JP2015154371A - crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal device capable of reducing variation in an oscillation frequency of a crystal element.SOLUTION: The crystal device comprises: a substrate; an electrode pad formed on an upper surface of the substrate; at least one bump formed on the electrode pad; a crystal element 120 including a crystal blank 121, oscillating electrodes 122 formed on upper and lower surfaces of the crystal blank 121 and a pair of extraction electrodes 123 formed on the lower surface of the crystal blank 121 with a gap from the oscillating electrodes 122 and mounted on the electrode pad 111 through conductive adhesive 140; through holes 124 formed on the extraction electrodes 123 so as to be pierced into the crystal blank 121; the conductive adhesive 140 applied to the upper surface of the electrode pad 111 and the insides of the through holes 124 so as to be applied to the bump 114; and a sealing lid 130 for airtightly sealing the crystal element 120.

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  A quartz crystal device uses a piezoelectric effect of a quartz crystal element to cause a thickness-shear vibration so that both surfaces of a quartz base plate are shifted from each other, thereby generating a specific frequency. A crystal device including a crystal element mounted on an electrode pad provided on a substrate via a conductive adhesive has been proposed (for example, see Patent Document 1 below). The crystal element has excitation electrodes on both main surfaces of the crystal base plate, one end of the crystal element is a fixed end connected to the upper surface of the substrate, and the other end is a free end spaced from the upper surface of the substrate. Cantilevered support structure.

JP 2002-111435 A

  The above-described quartz device is remarkably miniaturized, but the quartz element mounted on the substrate is also downsized. When a conductive adhesive is applied on a conventional electrode pad and the crystal element is placed on the upper surface of the conductive adhesive, the free end of the crystal element or the excitation electrode may come into contact with the substrate. When the free end of the crystal element or the excitation electrode is in contact with the substrate, the thickness-shear vibration of the crystal element is hindered and the oscillation frequency of the crystal element may fluctuate.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a crystal device capable of reducing fluctuations in the oscillation frequency of a crystal element.

  A crystal device according to one aspect of the present invention includes a substrate, an electrode pad provided on the upper surface of the substrate, a bump provided on the electrode pad, a crystal element plate, and upper and lower surfaces of the crystal element plate. And a pair of extraction electrodes provided on the lower surface of the quartz base plate with a space between the excitation electrodes and mounted on the electrode pad via a conductive adhesive. In order to hermetically seal the crystal element, the through-hole provided in the lead electrode, the conductive adhesive provided in the upper surface of the electrode pad and in the through-hole and provided so as to cover the bump, and the crystal element A provided sealing lid.

  A quartz crystal device according to an aspect of the present invention includes at least one bump provided on an electrode pad, a quartz base plate, excitation electrodes provided on the top and bottom surfaces of the quartz base plate, and a bottom surface of the quartz base plate. A pair of lead electrodes provided spaced apart from the excitation electrode, a crystal element mounted on the electrode pad via a conductive adhesive, a through hole provided in the lead electrode, A conductive adhesive provided on the upper surface of the electrode pad and in the through-hole and provided so as to cover the bump. By doing so, the quartz crystal device is provided so that the conductive adhesive crawls up to the upper surface of the extraction electrode through the through hole, so that the conductive adhesive and the extraction electrode provided on the electrode pad are provided. When the conductive adhesive provided on the upper surface is cured and contracted, the fixed end side of the crystal element is pulled downward, and the free end of the crystal element is lifted upward by the principle of the insulator with the bump as a fulcrum. Therefore, it is possible to reduce the inhibition of the thickness-shear vibration of the crystal element, so that the oscillation frequency of the crystal element can be stably output.

It is a disassembled perspective view which shows the crystal device in this embodiment. (A) It is sectional drawing in AA of the crystal device shown by FIG. 1, (b) It is the elements on larger scale of X1 location of Fig.2 (a). (A) It is a top view which shows the state which removed the cover of the crystal device in this embodiment, (b) It is a top view which shows the state which removed the cover and crystal element of the crystal device in this embodiment. It is a disassembled perspective view which shows the quartz crystal device in the 1st modification of this embodiment. (A) It is sectional drawing in BB of the crystal device shown by FIG. 4, (b) It is the elements on larger scale of X2 location of Fig.5 (a). (A) It is a top view which shows the state which removed the cover of the crystal device in the 1st modification of this embodiment, (b) The cover and crystal element of the crystal device in the 1st modification of this embodiment are removed. It is a top view which shows the state which carried out.

