JP2006185968A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device excellent in the electromagnetism noise characteristic and reliability by hermetic sealing of the minute electronic machinery mechanism of the principal surface of a semiconductor substrate. <P>SOLUTION: On a supporting substrate 1 with two or more connection pads, a semiconductor substrate 6 is arranged which has an undersurface electrode pad 5 connected via a conductive jointing material 4 to a minute electronic machinery mechanism 3 and a connection pad 2. While carrying out hermetic sealing of the minute electronic machinery mechanism 3, through a via conductor 12 for signals in a support board 1 for a connection pad 2 connected electrically with a signal terminal 13 of the undersurface of the support board 1. The distance between a via conductor 10 for grounds and a via conductor 12 for signals is set to 1/2 or less of the wavelength of a high frequency signal which transmits the via conductor 12 for signals. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention provides a semiconductor substrate having a microelectromechanical mechanism and an electrode pad connected to the connection pad via a conductive bonding material on a support substrate having a plurality of connection pads. The present invention relates to an electronic device that is arranged so that a void is formed, and a microelectromechanical mechanism is accommodated in the void.

  2. Description of the Related Art In recent years, an electronic component in which a very small electromechanical mechanism, so-called MEMS (Micro Electromechanical System), is formed by applying a processing technique for forming fine wiring such as a semiconductor integrated circuit element on the main surface of a semiconductor substrate such as a silicon wafer. Has been attracting attention, and is being developed for practical use.

  Such microelectromechanical mechanisms include sensors such as accelerometers, pressure sensors, actuators, micromirror devices with movable micromirrors, optical devices or microchemical systems incorporating micropumps, etc. Prototypes have been developed and developed over a very wide field.

  FIG. 4 shows an example of a conventional electronic component sealing substrate for configuring an electronic device using an electronic component having such a micro-electromechanical mechanism and an electronic device using the same. In the example shown in FIG. 4, power is supplied to the main surface of the semiconductor substrate 21 on which the micro electro mechanical mechanism 22 is formed, or an electric signal is transmitted from the micro electro mechanical mechanism 22 to an external electric circuit. An electrode 23 for feeding out is formed by being electrically connected to the micro electro mechanical mechanism 22, and the semiconductor substrate 21, the micro electro mechanical mechanism 22 and the electrode 23 constitute one electronic component 24.

  Note that such an electronic component 24 is normally formed in a multi-cavity form in which a large number are arranged in a vertical and horizontal manner on the main surface of the semiconductor substrate 21, as will be described later, and then the individual semiconductor substrates 21 are formed. Since it is manufactured by cutting, in order to prevent foreign matter such as cutting powder from adhering to the microelectromechanical mechanism 22 during this cutting, it is covered and protected by a glass plate 25 or the like. Has been.

  The electronic component 24 is accommodated in a recess A of an electronic component storage package (hereinafter also referred to as a package) 31 having a recess A for storing the electronic component, and the electrode 23 of the electronic component 24 is connected to the electrode of the package 31. After connecting to the pad 32 through a conductive connecting material such as a bonding wire 33, the concave portion A of the package 31 is covered with a lid 34 and the electronic component 24 is hermetically sealed in the concave portion A, thereby completing an electronic device. To do. In this case, the electronic component 24 needs to be hermetically sealed in a hollow state so as not to hinder the operation of the microelectromechanical mechanism 22.

  For this electronic device, a microelectronic machine hermetically sealed by connecting a lead-out portion of the wiring conductor 35 formed in advance so as to lead out from the electrode pad 32 of the package 31 to an external electric circuit. The mechanism 22 is electrically connected to an external electric circuit through the electrode 23, the bonding wire 33, the electrode pad 32, and the wiring conductor 35.

  In addition, such an electronic component 24 is usually manufactured by arranging a large number of elements in the main surface of a large-area semiconductor substrate vertically and horizontally, and a method for manufacturing an electronic device in this case is conventionally as follows. It was something like that. That is, a step 1 of preparing an electronic component in which a plurality of electronic component regions formed by forming a microelectromechanical mechanism 22 and an electrode 23 electrically connected to the microelectromechanical mechanism 22 on a main surface of a semiconductor substrate are arranged vertically and horizontally; The step 2 of sealing the micro electro mechanical mechanism 22 of each electronic component 24 with a glass plate 25 or the like so that the periphery thereof is in a hollow state, and cutting processing such as dicing processing on the semiconductor substrate, It is manufactured by the step 3 of dividing into individual electronic components 24 and the step 4 of hermetically sealing the individual electronic components 24 in the package 31.

