JP2014229912A - Crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal device which stably outputs the oscillatory frequency of a crystal element.SOLUTION: A crystal device includes: a rectangular substrate 110; electrode pads 111 provided on four corners on an upper surface of the substrate 110; electrode terminals 112 which are provided at four corners of a lower surface of the substrate 110 and respectively and electrically connected with the electrode pads 111 which overlap with the electrode terminals 112 in a planar perspective view and are located at the four corners; a pair of conductive adhesives 140 which are provided above the substrate 110 so as to be respectively located at the electrode pads 111 diagonally positioned; a crystal element 120 which is provided above the substrate 110 so as to lie astride a space between the pair of adhesives 140; and a sealing lid 130 which is provided along an outer edge on the substrate 110 and seals the crystal element 120.

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  The crystal device generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a crystal element mounted on a pair of electrode pads provided along one side of the upper surface of a rectangular substrate via a conductive adhesive, and bonded to the upper surface of the substrate via a bonding member, A crystal resonator provided with a lid for hermetically sealing has been proposed (see, for example, Patent Document 1 below). Glass is used for the bonding member, and the lid and the upper surface of the substrate can be bonded by applying heat. In addition, external terminals are provided at the four corners of the lower surface of the substrate constituting the crystal device, and are mounted on a motherboard such as an electronic device.

JP 2009-141234 A

  The above-described quartz device is remarkably miniaturized, but the quartz element mounted on the substrate using a conductive adhesive is also downsized. When heat is applied to such a crystal device, the substrate may be warped due to the difference in thermal expansion coefficient, and stress is applied to the conductive adhesive via the substrate. Further, when stress is applied to the conductive adhesive, the stress applied to the conductive adhesive is linearly propagated to the excitation electrode of the crystal element. Therefore, the stress applied to the conductive adhesive cannot be sufficiently reduced, and the oscillation frequency of the crystal element may fluctuate.

  The present invention has been made in view of the above problems, and provides a crystal device capable of stably outputting the oscillation frequency of a crystal element.

  A quartz crystal device according to one aspect of the present invention includes a rectangular substrate, electrode pads provided at the four corners of the upper surface of the substrate, and electrodes at the four corners provided at the four corners of the lower surface of the substrate, each overlapping in plan view. An electrode terminal electrically connected to the pad; a pair of conductive adhesives provided on each of the opposite electrode pads on the substrate; and a pair of conductive adhesives on the substrate. It is characterized by comprising a crystal element provided across the agent and a sealing lid provided along the outer edge on the substrate and sealing the crystal element.

  A quartz crystal device according to one aspect of the present invention includes a rectangular substrate, electrode pads provided at the four corners of the upper surface of the substrate, and electrodes at the four corners provided at the four corners of the lower surface of the substrate, each overlapping in plan view. An electrode terminal electrically connected to the pad is provided. By doing so, the thermal expansion coefficients of the upper surface and the lower surface of the substrate are approximated, so that the warpage of the substrate due to application of heat can be reduced. Therefore, it is possible to reduce the stress applied to the conductive adhesive through the substrate to the crystal element, and to stably output the oscillation frequency of the crystal element.

It is a disassembled perspective view which shows the crystal device in this embodiment. (A) It is sectional drawing in AA of the quartz crystal device shown in FIG. 1, (b) It is sectional drawing in BB of the quartz crystal device shown in FIG. (A) It is a top view which shows the state which mounted the large sized crystal element of the crystal device in this embodiment, (b) It is a top view which shows the state which mounted the small crystal element of the crystal device in this embodiment. (A) It is the top view which looked at the board | substrate which comprises the crystal device in this embodiment from the upper surface, (b) The top view which looked at the board | substrate which comprises the crystal device in this embodiment from the lower surface. It is a disassembled perspective view which shows the quartz crystal device in the 1st modification of this embodiment. (A) It is the top view which looked at the board | substrate which comprises the crystal device in the 1st modification of this embodiment from the upper surface, (b) The board | substrate which comprises the crystal device in the 1st modification of this embodiment is seen from a lower surface. FIG. (A) It is the top view which looked at the board | substrate which comprises the crystal device in the 2nd modification of this embodiment from the upper surface, (b) The board | substrate which comprises the crystal device in the 2nd modification of this embodiment is seen from a lower surface. FIG.