  As shown in FIGS. 1 to 3, the crystal device according to the present embodiment includes a package 110, a crystal element 120 bonded to the upper surface of the package 110, and a lid 130 bonded to the upper surface of the package 110. Is included. The package 110 has a recess K surrounded by the upper surface of the substrate 110a and the inner surface of the frame 110b. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface. The substrate 110 a is provided with a pair of electrode pads 111 on the upper surface for bonding the crystal element 120.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern (not shown) and via conductors (not shown) for electrically connecting the electrode pads 111 provided on the upper surface and the external terminals 112 provided on the lower surface of the substrate 110a are provided on and inside the substrate 110a. (Not shown) is provided.

  The frame 110b is disposed on the upper surface of the substrate 110a, and is for forming the recess K on the upper surface of the substrate 110a. The frame 110b is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a.

  Here, when the package 110 is viewed in plan, the dimension of one side is 1.0 to 3.0 mm, and the vertical dimension of the package 110 is 0.7 to 1.5 mm as an example. The size of K will be described. The length of the long side of the recess K is 0.7 to 2.0. mm, and the length of the short side is 0.5 to 1.5 mm. Moreover, the length of the up-down direction of the recessed part K is 0.2-0.5 mm.

  In addition, external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Two of the external terminals 112 are electrically connected to an electrode pad 111 provided on the upper surface of the substrate 110a. The external terminals 112 that are electrically connected to the electrode pads 111 are provided so as to be located diagonally on the lower surface of the substrate 110a.

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. The electrode pad 111 includes a first electrode pad 111a and a second electrode pad 111b. The electrode pad 111 is electrically connected to an external terminal 112 provided on the lower surface of the substrate 110a through a wiring pattern (not shown) and a via conductor (not shown) provided on the substrate 110a.

  The bump 114 is for suppressing the free end of the crystal element 120 from contacting the substrate 110a. The bump 114 is provided at a position facing the extraction electrode 123 of the crystal element 120. The bump 114 is composed of a first bump 114a and a second bump 114b. As shown in FIG. 1, the first bump 114a is provided on the first electrode pad 111a, and the second bump 114b is provided on the second electrode pad 111b. The bump 114 has a rectangular shape in plan view, and is provided on the electrode pad 111 so as to have an arc-shaped chamfer at the corner. By providing arc-shaped chamfers at the corners of the bumps 114, the bumps 114 can be prevented from being peeled off from the electrode pads 111 by being dispersed when stress is applied during curing shrinkage of the conductive adhesive 140.

  Further, as shown in FIG. 3B, the first bump 114a and the second bump 114b are provided so as to be aligned on the same straight line with respect to a straight line parallel to one side of the substrate 110a. . By doing so, the first lead electrode 123a of the crystal element 120 is brought into contact with the first bump 114a, and the second lead electrode 123b is mounted on the electrode pad 111 while being brought into contact with the second bump 114b. 120 can be mounted in a stable state without tilting.

  Here, when the package 110 is viewed in plan, the dimension of one side is 1.0 to 3.0 mm, and the vertical dimension of the package 110 is 0.7 to 1.5 mm as an example. The size of the pad 111 and the bump 114 will be described. The length of the side of the electrode pad 111 parallel to one side of the substrate 110a is 250 to 400 μm. The length of the side of the electrode pad 111 that is parallel to the side that intersects with one side of the substrate 110a is 250 to 400 μm. The length of the bump 114 in the long side direction is 150 to 300 μm, and the length of the side in the short side direction of the bump 114 is 50 to 75 μm. The length of the thickness of the bump 114 in the vertical direction is 20 to 75 μm.

  The sealing conductor pattern 113 plays a role of improving the wettability of the bonding member 131 when bonded to the lid 130 via the bonding member 131. The sealing conductor pattern 113 is provided so as to surround the upper surface of the frame 110b. The sealing conductor pattern 113 is formed to have a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of, for example, tungsten or molybdenum so as to surround the upper surface of the frame 110b in an annular shape. Has been.