  In such a conventional manufacturing method, it is necessary to seal and protect each of a large number of electronic component regions arranged on the main surface of the semiconductor substrate with a glass plate 25 or the like, The electronic component 24 once sealed with the glass plate 25 is divided into individual electronic components 24 and then hermetically sealed in the package 31 and the electrode 23 is connected to the electrode pad 32 and the like of the package 31. Due to the necessity of external connection, there was a problem that productivity was poor and practical application was difficult.

  In order to solve this problem, a substrate that covers and seals a large number of microelectromechanical mechanisms 22 arrayed on the main surface of a semiconductor substrate has been studied. As such a sealing substrate, a substrate made of a semiconductor substrate, a substrate made of a conductive metal plate, or the like is known.

  In the case of using a semiconductor substrate as a material, for example, apart from the first semiconductor substrate in which a large number of electronic component regions are arranged on the main surface, a large number of recesses are formed corresponding to the arrangement of the electronic component regions. The second semiconductor substrate for sealing is prepared, the second semiconductor substrate is covered on the main surface of the first semiconductor substrate, and the concave portion of the second semiconductor substrate covers the electronic component region of the first semiconductor substrate. Thus, a technique has been proposed in which the electronic component region (especially the microelectromechanical mechanism) of the first semiconductor substrate is sealed inside the second semiconductor substrate (see, for example, Patent Document 1). ).

  When a conductive metal plate is used as a material, a pattern groove is formed in the conductive cover metal plate, and the pattern groove is filled with glass or a ceramic material and flattened. Then, a bonding pattern (electrode pad, etc.) is formed thereon, the electrodes of the electronic component are connected to the bonding pattern, and a metal plate is bonded to the main surface of the semiconductor substrate. Thereafter, the electronic component region is made of ceramic or glass, etc. A technique has been proposed in which an electrode pattern for external wiring is formed for sealing and for leading out a bonding pattern to the outside (see, for example, Patent Document 2).

In recent years, electronic components having a microelectromechanical mechanism, so-called MEMS (Micro Electromechanical System), have been driven at low voltage and increased in speed, and harmonic noise that enters from outside the electronic component. At the same time, harmonic noise included in a signal propagating through the wiring conductor is likely to be emitted to the outside of the electronic component.
JP 2001-144117 A JP 2002-43463 A

  However, when the electronic component region on the main surface of the semiconductor substrate is sealed using the conventional sealing substrate, a large number of electronic component regions can be collectively sealed. In the case of the sealing substrate made of the material, since the three-dimensional wiring conductor cannot be formed inside the semiconductor substrate, the electronic component region of the second semiconductor substrate for sealing is arranged and formed. The wiring conductor cannot be led out from the main surface bonded to the first semiconductor substrate to the other main surface facing the first semiconductor substrate, and the electrode of the electronic component is one of the electrodes formed on the main surface of the first semiconductor substrate. It is necessary to extend the portion to the outside of the sealing portion and to connect the extended portion to an electrode pad of the package or an external electric circuit via a bonding wire. Therefore, the mounting process (the process from sealing the electronic component region to completing the electronic device and connecting it to the external electric circuit) is long, and there is a problem that the size of each electronic device is increased. There is also a problem that surface mounting that is advantageous for downsizing an electronic system incorporating an electronic device cannot be performed.

  Furthermore, in the case of a sealing substrate made of a conductive metal plate or the like, a pattern once formed on the surface of the metal plate with glass or ceramic so that a conductor pattern such as an electrode pad can be formed on the metal plate. In this case, it is difficult to shorten the mounting process of the electronic component because it is necessary to form an insulating part by filling a groove or the like, or to form a conductor part on the surface of the insulating part in the middle of the mounting process. There was a problem that there was.