  As shown in FIGS. 1 and 2, the crystal device according to the present embodiment includes a substrate 110, a crystal element 120 bonded to the upper surface of the substrate 110, and a lid for hermetically sealing the crystal element 120. 130. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110 has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface. Electrode pads 111 for bonding the crystal element 120 are provided at the four corners of the upper surface of the substrate 110, and electrode terminals 112 are provided at the four corners of the lower surface of the substrate 110. Further, two of the four electrode terminals 112 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120.

  The substrate 110 is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110 may be one using an insulating layer or may be a laminate of a plurality of insulating layers. Inside the substrate 110, via conductors 113 are provided for electrically connecting the electrode pads 111 provided on the upper surface and the electrode terminals 112 on the lower surface, respectively.

  The electrode pads 111 are provided at the four corners of the upper surface of the substrate 110 as shown in FIG. The electrode pad 111 is electrically connected to an electrode terminal 112 provided at a position overlapping the electrode pad 111 in plan view via a via conductor 113 provided on the substrate 110. The electrode terminals 112 are provided along the outer peripheral edge of the substrate 110 at the four corners of the lower surface of the substrate 110.

  The electrode pad 111 includes a first electrode pad 111a, a second electrode pad 111b, a third electrode pad 111c, and a fourth electrode pad 111d. The electrode terminal 112 includes a first electrode terminal 112a, a second electrode terminal 112b, a third electrode terminal 112c, and a fourth electrode terminal 112d. The via conductor 113 includes a first via conductor 113a, a second via conductor 113b, a third via conductor 113c, and a fourth via conductor 113d. The first electrode pad 111a and the first electrode terminal 112a are connected by a first via conductor 113a provided on the substrate 110, and the second electrode pad 111b and the second electrode terminal 112b are provided on the substrate 110. The second via conductor 113b is connected. The third electrode pad 111c and the third electrode terminal 112c are connected by a third via conductor 113c provided on the substrate 110, and the fourth electrode pad 111d and the fourth electrode terminal 112d are connected to the substrate 110. Are connected by a fourth via conductor 113d provided in the first via conductor.

  The electrode pads 111 of the substrate 110 are used for mounting the crystal element 120 as shown in FIG. The electrode terminal 112 is used as an external terminal for mounting on an external mounting substrate. The electrode terminal 112 of the substrate 110 may be used for mounting the crystal element 120, and the electrode pad 111 may be used as an external terminal for mounting on an external mounting substrate. By doing in this way, since the crystal | crystallization element 120 may be mounted in any of the upper and lower surfaces of the board | substrate 110, handling is simple and productivity of a crystal device can be improved.

  The electrode pad 111 and the electrode terminal 112 have a shape provided along the substrate 110. Here, when the package 110 is viewed in plan, the long side dimension is 1.2 to 2.5 mm, and the short side dimension is 1.0 to 2.0 mm. The size of the electrode terminal 112 will be described. The long sides of the electrode pad 111 and the electrode terminal 112 are 0.40 to 0.90 mm, and the short sides are 0.30 to 0.60 mm.

  Moreover, the electrode pad 111 and the electrode terminal 112 are arrange | positioned in the position which overlaps in planar view, respectively, and the electrode pad 111 and electrode terminal 112 in an overlapping position are electrically connected. By doing so, the thermal expansion coefficients of the upper surface and the lower surface of the substrate 110 are approximated, so that the warpage of the substrate 110 can be reduced. Even if the substrate 110 is warped, by holding the crystal element 120 diagonally, the stress applied to the crystal element 120 can be made equal by both holding. Therefore, it is possible to reduce fluctuations in the oscillation frequency of the crystal element 120 caused by the stress applied to the conductive adhesive 140 being transmitted to the crystal element 120.

