JP2016181889A - Crystal Device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal device which enables reduction of fluctuation of the oscillatory frequency of a crystal element.SOLUTION: A crystal device includes: a substrate 110a; a frame body 110b provided along an outer peripheral edge on an upper surface of the substrate 110a; an electrode pad 111 provided on the upper surface of the substrate 110a; a conductor pattern 118 provided in an annular shape along an outer peripheral edge on an upper surface of the frame body 110b; a joint member 150 provided in an annular shape along the inner side of the conductor pattern 118 on the upper surface of the frame body 110b; a crystal element 120 mounted on the electrode pad 111 of the substrate 110a; and a lid body 130 comprising a base part 130 and an inclined part 130b provided along an outer side surface of the base part 130a, the lid body 130 joined to the frame body 110b through the joint member 150. The inclined part 130b contacts with the conductor pattern 118.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  The crystal device generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a crystal element mounted on a pair of electrode pads provided along one side of the upper surface of a rectangular substrate via a conductive adhesive, and bonded to the upper surface of the substrate via a bonding member, A crystal resonator provided with a metal sealing lid for hermetically sealing has been proposed (see, for example, Patent Document 1 below). Glass is used for the joining member, and the sealing lid and the upper surface of the substrate can be joined by applying heat. In addition, external terminals are provided at the four corners of the lower surface of the substrate constituting the crystal device, and are mounted on a mother board such as an electronic device with solder or the like.

JP 2009-141234 A

  In the crystal device described above, since the lid and the package are joined by the joining member, the sealing lid is connected to the ground terminal which is one of the plurality of external terminals provided on the lower surface of the substrate. Absent. Therefore, when such a crystal device is mounted on a mounting board of an electronic device, there is a possibility that the oscillation frequency of the crystal element may fluctuate due to the influence of external electromagnetic noise.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a crystal device that can reduce fluctuations in the oscillation frequency of a crystal element.

  A quartz crystal device according to an aspect of the present invention includes a substrate, a frame provided along the outer periphery of the upper surface of the substrate, an electrode pad provided on the upper surface of the substrate, and an outer periphery of the upper surface of the frame. An annular conductor pattern, a joining member annularly provided on the upper surface of the frame body along the inner side of the conductor pattern, a crystal element mounted on the electrode pad of the substrate, a base, and an outer side surface of the base And a lid that is joined via a joining member, and the slope is in contact with the conductor pattern. .

  A quartz crystal device according to an aspect of the present invention includes a substrate, a frame provided along the outer periphery of the upper surface of the substrate, an electrode pad provided on the upper surface of the substrate, and an outer periphery of the upper surface of the frame. An annular conductor pattern, a joining member annularly provided on the upper surface of the frame body along the inner side of the conductor pattern, a crystal element mounted on the electrode pad of the substrate, a base, and an outer side surface of the base And a lid body joined via a joining member, and the sloped part is in contact with the conductor pattern. By doing so, since the conductor pattern is provided so as to surround the crystal element, it is possible to prevent external electromagnetic wave noise from being blocked by the conductor pattern and superimposing the external electromagnetic wave noise on the crystal element. In addition, because the inclined portion of the lid and the conductor pattern are in contact, the lid will be electrically connected to the conductor pattern, and even if a metal plate or the like is close to the quartz device from above, The stray capacitance is less likely to occur between the adjacent metal plate and the crystal element, and fluctuations in the oscillation frequency of the crystal element can be reduced.

It is a disassembled perspective view which shows the crystal device in this embodiment. (A) It is sectional drawing in AA of the quartz crystal device shown by FIG. 1, (b) It is the X partial expanded sectional view of (a). (A) It is the top view which looked at the package which comprises the crystal device in this embodiment from the upper surface, (b) The top view which looked at the board | substrate of the package which comprises the crystal device in this embodiment from the upper surface. It is the top view which looked at the board | substrate of the package which comprises the crystal device in this embodiment from the lower surface. It is sectional drawing which shows the crystal device in the 1st modification of this embodiment.

  As shown in FIGS. 1 and 2, the crystal device according to the present embodiment includes a package 110, a crystal element 120 mounted on the upper surface of the package 110, and a lid 130 bonded to the upper surface of the package 110. Is included. The package 110 has a recess K surrounded by the upper surface of the substrate 110a and the inner surface of the frame 110b. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape and functions as a mounting member for mounting the crystal element 120 on the upper surface. A pair of electrode pads 111 for bonding the crystal element 120 are provided on the upper surface of the substrate 110a. The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern 113, a conductor portion 114, and a via conductor 115 for electrically connecting the electrode pad 111 provided on the upper surface and the external terminal 112 provided on the lower surface of the substrate 110a are provided on and inside the substrate 110a. Is provided.