  Further, in recent years, electronic components formed with micro-electromechanical mechanisms (MEMS) have been driven at low voltage and increased in speed, and are easily affected by harmonic noise that enters from outside the electronic components. At the same time, since harmonic noise contained in the signal propagating through the wiring conductor has become easy to be emitted to the outside of the electronic component, if there is a noise generation source outside the electronic component, an insulating substrate Electromagnetic noise enters the signal propagating through the wiring conductor formed on the substrate, and is propagated to the microelectromechanical mechanism to cause malfunction. In addition, when there is an electronic device or the like that is easily affected by electromagnetic noise at a position near the outside of the electronic component, there is a problem that the electromagnetic noise emitted from the electronic component has an adverse effect on the electronic device or the like.

  The present invention has been devised in view of the above-described problems, and an object of the present invention is to easily and reliably seal a microelectromechanical mechanism formed on the main surface of a semiconductor substrate. The electrode pads on the main surface of the semiconductor substrate connected to the mechanism can be connected easily and reliably, and the micro-electromechanical mechanism is less susceptible to external harmonic noise, and the signal propagates through the wiring conductor. An object of the present invention is to provide an electronic device that can make it difficult to emit harmonic noise contained therein.

  The electronic device of the present invention includes a semiconductor substrate having a micro electro mechanical mechanism and an electrode pad connected to the connection pad via a conductive bonding material on a lower surface on a support substrate having a plurality of connection pads. An electronic device that is arranged so that a predetermined space is formed between the microelectromechanical mechanisms and that accommodates a microelectromechanical mechanism in the space, wherein the conductive material is interposed between the semiconductor substrate and the support substrate. The microelectromechanical mechanism is hermetically sealed with a metal sealing member surrounding the void outside the conductive bonding material, and the metal via is connected to the ground via conductor in the support substrate. The connection pad is electrically connected to the signal terminal on the lower surface of the support substrate via the signal via conductor in the support substrate, and the ground via conductor and the signal are further connected to the ground terminal on the lower surface of the support substrate. Via conductor It is characterized in that the distance between the set to 1/2 or less of the wavelength of a high-frequency signal for transmitting the signal via conductor.

  In the electronic device of the present invention, a plurality of the ground via conductors are embedded in a row in the support substrate, and the distance between the ground via conductors is also set to ½ or less of the wavelength. It is characterized by that.

  Furthermore, the electronic device according to the present invention is characterized in that a recess that accommodates at least a part of the micro electro mechanical mechanism is provided in a portion corresponding to the micro electro mechanical mechanism on the upper surface of the support substrate. Is.

  In the electronic device of the present invention, the sealing member and the conductive bonding material are made of the same metal material.

  Furthermore, the electronic device of the present invention is characterized in that the semiconductor substrate and the support substrate are substantially congruent as seen through a plane.

  The electronic device according to the present invention is characterized in that the ground terminal is disposed on an outer peripheral portion of the other main surface of the support substrate.

  Furthermore, the electronic device according to the present invention is characterized in that the support substrate has a polygonal shape, and the ground terminal is disposed in the vicinity of a corner of the support substrate.

  An electronic device according to the present invention includes a semiconductor substrate having a microelectromechanical mechanism and an electrode pad connected to the connection pad via a conductive bonding material on a lower surface on a support substrate having a plurality of connection pads. And an electronic device in which a microelectromechanical mechanism is accommodated in the space, and a conductive bonding material is interposed between the semiconductor substrate and the support substrate. The micro electro mechanical mechanism is hermetically sealed with a metal sealing member surrounding the void outside, and the metal sealing member is connected to the ground terminal on the lower surface of the support substrate via the ground via conductor in the support substrate. In addition, the connection pad is electrically connected to the signal terminal on the lower surface of the support substrate via the signal via conductor in the support substrate, whereby the electrode of the electronic component is connected to the connection pad and the signal via conductor. Signal through It can be led to the outside as a child.

  In addition, according to the electronic component of the present invention, for example, by using an insulating substrate such as a ceramic multilayer wiring board, a metal bump for external connection can be attached to a signal terminal or a ground terminal. It can be completed as an electronic component that can be surface-mounted.

  Further, since the distance between the ground via conductor and the signal via conductor is set to ½ or less of the wavelength of the high-frequency signal transmitted through the signal via conductor, the signal via conductor having an inductor component On the other hand, by adding a capacitor component, impedance matching becomes possible, and a high-frequency signal transmitted through the signal via conductor can be transmitted with low loss. Thereby, an electronic device with high reliability can be obtained.

