board on which the wiring conductor 2 led out from one main surface to the other main surface or side surface is formed, for example, the insulating mother board is made of an aluminum oxide sintered body, and the wiring conductor 2 is made of a metallized layer of tungsten. In some cases, raw powders such as aluminum oxide, silicon oxide, and calcium oxide are kneaded with an organic resin and a binder to obtain a slurry, and the slurry is formed into a sheet by a doctor blade method, a lip coater method, or the like. A green metal sheet is formed, and a metallized paste of tungsten is printed on the surface of the green sheet and, if necessary, in the through holes previously formed in the green sheet, filled, and then these green sheets Can be formed by laminating and firing.

  Of these green sheets, some of the green sheets are punched to form square-shaped openings arranged vertically and horizontally, which are arranged on the outermost layer on the other main surface side, or the outermost layer. Recesses 12 are formed in each insulating substrate region 1a on the other main surface of the fired insulating mother substrate so that several layers are laminated from the inside toward the inside.

  In addition, a part of these green sheets is punched to form an opening such as a square shape, which is disposed on the outermost layer on one main surface side, or from the outermost layer to the inside. The other concave portion is formed on one main surface of the fired insulating mother substrate so that several layers are laminated. When the other concave portion is formed so as to overlap with the concave portion 12 in plan view, for example, when the insulating mother substrate is formed by firing the green sheet, the shrinkage caused by the firing is reduced to the one main surface side. On the other side, the same behavior is obtained on the other main surface side, and the stress accompanying the shrinkage can be effectively offset, so that the insulating mother substrate is less likely to be warped during fabrication, and between each insulating substrate region 1a of the insulating mother substrate and the MEMS. The reliability of the primary mounting surface is further increased.

  In addition, when the other concave portion is provided on the one main surface side in this way, the micro electro mechanical mechanism 8 can be accommodated inside the other concave portion, so that the frame member 4 for enclosing the micro electro mechanical mechanism 8 is provided. The height can be kept low, which is advantageous for reducing the height of the electronic device.

  The connection pad 3 is usually made of the same material as that of the wiring conductor 2. For example, a tungsten paste is connected to the printed tungsten paste that becomes the wiring conductor 2 on the outermost surface of the green sheet that becomes the insulating mother substrate. In this manner, a large number are arranged in rows and columns and printed by screen printing or the like.

  Further, if the frame member 4 is made of, for example, an iron-nickel-cobalt alloy, the metal plate of the iron-nickel-cobalt alloy is subjected to a rolling process, a punching process using a mold, or an etching process to form a frame shape. It is manufactured by doing.

  The frame member 4 and the insulating mother board are joined by a solder such as tin-silver solder, a low-melting solder such as gold-tin solder, a high-melting solder such as silver-germanium, or a conductive organic resin. It can be carried out by a method of joining via a welding method or a welding method such as seam welding or electron beam welding.

  Connection terminals 5 are formed on the connection pads 3 so as to have the same height as the frame member 4. If the connection terminal 5 is made of, for example, tin-silver solder, the connection terminal 5 is formed by positioning, heating, melting, and joining the solder balls on the connection pads 3.

  As a method of making the height of the connection terminal 5 the same as the height of the frame member 4, for example, when the tin-silver solder used as the connection terminal 5 is melted and formed on the connection pad 3, the upper surface thereof is changed. It is possible to use a method such as pressing with a ceramic jig or the like so as to be the same height as the frame member 4.

  Next, as shown in FIG. 3C, the multi-piece electronic component 10b is overlapped with the multi-piece electronic component sealing substrate 6a so that each electronic component region 10a and each insulating substrate region 1a correspond to each other. In addition, the electrode 7 is joined to the connection terminal 5, and the main surface of the semiconductor substrate 7 around the micro electro mechanical mechanism 8 is joined to the main surface of the frame member 4. Hermetically seal.

  Here, when the electrode 7 and the connection terminal 5 are joined, for example, when the connection terminal 5 is made of tin-silver solder, the connection terminal 5 is aligned and placed on the electrode 7, and these are placed at about 250. For example, the heat treatment is performed in a reflow furnace at a temperature of about from ℃ to 300 ℃.