  In addition, the substrate 110 configured in the quartz crystal device of the present invention is provided at a position where the electrode pad 111 and the electrode terminal 112 provided on the upper surface and the lower surface overlap with each other in a plan view. Further, the upper surface and the lower surface of the substrate 110 are symmetrical with respect to an axis passing through the midpoint of the long side of the substrate 110. When the substrate 110 is carried into the manufacturing apparatus, it is not necessary to confirm the upper and lower surfaces of the substrate 110 and the direction of the substrate 110 by image processing if they are aligned with an alignment jig. If a substrate used in a conventional crystal device is used, when the substrate is aligned with an alignment jig when it is carried into a manufacturing apparatus, confirmation of the upper and lower surfaces of the substrate and confirmation of the direction of the substrate is possible. It is necessary to carry out by processing etc., and productivity will fall. By doing so, it is not necessary to confirm the aligned substrates 110 by image processing, so that the productivity of the crystal device can be improved.

  Here, a method for manufacturing the substrate 110 is described. When the substrate 110 is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, it is produced by applying nickel plating, gold plating, silver palladium, or the like to a predetermined portion of the conductor pattern, specifically, a portion to be the electrode pad 111 or the electrode terminal 112. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIG. 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  As shown in FIG. 2, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to an upper surface and a lower surface of a crystal base plate 121, respectively. The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on the upper and lower surfaces of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward the opposite sides of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward the other side of the crystal base plate 121.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110 will be described. First, the conductive adhesive 140 is applied onto the electrode pad 111 by, for example, a dispenser. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111.

  The first extraction electrode 123a and the second extraction electrode 123b of the crystal element 120 are joined to the first electrode pad 111a and the third electrode pad 111c. As a result, the first electrode terminal 112 a and the third electrode terminal 112 c are electrically connected to the crystal element 120. Further, even when the external dimensions of the crystal element 120 are different, the crystal element 120 can be mounted on the electrode pad 111 as shown in FIG. Therefore, when the extraction electrode 123 of the crystal element 120 is located on the upper surface of the electrode pad 111, crystal elements having different external dimensions can be used. Therefore, it is not necessary to redo the design of the substrate on which the electrode pads are formed in accordance with the mounting of crystal elements having different external dimensions.

  In addition, even if the first lead electrode 123a and the second lead electrode 123b of the crystal element 120 are inclined about the place where the first electrode pad 111a and the third electrode pad 111c are joined, the crystal element 120 is bonded. Since the corner that is not in contact with the second electrode pad 111b or the fourth electrode pad 111c, it is possible to prevent the corner that is not bonded to the crystal element 120 from contacting the upper surface of the substrate 110. If a drop test or the like is performed in a state where the corner where the crystal element 120 is not bonded is in contact with the substrate 110, the corner where the crystal element 120 is not bonded may be lost. By doing in this way, it can suppress that the angle | corner of the crystal element 120 is missing, and can reduce that the oscillation frequency of the crystal element 120 fluctuates.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The sealing lid 130 includes a rectangular sealing base portion 130a and a sealing frame portion 130b, and an accommodation space K is formed by the lower surface of the sealing base portion 130a and the inner side surface of the sealing frame portion 130b. Has been. The sealing frame part 130b is for forming the accommodation space K on the lower surface of the sealing base part 130a. The sealing frame part 130b is provided along the outer edge of the lower surface of the sealing base part 130a.

  The sealing base portion 130a and the sealing frame portion 130b are made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and are integrally formed. Such a sealing lid 130 is for hermetically sealing the housing space K in a vacuum state or the housing space K filled with nitrogen gas or the like. Specifically, the sealing lid 130 is placed on the upper surface of the substrate 110 in a predetermined atmosphere, and is provided between the upper surface of the substrate 110 and the lower surface of the sealing frame portion 130b of the sealing lid 130. The bonding member 150 is melt-bonded by applying heat.