  According to the electronic device of the present invention, a plurality of the ground via conductors are embedded in the support substrate in rows, and the distance between the ground via conductors is also set to ½ or less of the wavelength. By doing so, a stable ground network can be formed, and good shielding properties can be obtained. Therefore, it is possible to effectively remove harmonic noise that enters from the outside of the electronic device in which the microelectromechanical mechanism is formed, to operate the electronic device etc. normally and stably, and to include harmonics included in the signal propagated through the electronic device. Wave noise can be effectively prevented from being released to the outside.

  Furthermore, according to the electronic device of the present invention, a concave portion that accommodates at least a part of the micro electro mechanical mechanism is provided in a portion corresponding to the micro electro mechanical mechanism on the upper surface of the support substrate. The height of the metal sealing member for surrounding the micro-electromechanical mechanism can be kept low, which can be advantageous for reducing the height of the electronic device. In this case, since distortion and stress applied to the micro electro mechanical mechanism can be minimized, an electronic device having higher reliability can be obtained.

  Further, according to the electronic device of the present invention, since the sealing member and the conductive bonding material are formed of the same metal material, they can be collectively bonded and sealed in the mounting process. It can be used to improve the property. Further, in this case, since bonding and mounting can be performed under the same temperature condition, distortion and stress concentration are unlikely to occur, and this can also be used to improve the reliability of the electronic device.

  Further, according to the electronic device of the present invention, since the semiconductor substrate and the support substrate are made substantially congruent when seen through the plane, stress concentration and distortion at the time of joint mounting do not occur, so that the highly reliable electron A device is obtained. In addition, when the secondary mounting is performed on a mother board such as an organic substrate, local stress concentration is not generated, so that the performance can be stabilized and the reliability of the electronic device can be improved.

  Further, according to the electronic device of the present invention, by disposing the ground terminal on the outer peripheral portion of the other main surface of the support substrate, the mismatch of the propagation mode induced by the instability of the high frequency ground is reduced. . In addition, since the ground network path is shortened and an increase in inductance component can be prevented, a grounded state can be stably formed, and good electromagnetic shielding properties can be maintained. This makes it less susceptible to harmonic noise entering from outside the electronic device, and at the same time, harmonic noise contained in the signal propagating through the wiring in the electronic device is released to the outside and external devices and It is possible to effectively prevent adverse effects on devices and the like.

  Furthermore, according to the electronic device of the present invention, the grounding state can be stably configured by forming the support substrate in a polygonal shape and arranging the ground terminal in the vicinity of a corner of the support substrate. Good electromagnetic shielding properties can be maintained. This also makes it less susceptible to the effects of harmonic noise that enters from the outside, and at the same time, the harmonic noise contained in the signal propagating through the wiring in the electronic device is released to the outside, adversely affecting external devices and equipment. Can be effectively prevented.

  The present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic device according to the present invention, in which 1 is a support substrate, 2 is a connection pad, 3 is a microelectromechanical mechanism, 4 is a conductive bonding material, 5 Is an electrode pad, 6 is a semiconductor substrate, 7 is a void, 8 is an electronic device, 9 is a metal sealing member, 10 is a ground via conductor, 11 is a ground terminal, 12 is a signal via conductor, 13 is a signal terminal, Reference numeral 14 denotes a recess.

  The microelectromechanical mechanism 3 in the present invention includes, for example, an electric switch, an inductor, a capacitor, a co-propagator, an antenna, a micro relay, an optical switch, a magnetic head for a hard disk, a microphone, a biosensor, a DNA chip, a microreactor, a print head, and an acceleration sensor. It is an electronic device having functions such as various sensors such as pressure sensors and display devices, and is a component made by so-called micromachining based on semiconductor micromachining technology, and has a size of about 10 μm to several hundred μm per element. Have.

  The semiconductor substrate 6 is made of a silicon substrate such as a single crystal or polycrystal. A silicon oxide layer is formed on the surface of such a silicon substrate, and by applying a fine wiring processing technique such as photolithography, from a minute electromechanical mechanism 3 such as a minute vibrating body and a conductor such as a circular or rectangular pattern. An electrode pad 5 is formed. In the present embodiment, the micro electro mechanical mechanism 3 and the electrode pad 5 are electrically connected via fine wirings (not shown) formed on the main surface of the semiconductor substrate 6, respectively.

