JP2014049966A - Crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal device capable of relaxing stress applied to a crystal element and reducing fluctuation in oscillation frequency of the crystal element.SOLUTION: A crystal device of the present invention comprises: a substrate 110a; a pair of electrode pads 111 mounted on the substrate 110a; first bumps 112 each of which is mounted on each of the electrode pads 111; second bumps 113 each of which is mounted on each of the electrode pads 111 along one side of the substrate 110a so as to be arranged closer to the outer peripheral edge of the substrate 110a than the first bump 112 with a space with the first bump 112; and a crystal element 120 including a pair of connection electrodes 123 one of which is in contact with one of the first bumps 112 and the other of which is in contact with the other of the first bumps 112. The connection electrodes 123 are connected via the electrode pads 111 and conductive adhesives 140 which are arranged between the first bumps 112 and the second bumps 113.

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  A quartz crystal device uses a piezoelectric effect of a quartz crystal element to cause a thickness-shear vibration so that both surfaces of a quartz base plate are shifted from each other, thereby generating a specific frequency. A crystal device including a crystal element mounted on an electrode pad provided on a substrate via a conductive adhesive has been proposed (for example, see Patent Document 1 below). The crystal element has excitation electrodes on both main surfaces of the crystal base plate, one end of the crystal element is a fixed end connected to the upper surface of the substrate, and the other end is a free end spaced from the upper surface of the substrate. This is a piece holding structure.

JP 2002-111435 A

  The above-described quartz device is remarkably miniaturized, but the quartz element mounted on the substrate is also downsized. When a conductive adhesive is applied on a conventional electrode pad and the crystal element is placed on the upper surface of the conductive adhesive, the free end of the crystal element or the excitation electrode comes into contact with the substrate, and the vibration is hindered. There was a possibility that the oscillation frequency of the element would fluctuate.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a crystal device capable of reducing fluctuations in the oscillation frequency of a crystal element.

  A quartz crystal device according to an aspect of the present invention includes a rectangular substrate, a pair of electrode pads provided on the substrate along one side of the substrate, and each electrode on the electrode pad provided along one side of the substrate. A first bump, a second bump provided on each of the electrode pads, and a second bump provided along one side of the substrate so as to be closer to the outer peripheral edge of the substrate than the first bump; A crystal base plate, excitation electrodes provided on the upper and lower surfaces of the crystal base plate, and a pair of connection electrodes provided on the lower surface of the crystal base plate with a space between the excitation electrodes. One of the pair of connection electrodes and one of the first bumps are in contact, the other of the pair of connection electrodes and the other of the first bumps are in contact, and the connection electrodes are the first bump and the second bump Connected to the electrode pad located between the two via conductive adhesive When, and is characterized in that it comprises a.

  In the quartz crystal device according to one aspect of the present invention, one of the pair of connection electrodes contacts one of the first bumps, the other of the pair of connection electrodes contacts the other of the first bumps, and the connection electrode The crystal device includes an electrode pad positioned between the first bump and the second bump and a crystal element connected via a conductive adhesive, whereby the crystal device has a tip portion of the crystal element and an excitation electrode. Since the thickness sliding vibration of the quartz crystal element is not hindered, the oscillation frequency can be output stably.

It is a disassembled perspective view which shows the crystal device in this embodiment. (A) It is sectional drawing in AA of the crystal device shown by FIG. 1, (b) It is the X partial enlarged view of the crystal device shown by Fig.2 (a). (A) It is a top view which shows the state which removed the cover of the crystal device in this embodiment, (b) It is a top view which shows the state which removed the cover and crystal element of the crystal device in this embodiment. It is a top view which shows the state which removed the cover body and crystal element of the crystal device in this embodiment, and spread on the electrode pad from the location where the conductive adhesive was released. (A) It is sectional drawing of the crystal device in the 1st modification of this embodiment, (b) It is Y partial enlarged view of the crystal device shown by Fig.5 (a). (A) It is sectional drawing of the crystal device in the 2nd modification of this embodiment, (b) It is Z partial enlarged view of the crystal device shown by Fig.6 (a). (A) It is a top view which shows the state which removed the cover of the crystal device in the 3rd modification of this embodiment, (b) The cover and crystal element of the crystal device in the 3rd modification of this embodiment are removed. It is a top view which shows the state which carried out.

  The crystal device in this embodiment includes a package 110 and a crystal element 120 bonded to a substrate 110a of the package 110 as shown in FIGS. The package 110 has an accommodation space K surrounded by the upper surface of the substrate 110a and the inner surface of the frame 110b.