  The frame 110b is disposed on the upper surface of the substrate 110a, and is for forming the recess K on the upper surface of the substrate 110a. The frame 110b is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a.

  Here, when the package 110 is viewed in plan, the dimension of one side is 1.0 to 3.0 mm, and the dimension of the package 110 in the vertical direction is 0.2 to 1.5 mm. The size of K will be described. The length of the long side of the recess K is 0.7 to 2.0. mm, and the length of the short side is 0.5 to 1.5 mm. Moreover, the length of the up-down direction of the recessed part K is 0.1-0.5 mm.

  In addition, external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. At least two of the external terminals 112 are electrically connected to the electrode pad 111. Further, at least one of the remaining external terminals 112 is electrically connected to the conductor pattern 118.

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. The electrode pad 111 includes a first electrode pad 111a and a second electrode pad 111b. The electrode pad 111 is electrically connected to an external terminal 112 provided on the lower surface of the substrate 110a via a wiring pattern 113 and a conductor portion 114 provided on the substrate 110a.

  On the pair of electrode pads 111, a pair of convex portions 116 that are rectangular in plan view are provided. In addition, the pair of convex portions 116 is provided along the outer peripheral edge on the electrode pad 111 whose one side faces the center side of the substrate 110a when seen in a plan view, and is connected to the other side. Is provided along the outer peripheral edge on the electrode pad 111 facing the outer peripheral edge of the substrate 110a.

  The external terminal 112 is used for mounting on a mounting board constituting an external electronic device or the like. As shown in FIG. 4, the external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Two of the external terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110a. The external terminals 112 that are electrically connected to the electrode pads 111 are provided so as to be located diagonally on the lower surface of the substrate 110a. At least one of the external terminals 112 is connected to a mounting pad connected to a ground potential that is a reference potential on an external mounting substrate. The third external terminal 112c is electrically connected to the conductor pattern 118 via the via conductor 115, the third wiring pattern 113c, and the third conductor portion 114c. The third external terminal 112c is connected to a mounting pad connected to a ground potential that is a reference potential on a mounting substrate of an electronic device or the like. As a result, the conductor pattern 118 in the external electromagnetic wave noise and the inclined portion 130b of the lid body 130 come into contact with each other, whereby the lid body 130 is electrically connected to the third external terminal 112c that is at the ground potential. Therefore, the shielding property in the recessed part K by the cover body 130 is improved.

  As shown in FIGS. 3A and 3B, the wiring pattern 113 electrically connects the electrode pad 111 and the conductor portion 114, and electrically connects the via conductor 115 and the conductor portion 114. Is for. The wiring pattern 113 includes a first wiring pattern 113a, a second wiring pattern 113b, and a third wiring pattern 113c. The wiring pattern 113 is provided so as to overlap the frame 110b in plan view. By doing so, the crystal device suppresses the generation of stray capacitance between the wiring pattern 113 and the crystal element 120, so that this stray capacitance is not added to the crystal element 120, and therefore the oscillation frequency Can be prevented from fluctuating.

  Further, as shown in FIG. 3, the first wiring pattern 113a is electrically connected to the first electrode pad 111a and the first conductor portion 114a. The first wiring pattern 113a extends in the long side direction of the frame 110b adjacent to the first electrode pad 111a, and a part of the first wiring pattern 113a is exposed. The second wiring pattern 113b is electrically connected to the second electrode pad 111b and the second conductor portion 114b. The second wiring pattern 113b extends in the long side direction of the frame 110b adjacent to the first electrode pad 111a, and a part of the second wiring pattern 113b is exposed. The third wiring pattern 113c extends from the via conductor 115 toward the third conductor portion 114c provided at the corner portion of the substrate 110a adjacent thereto.

  As described above, a part of the wiring pattern 113 is provided so as to extend from the electrode pad 111 toward the long side direction of the frame 110b and be exposed, so that when the crystal element 120 is mounted, Since the conductive adhesive 140 that is about to overflow flows out along the wiring pattern 113 having better wettability than the substrate 110a, the conductive adhesive 140 is excited without flowing out toward the center of the package 110. It can suppress adhering to the electrode 122 for use.