  As shown in FIG. 2, the bonding member 150 is provided from the lower surface of the sealing frame portion 130 b to the substrate 110. For example, in the case of glass, the bonding member 150 is made of low-melting glass containing, for example, vanadium, which is a lead-free glass that melts at 350 ° C. to 400 ° C. Lead-free glass is in the form of a paste with a binder and a solvent added, and after being melted and solidified, it adheres to other members. The joining member 150 is provided, for example, by applying a glass frit paste by a screen printing method and drying it.

  For example, in the case of an insulating resin, the bonding member 150 is made of an epoxy resin or a polyimide resin. The thickness of the bonding member 150 provided between the lower surface of the sealing frame portion 130b and the upper surface of the substrate 110 is 30 to 100 μm.

  For example, when the joining member 150 is gold tin, the thickness of the layer of the joining member 150 is 10 to 40 μm. For example, the component ratio is 70 to 80% for gold and 20 to 30% for tin. May be used. For example, when the joining member 150 is silver brazing, the thickness of the layer of the joining member 150 is 10 to 40 μm. For example, the component ratio is 70 to 80% for silver and 20 to 30% for copper. May be used.

  The quartz crystal device according to the present embodiment includes a rectangular substrate 110, electrode pads 111 provided at the four corners of the upper surface of the substrate 110, and four corners provided at the four corners of the lower surface of the substrate 110 that overlap each other when seen through in plan view. An electrode terminal 112 electrically connected to the electrode pad 111 is provided. By doing so, the thermal expansion coefficients of the upper surface and the lower surface of the substrate 110 are approximated, so that the warpage of the substrate 110 due to application of heat can be reduced. Therefore, the stress applied to the conductive adhesive 140 via the substrate 110 is reduced from being transmitted to the crystal element 120, and the oscillation frequency of the crystal element 120 can be output stably.

  In addition, the crystal device according to the present embodiment includes electrode pads 111 provided at the four corners of the upper surface of the substrate 110 and electrode terminals 112 provided at the four corners of the lower surface of the substrate 110. The electrode terminals 112 are arranged at positions overlapping each other in plan view, and are electrically connected to each other. In this way, even if crystal elements having different external dimensions are used, it is not necessary to redo the design of the substrate on which the electrode pads adapted to the mounting are formed. Therefore, the productivity of the crystal device can be improved.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIG. 5, the crystal device according to the first modification of the present embodiment is provided such that the crystal element 220 extends from the excitation electrode 222 to one side of the crystal base plate 221. This embodiment is different from the present embodiment in that an extraction electrode 223 is provided.

  In the first modification of the present embodiment, one end of the crystal element 220 connected to the electrode pad 111 is a fixed end connected to the upper surface of the substrate 110, and the other end is a free end spaced from the upper surface of the substrate 110. The crystal element 220 is fixed on the substrate 110 with the cantilever support structure described above.

  In addition, the extraction electrode 223 of the crystal element 220 is bonded to the first electrode pad 111a and the second electrode pad 111b. As a result, the first electrode terminal 112 a and the second electrode terminal 112 b are electrically connected to the crystal element 220. Further, even when the mounting position of the crystal element 220 is different, it can be mounted on the electrode pad 111 as shown in FIG. Therefore, even if the crystal elements 220 having different mounting positions are used, it is not necessary to redo the design of the substrate on which the electrode pads corresponding to the mounting are formed. Therefore, the productivity of the crystal device can be improved.

  Further, even when the lead electrode 223 of the crystal element 220 and the electrode pad 111 are tilted around the axis, the free end corner of the crystal element 220 contacts the third electrode pad 111c or the fourth electrode pad 111c. As a result, it is possible to prevent the corner of the crystal element 220 that is not bonded from coming into contact with the upper surface of the substrate 110. If a drop test or the like is performed in a state in which the corner where the crystal element 220 is not bonded is in contact with the substrate 110, the corner where the crystal element 220 is not bonded may be lost. By doing in this way, it can suppress that the angle | corner of the crystal element 220 is missing, and can reduce that the oscillation frequency of the crystal element 220 fluctuates.