  The support substrate 1 functions as a lid for sealing the micro-electromechanical mechanism 3, and also includes a connection pad 2, a metal sealing member 9, a ground via conductor 10, a ground terminal 11, a signal via conductor 12, and a signal. It functions as a base for forming the terminal 13 and the recess 14.

  Such a support substrate 1 is made of ceramics such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a glass ceramic sintered body. It is formed of a material, an organic resin material such as polyimide or glass epoxy resin, or a composite material formed by bonding inorganic powder such as ceramics or glass with an organic resin such as epoxy resin.

  For example, when the support substrate 1 is formed of an aluminum oxide sintered body, the support substrate 1 is formed by stacking and firing a green sheet formed by forming aluminum oxide and a raw material powder such as glass powder on the sheet. The support substrate 1 is not limited to the one formed of an aluminum oxide sintered body, and is appropriately selected depending on the application and the characteristics of the electronic device 8 to be hermetically sealed.

  For example, since the support substrate 1 is mechanically bonded to the semiconductor substrate 6 via the conductive bonding material 4 and the metal sealing member 9 as will be described later, the reliability of bonding with the semiconductor substrate 6, that is, a minute amount In order to increase the hermeticity of sealing of the electronic mechanical mechanism 3, an oxidation in which the thermal expansion coefficient is approximated to that of the semiconductor substrate 6 by adjusting the kind and added amount of the mullite sintered body or the glass component, for example. It is preferable to form it with a material having a small difference in thermal expansion coefficient from that of the semiconductor substrate 6, such as a sintered glass ceramic such as an aluminum-borosilicate glass.

  Further, the support substrate 1 is made of an organic resin material such as polyimide or glass epoxy resin, or an inorganic powder such as ceramic or glass, when preventing the delay of the electrical signal transmitted by the signal via conductor 12. It is preferable to form with a material having a low relative dielectric constant such as a composite material formed by bonding with an organic resin such as an aluminum oxide-borosilicate glass-based or lithium oxide-based glass ceramic sintered body.

  Further, the support substrate 1 has a large calorific value of the micro-electromechanical mechanism 3 to be sealed, and in the case where the heat dissipating property is good, heat such as an aluminum nitride sintered body is used. It is preferable to form with a material having high conductivity.

  A plurality of connection pads 2 and a metal sealing member 9 are formed on one main surface of the support substrate 1 (the side on which the micro electro mechanical mechanism 3 is sealed). A via conductor 12 is led out and connected to the signal terminal 13. A ground via conductor 10 is led out from the metal sealing member 9 and connected to the ground terminal 11.

  The connection pad 2, the signal via conductor 12, the signal terminal 13, the ground via conductor 10, and the ground terminal 11 are formed of a metal material such as copper, silver, gold, palladium, tungsten, molybdenum, and manganese. These may be formed by depositing a metal thin film, such as plating or vapor deposition, or may be formed by printing a conductor paste on a green sheet to be the insulating substrate 1 and firing it with the green sheet. .

  The conductive bonding material 4 and the metal sealing member 9 are composed of solder such as tin-silver, tin-silver-copper, low melting point brazing material such as gold-tin brazing, high melting point brazing material such as silver-germanium, It is made of a conductive organic resin or a metal material that can be joined by a welding method such as seam welding or electron beam welding.

  By bonding the conductive bonding material 4 to the electrode pad 5 of the electronic device 8, the support substrate 1 is connected via the electrode pad 5 of the electronic device 8, the conductive bonding material 4, the connection pad 2, and the signal via conductor 12. The other main surface is derived. Further, by joining the metal sealing member 9 to the electronic device 10, the metal sealing member 9 is led out to the other main surface of the support substrate 1 through the metal sealing member 9, the ground via conductor 10 and the ground terminal 11. Then, the electrode 9 of the electronic component 10 is electrically connected to the external electric circuit by joining the derived terminal to the external electric circuit via tin-lead solder or the like. With such a configuration, the electrode of the electronic device 8 is led out to the outside.

  In addition, the electronic component of this embodiment can be easily formed on the surface by, for example, attaching a metal bump for external connection to a signal terminal or a ground terminal by using an insulating substrate such as a ceramic multilayer wiring board. It can be completed as an electronic component that can be mounted.

