JP2014107649A - Quartz device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a quartz device in which both of two quartz elements can stably output an oscillation frequency.SOLUTION: The quartz device includes: a substrate 110 having a through hole 113a; a first quartz element 120 of which one end is fixed to an upper surface of the substrate 110 and the other end is separated from the upper surface of the substrate 110; a second quartz element 130 of which one end is fixed to a lower surface of the substrate 110 and the other end is separated from the lower surface of the substrate 110; a first lid body 140 sealing the first quartz element 120 and having a first recess 142 in a lower surface; and a second lid body 150 sealing the second quartz element 130 and having a second recess 152 in an upper surface. The other end of the first quartz element 120 and the other end of the second quartz element 130 are superposed on the through hole 113a, the first recess 142 and the second recess 152 in plane see-through.

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  The crystal device generates a specific frequency by using the piezoelectric effect of the crystal element. A crystal device including a first crystal element mounted on the upper surface of a substrate and a second crystal element mounted on the lower surface of the substrate has been proposed (for example, see Patent Document 1 below). The first crystal element and the second crystal element have excitation electrodes on both main surfaces of the crystal element plate, one end of the crystal element plate is a fixed end connected to the upper surface of the substrate, and the other end is the upper surface of the substrate It becomes a one-piece holding structure with a free end spaced apart.

JP 2003-258589 A

  The above-described crystal device is remarkably miniaturized, but the first crystal element and the second crystal element mounted on the substrate are also miniaturized. When a conductive adhesive is applied on a conventional electrode pad and the first crystal element and the second crystal element are placed on the upper surface of the conductive adhesive, the free end of the first crystal element or the second crystal element or for excitation There is a possibility that the electrode comes into contact with the substrate and the vibration is inhibited, so that the oscillation frequency of either the first crystal element or the second crystal element fluctuates.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a crystal device that can stably output an oscillation frequency for both two crystal elements.

  A crystal device according to an aspect of the present invention includes a substrate having a through hole, a first crystal element provided on the upper surface of the substrate, one end fixed to the upper surface of the substrate, and the other end spaced from the upper surface of the substrate. A second crystal element provided on the lower surface of the substrate, one end fixed to the lower surface of the substrate and the other end spaced from the lower surface of the substrate, and provided on the upper surface of the substrate to seal the first crystal element A first lid having a first recess on the lower surface and a second lid provided on the lower surface of the substrate for sealing the second crystal element and having a second recess on the upper surface. The other end of the element and the other end of the second crystal element overlap with the through hole, the first recess, and the second recess as seen in a plan view.

  The quartz crystal device according to one aspect of the present invention is configured such that the other end of the first quartz element and the other end of the second quartz element overlap with the through hole, the first recess, and the second recess when seen in a plan view. It can reduce that the other end of an element and a 2nd crystal element, or the electrode for excitation contacts a board | substrate. Therefore, since the thickness shear vibration of the crystal element is not inhibited, both the first crystal element and the second crystal element can stably output the oscillation frequency.

It is a disassembled perspective view which shows the crystal device in this embodiment. It is sectional drawing in AA of the quartz crystal device shown by FIG. It is the top view seen from the upper surface which showed the state which removed the 1st cover body of the crystal device in this embodiment. (A) The plane perspective view which looked at the package which comprises the crystal device in this embodiment from the upper surface, (b) The plane perspective view which looked at the package which comprises the crystal device in this embodiment from the lower surface. It is sectional drawing of the quartz crystal device in the 1st modification of this embodiment. It is sectional drawing of the quartz crystal device in the 2nd modification of this embodiment.

  The crystal device in this embodiment includes a package 110 and a crystal element 120 bonded to a substrate 110a of the package 110 as shown in FIGS. The package 110 has a first accommodation space K1 surrounded by the upper surface of the substrate 110a and the inner surface of the first frame 110b. Further, the package 110 has a second accommodation space K2 surrounded by the lower surface of the substrate 110a and the inner surface of the second frame 110c.