(Second modification)
Hereinafter, the quartz crystal device according to the second modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In the crystal device according to the second modification of the present embodiment, as shown in FIG. 6, the electrode pad 211 and the electrode terminal 212 are rectangular, and are in a position overlapping the excitation electrode 122 in plan view. This embodiment differs from the present embodiment in that a chamfered portion 214 is provided on the electrode pad 211 and the electrode terminal 212.

  The chamfered portion 214 is provided in a straight line at a corner facing the excitation electrode 122 side so as to cross from one side of the electrode pad 211 to one side adjacent to the one side. By doing so, a sufficient distance can be secured between the excitation electrode 122 and the electrode pad 211, so that the contact between the excitation electrode 122 and the electrode pad 211 can be reduced.

  Further, the electrode pad 211 and the electrode terminal 212 have a shape provided along the substrate 210. Here, taking the case where the long side dimension of the substrate 210 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 211 is taken as an example. The size of the electrode terminal 212 will be described. The long sides of the electrode pads 211 and the electrode terminals 212 are 0.40 to 0.90 mm, and the short sides are 0.30 to 0.60 mm. The chamfered portion 214 is obtained by removing the corners of the rectangular electrode pad 211 and the electrode terminal 212 in a triangular shape, and has a dimension parallel to the vertical dimension when the electrode pad 211 and the electrode terminal 212 are viewed in plan view. It is 0.05-0.15 mm, and the horizontal dimension when viewed in plan is 0.05-0.15 mm. In addition, the electrode pad 211 and the electrode terminal 212 provided with the chamfered portion 214 are formed to have an area of 97 to 99% as compared with the rectangular electrode pad 211 and the electrode terminal 212.

  In the crystal device according to the second modification of the present embodiment, the electrode pad 211 and the electrode terminal 212 are rectangular, and the electrode pad 211 and the electrode terminal 212 are provided with a chamfered portion 214. By doing so, a sufficient distance can be secured between the excitation electrode 122 and the electrode pad 211, so that the contact between the excitation electrode 122 and the electrode pad 211 can be reduced. Therefore, the crystal device can reduce the fluctuation of the oscillation frequency of the crystal element 120.

(Third modification)
Hereinafter, the quartz crystal device according to the third modification of the present embodiment will be described. Note that, in the quartz crystal device according to the third modification of the present embodiment, the same parts as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIG. 7, in the quartz device according to the third modification of the present embodiment, the four electrode pads 311 are provided with the first protrusions 314, and the four electrode terminals 312 are the second ones. This embodiment is different from the present embodiment in that the convex portion 315 is provided.

  The first convex portion 314 is provided on the upper surface of each electrode pad 311 so as to be parallel to the short side direction of the substrate 310. The first convex portions 314 are provided on the same straight line along the short side of the substrate 310. In this way, when the extraction electrode 123 of the crystal element 120 is mounted on the electrode pad 311 while being in contact with the first convex portion 314, the crystal element 120 can be mounted in a stable state without being inclined.

  The second convex portion 315 is provided on the lower surface of each electrode terminal 312 so as to extend along the short side direction of the substrate 310. The second protrusions 315 are provided on the same straight line along the short side of the substrate 310. When the electrode terminal 312 is used as an external terminal for mounting on an external mounting substrate, the surface area of the electrode terminal 312 can be increased by the second convex portion 315, so that the electrode terminal 312 is bonded to the external mounting substrate. Strength can be improved.