  Furthermore, in this embodiment, a metal sealing member 9 is bonded to one main surface of the support substrate 1 so as to surround the conductive bonding material 4. The metal sealing member 9 functions as a side wall for hermetically sealing the micro electro mechanical mechanism 3 of the electronic device 8 inside. The main surface (upper surface in the example of FIG. 1) of the metal sealing member 9 is joined to the main surface (lower surface in the example of FIG. 1) of the electronic device 8, so that the microelectromechanical mechanism is placed inside the metal sealing member 9. 3 is hermetically sealed. In this case, the semiconductor substrate 6 serves as a bottom plate and the support substrate 1 serves as a lid.

  The metal sealing member 9 is made of an iron-nickel alloy such as an iron-nickel-cobalt alloy or an iron-nickel alloy, a metal material such as oxygen-free copper, aluminum, stainless steel, a copper-tungsten alloy, or a copper-molybdenum alloy. . The metal sealing member 9 is formed of an inorganic material such as an aluminum oxide sintered body or a glass ceramic sintered body, or an organic resin material such as PTFE (polytetrafluoroethylene) or glass epoxy resin. Then, a metal layer such as Au, Ag, Cu, Al, Pt, or Pd may be formed on the surface by depositing a conductive film by a plating method or the like.

  Further, as a method for joining the main surface of the metal sealing member 9 to the main surface of the semiconductor substrate 6 of the electronic device 8, a solder such as tin-silver based solder, a low melting point brazing material such as gold-tin brazing, silver-germanium, etc. A method of joining via a joining material such as a high melting point brazing material such as a conductive system or a conductive organic resin, or a conventionally known welding method such as seam welding or electron beam welding is used.

  And about the electronic device 8 in which the micro electromechanical mechanism 3 and the electrode pad 5 electrically connected to this are formed on the main surface of the semiconductor substrate 6, the electrode pad 5 is bonded to the conductive bonding material 4, and the semiconductor By bonding the main surface of the substrate 6 to the main surface of the metal sealing member 9, an electronic device in which the microelectromechanical mechanism 3 of the electronic device 8 is hermetically sealed inside the metal sealing member 9 is formed.

  A ground via conductor 10 and a ground terminal 11 electrically connected to the metal sealing member 9 are led out to the other main surface of the support substrate 1 to which the conductive bonding material 4 is bonded.

  With this configuration, a stable ground network can be formed, so that a good electromagnetic shielding property can be obtained, and harmonic noise that tries to enter the electronic device 8 from the outside can be effectively removed. Thus, the electronic device 8 operates normally and stably, and harmonic noise included in a signal propagating through the wiring of the electronic device 8 is emitted to the outside of the electronic device 8 to adversely affect external devices and equipment. Can be effectively prevented.

  Furthermore, in the electronic device of the present invention, as shown in FIG. 2, a distance L1 between the ground via conductor 10 and the signal via conductor 11 is set to a high frequency signal (several tens of MHz) transmitted through the signal via conductor 12. It is preferable to set it to ½ or less of the wavelength of about ˜100 GHz. 2, the same parts as those in FIG. 1 are denoted by the same reference numerals, and redundant description is omitted.

  Accordingly, the distance between the ground via conductor 10 and the signal via conductor 11 is set to ½ or less of the wavelength of the high-frequency signal (several tens of MHz to 100 GHz) transmitted through the signal via conductor 12. Therefore, by adding a capacitor component to the signal via conductor 12 having an inductor component, impedance matching becomes possible, so that a high-frequency signal transmitted through the signal via conductor 12 can be transmitted with low loss. Therefore, the highly reliable electronic device 8 is obtained.

  Furthermore, in the electronic device of the present invention, as shown in FIG. 3, a plurality of ground via conductors 10 are embedded in the support substrate 1 in rows, and the distance between the ground via conductors is also set to the above-mentioned wavelength. It is preferable to set it to 1/2 or less. In FIG. 3, the same parts as those in FIG. 1 are denoted by the same reference numerals, and redundant description is omitted.

  Thereby, the mismatch of the propagation mode induced by the instability of the high-frequency ground is reduced, and a stable ground network can be formed. Therefore, a stable grounding state can be obtained and a good shielding property can be obtained. Therefore, it is possible to effectively remove the harmonic noise that tries to enter from the outside of the electronic device 8 and to operate the electronic device 8 normally and stably, and is included in the signal that propagates through the wiring of the electronic device 8 and the like. It is possible to effectively prevent the existing harmonic noise from being emitted to the outside and adversely affecting external electronic devices and electronic equipment.