  The substrate 110a has a rectangular shape and functions as a support member for supporting the crystal element 120 mounted on the upper surface. The substrate 110a is provided with a first electrode pad 111 for bonding the first crystal element 120 on the upper surface of the substrate 110a, and a second electrode pad 114 for bonding the second crystal element 130 on the lower surface of the substrate 110a. Is provided. The substrate 110a is provided with a through hole 113a penetrating in the vertical direction.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using one insulating layer or may be a laminate of a plurality of insulating layers. The first electrode pad 111 provided on the upper surface, the first external connection electrode terminal G1 provided on the upper surface of the first frame 110b, and the lower surface of the second frame 110c are provided on the surface and inside of the substrate 110a. A first wiring pattern 115 and a first via conductor 116 for electrically connecting the second external connection electrode terminal G2 are provided. Further, on the surface and inside of the substrate 110a, the second electrode pad 114 provided on the lower surface, the first external connection electrode terminal G1 provided on the upper surface of the second frame 110c, and the lower surface of the second frame 110c. Are provided with a second wiring pattern 117 and a second via conductor 118 for electrically connecting the second external connection electrode terminal G2 provided on the second external connection electrode terminal G2.

  The first frame 110b is disposed on the upper surface of the substrate 110a and is for forming the first accommodation space K1 on the upper surface of the substrate 110a. The second frame 110c is disposed on the lower surface of the substrate 110a and is for forming the second accommodation space K2 on the lower surface of the substrate 110a. The first frame 110b and the second frame 110c are made of a ceramic material such as alumina ceramics or glass-ceramics, and are formed integrally with the substrate 110a. Inside the first frame 110b, a first notch 119a provided so as to surround is provided. A second notch 119b is provided inside the second frame 110c so as to surround the second frame 110c.

  A first sealing conductor pattern 112a is provided on the upper surface of the first notch 119a provided inside the first frame 110b. A first external connection electrode terminal G1 is provided on the upper surface of the first frame portion 110b. A second sealing conductor pattern 112b is provided on the lower surface of the second notch 119b provided inside the second frame 110c. A second external connection electrode terminal G2 is provided on the lower surface of the second frame 110c.

  The first electrode pads 111 are provided as a pair on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. As shown in FIG. 4A, the first electrode pad 111 is formed on the upper surface of the first frame 110b through the first wiring pattern 115 and the first via conductor 116 provided on the upper surface of the substrate 110a. The first external connection electrode terminal G1 provided and the second external connection electrode terminal G2 provided on the lower surface of the second frame 110c are electrically connected.

  The second electrode pads 114 are provided as a pair on the lower surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. The second electrode pad 114 is provided so as to be located immediately below the first electrode pad 111. As shown in FIG. 4B, the second electrode pad 114 is formed on the upper surface of the first frame 110b via the second wiring pattern 117 and the second via conductor 118 provided on the lower surface of the substrate 110a. The first external connection electrode terminal G1 provided and the second external connection electrode terminal G2 provided on the lower surface of the second frame 110c are electrically connected.

  The through hole 113a has a rectangular shape and is provided so as to penetrate in the vertical direction of the substrate 110a. The through hole 113a is provided at a position overlapping the other end of the first crystal element 120 as seen in a plan view. In addition, the opening area of the through hole 113a is larger than the area of the other end of the first crystal element 120 in a plan view. The length of the side of the through hole 113a that is parallel to one side of the substrate 110a is 0.50 to 1.3 mm. In addition, the length of the side of the through hole 113 that is parallel to the side intersecting with one side of the substrate 110a is 0.25 to 0.40 mm. The length of the other end of the first crystal element 120 that is parallel to one side of the substrate 110a is 0.4 to 1.2 mm. The length of the side of the other end of the first crystal element 120 that is a side that intersects with one side of the substrate 110a is 0.1 to 0.3 mm. By doing in this way, even if the other end of the 1st crystal element 120 falls below, it can reduce that the other end of the 1st crystal element 120 contacts substrate 110a.

  In addition, the through hole 113a is provided at a position overlapping the other end of the second crystal element 130 as seen in a plan view. In addition, the opening area of the through hole 113a is larger than the area of the other end of the second crystal element 130 in plan view. The length of the other end of the second crystal element 130 that is parallel to one side of the substrate 110a is 0.4 to 1.2 mm. The length of the side of the other end of the second crystal element 130 that is a side that intersects with one side of the substrate 110a is 0.1 to 0.3 mm. Moreover, by doing in this way, even if the other end of the 2nd crystal element 130 goes up, it can reduce that the other end of the 2nd crystal element 130 contacts the board | substrate 110a.