  The conductor portion 114 is for electrically connecting the wiring pattern 113 and the external terminal 112. The conductor part 114 is provided inside a notch provided in a corner part of the substrate 110a. Both ends of the conductor portion 114 are connected to the wiring pattern 113 and the external terminal 112. The conductor part 114 includes a first conductor part 114a, a second conductor part 114b, a third conductor part 114c, and a fourth conductor part 114d.

  The via conductor 115 is provided inside the substrate 110a, and both ends thereof are electrically connected to the conductor pattern 118 and the third wiring pattern 113c, and are also electrically connected to a conductor pattern 118 and an external terminal 112 described later. belongs to. The via conductor 115 is provided by filling a conductor in a through hole provided in the substrate 110a.

  The convex part 116 is for suppressing the vertical inclination of the short side of the crystal element 120 and for preventing the end part on the long side of the crystal element 120 from coming into contact with the substrate 110 a and the lid 130. Moreover, the convex part 116 is for suppressing that the free end of the crystal | crystallization element 120 contacts the board | substrate 110a. A pair of convex part 116 is comprised by the 1st convex part 116a and the 2nd convex part 116b. The 1st convex part 116a is provided in the upper surface of the 1st electrode pad 111a, and the 2nd convex part 116b is provided in the upper surface of the 2nd electrode pad 111b. Similarly to the electrode pad 111, the convex portion 116 is provided by performing gold plating or nickel plating on the upper surface of a sintered body of metal powder such as tungsten, molybdenum, copper, silver, or silver palladium.

  Further, one side of the pair of convex portions 116 facing the center side of the substrate 110a is provided so as to be aligned on the same straight line as shown in FIG. By doing so, when the extraction electrode 123 of the crystal element 120 is mounted on the electrode pad 111 while being in contact with the pair of convex portions 116, the crystal element 120 can be mounted in a stable state without being inclined.

  Further, the convex portion 116 is provided at a position facing the extraction electrode 123 on the outer peripheral edge of the crystal element 120. In this way, when the crystal element 120 is mounted on the electrode pad 111 via the conductive adhesive 140, even if the crystal element 120 is inclined, the lead electrode 123 is in contact with the convex portion 116. Thus, the crystal element 120 can be mounted in a stable state without tilting downward from the convex portion 116. Further, the projection 116 is provided at a position overlapping the extraction electrode 123 on the outer peripheral edge on the fixed end side of the crystal element plate 121 in plan view. By doing in this way, it can reduce that the fixed end of crystal element 120 contacts the upper surface of substrate 110a.

  The projection 117 has a rectangular shape in a plan view, and is provided at a position facing the free end side of the crystal element 120 to prevent the free end side of the crystal element 120 from contacting the substrate 110a. It is. The protrusion 117 is provided on the substrate 110a in the recess K so that the long side of the protrusion 117 and the long side of the substrate 110a are substantially parallel. By doing so, it is possible to suppress chipping or the like due to the free end side of the crystal element 120 coming into contact with the substrate 110a when an impact such as dropping is applied to the crystal device.

  Here, when the package 110 is viewed in plan, the dimension of one side is 1.0 to 3.0 mm, and the vertical dimension of the package 110 is 0.7 to 1.5 mm as an example. The size of the pad 111 and the convex part 116 will be described. The side length of the electrode pad 111 is 250 to 400 μm. The length of the thickness of the electrode pad 111 in the vertical direction is 10 to 50 μm. The length of the side of the convex part 116 formed along the outer periphery of the electrode pad 111 is 200 to 400 μm. The length of the thickness of the convex part 116 in the vertical direction is 7 to 30 μm. In addition, the length of the protrusion 117 parallel to the long side direction of the substrate 110a is 500 to 800 μm, and the length of the protrusion 117 parallel to the short side direction of the substrate 110a is 150 to 300 μm. Further, the length of the protrusion 117 in the vertical direction is about 30 to 100 μm.

  In addition, the arithmetic average surface roughness of the electrode pad 111 is 0.02 to 0.10 μm, and the arithmetic average surface roughness of the surface of the substrate 110a is 0.5 to 1.5 μm. Therefore, the conductive adhesive 140 spreads in the direction of the wiring pattern 113 where the convex portions 116 on the electrode pad 111 are not provided, but the conductive adhesive 140 spreads from the electrode pad 111 to the substrate. It becomes difficult to spread toward 110a.