  Here, a method for manufacturing the package 110 will be described. When the substrate 110a and the frame 110b are made of alumina ceramics, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, a predetermined portion of the conductor pattern, specifically, a pair of electrode pads 111, an external terminal 112, a sealing conductor pattern 113, or a portion that becomes the bump 114 is manufactured by nickel plating or gold plating. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIGS. 2 and 3A, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  As shown in FIGS. 2 and 3A, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to the upper surface and the lower surface of the crystal base plate 121, respectively. Yes. The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In addition, the lead electrode 123 is provided with a through hole 124 penetrating in the vertical direction of the crystal base plate 121.

  The through hole 124 is provided in the extraction electrode 123 so as to penetrate the crystal base plate 121 in the vertical direction. The through hole 124 includes a first through hole 124a and a second through hole 124b. The first through hole 124a is provided in the first lead electrode 123a, and the second through hole 124b is provided in the second lead electrode 123b. In addition, the conductive adhesive 140 is provided in the through hole 124 so as to be filled therein. By doing so, the contact area between the conductive adhesive 140 and the through hole 124 of the crystal element 120 is increased as compared with the case where the conductive adhesive is provided only on the bump. Thus, the bonding strength between the crystal element 120 and the conductive adhesive 140 can be improved.

  Further, the through hole 124 serves to prevent the conductive adhesive 140 from overflowing to the excitation electrode 122 side described later beyond the bump. That is, when the conductive adhesive 140 enters the through hole 124, the conductive adhesive 140 does not flow over the bump 114 and onto the electrode pad 111, but remains on the electrode pad 111, and the conductive adhesive 140. The thickness in the vertical direction is maintained. Further, by suppressing the conductive adhesive 140 from overflowing toward the second excitation electrode 122b side, a short circuit between the second excitation electrode 122b and the first extraction electrode 123a can be reduced.

Further, the through hole 124 is provided at a position that does not overlap the bump 114 on the electrode pad 111 in plan view. By doing so, when the conductive adhesive 140 provided on the upper surface of the extraction electrode 123 through the through hole 124 is cured and contracted, the bump 114 can be reliably used as a fulcrum of the insulator. The free end side of the crystal element 120 can be further floated. Further, when the conductive adhesive 140 provided on the upper surface of the extraction electrode 123 is cured and shrunk through the through hole 124, even if a downward force is applied directly below the through hole 124, the through hole 124 Since it is provided in a position not overlapping with the bump 114 on the electrode pad 111 in plan view,
Suppressing the occurrence of concentrated downward stress at the location where the bump 114 and the crystal element 120 are in contact with each other, and reducing the chipping of the crystal element 120 caused by the crystal element 120 being pressed against the bump 114. Can do.

  Here, as an example, the dimension of one side when the crystal element 120 is viewed in plan is 0.7 to 1.2 mm, and the dimension in the vertical direction of the crystal element 120 is 0.016 to 0.25 mm. The size of the through hole 124 will be described. The diameter of the through hole 124 is 0.05 to 0.10 mm.

  In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111a and the second electrode pad 111b is a fixed end connected to the upper surface of the substrate 110a, and the other end is spaced from the upper surface of the substrate 110a. The quartz crystal element 120 is fixed on the substrate 110a by a cantilever support structure having a free end. Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  The first lead electrode 123a of the crystal element 120 is in contact with the first bump 114a, and the second lead electrode 123b of the crystal element 120 is in contact with the second bump 114b. Since the crystal element 120 can be prevented from being tilted by bringing the lead electrode 123 of the crystal element 120 into contact with the bump 114 in this manner, the free end of the crystal element 120 and the excitation electrode 122 are in contact with the substrate 110a. Can be reduced.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. Then, the quartz crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the quartz base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied so as to spread on the electrode pad 111 by, for example, a dispenser. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140 so as to reach the upper surface of the extraction electrode 123 through the through hole 124 provided in the extraction electrode 123. The conductive adhesive 140 is cured and contracted by being heated and cured. When the conductive adhesive 140 cures and shrinks, the quartz crystal element 120 passes through the conductive adhesive 140 provided on the upper surface of the electrode pad 111 and the through-hole 124 and the conductive adhesive provided on the upper surface of the extraction electrode 123. The agent 140 is pulled downward on the fixed end side of the crystal element 120, and the principle of the insulator with the bump 114 as a fulcrum works, and the free end side of the crystal element 120 floats upward, and a pair of electrodes Bonded to the pad 111.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The conductive adhesive 140 is formed so as to spread on the electrode pad 111 so as to overlap the upper surface of the bump 114 in a plan view, and is disposed so as to be spaced from the excitation electrode 122 of the crystal element 120. In the quartz crystal device, the conductive adhesive 140 and the excitation electrode 122 are arranged with a space therebetween, so that a short circuit caused by the conductive adhesive 140 adhering to the excitation electrode 122 can be reduced. .