  In addition, the main surface of the semiconductor substrate 7 around the micro electro mechanical mechanism 8 and the main surface of the frame member 4 are joined, for example, with a tin-silver solder similar to the connection terminal 5 sandwiched between the joint surfaces. In addition, the heat treatment can be performed in a reflow furnace simultaneously with the joining of the electrode 7 and the connection terminal 5 described above.

  In this case, since the height of the connection terminal 5 is the same as the height of the frame member 4, the bonding between the electrode 7 and the connection terminal 5 and the bonding between the main surface of the frame member 4 and the main surface of the semiconductor substrate 7 are performed. It can be done easily and reliably at the same time.

  As described above, according to the method for manufacturing an electronic device of the present invention, the bonding for leading out the electrode 7 in the electronic component region 10a and the bonding for hermetically sealing the microelectromechanical mechanism 8 are simultaneously performed. Therefore, it is possible to reliably reduce at least one step of joining such as soldering that requires several hours as compared with the conventional manufacturing method, so that the productivity of electronic devices is greatly increased. Can do.

  Then, as shown in FIG. 3D, the multi-piece electronic component 10b and the multi-piece electronic component sealing substrate 6a joined to each other are divided into the electronic component region 10a and each insulating substrate region 1a. Then, individual electronic devices obtained by bonding the electronic component electronic component 10 to the electronic component sealing substrate 6 are obtained.

  The joined body of the electronic component 10b and the electronic component sealing substrate 6 that are joined together and cut together is cut by performing a cutting process such as dicing on the joined body. it can.

  In the method of manufacturing an electronic device according to the present invention, each microelectromechanical mechanism 8 is separated by the frame member 4, the semiconductor substrate 7, and the insulating substrate 1 inside the frame member 4 during the cutting process such as dicing. Since it is hermetically sealed, cutting powder such as silicon or ceramics generated when the semiconductor substrate 7 or the insulating substrate 1 is cut does not adhere to the microelectromechanical mechanism 8, and in the completed electronic device, The electronic mechanical mechanism 8 can be reliably operated normally.

  As described above, according to the method for manufacturing an electronic device of the present invention, when cutting the electronic component region 10a in which a large number are vertically and horizontally formed on the main surface of the semiconductor substrate 7 as in the prior art, the microelectronic machine is cut. It is not necessary to separately add a process device that covers and protects the mechanism 8 with a glass plate or the like, and the process only for protection can be surely deleted, so that the productivity of the electronic device is very high. Can be.

  In addition, the electronic device manufactured in this way is already hermetically sealed, and the electrode is led out to the outside through the wiring conductor 2, so that it is mounted in a separate package. There is no need to add an additional process, and it is possible to mount and use it on an external electric circuit board simply by connecting the lead-out portion of the wiring conductor 2 to an external electric circuit via an external terminal 11 such as a solder ball. it can.

  Further, in this case, since the wiring conductor 2 is led out to the other main surface or side surface of the insulating base 1, it can be connected to an external electric circuit in the form of surface mounting, and can be mounted at a high density, The substrate of the electric circuit can be effectively downsized.

  In addition, this invention is not limited to the example of above-mentioned embodiment, A various deformation | transformation is possible if it is in the range of the summary of this invention.

  For example, in the example of the above-described embodiment, one microelectromechanical mechanism is hermetically sealed in one electronic device, but a plurality of microelectromechanical mechanisms may be hermetically sealed in one electronic device.

  Further, in the example shown in FIG. 1, the wiring conductor 2 is led out to the other main surface side of the insulating substrate 1, but this is led out to the side surface or led to both the side surface and the other main surface. May be. Further, the electrical connection of the derived portion to an external electric circuit is not limited to being performed via a solder ball as an external terminal, and may be performed via a lead terminal, a conductive adhesive, or the like.

  Further, the recess 12 is not used only for accommodating a decoupling capacitor, a choke coil, or the like, but may be mounted with other semiconductor elements such as a semiconductor integrated circuit element.