  The substrate 110a has a rectangular shape and functions as a support member for supporting the crystal element 120 mounted on the upper surface. The substrate 110a is provided with an electrode pad 111 for bonding the crystal element 120 on the upper surface of the substrate 110a. In addition, external connection electrode terminals G are provided at the four corners of the lower surface of the substrate 110a.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using one insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern and a via conductor for electrically connecting the electrode pad 111 provided on the upper surface and the external connection electrode terminal G on the lower surface are provided on and inside the substrate 110a.

  The frame 110b is for forming the accommodation space K on the substrate 110a. The frame 110b is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a. A sealing conductor pattern 114 is provided on the upper surface of the frame 110b.

  The sealing conductor pattern 114 plays a role of improving the wettability of the sealing member 131 when it is bonded to the lid 130 via the sealing member 131. The sealing conductor pattern 114 is connected to at least one external connection electrode terminal G by a via conductor (not shown) and a wiring pattern (not shown) formed in the substrate 110a. The at least one external connection electrode terminal G serves as a ground terminal by being connected to a mounting pad connected to the ground on the external mounting substrate. Therefore, the lid 130 joined to the sealing conductor pattern 114 is connected to the ground, and the shielding performance in the accommodation space K by the lid 130 is improved. The sealing conductor pattern 114 is formed to have a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of tungsten, molybdenum, or the like, in a form surrounding the upper surface of the frame 110b in an annular shape. Has been.

The electrode pads 111 are provided as a pair, and are provided adjacent to each other along one side of the substrate 110a. A first bump 112 and a second bump 113 are respectively provided on the pair of electrode pads 111. The first bump 112 is
Each is provided on one side of the electrode pad 111 along one side of the substrate 110a. The second bump 113 is provided along one side of the substrate 110 a so as to be closer to the outer periphery of the substrate 110 a than the first bump 112 and spaced from the first bump 112.

  The pair of first bumps 112 are provided so as to be aligned on the same straight line with respect to a straight line parallel to one side of the substrate 110a. In this way, when the electrode 123 for connection of the crystal element 111 is mounted on the electrode pad 111 while being in contact with the pair of first bumps 112, the crystal element 120 can be mounted in a stable state without tilting. it can.

  Here, the size of the electrode pad 111, the first bump 112, and the second bump 113 will be described by taking as an example a case where the dimension of one side when the package 110 is viewed in plan is 1.0 to 2.5 mm. The length of the side of the electrode pad 111 parallel to one side of the substrate 110a is 0.25 to 0.40 mm. The length of the side of the electrode pad 111 that is parallel to the side that intersects with one side of the substrate 110a is 0.25 to 0.40 mm. The length of the thickness of the electrode pad 111 in the vertical direction is 10 to 50 μm. The length of the side of the first bump 112 that is parallel to one side of the substrate 110a is 0.15 to 0.3 mm. Moreover, the length of the side of the 1st bump 112 parallel to the side which cross | intersects one side of the board | substrate 110a will be 50-100 micrometers. The length of the thickness in the vertical direction of the first bump 112 is 7 to 25 μm. The length of the side of the second bump 113 that is parallel to one side of the substrate 110a is 0.15 to 0.3 mm. The length of the side of the second bump 113 that is parallel to the side intersecting with one side of the substrate 110a is 50 to 100 μm. The length of the thickness of the second bump 113 in the vertical direction is 7 to 25 μm. The length between the first bump 112 and the second bump 113 is 80 to 100 μm.

  The conductive adhesive 140 is formed so as to spread from the first bump 112 to the second bump 112 in a plan view, and is disposed so as to be spaced from the excitation electrode 122 of the crystal element 120. In the quartz crystal device, the conductive adhesive 140 and the excitation electrode 122 are arranged with a space therebetween, so that a short circuit caused by the conductive adhesive 140 adhering to the excitation electrode 122 can be reduced. .

  As shown in FIG. 3B, the conductive adhesive 140 passes through the first bump 112 and the second bump 113 from the portion sandwiched between the first bump 112 and the second bump 113, and crystal The spread of the element 120 on the electrode pad 111 in the direction close to the excitation electrode 122 causes the wettability effect of the wall surfaces of the first bump 112 and the second bump 113 and the first bump 112 and the second bump 113. It can be suppressed by the capillary action effect. Therefore, the quartz device is less likely to leak and spread in the direction where the conductive adhesive 140 is sandwiched between the first bump 112 and the second bump 113 in the direction close to the excitation electrode 122 of the quartz element 120. The crystal element 120 can be stably mounted on the electrode pad 111 via the adhesive 140. In addition, since the crystal element 120 can be stably mounted, the oscillation frequency of the crystal element 120 can be output stably.