  Further, by using a conductive adhesive 140 having a viscosity of 35 to 45 Pa · s, when applied on the electrode pad 111, the conductive adhesive 140 exceeds the bump 114 on the electrode pad 111. It stays on the electrode pad 111 without flowing out, and the thickness of the conductive adhesive 140 in the vertical direction is maintained.

  The lid body 130 has a rectangular shape, and is for hermetically sealing the concave portion K in a vacuum state or the concave portion K filled with nitrogen gas or the like. Specifically, the lid 130 is placed on the upper surface of the joining member 131 provided on the frame 110b in a predetermined atmosphere. When heat is applied to the bonding member 131 provided on the upper surface of the sealing conductor pattern 113 of the frame 110b, fusion bonding is performed. The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example.

  The joining member 131 is provided from the upper surface of the frame 110b to the lower surface of the lid 130. For example, in the case of glass, the joining member 131 is a glass that melts at 300 ° C. to 400 ° C., and is made of, for example, low-melting glass or lead oxide-based glass containing vanadium. Glass is in the form of a paste to which a binder and a solvent are added. After being melted, the glass is solidified and joined to another member. The joining member 131 is provided by, for example, applying glass frit paste by a screen printing method and drying. The bonding member 131 is printed so that the bonding member 131 overlaps the four corners of the sealing conductor pattern 113 of the frame 110b when printing on the upper surface of the sealing conductor pattern 113 of the frame 110b. Therefore, the thickness of the bonding member 131 at the four corners is provided to be thicker than the thickness of other portions where the bonding member 131 is provided. The composition of the lead oxide glass is composed of lead oxide, lead fluoride, titanium dioxide, niobium oxide, bismuth oxide, boron oxide, zinc oxide, ferric oxide, copper oxide and calcium oxide.

  For example, in the case of an insulating resin, the bonding member 131 is made of an epoxy resin or a polyimide resin. The thickness of the joining member 150 provided between the frame 110b and the lid 130 is 30 to 100 μm.

  For example, when the joining member 131 is gold tin, the thickness of the layer of the joining member 131 is 10 to 40 μm. For example, the component ratio is 70 to 80% for gold and 20 to 30% for tin. May be used. For example, when the joining member 131 is silver brazing, the thickness of the layer of the joining member 131 is 10 to 40 μm. For example, the component ratio is 70 to 80% for silver and 20 to 30% for copper. May be used.

  The crystal device in this embodiment includes a substrate 110a, an electrode pad 111 provided on the upper surface of the substrate 110a, at least one bump provided on the electrode pad, a crystal element plate 121, and the crystal element plate 121. An excitation electrode 122 provided on the lower surface, and a pair of lead electrodes 123 provided on the lower surface of the quartz base plate 121 with a space between the excitation electrode 122, and the electrode via the conductive adhesive 140 The crystal element 120 mounted on the pad 111, the through hole 124 provided in the extraction electrode 123 so as to penetrate the crystal base plate 121, the upper surface of the electrode pad 111 and the through hole 124, and the bump 114 And a conductive adhesive 140 provided as described above. In this way, the quartz crystal device is provided such that the conductive adhesive 140 crawls up to the upper surface of the extraction electrode 123 through the through-hole 124, so that the conductive adhesive 140 provided on the electrode pad 111 and the extraction are provided. When the conductive adhesive 140 provided on the upper surface of the electrode 123 is cured and contracted, the fixed end side of the crystal element 120 is pulled downward, and the free end of the crystal element 120 is directed upward by the principle of the insulator with the bump 114 as a fulcrum. Float up. Therefore, the quartz crystal device can reduce the contact of the free end of the quartz crystal element 120 and the excitation electrode 122 with the substrate 110a. By doing so, the quartz crystal device can stably output the oscillation frequency because the thickness shear vibration of the quartz crystal element 120 is not inhibited.