It is sectional drawing which shows an example of embodiment of the board | substrate for electronic component sealing of this invention. It is sectional drawing which shows the other example of embodiment of the board | substrate for electronic component sealing of this invention. (A)-(d) is sectional drawing which showed an example of embodiment of the manufacturing method of the electronic device of this invention in order of the process, respectively. It is sectional drawing which shows an example of the conventional board | substrate for electronic component sealing, and an electronic apparatus using the same.

Explanation of symbols

1: Insulating substrate 2: Wiring conductor 3: Connection pad 4: Frame member 5: Connection terminal 6: Electronic component sealing substrate 6a: Multi-component electronic component sealing substrate 7: Semiconductor substrate 8: Micro-electromechanical mechanism 9: Electrode 10: Electronic component 10a: Electronic component region 10b: Electronic component 11: External terminal 12: Recess 13: Pad for connecting electronic elements

Claims (6)

An insulating substrate on which a wiring conductor led out from one main surface to the other main surface or side surface is formed; a connection pad formed on the one main surface of the insulating substrate and electrically connected to the wiring conductor; A frame member joined to the one main surface of the insulating substrate so as to surround the connection pad; a connection terminal formed on the connection pad and having the same height as the frame member; and A semiconductor substrate comprising: a recess for accommodating an electronic element formed on the other main surface; and an electronic element connection pad formed inside the recess and electrically connected to the wiring conductor. The electrode of an electronic component formed by forming a microelectromechanical mechanism and an electrode electrically connected thereto on the main surface of the semiconductor substrate is joined to the connection terminal, and the main surface of the semiconductor substrate is bonded to the main surface of the frame member By joining to Electronic component sealing substrate to the inside of the member electronic component of the micro electronic mechanical system is characterized in that the hermetically sealed. The electronic component sealing substrate according to claim 1, wherein the concave portion is formed inside the connection pad in a plan view. 3. The electronic component sealing substrate according to claim 1, wherein the electronic element is a decoupling capacitor or a choke coil. 4. The electronic component sealing according to claim 1, wherein another concave portion is formed on the one main surface of the insulating substrate so as to overlap the concave portion in plan view. Substrate. Insulating substrate regions in which a plurality of wiring conductors led out from the one main surface to the other main surface or side surfaces are formed on one main surface of the insulating mother substrate in a vertical and horizontal manner, and each of the insulating substrate regions A connection pad formed on the one main surface and electrically connected to the wiring conductor; a frame member joined to the one main surface of each insulating substrate region so as to surround the connection pad; A connection terminal formed on a connection pad and having the same height as the frame member, a recess for accommodating an electronic element formed on the other main surface of the insulating substrate, and formed inside the recess, An electronic component connecting pad electrically connected to the wiring conductor, and an electronic component formed by forming a microelectromechanical mechanism and an electrode electrically connected to the main surface of a semiconductor substrate. Join the electrode to the connection terminal Bonding the main surface of the semiconductor substrate to the main surface of the frame member to hermetically seal the microelectromechanical mechanism of the electronic component inside the frame member in each insulating substrate region, respectively. A substrate for sealing electronic parts for multi-piece production. A step of preparing a multi-chip electronic component in which a plurality of electronic component regions in which a micro-electromechanical mechanism and electrodes electrically connected thereto are formed on a main surface of a semiconductor substrate are arranged in a vertical and horizontal direction; An insulating substrate region in which a plurality of wiring conductors led out from the one main surface to the other main surface or side surfaces are formed on one main surface of the substrate in a vertical and horizontal manner, and the one of the insulating substrate regions A connection pad electrically connected to the wiring conductor, a frame member bonded to the one main surface of each insulating substrate region so as to surround the connection pad, and the connection pad; The wiring terminal formed on the same height as the frame member, a recess for accommodating an electronic element formed on the other main surface of the insulating substrate, and the wiring formed on the inner side of the recess Electrically connected to the conductor A step of preparing a substrate for encapsulating a multi-piece electronic component having a child element connection pad; joining the electrodes of the multi-piece electronic component to the connection terminals; and Bonding the main surface of the semiconductor substrate around the mechanism to the main surface of each frame member and hermetically sealing each micro-electromechanical mechanism inside each frame member; Dividing the multi-piece electronic component and the multi-piece electronic component sealing substrate into the electronic component region and the insulating substrate region to obtain individual electronic devices. Device manufacturing method.

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