  Since the conductor pattern 118 is annularly provided on the upper surface of the frame 110b so as to surround the mounted crystal element 120, the external electromagnetic noise is blocked by the conductor pattern 118, and the external electromagnetic noise is superimposed on the crystal element 120. This is to suppress this. As shown in FIGS. 3 and 4, the conductor portion 118 is electrically connected to the third external terminal 112 c through the via conductor 115, the third wiring pattern 113 c, and the third conduction portion 114 c. The third external terminal 112c is used as a ground terminal by being connected to a mounting pad connected to a ground potential that is a reference potential on an external mounting substrate. Therefore, the conductor pattern 118 electrically connected to the third external terminal 112c becomes the reference potential. By doing so, the external electromagnetic wave noise is further blocked by the conductor pattern 118. In addition, since the inclined portion 130b of the lid 130 is in contact with the conductor pattern 118, the lid 130 is electrically connected to the third external terminal 112c having a ground potential. The superimposition of external electromagnetic noise can be further reduced. Further, since the conductive pattern 118 is electrically connected to the ground terminal, even if a metal plate or the like is close to the crystal device from above, the adjacent metal plate and the crystal element are formed by the conductive pattern 118 having a reference potential. As a result, stray capacitance is less likely to occur between the crystal element 120 and the oscillation frequency of the crystal element 120 can be reduced. The conductor pattern 118 is, for example, 10 to 25 μm thick by applying nickel plating and gold plating on the surface of a conductor wiring made of tungsten or molybdenum, for example, in such a manner that the upper surface of the frame 110b is annularly surrounded along the outer periphery. Is formed.

  Here, a method for manufacturing the package 110 will be described. When the substrate 110a and the frame 110b are made of alumina ceramics, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating or gold plating is applied to a predetermined portion of the conductor pattern, specifically, the electrode pad 111, the external terminal 112, the wiring pattern 113, the conductor portion 114, the protruding portion 116, the protruding portion 117, and the portion that becomes the conductor pattern 118. It is produced by applying silver palladium or the like. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIG. 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIG. 2, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to the upper surface and the lower surface of a crystal base plate 121, respectively. The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111a and the second electrode pad 111b is a fixed end connected to the upper surface of the substrate 110a, and the other end is between the upper surface of the substrate 110a. The quartz crystal element 120 is fixed on the substrate 110a by a cantilevered support structure with a free end.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by a dispenser, for example. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first lead electrode 123a of the crystal element 120 is joined to the first electrode pad 111a, and the second lead electrode 123b is joined to the second electrode pad 111b. As a result, the first external terminal 112 a and the second external terminal 112 b are electrically connected to the crystal element 120.

  Further, the crystal element 120 is mounted such that the protrusion 117 is disposed at a position facing the free end of the crystal element 120. By doing so, the free end of the crystal element 120 comes into contact with the protrusion 117 even if the crystal element 120 is tilted about the location where the lead electrode 123 of the crystal element 120 and the electrode pad 111 are joined, so that the substrate 110a. It is possible to prevent the free end of the quartz crystal element 120 from coming into contact with the upper surface of the substrate. If a drop test or the like is performed in a state where the free end of the crystal element 120 is in contact with the substrate 110a, the free end of the crystal element 120 may be lost. By doing in this way, it can reduce that the oscillation frequency of the crystal element 120 fluctuates, suppressing that the free end side of the crystal element 120 is missing.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The lid 130 includes a rectangular base portion 130a and an inclined portion 130b provided along the outer peripheral edge of the lower surface of the base portion 130a. The base portion 130a has a rectangular shape in plan view. The inclined portion 130b is formed to be bent toward the package 110 when the lid 130 is joined to the package 110. The inclined portion 130b is formed so as to be inclined by 15 to 45 degrees in a direction approaching the substrate 110a when the plane of the base portion 130a is used as a reference plane.

The base portion 130a and the inclined portion 130b are made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and are integrally formed. Such a lid 130 is for hermetically sealing the recess K in a vacuum state or the recess K filled with nitrogen gas or the like.
Specifically, the lid 130 is placed on the upper surface of the frame 110b in a predetermined atmosphere, and heat is applied to the bonding member 150 provided between the upper surface of the frame 110b and the lower surface of the base 110a. As a result, it is melt-bonded. Further, the lid body 130 is joined onto the frame body 110b so that the inclined portion 130b contacts the conductor pattern 118 provided on the upper surface of the frame body 110b.