  Further, in the quartz crystal device according to the present embodiment, the through hole 124 is provided at a position where it does not overlap with the bump 114 on the electrode pad 111 in plan view. By doing so, when the conductive adhesive 140 provided on the upper surface of the extraction electrode 123 through the through hole 124 is cured and contracted, the bump 114 can be reliably used as a fulcrum of the insulator. The free end side of the crystal element 120 can be further floated. Further, when the conductive adhesive 140 provided on the upper surface of the extraction electrode 123 is cured and shrunk through the through hole 124, even if a downward force is applied directly below the through hole 124, the through hole 124 Since it is provided at a position that does not overlap with the bump 114 on the electrode pad 111 in plan view, it is possible to suppress the downward stress from being concentrated on the place where the bump 114 and the crystal element 120 are in contact with each other. Chipping of the crystal element 120 caused by the crystal element 120 being pressed against the bump 114 can be reduced.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 4 to 6, in the quartz crystal device according to the first modification of the present embodiment, the electrode pad 211 is rectangular, and one side of the electrode pad 211 and one side facing the one side are along. This embodiment differs from the present embodiment in that bumps 214 are provided.

  As shown in FIGS. 4 and 6B, the bump 214 includes a first bump 214a, a second bump 214b, a third bump 214c, and a fourth bump 214d. As shown in FIG. 6B, the first bump 214a is provided along one side of the first electrode pad 211a, and the third bump 214c is along one side facing one side of the first electrode pad 211a. Is provided. As shown in FIG. 6B, the second bump 214b is provided along one side of the second electrode pad 211b, and the fourth bump 214d is on one side facing the one side of the second electrode pad 211b. It is provided along.

  As shown in FIG. 5, the through hole 124 is provided at a position that does not overlap the bump 214 on the electrode pad 211 in a plan view. That is, the first through hole 124a is provided so as to be positioned between the first bump 214a and the third bump 214c provided on the first electrode pad 211a. The second through hole 124b is provided so as to be positioned between the second bump 214b and the fourth bump 214d provided on the second electrode pad 211b. In this way, when the conductive adhesive 140 provided on the upper surface of the extraction electrode 123 through the through-hole 124 is cured and contracted, the bump 214 can be reliably used as a fulcrum of the insulator. The free end side of the crystal element 120 can be further floated. Further, when the conductive adhesive 140 provided on the upper surface of the extraction electrode 123 is cured and shrunk through the through hole 124, even if a downward force is applied directly below the through hole 124, the through hole 124 Since it is provided at a position that does not overlap the bump 214 on the electrode pad 111 in plan view, it is possible to prevent the crystal element 120 and the bump 214 from contacting each other.

  In the crystal device according to the first modification of the present embodiment, the outer peripheral edge on the fixed end side of the crystal base plate 121 is parallel to one side of the substrate 210a in plan view, and the third bump 214c and the fourth bump 214d It is provided to overlap. By doing so, the mounting position of the crystal element 120 can be made visually easier to understand, and the productivity of the crystal device can be improved. Moreover, by doing in this way, it can reduce that the frame 210b of the package 210 and the outer periphery of the crystal element 120 contact, and it becomes possible to prevent the crystal element 120 from being chipped.