  The first sealing conductor pattern 112a plays a role of improving the wettability of the first sealing member 141 when the first sealing conductor pattern 112a is joined to the first lid 140 via the first sealing member 141. The first sealing conductor pattern 112a is connected to the third external connection electrode terminal G3 by the via conductor V1 and the wiring pattern S1 formed inside the substrate 110a. The third external connection electrode terminal G3 serves as a ground terminal by being connected to a mounting pad connected to the ground on the external mounting substrate. Therefore, the first lid 140 joined to the first sealing conductor pattern 112a is connected to the ground, and the shielding performance in the first accommodation space K1 by the first lid 140 is improved. The first sealing conductor pattern 112a has a form in which, for example, nickel plating and gold plating are sequentially provided on the surface of a conductor pattern made of tungsten, molybdenum, or the like, and the first notch 119a is annularly surrounded. The first sealing conductor pattern 112a is formed to a thickness of 10 to 25 μm, for example.

  The second sealing conductor pattern 112 b plays a role of improving the wettability of the second sealing member 151 when the second sealing conductor pattern 112 b is joined to the second lid 150 via the second sealing member 151. The second sealing conductor pattern 112b is connected to the third external connection electrode terminal G3 by the via conductor V1 and the wiring pattern S1 formed inside the substrate 110a. The third external connection electrode terminal G3 serves as a ground terminal by being connected to a mounting pad connected to the ground on the external mounting substrate. Therefore, the second lid 150 joined to the second sealing conductor pattern 112b is connected to the ground, and the shielding performance in the second accommodation space K2 by the second lid 150 is improved. The second sealing conductor pattern 112b has a form in which the surface of a conductor pattern made of, for example, tungsten or molybdenum is sequentially surrounded by nickel plating and gold plating, and the second notch 119b is annularly surrounded. The second sealing conductor pattern 112b is formed to a thickness of 10 to 25 μm, for example.

  The first external connection electrode terminal G1 is provided on the upper surface of the first frame 110b, and the second external connection electrode terminal G2 is provided on the lower surface of the second frame 110c. By doing in this way, it can be mounted in either the top or bottom direction of the crystal device.

  The conductive adhesive 160 is formed so as to spread on the first electrode pad 111 in a plan view, and is disposed so as to be spaced from the first excitation electrode 122 of the first crystal element 120. In the quartz crystal device, the conductive adhesive 160 and the first excitation electrode 122 are spaced apart from each other, thereby reducing a short circuit caused by the conductive adhesive 160 adhering to the first excitation electrode 122. can do. Further, the conductive adhesive 160 is formed so as to spread on the second electrode pad 114 in plan view, and is disposed so as to be spaced from the second excitation electrode 132 of the second crystal element 130. In the quartz crystal device, the conductive adhesive 160 and the second excitation electrode 132 are arranged with a space therebetween, thereby reducing a short circuit caused by the conductive adhesive 160 adhering to the second excitation electrode 132. can do.

  Here, a method for manufacturing the package 110 will be described. When the substrate 110a, the first frame 110b, and the second frame 110c are made of alumina ceramics, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel is applied to a predetermined portion of the conductor pattern, specifically, a portion to be a pair of first electrode pad 111, second electrode pad 114, first external connection electrode terminal G1, or second external connection electrode terminal G2. It is produced by plating or gold plating. The conductor paste is made of, for example, a sintered body of metal powder such as tungsten, molybdenum, copper, silver, or palladium.

  As shown in FIG. 2, the first crystal element 120 and the second crystal element 130 are bonded onto the first electrode pad 111 and the second electrode pad 114 via a conductive adhesive 140. The first crystal element 120 and the second crystal element 130 serve to oscillate a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  As shown in FIG. 2A, the first crystal element 120 includes a first excitation electrode 122, a first connection electrode 123, and a first lead-out on the upper surface and the lower surface of the first crystal base plate 121, respectively. The electrode 124 is attached. The first excitation electrode 122 is obtained by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the first quartz base plate 121. The first extraction electrode 124 extends from the first excitation electrode 122 toward the short side of the first quartz base plate 121. The first connection electrode 123 is connected to the first lead electrode 124 and is provided in a shape along the long side or the short side of the first crystal element plate 121.