  Further, when the conductive adhesive 140 has a viscosity of 35 to 45 Pa · s and is applied to a portion sandwiched between the first bump 112 and the second bump 113, the conductive adhesive 140 140 remains on the electrode pad 111 sandwiched between the first bump 112 and the second bump 113 without flowing over the electrode pad 111 beyond the first bump 112 and the second bump 113, and the thickness in the vertical direction is increased. Maintained.

  Further, the conductive adhesive 140 is applied to a portion sandwiched between the first bump 112 and the second bump 113. By doing in this way, the quartz crystal device can make the application amount and application position of the conductive adhesive 140 visually easier to understand.

  Further, since the conductive adhesive 140 hardly spreads from the electrode pad 111, the thickness of the conductive adhesive 140 in the vertical direction can be secured. The length of the thickness of the conductive adhesive 140 in the vertical direction is 15 to 30 μm. Since the thickness of the conductive adhesive 140 can be ensured in this way, even if an impact applied by a drop test is applied to the crystal element 120 in the vertical direction around the conductive adhesive 140, the impact is made conductive. The adhesive 140 can sufficiently absorb and relax the absorption. In addition, since the conductive adhesive 140 is formed so as to spread from the first bump 112 to the second bump 113, the bonding area between the conductive adhesive 140 and the electrode pad 111, the first bump 112, and the second bump 113. Can also be secured.

  Further, as shown in FIG. 4, the conductive adhesive 140 brings the crystal element 120 into contact with the first bump 112 from the released portion between the first bump 112 and the second bump 113. At this time, it spreads over the electrode pad 111 so as to overflow. Therefore, it is possible to reduce the extra conductive adhesive 140 from adhering to the crystal element 120. Further, since the overflowing conductive adhesive 140 spreads on the electrode pad 111, the contact area between the conductive adhesive 140 and the electrode pad 111 is increased, and the bonding strength can be improved.

  Here, a method for manufacturing the package 110 will be described. When the substrate 110a and the frame 110b are made of alumina ceramics, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, it is produced by applying nickel plating or gold plating to a predetermined portion of the conductor pattern, specifically, a portion to be the pair of electrode pads 111 or the external connection electrode terminal G. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIGS. 2 and 3A, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  As shown in FIG. 2A, the crystal element 120 has a structure in which the excitation electrode 122, the connection electrode 123, and the extraction electrode 124 are attached to the upper surface and the lower surface of the crystal base plate 121, respectively. doing. The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The extraction electrode 124 extends from the excitation electrode 122 toward the short side of the crystal base plate 121. The connection electrode 123 is connected to the lead electrode 124 and is provided in a shape along the long side or the short side of the crystal base plate 121.

  In the present embodiment, a one-side holding structure in which one end of the crystal element 120 connected to the electrode pad 111 is a fixed end connected to the upper surface of the substrate 110a and the other end is a free end spaced from the upper surface of the substrate 110a. The quartz crystal element 120 is fixed on the substrate 110a.

  One of the connection electrodes 123 of the crystal element 120 is in contact with one of the first bumps 112, and the other of the connection electrodes 123 of the crystal element 120 is in contact with the other of the first bumps 112. Since the crystal element 120 can be prevented from being inclined by bringing the connection electrode 123 of the crystal element 120 into contact with the first bump 112 in this way, the tip portion of the crystal element 120 and the excitation electrode 122 are attached to the substrate 110a. Contacting can be reduced.

  As shown in FIG. 3A, the outer peripheral edge on the fixed end side of the quartz base plate 121 is parallel to one side of the substrate 110 a in plan view, and is outside the substrate 110 a more than the second bump 113. It is provided so that it may approach the periphery. By doing so, the mounting position of the crystal element 120 can be made visually easier to understand, and the productivity of the crystal device can be improved. Moreover, by doing in this way, it can reduce that the frame 110b of the package 110 contacts the outer periphery of the crystal element 120, and it becomes possible to prevent the crystal element 120 from being chipped.