  The joining member 150 is used for joining the lower surface of the lid 130 and the upper surface of the frame 110b. The joining member 150 is provided in an annular shape along the inner peripheral edge of the frame 110b, and a conductor pattern 118 is provided on the outer side thereof. That is, in order to join the lid body 130 and the frame body 110b while bringing the inclined portion 130b and the conductor pattern 118 into contact with each other, the top surface of the frame body 110b is viewed in plan, and the joining member 150, The conductor patterns 118 are provided in this order. The joining member 150 is glass that melts at 300 ° C. to 400 ° C., and is made of, for example, low-melting glass or lead oxide glass containing vanadium. Glass is pasty with a binder and a solvent added, and is melted and then solidified to adhere to other members. For example, the joining member 150 is formed by applying a glass paste by screen printing, heating, softening and melting the glass paste, and cooling and solidifying the glass paste in a ring shape along the inner peripheral edge of the upper surface of the frame 110b. It is worn. The composition of the lead oxide glass is composed of lead oxide, lead fluoride, titanium dioxide, niobium oxide, bismuth oxide, boron oxide, zinc oxide, ferric oxide, copper oxide and calcium oxide.

  The quartz crystal device according to the present embodiment includes a substrate 110a, a frame 110b provided along the outer peripheral edge of the upper surface of the substrate 110a, an electrode pad 111 provided on the upper surface of the substrate 110a, and an outer surface of the upper surface of the frame 110b. Conductive pattern 118 provided annularly along the periphery, bonding member 150 provided annularly on the upper surface of frame 110b along the inner side of conductive pattern 118, and crystal element mounted on electrode pad 111 of substrate 110a 120, a base portion 130a, and an inclined portion 130b provided along the outer side surface of the base portion 130a. The lid body 130 is joined via a joining member 150, and the inclined portion 130b is provided. The conductor pattern 118 is in contact. By doing so, since the lid body 130 and the conductor pattern 118 are provided so as to surround the crystal element 120, the external electromagnetic wave noise is blocked by the conductor pattern 118 and the lid body 130, and the external electromagnetic wave noise is generated in the crystal element 120. Superposition can be suppressed. Therefore, such a quartz crystal device can reduce fluctuations in the oscillation frequency of the quartz crystal element 120.

  In the crystal device according to the present embodiment, a plurality of external terminals 112 are provided on the lower surface of the substrate 110a, and at least one of the external terminals 112 and the conductor pattern 118 are electrically connected. The external terminal 112 electrically connected to is used as a ground terminal. By doing so, at least one external terminal 112 and the conductor pattern 118 are electrically connected, and the external terminal 112 electrically connected to the conductor pattern 118 is used as a ground terminal. In addition, since the inclined portion 130b of the lid 130 is in contact with the conductor pattern 118, the lid 130 can also be set to a reference potential that is a ground potential. In this way, when the crystal device is mounted on a mounting substrate such as an electronic device, the conductor pattern 118 and the lid 130 that have become the reference potential even if the metal plate is close to the crystal device from above. The stray capacitance is less likely to be generated between the adjacent metal plate and the crystal element 120, and fluctuations in the oscillation frequency of the crystal element 120 can be further reduced.

  In the crystal device according to the present embodiment, the electrode pad 111 is provided along one side of the substrate 110a, and includes a convex portion 116 provided on the upper surface of the electrode pad 111. When the crystal element 120 is mounted on the electrode pad 111 via the conductive adhesive 140, even if the crystal element 120 is inclined, the extraction electrode 123 comes into contact with the convex portion 116, and the crystal element 120 is more than the convex portion 116. The crystal element 120 can be mounted in a stable state without being tilted downward. Further, the projection 116 is provided at a position overlapping the extraction electrode 123 on the outer peripheral edge on the fixed end side of the crystal element plate 121 in plan view. By doing in this way, it can reduce that the fixed end of crystal element 120 contacts the upper surface of substrate 110a.

  In addition, the quartz crystal device according to the present embodiment includes a protrusion 117 provided along a side facing one side of the substrate 110a. By doing so, when an impact such as a drop is applied to the crystal device, the free end side of the crystal element 120 comes into contact with the protruding portion 117, so that it is possible to suppress chipping or the like due to direct contact with the substrate 110a. .

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIG. 5, the quartz crystal device according to the first modification of the present embodiment is provided with a conductive member 160 for electrically joining the inclined portion 130 b and the conductor pattern 118. Different from form.