  Further, in the crystal device according to the first modification of the present embodiment, the outer peripheral edge on the fixed end side of the crystal base plate 121 is in contact with the third bump 214c and the fourth bump 214d, so that the crystal element 120 is fixed. It can suppress that an edge contacts the upper surface of substrate 210a. By doing in this way, the chip | tip of the crystal | crystallization element 120 produced when the outer periphery of the fixed end side of the crystal | crystallization element 120 contacts the board | substrate 210a can be prevented. Further, the outer peripheral edge on the fixed end side of the quartz base plate 121 is in contact with the third bump 214c and the fourth bump 214d, so that the fixed end side is a distance corresponding to the vertical thickness of the third bump 214c and the fourth bump 214d. Therefore, the free end of the crystal element 120 does not float too much, and the free end of the crystal element 120 can be prevented from contacting the lid 130.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where the frame 110b is integrally formed of a ceramic material in the same manner as the substrate 110a has been described. However, the frame 110b may be made of metal. In this case, the frame is joined to the conductor film of the substrate via a brazing material such as silver-copper.

  In the above embodiment, the case where the sealing conductor pattern 113 is provided on the upper surface of the frame 110b has been described. However, when the bonding member 131 is glass, the sealing conductor pattern 113 is not provided, and the lid 130 is provided. The lower surface of the frame and the upper surface of the frame 110b may be joined by the joining member 131.

  In the above embodiment, the case where the frame 110b is provided on the upper surface of the substrate 110a has been described. However, after the crystal element is mounted on the substrate, the sealing lid in which the sealing frame portion is provided on the lower surface of the sealing base. A structure may be used in which the quartz crystal element is hermetically sealed using a body. The lid is composed of a rectangular sealing base and a sealing frame portion provided along the outer peripheral edge of the lower surface of the sealing base. The lower surface of the sealing base and the inner side of the sealing frame portion An accommodation space is formed with the side surface. The sealing frame portion is for forming an accommodation space on the lower surface of the sealing base. The sealing frame part is provided along the outer edge of the lower surface of the sealing base.

  A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork type having a crystal base part and two flat plate-shaped crystal vibration parts extending in the same direction from the side surface of the crystal base part. A bent crystal element may be used. The crystal element includes a crystal piece, an excitation electrode provided on the surface of the crystal piece, an extraction electrode, and a metal film for frequency adjustment. The crystal piece includes a crystal base portion and a crystal vibration portion, and the crystal vibration portion includes a first crystal vibration portion and a second crystal vibration portion. The crystal base has an orthogonal coordinate system in which the electrical axis is the X axis, the mechanical axis is the Y axis, and the optical axis is the Z axis as the crystal axis direction, within a range of −5 ° to + 5 ° around the X axis. This is a flat plate having a substantially rectangular shape in a plan view in which the direction of the rotated Z ′ axis is the thickness direction. The first crystal vibrating part and the second crystal vibrating part are extended in parallel with the Y′-axis direction from one side of the crystal base part. Such a crystal piece has a tuning fork shape in which a crystal base and each crystal vibration part are integrated, and is manufactured by a photolithography technique and a chemical etching technique.

110, 210 ... Package 110a, 210a ... Substrate 110b, 210b ... Frame body 111, 211 ... Electrode pad 112, 212 ... External terminal 113, 213 ... Conductive pattern 114 for sealing , 214... Bump 120... Crystal element 121... Crystal element plate 122... Excitation electrode 123... Extraction electrode 124 ... Through hole 130 ... Sealing lid 140. Conductive adhesive 150 ... joining member K ... concave

Claims (3)

A substrate,
An electrode pad provided on the upper surface of the substrate;
At least one bump provided on the electrode pad;
A quartz base plate, excitation electrodes provided on the top and bottom surfaces of the quartz base plate, and a pair of lead electrodes provided on the bottom surface of the quartz base plate with a space between the excitation electrodes, A crystal element mounted on the electrode pad via the conductive adhesive;
A through-hole provided in the lead-out electrode so as to penetrate the quartz base plate,
A conductive adhesive provided in the upper surface of the electrode pad and in the through hole and provided so as to cover the bump; and a sealing lid provided for hermetically sealing the crystal element. A crystal device characterized by comprising: The crystal device according to claim 1,
The electrode pad is rectangular;
A crystal device, wherein the bump is provided along one side of the electrode pad and one side facing the one side. The quartz crystal device according to claim 1 or 2,
The crystal device according to claim 1, wherein the through hole is provided at a position not overlapping with the bump in plan view.

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