  Here, the operation of the crystal element 120 will be described. When an alternating voltage from the outside is applied to the crystal element plate 121 from the connection electrode 123 via the extraction electrode 124 and the excitation electrode 122, the crystal element 120 is excited in a predetermined vibration mode and frequency. Is supposed to wake up.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. Then, the quartz crystal element 120 has the excitation electrode 122, the connection electrode 123, and the extraction electrode 124 formed by depositing a metal film on both main surfaces of the quartz base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. It is produced by forming.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied so as to spread from the first bump 112 to the second bump 112 by, for example, a dispenser. The crystal element 120 is conveyed onto the conductive adhesive 140. Further, the crystal element 120 has an outer peripheral edge on the fixed end side of the crystal base plate 121 that is parallel to one side of the substrate 110a in plan view and is closer to the outer peripheral edge of the substrate 110a than the second bump 113. It is placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. In the crystal element 120, when the conductive adhesive 140 is cured and contracted, the fixed end side of the crystal element 120 is pulled downward, and the principle of the insulator using the first bump 112 as a fulcrum works. Are joined to the pair of electrode pads 111 such that the tip ends of the electrode pads float.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example. Such a lid 130 is for hermetically sealing the accommodation space K in a vacuum state or the accommodation space K filled with nitrogen gas or the like. Specifically, the lid 130 is placed on the frame 110b of the package 110 in a predetermined atmosphere, and the sealing conductor pattern 114 of the frame 110b and the sealing member 131 of the lid 130 are welded. As described above, by applying a predetermined current and performing seam welding, the frame body 110b is joined.

  The sealing member 131 is provided at a location of the lid body 130 facing the sealing conductor pattern 114 provided on the upper surface of the frame 110 b of the package 110. The sealing member 131 is provided by, for example, silver solder or gold tin. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper.

  In the crystal device according to this embodiment, the crystal element 120 is in contact with one of the pair of connection electrodes 123 and one of the first bumps 112, and is in contact with the other of the pair of connection electrodes 123 and the other of the first bumps 112. In addition, since the connection electrode 123 is connected to the electrode pad 111 located between the first bump 112 and the second bump 113 via the conductive adhesive 140, the crystal element when the conductive adhesive 140 is cured and contracted. The fixed end side of 120 is pulled downward, and the tip of the crystal element 120 is lifted by the principle of the insulator with the first bump 112 as a fulcrum. Therefore, the quartz crystal device can reduce contact between the tip of the quartz crystal element 120 and the excitation electrode 122 with the substrate 110a. Further, the quartz crystal device can stably output the oscillation frequency because the thickness shear vibration of the quartz crystal element 120 is not hindered.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  In the crystal device according to the first modification of the present embodiment, the vertical thickness of the first bump 212 is longer than the vertical thickness of the second bump 213, as shown in FIG. This is different from the present embodiment.

  In the quartz crystal device according to the first modification of the present embodiment, the thickness of the first bump 212 in the vertical direction is longer than the thickness of the second bump 213 in the vertical direction. Here, the size of the first bump 212 and the second bump 213 will be described by taking as an example a case where the dimension of one side when the package 210 is viewed in plan is 1.0 to 2.5 mm. The length of the thickness of the first bump 212 in the vertical direction is 7 to 25 μm. The length of the thickness of the second bump 213 in the vertical direction is 5 to 15 μm.

  In the crystal device according to the first modified example of the present embodiment, the vertical shrinkage of the first bump 212 is longer than the vertical thickness of the second bump 213, so that the conductive adhesive 140 is cured and contracted. Sometimes, the fixed end side of the quartz crystal element 120 is pulled downward, and the principle of the insulator using the first bump 212 as a fulcrum further works, so that the tip of the quartz crystal element 120 can be further floated. Therefore, the crystal device reduces the contact between the tip of the crystal element 120 and the excitation electrode 122 with the substrate 210a, and the thickness-shear vibration of the crystal element 120 is not hindered. Can be output.

(Second modification)
Hereinafter, the quartz crystal device according to the second modification of the present embodiment will be described. Of the quartz crystal device according to the second modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate.

  As shown in FIG. 6, in the crystal device according to the second modification of the present embodiment, one of the pair of connection electrodes 123 contacts one of the second bumps 213, and the pair of connection electrodes 123. This embodiment differs from the present embodiment in that the other and the other of the second bumps 213 are in contact with each other.

  In the crystal device according to the second modification of the present embodiment, one of the pair of connection electrodes 123 and one of the second bumps 213 are in contact with each other, and the other of the pair of connection electrodes 123 and the other of the second bumps 213 are in contact with each other. By being in contact, the fixed end side of the crystal element 120 is placed so that the tip of the crystal element 120 is lifted upward before the conductive adhesive 140 is cured and contracted. At the time of hardening shrinkage, the fixed end side of the quartz crystal element 120 is pulled downward, and the tip of the quartz crystal element 120 is further lifted by the principle of the insulator with the first bump 212 and the second bump 213 as fulcrums. Therefore, the crystal device can prevent the tip portion of the crystal element 120 and the excitation electrode 122 from coming into contact with the substrate 210a.