  As shown in FIG. 2A, the second crystal element 130 has a second excitation electrode 132, a second connection electrode 133, and a second lead-out on the upper and lower surfaces of the second crystal base plate 131, respectively. It has a structure in which an electrode 134 is deposited. The second excitation electrode 132 is formed by depositing and forming a metal in a predetermined pattern on the upper surface and the lower surface of the second quartz base plate 131. The second extraction electrode 134 extends from the second excitation electrode 132 toward the short side of the second crystal element plate 131. The second connection electrode 123 is connected to the second lead electrode 134 and is provided in a shape along the long side or the short side of the second crystal element plate 131.

  In the present embodiment, one end of the first crystal element 120 connected to the first electrode pad 111 is a fixed end connected to the upper surface of the substrate 110a, and the other end is a free end spaced from the upper surface of the substrate 110a. The first crystal element 120 is fixed on the substrate 110a with the piece holding structure. One-side holding structure in which one end of the second crystal element 130 connected to the second electrode pad 114 is a fixed end connected to the lower surface of the substrate 110a and the other end is a free end spaced from the lower surface of the substrate 110a. The second crystal element 120 is fixed on the substrate 110a.

  Here, the operation of the first crystal element 120 will be described. When an alternating voltage from the outside is applied from the first connection electrode 123 to the first crystal element plate 121 via the first extraction electrode 124 and the first excitation electrode 122, the first crystal element 120 The base plate 121 is excited in a predetermined vibration mode and frequency. Also, the second crystal element 130 performs the same operation as the first crystal element 120.

  Here, a manufacturing method of the first crystal element 120 will be described. First, the first crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle, the outer periphery of the first crystal element plate 121 is thinned, and the first crystal element is compared with the outer periphery of the first crystal element plate 121. A bevel process is performed so that the central portion of the plate 121 is thickened. The first crystal element 120 is formed by depositing a metal film on both main surfaces of the first crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique, so that the first excitation electrode 122, the first connection It is produced by forming the electrode for electrode 123 and the first extraction electrode. In addition, the second crystal element 130 is manufactured by the same manufacturing method as the first crystal element 120.

  A method for bonding the first crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 160 is applied on the first electrode pad 111 by a dispenser, for example. The first crystal element 120 is conveyed onto the conductive adhesive 160. Further, the first crystal element 120 is placed on the conductive adhesive 160 such that the outer peripheral edge on the fixed end side of the first crystal element plate 121 is parallel to one side of the substrate 110a in plan view. The The conductive adhesive 160 is cured and contracted by being heated and cured. Therefore, the first crystal element 120 is bonded to the pair of electrode pads 111. The second crystal element 130 is also bonded to the same substrate 110a as the first crystal element 120.

  The conductive adhesive 160 contains conductive powder as a conductive filler in a binder such as a silicone resin. Examples of the conductive powder include aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The 1st cover body 140 consists of an alloy containing at least any one of iron, nickel, or cobalt, for example. Such a first lid 140 is for hermetically sealing the first housing space K1 in a vacuum state or the first housing space K1 filled with nitrogen gas or the like. Specifically, the lid body 130 is placed on the first frame body 110b of the package 110 in a predetermined atmosphere, and the first sealing conductor pattern 112a of the first frame body 110b and the first lid body 140 of the first lid body 140 are placed. By performing seam welding by applying a predetermined current so that the one sealing member 141 is welded, the first sealing member 141 is joined to the first notch 119a of the first frame 110b.

  The first sealing member 141 is formed of the first lid 140 facing the first sealing conductor pattern 112a provided on the upper surface of the first notch 119a provided inside the first frame 110b of the package 110. It is provided in the place. The first recess 142 has a rectangular shape and is provided on the lower surface of the first lid 140. The first concave portion 142 is provided at a position overlapping the other end of the first crystal element 120 as seen in a plan view. Moreover, the length of the side of the 1st recessed part 142 parallel to one side of the 1st cover body 140 will be 0.50-1.3 mm. Moreover, the length of the side of the 1st recessed part 142 parallel to the edge | side which cross | intersects one edge | side of the 1st cover body 140 will be 0.25-0.40mm. Moreover, the depth of the up-down direction of the 1st recessed part 142 is 25-35 micrometers.