  The quartz crystal device according to the third modified example of the present embodiment has the first convex portion 314 provided on the four electrode pads 311, thereby bringing the lead electrode 123 of the crystal element 120 into contact with the first convex portion 314. In the case of mounting on the electrode pad 311, the crystal element 120 can be mounted in a stable state without tilting. By doing in this way, it becomes possible to output the oscillation frequency of the crystal element 120 stably. In addition, since the second convex portion 315 is provided on the lower surface of the four electrode terminals 312, the second convex portion 315 causes the electrode to be used when used as an external terminal for mounting on an external mounting substrate. Since the surface area of the terminal 312 can be increased, the bonding strength with an external mounting substrate can be improved.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the electrode pad 111 and the electrode terminal 112 are electrically connected by the via conductor 113 provided in the substrate 110. However, the wiring pattern is provided on the side surface of the substrate, and the electrode pad 111 and the electrode are connected. The terminal 112 may be electrically connected. In the first modification of the above-described embodiment, the case where the crystal element for AT is used as the crystal element has been described. However, two flat plate-like vibrating arms extending in the same direction from the side surface of the base part A tuning-fork type bent quartz element having a portion may be used.

  In addition, the crystal element 120 may be beveled so that the thickness of the outer periphery of the crystal element plate 121 is thin and the central part of the crystal element plate 121 is thicker than the outer periphery of the crystal element plate 121. . A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  In this embodiment, the case where the upper surface of the substrate 110 has no sealing conductor pattern has been described. However, the sealing conductor pattern may be provided on the upper surface of the substrate 110. The conductor pattern for sealing plays a role of improving the wettability of the bonding member 131 when bonded to the sealing lid 130 via the bonding member 150.

  In addition, when the bonding member 150 uses a conductive member, the sealing conductor pattern includes at least one electrode formed by a via conductor (not shown) and a wiring pattern (not shown) formed inside the substrate 110. The pad 111 and at least one electrode terminal 112 are connected. At least one electrode pad 111 and at least one electrode terminal 112 serve as a ground terminal by being connected to a mounting pad connected to a ground on an external mounting substrate. Therefore, the sealing lid 130 joined to the sealing conductor pattern is connected to the ground, and the shielding property in the accommodation space K by the sealing lid 130 is improved. The sealing conductor pattern is formed to have a thickness of, for example, 10 μm to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of tungsten, molybdenum, or the like, in a form surrounding the outer periphery of the upper surface of the substrate 110 in an annular shape Is formed.

110, 210, 310 ... substrate 111, 211, 311 ... electrode pad 112, 212, 312 ... electrode terminal 113, 213, 313 ... via conductor 120, 220 ... crystal element 121, 221 ... crystal base plates 122, 222 ... excitation electrodes 123, 223 ... extraction electrodes 130 ... sealing lid 131 ... sealing base 132 ... sealing frame 140 ... Conductive adhesive 150 ... joining member K ... accommodating space

Claims (4)

A rectangular substrate;
Electrode pads provided at the four corners of the upper surface of the substrate;
Electrode terminals provided at the four corners of the lower surface of the substrate, each electrically connected to the electrode pads at the four corners that overlap each other in plan view,
A pair of conductive adhesives provided on each of the electrode pads located diagonally on the substrate;
A crystal element provided on the substrate and straddling the pair of conductive adhesives;
A quartz device, comprising: a sealing lid body which is provided along an outer edge on the substrate and seals the quartz element. A rectangular substrate;
Electrode pads provided at the four corners of the upper surface of the substrate;
Electrode terminals provided at the four corners of the lower surface of the substrate, each electrically connected to the electrode pads at the four corners that overlap each other in plan view,
A pair of conductive adhesives provided on each of the electrode pads located on the substrate and adjacent to one side of the substrate;
A crystal element provided on the substrate and straddling the pair of conductive adhesives;
A quartz device, comprising: a sealing lid body which is provided along an outer edge on the substrate and seals the quartz element. The quartz crystal device according to claim 1 or 2,
The electrode pad and the electrode terminal are rectangular.
A crystal device comprising a chamfered portion at a corner of the electrode pad and the electrode terminal in plan view. The quartz crystal device according to claim 1 or 2,
A crystal device, wherein the electrode pad is provided with a first protrusion, and the electrode terminal is provided with a second protrusion.

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