(Third modification)
Hereinafter, the quartz crystal device according to the third modification of the present embodiment will be described. Note that, in the quartz crystal device according to the third modification of the present embodiment, the same parts as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  In the crystal device according to the third modification of the present embodiment, the length of the short side of the first bump 312 is longer than the length of the short side of the second bump 313 as shown in FIG. This is different from the present embodiment.

  In the quartz crystal device according to the third modification of the present embodiment, the length of the short side of the first bump 312 is longer than the length of the short side of the second bump 313. Here, the size of the first bump 312 and the second bump 313 will be described by taking as an example the case where the dimension of one side when the package 310 is viewed in plan is 1.0 to 2.5 mm. The length of the side of the electrode pad 311 which is parallel to one side of the substrate 310a is 0.25 to 0.40 mm. The length of the side of the electrode pad 311 that is parallel to the side that intersects with one side of the substrate 310a is 0.25 to 0.40 mm. The length of the side of the first bump 112 that is parallel to one side of the substrate 310a is 0.15 to 0.3 mm. The length of the side of the first bump 312 that is parallel to the side that intersects with one side of the substrate 310a is 100 to 150 μm. The length of the side of the second bump 313 that is parallel to one side of the substrate 310a is 0.15 to 0.3 mm. The length of the side of the second bump 313 that is parallel to the side that intersects with one side of the substrate 310a is 50 to 100 μm. The length between the first bump 311 and the second bump 312 is 80 to 100 μm.

  The crystal device according to the third modification of the present embodiment is for connecting the crystal element 120 because the length of the short side of the first bump 312 is longer than the length of the short side of the second bump 313. Since the contact area between the electrode 123 and the first bump 312 is to be increased, the tilt of the crystal element 120 can be further reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where the frame 110b is integrally formed of a ceramic material in the same manner as the substrate 110a has been described. However, the frame 110b may be made of metal. In this case, the frame is joined to the conductor film of the substrate via a brazing material such as silver-copper.

  In the above embodiment, the case where the frame is provided on the upper surface of the substrate has been described. However, after the crystal element is mounted on the substrate, the crystal element is hermetically sealed using the lid having the wall portion provided on the lower surface. It may be a structure that stops.

  In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bent crystal having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base. An element may be used.

  In addition, the crystal element 120 may be beveled so that the thickness of the outer periphery of the crystal element plate 121 is thin and the central part of the crystal element plate 121 is thicker than the outer periphery of the crystal element plate 121. . A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

110, 210, 310 ... Package 110a, 210a, 310a ... Substrate 110b, 210b, 310b ... Frame body 111, 211, 311 ... Electrode pad 112, 212, 312 ... First bump 113 213, 313 ... second bump 114, 214 ... sealing conductor pattern 120 ... crystal element 121 ... crystal base plate 122 ... excitation electrode 123 ... connection electrode 124 .... Lead electrode 130 ... Lid 131 ... Sealing member 140 ... Conductive adhesive K ... Storage space G ... External connection terminal

Claims (4)

A rectangular substrate;
A pair of electrode pads provided along one side of the substrate on the substrate;
A first bump provided along one side of the substrate on each of the electrode pads;
Provided on each of the electrode pads, a second bump provided along one side of the substrate spaced apart from the first bump so as to be closer to the outer periphery of the substrate than the first bump;
A pair of connections provided on the substrate, a quartz base plate, excitation electrodes provided on the top and bottom surfaces of the crystal base plate, and a pair of connections provided on the bottom surface of the crystal base plate with a space between the excitation electrodes. An electrode, and one of the pair of connection electrodes and one of the first bumps are in contact with each other, the other of the pair of connection electrodes and the other of the first bumps are in contact with each other, and the connection A crystal device, comprising: a crystal element comprising a conductive electrode connected to the electrode pad positioned between the first bump and the second bump via a conductive adhesive. The crystal device according to claim 1,
The pair of first bumps are provided so as to be arranged on the same straight line. The crystal device according to claim 1,
The quartz crystal device, wherein a thickness of the first bump in a vertical direction is longer than a thickness of the second bump in a vertical direction. The quartz crystal device according to claim 1, wherein
One of the pair of connection electrodes and one of the second bumps are in contact with each other, and the other of the pair of connection electrodes and the other of the second bumps are in contact with each other.

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