  In the electronic device of the present invention, as shown in FIG. 4, at least a part of the microelectromechanical mechanism 3 is accommodated in a portion corresponding to the microelectromechanical mechanism 3 on the upper surface of the support substrate 1. It is preferable to provide the concave portion 14 to be provided. In FIG. 4, the same parts as those in FIG. 1 are denoted by the same reference numerals, and redundant description is omitted.

  When the support substrate 1 is made of an aluminum oxide sintered body and the ground via conductor 10 and the signal via conductor 12 are made of a tungsten metallized layer, raw material powders such as aluminum oxide, silicon oxide, and calcium oxide are used as an organic resin and binder. The slurry is kneaded together to obtain a slurry, and the slurry is formed into a sheet shape by a doctor blade method or a lip coater method to form a plurality of green sheets. It can be formed by printing and filling tungsten metallized paste in the through-holes, and then laminating and firing these green sheets.

  Of these green sheets, some of them are punched to form square-shaped openings, etc., which are arranged on the outermost layer on one main surface side, or from the outermost layer to the inside. By laminating several layers toward the front, the concave portions 14 corresponding to the arrangement of the microelectromechanical mechanisms 3 may be arranged on one main surface of the support substrate 1 after firing. If the concave portion 14 is formed in this way, the micro electro mechanical mechanism 3 can be accommodated inside the concave portion 14, and therefore the height of the metal sealing member 9 for surrounding the micro electro mechanical mechanism 3 is kept low. This is advantageous for reducing the height of the electronic device 8. In addition, since the strain and stress applied to the microelectromechanical mechanism 3 can be minimized, an electronic device having higher reliability can be obtained.

  Furthermore, in the electronic device of the present invention, it is preferable that the metal sealing member 9 and the conductive bonding material 4 are formed of the same metal material. Thereby, since it becomes possible to join and seal in a lump in a mounting process, a process is reduced and it can use for productivity improvement. Further, since bonding and mounting can be performed under the same temperature condition, distortion and stress concentration are unlikely to occur, and this can also be used to improve reliability.

  Furthermore, in the present invention, if the semiconductor substrate 6 and the support substrate 1 are made substantially congruent when seen through the plane, stress concentration and distortion are less likely to occur when bonded and mounted, and thus the highly reliable electronic device 8. Can be obtained. Further, when secondary mounting is performed on a mother board such as an organic substrate, local stress concentration does not occur, so that the performance can be stabilized.

  Furthermore, in the electronic device of the present invention, it is preferable that the ground terminal 11 is arranged on the outer peripheral portion of the other main surface of the support substrate 1 as shown in FIG. In FIG. 5, the same parts as those in FIG. 1 are denoted by the same reference numerals, and redundant description is omitted.

  In the embodiment shown in FIG. 5, since the ground terminal 11 is arranged on the outer peripheral portion of the other main surface of the support substrate 1, the mismatch of the propagation mode induced by the instability of the high frequency ground is reduced. In addition, since the ground network path is shortened and an increase in inductance component can be prevented, a grounded state can be stably formed, and good electromagnetic shielding properties can be maintained. Therefore, it is less affected by the harmonic noise that tries to enter from the outside of the electronic device 8, and the harmonic noise included in the signal propagating through the wiring of the electronic device is emitted to the outside, so that the external electronic device or the electronic It is possible to effectively prevent adverse effects on the device.

  Furthermore, in the electronic device of the present invention, as shown in FIG. 6, it is preferable that the support substrate 1 has a polygonal shape and the ground terminals 11 are arranged in the vicinity of the corners of the support substrate 1. In FIG. 6, the same parts as those in FIG. 1 are denoted by the same reference numerals, and redundant description is omitted.

  In the embodiment shown in FIG. 6, since the ground terminal 11 is disposed in the vicinity of the corner of the support substrate 1, a grounded state can be stably formed and good electromagnetic shielding properties can be maintained. Can do. Therefore, it is difficult to be affected by harmonic noise entering from the outside of the electronic apparatus 8, and the harmonic noise included in the signal propagating through the wiring of the electronic apparatus 8 is emitted to the outside, It is possible to effectively prevent adverse effects on electronic devices and the like.