  The second lid 150 is made of, for example, an alloy containing at least one of iron, nickel, and cobalt. The second lid 150 is for hermetically sealing the second housing space K2 in a vacuum state or the second housing space K2 filled with nitrogen gas or the like. Specifically, the second lid 150 is placed on the third frame 110d of the package 110 in a predetermined atmosphere, and the second sealing conductor pattern 112b and the second lid 150 of the third frame 110b. The second sealing member 151 is joined to the second notch 119b of the second frame 110c by performing seam welding by applying a predetermined current so that the second sealing member 151 is welded.

  In addition, the second sealing member 151 is a second lid that faces the second sealing conductor pattern 112b provided on the lower surface of the second notch 119b provided inside the second frame 110c of the package 110. It is provided at 150 locations. The second recess 152 has a rectangular shape and is provided on the lower surface of the second lid 150. The second recess 152 is provided at a position overlapping the other end of the second crystal element 130 as seen in a plan view. Moreover, the length of the side of the 2nd recessed part 152 parallel to one side of the 2nd cover body 150 will be 0.50-1.3 mm. Moreover, the length of the side of the 2nd recessed part 152 parallel to the side which cross | intersects one side of the 2nd cover body 150 will be 0.25-0.40 mm. Moreover, the depth of the up-down direction of the 2nd recessed part 152 is 25-35 micrometers.

  The first sealing member 141 is provided by, for example, silver solder or gold tin. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. Further, the second sealing member 151 is provided by, for example, silver solder or gold tin. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper.

  In the crystal device according to the present embodiment, the other end of the first crystal element 120 and the other end of the second crystal element 130 overlap with the through hole 113a, the first recess 142, and the second recess 152 when seen in a plan view. Therefore, even if the second lid 150 of the crystal device is faced down and mounted on a mother board such as an electronic device using the second external connection electrode terminal G2, the other end of the first crystal element 120 and the first excitation element are used. The electrode does not contact the substrate 110 a, and the other end of the second crystal element 130 and the second excitation electrode 132 do not contact the second lid 150. Even if the first lid 140 of the crystal device is faced down and mounted on a mother board such as an electronic device using the first external connection electrode terminal G1, the other end of the first crystal element 120 and the first excitation element are used. The electrode 122 does not contact the first lid 140, and the other end of the second crystal element 130 and the second excitation electrode 132 do not contact the substrate 110a. Therefore, the thickness shear vibration of the first crystal element 120 and the second crystal element 130 can be made difficult to be inhibited, and both the first crystal element 120 and the second crystal element 130 can stably output the oscillation frequency. it can.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  As shown in FIG. 5, the quartz crystal device according to the first modification of the present embodiment is provided so that only one end of the first quartz crystal element 120 and one end of the second quartz crystal element 130 overlap each other as seen in a plan view. This is different from the present embodiment.

  The quartz crystal device according to the first modification of the present embodiment includes a through hole 113a, a first concave portion 142, and a second concave portion 152 when the other end of the first quartz crystal element 120 and the other end of the second quartz crystal element 130 are seen through the plane. Overlap. Therefore, the thickness shear vibration of the first crystal element 120 and the second crystal element 130 can be made difficult to be inhibited, and both the first crystal element 120 and the second crystal element 130 can stably output the oscillation frequency. it can.

  In the first modification of the present embodiment, the case where the angle formed by the first crystal element 120 and the second crystal element 130 is 180 ° has been described. However, the angle formed by the first crystal element 120 and the second crystal element 130 is 90 °. It may be °.

(Second modification)
Hereinafter, the quartz crystal device according to the second modification of the present embodiment will be described. Of the quartz crystal device according to the second modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate.

  As shown in FIG. 6, the crystal device in the second modification example of the present embodiment has the area of the shape of the through hole 113 b in plan view, the first excitation electrode 122 of the first crystal element 120 or the second excitation electrode 122. This embodiment is different from the present embodiment in that it is larger than the area of the second excitation electrode 132 of the crystal element 130.

  In the crystal device according to the second modification of the present embodiment, the area of the shape of the through hole 113b in a plan view has the first excitation electrode 122 of the first crystal element 120 or the second excitation electrode 132 of the second crystal element 130. Is larger than the area. Therefore, even if the first crystal element 120 or the second crystal element 130 is bent, the first excitation electrode 122 or the second excitation electrode 132 does not come into contact with the substrate 110. The thickness shear vibration of the second crystal element 130 can be effectively prevented from being hindered, and both the first crystal element 120 and the second crystal element 130 can output the oscillation frequency more stably.