  The conductive member 160 is used to electrically join the inclined portion 130b of the lid 130 and the conductor pattern 118 provided along the outer peripheral edge of the upper surface of the frame 110b. The conductive member 160 is made of, for example, silver paste or lead-free solder. The conductive member 160 contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 97.5% for tin, 2 to 4% for silver, and 0.5 to 1.0% for copper.

  The quartz crystal device according to the first modification of the present embodiment includes a conductive member 160 for electrically joining the inclined portion 130b and the conductor pattern 118. By doing in this way, it can further suppress that external electromagnetic wave noise is further blocked | interrupted by the conductor pattern 118 and the cover body 130, and external electromagnetic wave noise is superimposed on the crystal element 120. FIG. Further, by providing the conductive member 160 along the outer peripheral edge of the frame 110b, the portion of the ground potential further expands, so that it is possible to further suppress the external electromagnetic wave noise from being superimposed on the crystal element 120. Therefore, such a crystal device can further reduce the fluctuation of the oscillation frequency of the crystal element 120.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  In the above embodiment, the case where the joining member 150 is provided along the inner peripheral edge of the frame body 110b has been described. However, the joining member 150 is located on the lower surface of the lid body 130 at a location facing the inner peripheral edge of the frame body 110b. You may make it provide in cyclic | annular form. For example, such a joining member 150 is formed by printing and applying a glass paste by a screen printing method, heating and softening and melting the glass paste, and then cooling and solidifying the glass paste along the inner peripheral edge of the upper surface of the frame 110b. It is provided by attaching the joining member 150 in an annular shape.

  In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bending having a base and two flat-plate-shaped vibrating arms extending in the same direction from the side surface of the base is described. A crystal element may be used. Such a tuning-fork type bending crystal element is composed of a crystal piece, an excitation electrode provided on the surface of the crystal piece, an extraction electrode, and a frequency adjusting metal film. The crystal piece includes a crystal base portion and a crystal vibration portion, and the crystal vibration portion includes a first crystal vibration portion and a second crystal vibration portion. The crystal base has an orthogonal coordinate system in which the electrical axis is the X axis, the mechanical axis is the Y axis, and the optical axis is the Z axis as the crystal axis direction, within a range of −5 ° to + 5 ° around the X axis. This is a flat plate having a substantially rectangular shape in a plan view in which the direction of the rotated Z ′ axis is the thickness direction. The first crystal vibrating part and the second crystal vibrating part are extended in parallel with the Y′-axis direction from one side of the crystal base part. Such a crystal piece has a tuning fork shape in which a crystal base and each crystal vibration part are integrated, and is manufactured by a photolithography technique and a chemical etching technique.

DESCRIPTION OF SYMBOLS 110 ... Board | substrate 111 ... Electrode pad 112 ... External terminal 113 ... Wiring pattern 114 ... Conductor part 115 ... Via conductor 116 ... Convex part 117 ... Protrusion part 118 ... Conductor pattern 120: crystal element 121 ... crystal base plate 122 ... excitation electrode 123 ... extraction electrode 130 ... lid body 130a ... base portion 130b ... inclined portion 140 ... Conductive adhesive 150 ... joining member 160 ... conductive member K ... concave

Claims (5)

A substrate,
A frame provided along the outer peripheral edge of the upper surface of the substrate;
An electrode pad provided on the upper surface of the substrate;
A conductor pattern provided in an annular shape along the outer peripheral edge of the upper surface of the frame;
A joining member provided annularly on the upper surface of the frame body along the inside of the conductor pattern;
A crystal element mounted on the electrode pad of the substrate;
Comprising a base and an inclined portion provided along the outer side surface of the base, and a lid joined via the joining member,
The inclined device is in contact with the conductor pattern. The crystal device according to claim 1,
A quartz crystal device comprising a conductive member for electrically joining the inclined portion and the conductor pattern. The quartz crystal device according to claim 1 or 2,
A plurality of the external terminals are provided on the lower surface of the substrate,
At least one of the external terminals and the conductor pattern are electrically connected, and the external terminal electrically connected to the conductor pattern is used as a ground terminal. The quartz crystal device according to claim 1, wherein
The electrode pads are provided along one side of the substrate;
A crystal device comprising a convex portion provided on an upper surface of the electrode pad. The crystal device according to claim 1, wherein:
A crystal device comprising: a protrusion provided along a side facing one side of the substrate.

Images