  In addition, since the ground terminals 11 arranged in the vicinity of the corners of the support substrate 1 are increased in size, a stronger connection is possible when secondary mounting is performed. Therefore, the electronic device 8 with higher reliability can be obtained. Obtainable. In addition, since the ground potential can be stabilized, the influence of harmonic noise inside and outside the electronic device described above can be satisfactorily removed.

  Thus, the electronic device 8 of the present invention is hermetically sealed in a good state, and the electrode is led out to the outside through the ground terminal 11 and the signal terminal 13, so that There is no need to add a separate process for mounting in the package. Simply connecting the part where the ground terminal 11 and the signal terminal 13 are led to the external electric circuit via solder balls etc., it can be mounted on the external electric circuit board. Can be used.

  In addition, since the ground terminal 11 and the signal terminal 13 are led out to the other main surface of the support base 1, they can be connected to an external electric circuit in the form of surface mounting, and can be mounted with high density or an external electric circuit board. Can be effectively downsized.

  Note that the present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the gist of the present invention.

  For example, in the example of the above-described embodiment, one microelectromechanical mechanism is hermetically sealed in one electronic device, but a plurality of microelectromechanical mechanisms may be hermetically sealed in one electronic device. In the example shown in FIG. 1, the ground terminal 11 and the signal terminal 13 are led out to the other main surface side of the support substrate 1. However, they are led out to the side surface or to both the side surface and the other main surface. Or you may. Further, the electrical connection of the derived portion to an external electric circuit is not limited to being performed via a solder ball as an external terminal, and may be performed via a lead terminal, a conductive adhesive, or the like.

It is sectional drawing which shows an example of embodiment of the board | substrate for electronic component sealing of this invention. It is sectional drawing which shows an example of embodiment of the board | substrate for electronic component sealing of this invention. It is sectional drawing which shows the other example of embodiment of the board | substrate for electronic component sealing of this invention. It is sectional drawing which shows the other example of embodiment of the board | substrate for electronic component sealing of this invention. It is sectional drawing which shows the other example of embodiment of the board | substrate for electronic component sealing of this invention. It is sectional drawing which shows the other example of embodiment of the board | substrate for electronic component sealing of this invention. It is sectional drawing which shows an example of the conventional board | substrate for electronic component sealing, and an electronic apparatus using the same.

Explanation of symbols

1: Support substrate 2: Connection pad 3: Micro-electromechanical mechanism
4: Conductive bonding material 5: Electrode pad 6: Semiconductor substrate 7: Empty space 8: Electronic device 9: Metal sealing member
10: Ground via conductor
11: Ground terminal
12: Signal via conductor
13: Signal terminal
14: Recess

Claims (7)

On a support substrate having a plurality of connection pads, a micro electro mechanical mechanism and a semiconductor substrate having an electrode pad connected to the connection pad via a conductive bonding material on a lower surface, a predetermined void is provided between them. An electronic device that is arranged to be formed and that houses a microelectromechanical mechanism in the void,
The micro electro mechanical mechanism is hermetically sealed between the semiconductor substrate and the support substrate by interposing a metal sealing member surrounding the void outside the conductive bonding material, and the metal The sealing member is electrically connected to the ground terminal on the lower surface of the support substrate via the ground via conductor in the support substrate, and the connection pad is electrically connected to the signal terminal on the lower surface of the support substrate via the signal via conductor in the support substrate. And the distance between the ground via conductor and the signal via conductor is set to ½ or less of the wavelength of the high-frequency signal transmitted through the signal via conductor. . 2. A plurality of ground via conductors are embedded in a row in the support substrate, and the distance between the ground via conductors is set to ½ or less of the wavelength. An electronic device according to 1. 3. The concave portion in which at least a part of the micro electro mechanical mechanism is accommodated in a portion corresponding to the micro electro mechanical mechanism on an upper surface of the support substrate. Electronic devices. 4. The electronic device according to claim 1, wherein the sealing member and the conductive bonding material are made of the same metal material. 5. The electronic device according to claim 1, wherein the semiconductor substrate and the support substrate are substantially congruent in a plan view. The electronic device according to claim 1, wherein the ground terminal is disposed on an outer peripheral portion of the other main surface of the support substrate. The electronic device according to claim 1, wherein the support substrate has a polygonal shape, and the ground terminal is disposed in the vicinity of a corner portion of the support substrate.

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