  Further, in the crystal device according to the second modification of the present embodiment, the substrate 110 a is interposed between the first excitation electrode 122 of the first crystal element 120 and the second excitation electrode 132 of the second crystal element 130. Absent. Therefore, since the space between the first excitation electrode 122 of the first crystal element 120 and the second excitation electrode 132 of the second crystal element 130 is a vacuum state, the material of the substrate 110a such as alumina is used. Since the dielectric constant of the vacuum space is smaller than the dielectric constant, it is generated between the first excitation electrode 122 of the first crystal element 120 and the second excitation electrode 132 of the second crystal element 130. The stray capacitance to be reduced can be reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where the first crystal element 120 or the second crystal element 130 uses an AT crystal element has been described. However, two flat plate-like vibrations extending in the same direction from the base and the side surface of the base are described. A tuning fork type bent quartz element having an arm portion may be used.

  Further, the first crystal element 120 or the second crystal element 130 is beveled so that the thickness of the outer periphery of the crystal element plate is thin and the center part of the crystal element plate is thicker than the outer periphery of the crystal element plate. You may use. A bevel processing method for the first crystal element or the second crystal element will be described. A polishing material provided with media and abrasive grains of a predetermined particle size, and a quartz base plate formed to a predetermined size are prepared. The prepared abrasive and quartz base plate are placed in the cylindrical body, and the open end of the cylindrical body is closed with a cover. A beveling process is performed by polishing a quartz base plate that rotates a cylindrical body in which an abrasive and a quartz base plate are placed with the central axis of the cylindrical body as a rotation axis.

110 ... package 110a ... substrate 110b ... first frame 110c ... second frame 111 ... first electrode pad 112a ... first sealing conductor pattern 112b ... first Two sealing conductor patterns 113a, 113b ... through hole 114 ... second electrode pad 115 ... first wiring pattern 116 ... first via conductor 117 ... second wiring pattern 118 ... Second via conductor 119a ... first notch 119b ... second notch 120 ... first crystal element 121 ... first crystal element plate 122 ... first excitation electrode 123 ... First connection electrode 124 ... first extraction electrode 130 ... second crystal element 131 ... second crystal element plate 132 ... second excitation electrode 133 ... second connection electrode 134 ..Second extraction electrode 14 DESCRIPTION OF SYMBOLS 0 ... 1st cover body 141 ... 1st sealing member 142 ... 1st recessed part 150 ... 2nd cover body 151 ... 2nd sealing member 152 ... 2nd recessed part 160-・ ・ Conductive adhesive K1 ・ ・ ・ First storage space K2 ・ ・ ・ Second storage space G1 ・ ・ ・ First external connection terminal G2 ・ ・ ・ Second external connection terminal

Claims (4)

A substrate having a through hole;
A first crystal element provided on the upper surface of the substrate, one end fixed to the upper surface of the substrate and the other end spaced from the upper surface of the substrate;
A second crystal element provided on the lower surface of the substrate, having one end fixed to the lower surface of the substrate and the other end spaced from the lower surface of the substrate;
A first lid that is provided on the upper surface of the substrate, seals the first crystal element, and has a first recess on the lower surface;
A second lid body provided on the lower surface of the substrate, sealing the second crystal element, and having a second recess on the upper surface;
The other end of the first crystal element and the other end of the second crystal element overlap with the through-hole, the first recess, and the second recess in a plan view. The crystal device according to claim 1,
One end of the first crystal element and one end of the second crystal element overlap each other in a plan view. The quartz crystal device according to claim 1 or 2,
The substrate includes a first frame portion on an upper surface and a second frame portion on a lower surface, and a first external connection electrode terminal provided on an outer side of an upper end of the first frame body, and the second frame body. And a second external terminal provided outside the lower end of the quartz device The quartz crystal device according to any one of claims 1 to 3,
The first crystal element has a rectangular first crystal element plate and first excitation electrodes provided on the upper and lower surfaces of the first crystal element plate,
The second crystal element has a rectangular second crystal element plate, and second excitation electrodes provided on the upper and lower surfaces of the second crystal element plate,
The quartz crystal device, wherein an area of the shape of the through hole in plan view is larger than an area of the first excitation electrode or the second excitation electrode.

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